KR102875033B1 - 평탄화 공정, 장치, 및 물품 제조 방법 - Google Patents

평탄화 공정, 장치, 및 물품 제조 방법

Info

Publication number
KR102875033B1
KR102875033B1 KR1020227004067A KR20227004067A KR102875033B1 KR 102875033 B1 KR102875033 B1 KR 102875033B1 KR 1020227004067 A KR1020227004067 A KR 1020227004067A KR 20227004067 A KR20227004067 A KR 20227004067A KR 102875033 B1 KR102875033 B1 KR 102875033B1
Authority
KR
South Korea
Prior art keywords
upper plate
substrate
top plate
chuck
separation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
KR1020227004067A
Other languages
English (en)
Korean (ko)
Other versions
KR20220031078A (ko
Inventor
오즈칸 오즈투르크
세스 제이. 베임스버거
마사키 사이토
알리레자 아길리
스티븐 씨. 섀클턴
최병진
Original Assignee
캐논 가부시끼가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 캐논 가부시끼가이샤 filed Critical 캐논 가부시끼가이샤
Priority to KR1020247019643A priority Critical patent/KR20240095464A/ko
Publication of KR20220031078A publication Critical patent/KR20220031078A/ko
Application granted granted Critical
Publication of KR102875033B1 publication Critical patent/KR102875033B1/ko
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H01L21/31058—
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
    • B28D5/0011—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing with preliminary treatment, e.g. weakening by scoring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
    • B28D5/0041—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing the workpiece being brought into contact with a suitably shaped rigid body which remains stationary during breaking
    • B28D5/0047—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing the workpiece being brought into contact with a suitably shaped rigid body which remains stationary during breaking using fluid or gas pressure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
    • B28D5/0017—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing using moving tools
    • B28D5/0023—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing using moving tools rectilinearly
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
    • B28D5/0052—Means for supporting or holding work during breaking
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0428—Apparatus for mechanical treatment or grinding or cutting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H10P95/06—Planarisation of inorganic insulating materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H10P95/08—Planarisation of organic insulating materials

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Micromachines (AREA)
  • Auxiliary Devices For And Details Of Packaging Control (AREA)
KR1020227004067A 2019-08-15 2020-07-17 평탄화 공정, 장치, 및 물품 제조 방법 Active KR102875033B1 (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020247019643A KR20240095464A (ko) 2019-08-15 2020-07-17 평탄화 공정, 장치, 및 물품 제조 방법

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US16/541,618 2019-08-15
US16/541,618 US11034057B2 (en) 2019-08-15 2019-08-15 Planarization process, apparatus and method of manufacturing an article
PCT/US2020/070292 WO2021030823A1 (en) 2019-08-15 2020-07-17 Planarization process, apparatus and method of manufacturing an article

Related Child Applications (1)

Application Number Title Priority Date Filing Date
KR1020247019643A Division KR20240095464A (ko) 2019-08-15 2020-07-17 평탄화 공정, 장치, 및 물품 제조 방법

Publications (2)

Publication Number Publication Date
KR20220031078A KR20220031078A (ko) 2022-03-11
KR102875033B1 true KR102875033B1 (ko) 2025-10-22

Family

ID=74567897

Family Applications (2)

Application Number Title Priority Date Filing Date
KR1020227004067A Active KR102875033B1 (ko) 2019-08-15 2020-07-17 평탄화 공정, 장치, 및 물품 제조 방법
KR1020247019643A Pending KR20240095464A (ko) 2019-08-15 2020-07-17 평탄화 공정, 장치, 및 물품 제조 방법

Family Applications After (1)

Application Number Title Priority Date Filing Date
KR1020247019643A Pending KR20240095464A (ko) 2019-08-15 2020-07-17 평탄화 공정, 장치, 및 물품 제조 방법

Country Status (7)

Country Link
US (1) US11034057B2 (enExample)
EP (1) EP4014248A4 (enExample)
JP (3) JP7555967B2 (enExample)
KR (2) KR102875033B1 (enExample)
CN (1) CN114097065A (enExample)
TW (1) TWI781424B (enExample)
WO (1) WO2021030823A1 (enExample)

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US11656546B2 (en) 2020-02-27 2023-05-23 Canon Kabushiki Kaisha Exposure apparatus for uniform light intensity and methods of using the same
US11443940B2 (en) * 2020-06-24 2022-09-13 Canon Kabushiki Kaisha Apparatus for uniform light intensity and methods of using the same
JP7712111B2 (ja) * 2021-05-25 2025-07-23 株式会社ディスコ 剥離方法、ウエーハの製造方法及び剥離装置
US12282251B2 (en) 2021-09-24 2025-04-22 Canon Kabushiki Kaisha Method of shaping a surface, shaping system, and method of manufacturing an article

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JP2014004826A (ja) 2012-05-31 2014-01-16 Fujikura Ltd パターン形成方法及び離型装置

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TW524873B (en) 1997-07-11 2003-03-21 Applied Materials Inc Improved substrate supporting apparatus and processing chamber
JPH11195563A (ja) * 1997-12-26 1999-07-21 Canon Inc 試料の分離装置及びその方法並びに基板の製造方法
US6391743B1 (en) * 1998-09-22 2002-05-21 Canon Kabushiki Kaisha Method and apparatus for producing photoelectric conversion device
JP3651293B2 (ja) * 1999-01-08 2005-05-25 株式会社リコー 光ディスク用スタンパ剥離装置および剥離方法
JP4311702B2 (ja) 1999-12-08 2009-08-12 キヤノン株式会社 複合部材の分離方法及び薄膜の製造方法
US6653205B2 (en) * 1999-12-08 2003-11-25 Canon Kabushiki Kaisha Composite member separating method, thin film manufacturing method, and composite member separating apparatus
JP2003017667A (ja) * 2001-06-29 2003-01-17 Canon Inc 部材の分離方法及び分離装置
US20040132301A1 (en) * 2002-09-12 2004-07-08 Harper Bruce M. Indirect fluid pressure imprinting
US7790231B2 (en) 2003-07-10 2010-09-07 Brewer Science Inc. Automated process and apparatus for planarization of topographical surfaces
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KR100780356B1 (ko) * 2006-11-27 2007-11-30 삼성전자주식회사 나노 임프린팅 장치와 이에 의한 소프트스템퍼의 이형방법
JP2010080010A (ja) * 2008-09-26 2010-04-08 Konica Minolta Opto Inc 情報記録媒体基板の製造方法
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JP2014004825A (ja) * 2012-05-31 2014-01-16 Fujikura Ltd パターン形成方法及び離型装置
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JP2012227430A (ja) * 2011-04-21 2012-11-15 Hoya Corp ナノインプリント装置及び離型方法
JP2014004826A (ja) 2012-05-31 2014-01-16 Fujikura Ltd パターン形成方法及び離型装置

Also Published As

Publication number Publication date
JP2024109753A (ja) 2024-08-14
JP7555967B2 (ja) 2024-09-25
CN114097065A (zh) 2022-02-25
WO2021030823A1 (en) 2021-02-18
KR20220031078A (ko) 2022-03-11
EP4014248A4 (en) 2023-08-30
US20210050218A1 (en) 2021-02-18
TWI781424B (zh) 2022-10-21
EP4014248A1 (en) 2022-06-22
JP2025143458A (ja) 2025-10-01
US11034057B2 (en) 2021-06-15
TW202121536A (zh) 2021-06-01
JP7713064B2 (ja) 2025-07-24
JP2022544891A (ja) 2022-10-24
KR20240095464A (ko) 2024-06-25

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