CN116494124A - 卡盘工作台和磨削装置 - Google Patents
卡盘工作台和磨削装置 Download PDFInfo
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/06—Work supports, e.g. adjustable steadies
- B24B41/068—Table-like supports for panels, sheets or the like
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/06—Work supports, e.g. adjustable steadies
- B24B41/061—Work supports, e.g. adjustable steadies axially supporting turning workpieces, e.g. magnetically, pneumatically
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B13/00—Accessories or details of general applicability for machines or apparatus for cleaning
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/02—Cleaning by the force of jets or sprays
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
- B24B37/30—Work carriers for single side lapping of plane surfaces
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/06—Work supports, e.g. adjustable steadies
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
- B24B55/02—Equipment for cooling the grinding surfaces, e.g. devices for feeding coolant
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
- B24B55/06—Dust extraction equipment on grinding or polishing machines
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
- B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
- B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
- B24B7/226—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain in which the tool is supported by the workpiece
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
- B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
- B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
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- Inorganic Chemistry (AREA)
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- General Physics & Mathematics (AREA)
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- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Grinding Of Cylindrical And Plane Surfaces (AREA)
Abstract
本发明提供卡盘工作台和磨削装置,该卡盘工作台和该磨削装置能够消除搬送机构的吸附垫吸引污染物而污染吸附垫的问题以及在多孔板中产生堵塞的问题。该磨削装置包含:卡盘工作台,其对晶片进行保持;磨削单元,其具有能够旋转的磨削磨轮,该磨削磨轮呈环状配设有对卡盘工作台所保持的晶片进行磨削的多个磨削磨具;以及磨削水提供单元,其向磨削磨具和晶片提供磨削水(W)。卡盘工作台包含:多孔板,其具有对晶片进行吸引保持的保持面;以及框体,其对多孔板的外周和底面进行支承,并向保持面传递负压、正压,在框体上形成有从保持面侧到达侧面的多个槽。
Description
技术领域
本发明涉及对晶片进行保持的卡盘工作台和对卡盘工作台所保持的晶片进行磨削的磨削装置。
背景技术
