TWI781284B - 研削研磨裝置以及研削研磨方法 - Google Patents

研削研磨裝置以及研削研磨方法 Download PDF

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Publication number
TWI781284B
TWI781284B TW108103163A TW108103163A TWI781284B TW I781284 B TWI781284 B TW I781284B TW 108103163 A TW108103163 A TW 108103163A TW 108103163 A TW108103163 A TW 108103163A TW I781284 B TWI781284 B TW I781284B
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TW
Taiwan
Prior art keywords
grinding
wafer
holding
water
holding means
Prior art date
Application number
TW108103163A
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English (en)
Chinese (zh)
Other versions
TW201934261A (zh
Inventor
禹俊洙
長井修
守屋宗幸
Original Assignee
日商迪思科股份有限公司
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Publication date
Application filed by 日商迪思科股份有限公司 filed Critical 日商迪思科股份有限公司
Publication of TW201934261A publication Critical patent/TW201934261A/zh
Application granted granted Critical
Publication of TWI781284B publication Critical patent/TWI781284B/zh

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/015—Temperature control
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/06—Work supports, e.g. adjustable steadies
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
    • B24B55/02—Equipment for cooling the grinding surfaces, e.g. devices for feeding coolant
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
TW108103163A 2018-01-31 2019-01-28 研削研磨裝置以及研削研磨方法 TWI781284B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018014332A JP7096674B2 (ja) 2018-01-31 2018-01-31 研削研磨装置及び研削研磨方法
JP2018-014332 2018-01-31

Publications (2)

Publication Number Publication Date
TW201934261A TW201934261A (zh) 2019-09-01
TWI781284B true TWI781284B (zh) 2022-10-21

Family

ID=67483688

Family Applications (1)

Application Number Title Priority Date Filing Date
TW108103163A TWI781284B (zh) 2018-01-31 2019-01-28 研削研磨裝置以及研削研磨方法

Country Status (4)

Country Link
JP (1) JP7096674B2 (ja)
KR (1) KR102606113B1 (ja)
CN (1) CN110103131B (ja)
TW (1) TWI781284B (ja)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110625519B (zh) * 2019-08-26 2021-08-03 苏州冠博控制科技有限公司 一种高精度晶圆研磨机
JP7353715B2 (ja) * 2019-10-25 2023-10-02 株式会社ディスコ 被加工物の研削方法
JP7358222B2 (ja) * 2019-12-06 2023-10-10 株式会社ディスコ 板状物保持具
JP2022040984A (ja) 2020-08-31 2022-03-11 株式会社ディスコ 研削装置
JP2022077171A (ja) 2020-11-11 2022-05-23 株式会社ディスコ 加工装置
CN113021105B (zh) * 2021-02-25 2022-02-01 深圳市昶东鑫线路板有限公司 一种用于线路板预处理的研磨装置及其研磨方法
CN113199487B (zh) * 2021-03-30 2022-04-01 武汉数字化设计与制造创新中心有限公司 磨抛单元位姿感知方法、打磨方法和磨抛单元
JP2023053560A (ja) 2021-10-01 2023-04-13 株式会社ディスコ 研削装置

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6379230B1 (en) * 1997-04-28 2002-04-30 Nec Corporation Automatic polishing apparatus capable of polishing a substrate with a high planarization
JP2003092276A (ja) * 2001-09-19 2003-03-28 Nikon Corp 加工装置、これを用いた半導体デバイス製造方法およぴこの方法により製造される半導体デバイス。
TW200737330A (en) * 2006-03-29 2007-10-01 Okamoto Machine Tool Works Planarization apparatus and method for semiconductor wafer
JP6166958B2 (ja) * 2013-06-10 2017-07-19 株式会社ディスコ チャックテーブル及び研磨装置

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01252333A (ja) * 1988-03-30 1989-10-09 Toshiba Corp 保持装置
JPH05183042A (ja) * 1991-12-28 1993-07-23 Disco Abrasive Syst Ltd ウェーハの吸着方法
SG70097A1 (en) * 1997-08-15 2000-01-25 Disio Corp Apparatus and method for machining workpieces by flushing working liquid to the tool-and-workpiece interface
JP2009113145A (ja) * 2007-11-06 2009-05-28 Disco Abrasive Syst Ltd 研磨装置のチャックテーブル機構
JP5944724B2 (ja) * 2012-04-12 2016-07-05 株式会社ディスコ チャックテーブル
KR101920941B1 (ko) * 2012-06-08 2018-11-21 도쿄엘렉트론가부시키가이샤 기판 처리 장치, 기판 처리 방법, 유체의 공급 방법 및 기억 매체
JP6377459B2 (ja) * 2014-08-29 2018-08-22 株式会社ディスコ ウエーハ検査方法、研削研磨装置
JP6675879B2 (ja) * 2016-02-09 2020-04-08 株式会社荏原製作所 基板処理装置及び制御方法
JP6622140B2 (ja) * 2016-04-18 2019-12-18 株式会社ディスコ チャックテーブル機構及び搬送方法
JP6792363B2 (ja) * 2016-07-22 2020-11-25 株式会社ディスコ 研削装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6379230B1 (en) * 1997-04-28 2002-04-30 Nec Corporation Automatic polishing apparatus capable of polishing a substrate with a high planarization
JP2003092276A (ja) * 2001-09-19 2003-03-28 Nikon Corp 加工装置、これを用いた半導体デバイス製造方法およぴこの方法により製造される半導体デバイス。
TW200737330A (en) * 2006-03-29 2007-10-01 Okamoto Machine Tool Works Planarization apparatus and method for semiconductor wafer
JP6166958B2 (ja) * 2013-06-10 2017-07-19 株式会社ディスコ チャックテーブル及び研磨装置

Also Published As

Publication number Publication date
JP7096674B2 (ja) 2022-07-06
KR20190093122A (ko) 2019-08-08
TW201934261A (zh) 2019-09-01
CN110103131B (zh) 2023-04-18
KR102606113B1 (ko) 2023-11-23
CN110103131A (zh) 2019-08-09
JP2019130607A (ja) 2019-08-08

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