TWI781412B - 探針、檢查治具以及檢查單元 - Google Patents

探針、檢查治具以及檢查單元 Download PDF

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Publication number
TWI781412B
TWI781412B TW109118378A TW109118378A TWI781412B TW I781412 B TWI781412 B TW I781412B TW 109118378 A TW109118378 A TW 109118378A TW 109118378 A TW109118378 A TW 109118378A TW I781412 B TWI781412 B TW I781412B
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TW
Taiwan
Prior art keywords
contact
pair
probe
inspection
contact part
Prior art date
Application number
TW109118378A
Other languages
English (en)
Chinese (zh)
Other versions
TW202045943A (zh
Inventor
笹野直哉
寺西宏真
酒井貴浩
Original Assignee
日商歐姆龍股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商歐姆龍股份有限公司 filed Critical 日商歐姆龍股份有限公司
Publication of TW202045943A publication Critical patent/TW202045943A/zh
Application granted granted Critical
Publication of TWI781412B publication Critical patent/TWI781412B/zh

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06733—Geometry aspects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06705—Apparatus for holding or moving single probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06716—Elastic
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06716—Elastic
    • G01R1/06722—Spring-loaded
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G01R31/2601—Apparatus or methods therefor
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2863—Contacting devices, e.g. sockets, burn-in boards or mounting fixtures

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Geometry (AREA)
  • Environmental & Geological Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Transducers For Ultrasonic Waves (AREA)
  • Ultra Sonic Daignosis Equipment (AREA)
TW109118378A 2019-06-10 2020-06-02 探針、檢查治具以及檢查單元 TWI781412B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019-107982 2019-06-10
JP2019107982A JP7306082B2 (ja) 2019-06-10 2019-06-10 プローブピン、検査治具および検査ユニット

Publications (2)

Publication Number Publication Date
TW202045943A TW202045943A (zh) 2020-12-16
TWI781412B true TWI781412B (zh) 2022-10-21

Family

ID=70931181

Family Applications (1)

Application Number Title Priority Date Filing Date
TW109118378A TWI781412B (zh) 2019-06-10 2020-06-02 探針、檢查治具以及檢查單元

Country Status (5)

Country Link
JP (2) JP7306082B2 (ja)
KR (1) KR20220002619A (ja)
CN (2) CN210720509U (ja)
TW (1) TWI781412B (ja)
WO (1) WO2020250638A1 (ja)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI745182B (zh) * 2020-11-30 2021-11-01 中華精測科技股份有限公司 探針卡裝置及雙臂式探針
JP2022135106A (ja) * 2021-03-04 2022-09-15 オムロン株式会社 プローブピン、検査治具および検査治具ユニット
KR102602053B1 (ko) * 2021-06-16 2023-11-14 주식회사 메가터치 프로브 핀 및 그 프로브 핀을 구비한 소켓
CN113866464A (zh) * 2021-09-22 2021-12-31 深圳凯智通微电子技术有限公司 探针及集成电路测试设备

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002214286A (ja) * 2001-01-19 2002-07-31 Matsushita Electric Ind Co Ltd Ｂｇａ基板の検査装置
US20190094269A1 (en) * 2016-06-17 2019-03-28 Omron Corporation Probe pin

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001318119A (ja) 2000-05-02 2001-11-16 Fujitsu Ltd Ｉｃパッケージの接続方法及びｉｃコンタクタ
JP2002373748A (ja) 2001-06-14 2002-12-26 Yamaichi Electronics Co Ltd 半導体装置用ソケット
JP4486880B2 (ja) * 2004-12-27 2010-06-23 日本電子材料株式会社 コンタクトプローブ
JP5083430B2 (ja) * 2011-03-29 2012-11-28 山一電機株式会社 コンタクトプローブ及びそれを備えた半導体素子用ソケット
JP6269337B2 (ja) * 2014-06-16 2018-01-31 オムロン株式会社 プローブピン、および、これを用いた電子デバイス
JP6084592B2 (ja) 2014-08-05 2017-02-22 株式会社アイエスシーＩｓｃ Ｃｏ．， Ｌｔｄ． ポゴピン用プローブ部材
JP6515516B2 (ja) * 2014-12-12 2019-05-22 オムロン株式会社 プローブピン、および、これを備えた電子デバイス
JP6642359B2 (ja) * 2016-09-21 2020-02-05 オムロン株式会社 プローブピンおよび検査ユニット
KR101926672B1 (ko) 2017-03-23 2018-12-11 주식회사 엔티에스 클립 스프링 핀 및 이를 포함하는 테스트 소켓

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002214286A (ja) * 2001-01-19 2002-07-31 Matsushita Electric Ind Co Ltd Ｂｇａ基板の検査装置
US20190094269A1 (en) * 2016-06-17 2019-03-28 Omron Corporation Probe pin

Also Published As

Publication number Publication date
JP7306082B2 (ja) 2023-07-11
WO2020250638A1 (ja) 2020-12-17
JP2020201121A (ja) 2020-12-17
JP2023121805A (ja) 2023-08-31
CN113892036A (zh) 2022-01-04
TW202045943A (zh) 2020-12-16
KR20220002619A (ko) 2022-01-06
CN210720509U (zh) 2020-06-09
CN113892036B (zh) 2024-01-05

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