由交叉的多条分割预定线划分而在正面上形成有IC、LSI等多个器件的晶片在通过磨削装置对背面进行磨削而形成为期望的厚度之后,通过切割装置、激光加工装置分割成各个器件芯片,分割得到的器件芯片用于移动电话、个人计算机等电子设备。
磨削装置构成为包含:卡盘工作台,其对晶片进行保持;磨削单元,其具有能够旋转的磨削磨轮,该磨削磨轮呈环状配设有对该卡盘工作台所保持的晶片进行磨削的多个磨削磨具;以及磨削水提供单元,其向磨削磨具和晶片提供磨削水,该磨削装置能够将晶片加工成期望的厚度(例如参照专利文献1)。
专利文献1:日本特开2009-246098号公报
但是,存在如下的问题:当在上述磨削装置中对卡盘工作台所保持的晶片进行磨削时,磨削时产生的污染物(磨削屑)会混入磨削时提供的磨削水而滞留在卡盘工作台的外周,在将晶片从卡盘工作台搬出时,搬送机构的吸附垫会吸引该污染物而污染吸附垫。
另外,存在如下的问题:在卡盘工作台对接下来的晶片进行吸引保持时,会吸引混入有污染物的磨削水而在构成卡盘工作台的多孔板中产生堵塞。
发明内容
由此,本发明的目的在于提供卡盘工作台和磨削装置,该卡盘工作台和该磨削装置能够消除搬送机构的吸附垫吸引污染物而污染吸附垫的问题以及在多孔板中产生堵塞的问题。
根据本发明的一个方式,提供卡盘工作台,其对晶片进行保持,其中,该卡盘工作台具有:多孔板,其具有对该晶片进行吸引保持的保持面;以及框体,其对该多孔板的外周和底面进行支承,并向该保持面传递负压、正压,在该框体上形成有从该保持面侧到达侧面的多个槽。
根据本发明的另一方式,提供磨削装置,其中,该磨削装置具有:卡盘工作台,其对晶片进行保持;磨削单元,其具有能够旋转的磨削磨轮,该磨削磨轮呈环状配设有对该卡盘工作台所保持的该晶片进行磨削的多个磨削磨具;以及磨削水提供单元,其向该磨削磨具和该晶片提供磨削水,该卡盘工作台包含:多孔板,其具有对该晶片进行吸引保持的保持面;以及框体,其对该多孔板的外周和底面进行支承,并向该保持面传递负压、正压,在该框体上形成有从该保持面侧到达侧面的多个槽。
根据本发明的卡盘工作台,在应用于磨削装置的情况下,通过槽中的毛细管现象和从框体的侧面流下的磨削水的表面张力,使混入有污染物等的磨削水从卡盘工作台的外周即框体的上表面顺利地流下,从而抑制该磨削水滞留在卡盘工作台的外周。由此,能够消除当从卡盘工作台搬出加工完成的晶片时对晶片进行吸附的吸附垫吸引加工时产生的污染物等而污染该吸附垫的问题。
根据本发明的磨削装置,通过形成于框体的槽的毛细管现象和从框体的侧面流下的磨削水的表面张力,使混入有污染物等的磨削水从卡盘工作台的外周即框体的上表面顺利地流下,从而抑制该磨削水滞留在卡盘工作台的外周。由此,能够消除当从卡盘工作台搬出磨削加工完成的晶片时对晶片进行吸附的吸附垫吸引加工时产生的污染物等而污染该吸附垫的问题。
附图说明
图1是本发明实施方式的卡盘工作台所保持的晶片的立体图。
图2是本发明实施方式的磨削装置的整体立体图。
图3是示出将晶片保持于图2所示的磨削装置的卡盘工作台的方式的立体图。
图4是示出在图2所示的卡盘工作台上连接吸引源、水源以及空气提供源的方式的剖视图。
图5是示出在图2所示的磨削装置中对晶片进行磨削的方式的立体图。
标号说明
1:磨削装置;2:装置壳体;3:卡盘工作台;31:多孔板;31a:保持面;32:框体;33:槽;4:磨削单元;41:旋转轴;41a:上端;42:磨削磨轮;43:磨削磨具;44:电动机;45:支承部;46:Z轴移动基台;5:升降机构;51:脉冲电动机;52:滚珠丝杠;6:磨削水提供单元;61:磨削水提供源;62:连通路;63:开闭阀;7:吸引源;71、73、74:连通路;72:开闭阀;8:水源;81:连通路;82:开闭阀;9:空气提供源;91:连通路;92:开闭阀;10:晶片;12:器件;14:分割预定线;T:保护带;W:磨削水。
具体实施方式
以下,参照附图对本发明实施方式的卡盘工作台和对卡盘工作台所保持的晶片进行磨削的磨削装置进行详细说明。
在图1中示出被本实施方式的磨削装置1(参照图2)的卡盘工作台3保持并磨削的晶片10。晶片10由交叉的多条分割预定线14划分而在正面10a上形成有多个器件12,在晶片10的磨削时,在正面10a上粘贴保护带T。
在图2中示出对本实施方式的晶片10进行磨削的磨削装置1的整体立体图。磨削装置1至少具有:对上述晶片10进行保持的卡盘工作台3;对卡盘工作台3所保持的晶片10的背面10b进行磨削的磨削单元4;使磨削单元4在Z轴方向(上下方向)上升降的升降机构5;以及向磨削单元4的磨削磨具43和晶片10提供磨削水W的磨削水提供单元6。
由图2、图3可理解,卡盘工作台3具有:多孔板31,其具有对晶片10进行吸引保持的保持面31a;以及框体32,其对多孔板31的外周和底面进行支承,并向该保持面31a传递负压、正压。多孔板31由具有通气性的部件构成。在框体32上沿着整周形成有从保持面31a侧到达侧面的多个槽33。各槽33的宽度例如以1mm~2mm左右的宽度形成。
卡盘工作台3构成为能够通过省略图示的旋转驱动机构进行旋转,通过收纳于装置壳体2的内部的省略图示的X轴移动单元机构移动至X轴方向的任意的位置例如图中近前侧的搬入、搬出晶片10的搬出搬入位置、以及在磨削单元4的正下方实施磨削加工的磨削加工位置。
