TW202344349A - 卡盤台及研削裝置 - Google Patents

卡盤台及研削裝置 Download PDF

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TW202344349A
TW202344349A TW112101711A TW112101711A TW202344349A TW 202344349 A TW202344349 A TW 202344349A TW 112101711 A TW112101711 A TW 112101711A TW 112101711 A TW112101711 A TW 112101711A TW 202344349 A TW202344349 A TW 202344349A
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grinding
wafer
chuck table
holding surface
porous plate
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中村勝
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日商迪思科股份有限公司
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/06—Work supports, e.g. adjustable steadies
    • B24B41/068—Table-like supports for panels, sheets or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/06—Work supports, e.g. adjustable steadies
    • B24B41/061—Work supports, e.g. adjustable steadies axially supporting turning workpieces, e.g. magnetically, pneumatically
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B13/00—Accessories or details of general applicability for machines or apparatus for cleaning
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/02—Cleaning by the force of jets or sprays
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/06—Work supports, e.g. adjustable steadies
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
    • B24B55/02—Equipment for cooling the grinding surfaces, e.g. devices for feeding coolant
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
    • B24B55/06—Dust extraction equipment on grinding or polishing machines
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
    • B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
    • B24B7/226—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain in which the tool is supported by the workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
    • B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)

Abstract

[課題]提供一種卡盤台及研削裝置，其等可解決搬送機構的吸附墊吸引汙染物而汙染吸附墊之問題、多孔板產生氣孔堵塞之問題。[解決手段]一種研削裝置，其包含：卡盤台，其保持晶圓；研削單元，其能旋轉地具備環狀地配設有多個研削磨石之研削輪，所述多個研削磨石研削被保持於卡盤台之晶圓；以及研削水供給單元，其將研削水W供給至研削磨石與晶圓。卡盤台包含：多孔板，其具有吸引保持晶圓之保持面；以及框體，其支撐多孔板的外周及底面，並將負壓、正壓傳遞至保持面，並且，框體形成有從保持面側至側面之多個槽。

