CN114097065A - 制造物品的平整过程、装置和方法 - Google Patents

制造物品的平整过程、装置和方法 Download PDF

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Publication number
CN114097065A
CN114097065A CN202080051174.4A CN202080051174A CN114097065A CN 114097065 A CN114097065 A CN 114097065A CN 202080051174 A CN202080051174 A CN 202080051174A CN 114097065 A CN114097065 A CN 114097065A
Authority
CN
China
Prior art keywords
superstrate
substrate
chuck
crack
edge
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202080051174.4A
Other languages
English (en)
Chinese (zh)
Inventor
O·奥兹特克
S·J·贝姆斯伯格
斋藤真树
A·阿加里
S·C·沙克尔顿
崔炳镇
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Publication of CN114097065A publication Critical patent/CN114097065A/zh
Pending legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
    • B28D5/0041—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing the workpiece being brought into contact with a suitably shaped rigid body which remains stationary during breaking
    • B28D5/0047—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing the workpiece being brought into contact with a suitably shaped rigid body which remains stationary during breaking using fluid or gas pressure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
    • B28D5/0011—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing with preliminary treatment, e.g. weakening by scoring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
    • B28D5/0017—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing using moving tools
    • B28D5/0023—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing using moving tools rectilinearly
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
    • B28D5/0052—Means for supporting or holding work during breaking
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0428—Apparatus for mechanical treatment or grinding or cutting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H10P95/06—Planarisation of inorganic insulating materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H10P95/08—Planarisation of organic insulating materials

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Micromachines (AREA)
  • Auxiliary Devices For And Details Of Packaging Control (AREA)
CN202080051174.4A 2019-08-15 2020-07-17 制造物品的平整过程、装置和方法 Pending CN114097065A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US16/541,618 2019-08-15
US16/541,618 US11034057B2 (en) 2019-08-15 2019-08-15 Planarization process, apparatus and method of manufacturing an article
PCT/US2020/070292 WO2021030823A1 (en) 2019-08-15 2020-07-17 Planarization process, apparatus and method of manufacturing an article

Publications (1)

Publication Number Publication Date
CN114097065A true CN114097065A (zh) 2022-02-25

Family

ID=74567897

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202080051174.4A Pending CN114097065A (zh) 2019-08-15 2020-07-17 制造物品的平整过程、装置和方法

Country Status (7)

Country Link
US (1) US11034057B2 (enExample)
EP (1) EP4014248A4 (enExample)
JP (3) JP7555967B2 (enExample)
KR (2) KR102875033B1 (enExample)
CN (1) CN114097065A (enExample)
TW (1) TWI781424B (enExample)
WO (1) WO2021030823A1 (enExample)

Families Citing this family (4)

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US11656546B2 (en) 2020-02-27 2023-05-23 Canon Kabushiki Kaisha Exposure apparatus for uniform light intensity and methods of using the same
US11443940B2 (en) * 2020-06-24 2022-09-13 Canon Kabushiki Kaisha Apparatus for uniform light intensity and methods of using the same
JP7712111B2 (ja) * 2021-05-25 2025-07-23 株式会社ディスコ 剥離方法、ウエーハの製造方法及び剥離装置
US12282251B2 (en) 2021-09-24 2025-04-22 Canon Kabushiki Kaisha Method of shaping a surface, shaping system, and method of manufacturing an article

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JP2000348392A (ja) 1999-06-03 2000-12-15 Ricoh Co Ltd 光ディスク用スタンパの剥離方法及びその装置
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JP6995530B2 (ja) * 2017-08-29 2022-01-14 キヤノン株式会社 型を用いて基板上の組成物を成形する成形装置及び物品の製造方法
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US6391743B1 (en) * 1998-09-22 2002-05-21 Canon Kabushiki Kaisha Method and apparatus for producing photoelectric conversion device
US20040132301A1 (en) * 2002-09-12 2004-07-08 Harper Bruce M. Indirect fluid pressure imprinting
US20070092594A1 (en) * 2005-10-25 2007-04-26 Industrial Technology Research Institute Method and device for demolding
JP2008078550A (ja) * 2006-09-25 2008-04-03 Toppan Printing Co Ltd インプリントモールドおよびその製造方法およびパターン形成方法
KR20080046477A (ko) * 2006-11-22 2008-05-27 주식회사 에이디피엔지니어링 패턴형성장치 및 패턴형성방법
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JP2010080010A (ja) * 2008-09-26 2010-04-08 Konica Minolta Opto Inc 情報記録媒体基板の製造方法
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KR101328492B1 (ko) * 2013-04-02 2013-11-13 주식회사 템네스트 에어로졸 코팅을 이용한 정전척 재생 방법
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Also Published As

Publication number Publication date
JP2024109753A (ja) 2024-08-14
JP7555967B2 (ja) 2024-09-25
WO2021030823A1 (en) 2021-02-18
KR20220031078A (ko) 2022-03-11
EP4014248A4 (en) 2023-08-30
US20210050218A1 (en) 2021-02-18
TWI781424B (zh) 2022-10-21
EP4014248A1 (en) 2022-06-22
JP2025143458A (ja) 2025-10-01
US11034057B2 (en) 2021-06-15
TW202121536A (zh) 2021-06-01
JP7713064B2 (ja) 2025-07-24
JP2022544891A (ja) 2022-10-24
KR20240095464A (ko) 2024-06-25
KR102875033B1 (ko) 2025-10-22

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