如图4所示,在框体32上经由连通路73和连通路71而连接有吸引源7,经由连通路73、74和81而连接有水源8,经由连通路73、74和91而连接有空气提供源9。在连通路71上配设有开闭阀72,在连通路81上配设有开闭阀82,在连通路91上配设有开闭阀92。通过将开闭阀82、92关闭、将开闭阀72打开,并且使吸引源7进行动作,能够经由框体32而传递负压,在多孔板31的保持面31a上产生负压。另外,通过将开闭阀72、92关闭、将开闭阀82打开,并且使水源8进行动作,能够经由框体32而提供清洗水,向多孔板31的保持面31a喷出清洗用的水。另外,通过将开闭阀72、82关闭、将开闭阀92打开,并且使空气提供源9进行动作,能够经由框体32而传递正压,在多孔板31的保持面31a上产生正压。另外,通过将开闭阀72关闭、将开闭阀82、92打开且使水源8和空气提供源9进行动作,能够将空气与水的混合流体喷出到多孔板31的保持面31a上。
如图2所示,磨削单元4至少具有:旋转轴41;配设于旋转轴41的下端的磨削磨轮42;在磨削磨轮42的下表面呈环状配设有多个的磨削磨具43;使该旋转轴41旋转的电动机44;对该磨削单元4进行支承的支承部45;以及在装置壳体2的垂直壁部2a上被支承为能够与支承部45一起在Z轴方向上升降的Z轴移动基台46。升降机构5能够将脉冲电动机51的旋转运动经由通过脉冲电动机51进行旋转的滚珠丝杠52转换成直线运动而传递至Z轴移动基台46,使磨削单元4移动至Z轴方向(上下方向)的任意位置。磨削水提供单元6具有磨削水提供源61、连通路62以及将连通路62开闭的开闭阀63,该连通路62与磨削单元4的旋转轴41的上端41a连接。从磨削水提供源61提供的磨削水W经由旋转轴41的内部而提供至卡盘工作台3所保持的晶片10和对该晶片10进行磨削的磨削磨具43。磨削装置1具有省略图示的控制器,通过从该控制器指示的控制信号,控制上述各动作部。
本实施方式的磨削装置1和卡盘工作台3具有大致如上所述的结构,以下对它们的功能、作用进行说明。
在通过上述磨削装置1对晶片10的背面10b进行磨削时,如图2所示,使卡盘工作台3移动至搬出搬入位置,使晶片10的背面10b侧朝向上方、使保护带T侧朝向下方而载置于卡盘工作台3的保持面31a上。接着,将根据图4进行了说明的开闭阀72打开并且使吸引源7进行动作,在多孔板31的保持面31a上产生负压而对晶片10进行吸引保持。
接着,使上述X轴移动单元机构进行动作,将卡盘工作台3定位于磨削单元4的正下方的磨削加工位置。并且,如图5所示,使未图示的旋转驱动机构进行动作而使卡盘工作台3在箭头R1所示的方向上以规定的旋转速度(例如300rpm)旋转,并且使磨削单元4的旋转轴41在箭头R2所示的方向上以规定的旋转速度(例如3000rpm)旋转。接着,使上述升降机构5进行动作而使磨削单元4在箭头R3所示的方向上下降,使磨削磨具43与晶片10的背面10b抵接,并且使上述磨削水提供单元6进行动作,经由旋转轴41而将磨削水W提供至磨削磨具43和晶片10的背面10b。这样,一边将磨削单元4以规定的速度(例如1μm/秒)进行磨削进给,一边将晶片10磨削而薄化至规定的厚度。另外,在实施该磨削加工时,能够使省略图示的厚度测量器进行动作而一边测量晶片10的厚度一边实施上述磨削加工。
如上所述,当通过本实施方式的磨削装置1实施磨削加工时,在卡盘工作台3的框体32上形成有从保持面31a侧到达侧面的多个槽33,因此提供至磨削磨具43和晶片10且混入有污染物的磨削水W通过槽33的毛细管现象和从框体32的侧面流下的磨削水W的表面张力而从卡盘工作台3的外周即框体32的上表面顺利地流下,从而抑制该磨削水W滞留在卡盘工作台3的外周。由此,能够消除在磨削加工后,使该吸引源7的动作停止而从卡盘工作台3搬出晶片10时省略图示的吸附垫吸引污染物而污染该吸附垫的问题。
若结束了上述磨削加工,则将上述开闭阀72、92关闭、将开闭阀82打开,并且使水源8进行动作而从多孔板31的保持面31a喷出清洗用的水,对多孔板31进行清洗,或者将开闭阀72关闭、将开闭阀82、92打开且使水源8和空气提供源9进行动作,由此将空气与水的混合流体喷出到多孔板31的保持面31a而进行清洗,将开闭阀72、82关闭、将开闭阀92打开,并且使空气提供源9进行动作,由此向多孔板31提供干燥用的空气而使多孔板31干燥。此时,在卡盘工作台3的框体32上形成有上述槽33,由此从框体32的内部喷出到多孔板31的保持面31a侧的清洗水对多孔板31进行清洗,并且顺利地流到框体32外,从而抑制清洗水滞留在框体32上的情况,因此能够消除当卡盘工作台3的多孔板31对接下来的晶片10进行吸引保持时吸引滞留在框体32上的包含污染物等的水而引起堵塞的问题。
Claims (2)
1.一种卡盘工作台,其对晶片进行保持,其中,
该卡盘工作台具有:
多孔板,其具有对该晶片进行吸引保持的保持面;以及
框体,其对该多孔板的外周和底面进行支承,并向该保持面传递负压、正压,
在该框体上形成有从该保持面侧到达侧面的多个槽。
2.一种磨削装置,其中,
该磨削装置具有:
卡盘工作台,其对晶片进行保持;
磨削单元,其具有能够旋转的磨削磨轮,该磨削磨轮呈环状配设有对该卡盘工作台所保持的该晶片进行磨削的多个磨削磨具;以及
磨削水提供单元,其向该磨削磨具和该晶片提供磨削水,
该卡盘工作台包含:
多孔板,其具有对该晶片进行吸引保持的保持面;以及
框体,其对该多孔板的外周和底面进行支承,并向该保持面传递负压、正压,
在该框体上形成有从该保持面侧到达侧面的多个槽。
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