Description

卡盤台及研削裝置
本發明關於一種保持晶圓之卡盤台以及一種研削被保持於卡盤台之晶圓之研削裝置。
在正面形成有藉由交叉之多條分割預定線所劃分之IC、LSI等多個元件之晶圓係被研削裝置研削背面，在被形成為所要求的厚度後，藉由切割裝置、雷射加工裝置而被分割成一個個元件晶片，經分割之元件晶片被利用於手機、個人電腦等電子設備。
研削裝置係包含以下構件所構成，並可將晶圓加工成所要求的厚度：卡盤台，其保持晶圓；研削單元，其能旋轉地具備環狀地配設有多個研削磨石之研削輪，所述多個研削磨石研削被保持於該卡盤台之晶圓；以及研削水供給單元，其將研削水供給至研削磨石與晶圓（例如，參照專利文獻1）。 [習知技術文獻] [專利文獻]
[專利文獻1]日本特開2009-246098號公報
[發明所欲解決的課題] 然而，在上述之研削裝置中，若研削被保持於卡盤台之晶圓，則研削時所產生之汙染物（研削屑）會混入研削時所供給之研削水，且滯留於卡盤台的外周，在從卡盤台搬出晶圓時，有搬送機構的吸附墊會吸引該汙染物而汙染吸附墊之問題。
並且，在卡盤台吸引保持下一個晶圓時，會有吸引已混入汙染物之研削水而在構成卡盤台之多孔板產生氣孔堵塞之問題。
因此，本發明之目的係提供一種卡盤台及研削裝置，其等可解決搬送機構的吸附墊吸引該汙染物而汙染吸附墊之問題以及多孔板產生氣孔堵塞之問題。
[解決課題的技術手段] 根據本發明的一態樣，提供一種卡盤台，其保持晶圓，且具備：多孔板，其具有吸引保持晶圓之保持面；以及框體，其支撐該多孔板的外周及底面，並將負壓、正壓傳遞至該保持面，並且，該框體形成有從該保持面側至側面之多個槽。
根據本發明的另一態樣，提供一種研削裝置，其具備：卡盤台，其保持晶圓；研削單元，其能旋轉地具備環狀地配設有多個研削磨石之研削輪，所述多個研削磨石研削被保持於該卡盤台之該晶圓；以及研削水供給單元，其將研削水供給至該研削磨石與該晶圓，該卡盤台包含：多孔板，其具有吸引保持該晶圓之保持面；以及框體，其支撐該多孔板的外周及底面，並將負壓、正壓傳遞至該保持面，並且，該框體形成有從該保持面側至側面之多個槽。
[發明功效] 根據本發明的卡盤台，在被應用於研削裝置之情形中，藉由槽中之毛細現象與從框體的側面流落之研削水的表面張力，而已混入汙染物等之研削水會從卡盤台的外周亦即框體的上表面流暢地流下，而抑制該研削水滯留於卡盤台的外周。藉此，解決在從卡盤台搬出加工完畢的晶圓時，吸附晶圓之吸附墊吸引加工時所產生之汙染物等而汙染該吸附墊之問題。
根據本發明的研削裝置，藉由形成於框體之槽的毛細現象與從框體的側面流落之研削水的表面張力，而已混入該汙染物等之研削水會從卡盤台的外周亦即框體的上表面流暢地流下，而抑制滯留於卡盤台的外周的狀況。藉此，解決在從卡盤台搬出研削加工完畢的晶圓時，吸附晶圓之吸附墊吸引加工時所產生之汙染物等而汙染該吸附墊之問題。
以下，針對本發明實施方式的卡盤台及研削被保持於卡盤台之晶圓之研削裝置，一邊參照隨附圖式，一邊詳細地進行說明。
圖1中表示本發明實施方式的被保持於研削裝置1（參照圖2）的卡盤台3並被研削之晶圓10。晶圓10在正面10a形成有藉由交叉之多條分割預定線14所劃分之多個元件12，且在研削晶圓10時將保護膠膜T黏貼於正面10a。
圖2中表示本實施方式的研削晶圓10之研削裝置1的整體立體圖。研削裝置1至少具備：卡盤台3，其保持上述的晶圓10；研削單元4，其研削被保持於卡盤台3之晶圓10的背面10b；升降機構5，其使研削單元4在Z軸方向（上下方向）升降；以及研削水供給單元6，其將研削水W供給至研削單元4的研削磨石43與晶圓10。
如由圖2、圖3所理解，卡盤台3具備：多孔板31，其具有吸引保持晶圓10之保持面31a；以及框體32，其支撐多孔板31的外周及底面，並將負壓（negative pressure）、正壓（positive pressure）傳遞至該保持面31a。多孔板31係由具有通氣性之構件所構成。框體32在全周形成有從保持面31a側至側面之多個槽33。各槽33的寬度例如被形成為1～2mm左右的寬度。
卡盤台3被構成為能藉由省略圖示之旋轉驅動機構而旋轉，且藉由容納於裝置外殼2的內部之省略圖示之X軸移動機構，而被移動至X軸方向的任意的位置，例如，將圖中前側的晶圓10進行搬入、搬出之搬出搬入位置以及在研削單元4的正下方施加研削加工之研削加工位置。
如圖4所示，框體32係透過連通路徑73及連通路徑71而與吸引源7連接，透過連通路徑73、74及81而與水源8連接，透過連通路徑73、74及91而與空氣供給源9連接。連通路徑71配設有開關閥72，連通路徑81配設有開關閥82，連通路徑91配設有開關閥92。藉由關閉開關閥82、92並開放開關閥72且使吸引源7運作，而可透過框體32傳遞負壓，在多孔板31的保持面31a生成負壓。並且，藉由關閉開關閥72、92並開放開關閥82且使水源8運作，而可透過框體32供給清洗水並使清洗用的水噴出至多孔板31的保持面31a。再者，藉由關閉開關閥72、82並開放開關閥92且使空氣供給源9運作，而可透過框體32傳遞正壓，在多孔板31的保持面31a生成正壓。並且，藉由關閉開關閥72且開放開關閥82、92並使水源8與空氣供給源9運作，而可使空氣與水的混合流體噴出至多孔板31的保持面31a。
如圖2所示，研削單元4至少具備：旋轉軸41；研削輪42，其配設於旋轉軸41的下端；多個研削磨石4，其等環狀地配設於研削輪42的底面；電動馬達44，其使該旋轉軸41旋轉；支撐部45，其支撐該研削單元4；以及Z軸移動基台46，其被支撐在裝置外殼2的垂直壁部2a且能與支撐部45一起在Z軸方向升降。升降機構5係將脈衝馬達51的旋轉運動透過藉由脈衝馬達51而被旋轉之滾珠螺桿52轉換成直線運動並傳遞至Z軸移動基台46，而能使研削單元4移動至Z軸方向（上下方向）中之任意的位置。研削水供給單元6具備：研削水供給源61、連通路徑62以及開關連通路徑62之開關閥63，該連通路徑62係與研削單元4的旋轉軸41的上端41a連接。從研削水供給源61供給之研削水W係經由旋轉軸41的內部而被供給至被保持於卡盤台3之晶圓10與研削該晶圓10之研削磨石43。研削裝置1具備省略圖示之控制器，藉由該控制器所指示之控制訊號而控制上述之各運作部。
本實施方式的研削裝置1及卡盤台3具備大致如同上述的構成，以下針對其功能、作用進行說明。
在藉由上述之研削裝置1而研削晶圓10的背面10b時，如圖2所示，將卡盤台3移動至搬出搬入位置，將晶圓10的背面10b側朝向上方，將保護膠膜T側朝向下方，並載置於卡盤台3的保持面31a上。接下來，將根據圖4所說明之開關閥72開放且使吸引源7運作，而在多孔板31的保持面31a生成負壓並吸引保持晶圓10。
接下來，使上述之X軸移動手段機構運作，將卡盤台3定位於研削單元4的正下方的研削加工位置。然後，如圖5所示，使未圖示之旋轉機構運作而使卡盤台3往箭頭R1所示之方向以預定的旋轉速度（例如300rpm）旋轉，且使研削單元4的旋轉軸41往箭頭R2所示之方向以預定的旋轉速度（例如3000rpm）旋轉。接下來，使上述之升降機構5運作而使研削單元4往箭頭R3所示之方向下降，使研削磨石43抵接於晶圓10的背面10b，且使上述的研削水供給單元6運作，而透過旋轉軸41將研削水W供給至研削磨石43與晶圓10的背面。如此進行，一邊以預定的速度（例如1μm/秒鐘）將研削單元4進行研削進給，一邊研削並薄化晶圓10直至成為預定的厚度為止。此外，在實施此研削加工時，使省略圖示之厚度量測器運作，可一邊量測晶圓10的厚度一邊實施上述研削加工。
如上所述，若藉由本實施方式的研削裝置1而實施研削加工，則因在卡盤台3的框體32形成有從保持面31a側至側面之多個槽33，故被供給至研削磨石43與晶圓10之已混入汙染物之研削水W係藉由槽33的毛細現象與從框體32的側面流落之研削水W的表面張力而從卡盤台3的外周亦即框體32的上表面流暢地流下，而抑制滯留於卡盤台3的外周的狀況。藉此，解決在研削加工後停止該吸引源7的運作且從卡盤台3搬出晶圓10時，省略圖示之吸附墊吸引汙染物而汙染該吸附墊之問題。
若上述之研削加工結束，則關閉上述之開關閥72、92並開放開關閥82且使水源8運作，使清洗用的水從多孔板31的保持面31a噴出而清洗多孔板31，或者，關閉開關閥72且開放開關閥82、92並使水源8與空氣供給源9運作，藉此使空氣與水的混合流體噴出至多孔板31的保持面31a而進行清洗，關閉開關閥72、82並開放開關閥92且使空氣供給源9運作，藉此將乾燥用的空氣供給至多孔板31而使其乾燥。此時，亦藉由在卡盤台3的框體32形成有上述的槽33，而從框體32的內部噴出至多孔板31的保持面31a之清洗水會清洗多孔板31且在框體32外流暢地流下，而抑制滯留於框體32上的狀況，因此解決在卡盤台3的多孔板31吸引保持下一個晶圓10時，吸引滯留於框體32上之包含汙染物等之水而造成氣孔堵塞之問題。
1:研削裝置 2:裝置外殼 3:卡盤台 31:多孔板 31a:保持面 32:框體 33:槽 4:研削單元 41:旋轉軸 41a:上端 42:研削輪 43:研削磨石 44:電動馬達 45:支撐部 46:Z軸移動基台 5:升降機構 51:脈衝馬達 52:滾珠螺桿 6:研削水供給單元 61:研削水供給源 62:連通路徑 63:開關閥 7:吸引源 71,73,74:連通路徑 72:開關閥 8:水源 81:連通路徑 82:開關閥 9:空氣供給源 91:連通路徑 92:開關閥 10:晶圓 12:元件 14:分割預定線 T:保護膠膜 W:研削水
圖1係本發明實施方式的被保持於卡盤台之晶圓的立體圖。 圖2係本發明實施方式的研削裝置的整體立體圖。 圖3係表示將晶圓保持於圖2所示之研削裝置的卡盤台之態樣之立體圖。 圖4係表示在圖2所示之卡盤台連接吸引源、水源、空氣供給源之態樣之剖面圖。 圖5係表示在圖2所示之研削裝置中研削晶圓之態樣之立體圖。
10:晶圓
10a:正面
10b:背面
12:元件
14:分割預定線
T:保護膠膜

Claims (2)

  1. 一種卡盤台，其保持晶圓，且具備： 多孔板，其具有吸引保持該晶圓之保持面；以及 框體，其支撐該多孔板的外周及底面，並將負壓、正壓傳遞至該保持面， 該框體形成有從該保持面側至側面之多個槽。
  2. 一種研削裝置，其具備： 卡盤台，其保持晶圓； 研削單元，其能旋轉地具備環狀地配設有多個研削磨石之研削輪，所述多個研削磨石研削被保持於該卡盤台之該晶圓；以及 研削水供給單元，其將研削水供給至該研削磨石與該晶圓， 該卡盤台包含：多孔板，其具有吸引保持該晶圓之保持面；以及框體，其支撐該多孔板的外周及底面，並將負壓、正壓傳遞至該保持面， 該框體形成有從該保持面側至側面之多個槽。
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