TWI780283B - 觸控感測器面板用透明膜基材及使用其之觸控感測器面板 - Google Patents
觸控感測器面板用透明膜基材及使用其之觸控感測器面板 Download PDFInfo
- Publication number
- TWI780283B TWI780283B TW107145627A TW107145627A TWI780283B TW I780283 B TWI780283 B TW I780283B TW 107145627 A TW107145627 A TW 107145627A TW 107145627 A TW107145627 A TW 107145627A TW I780283 B TWI780283 B TW I780283B
- Authority
- TW
- Taiwan
- Prior art keywords
- transparent film
- touch sensor
- polyimide
- film substrate
- sensor panel
- Prior art date
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- 239000000758 substrate Substances 0.000 title claims abstract description 134
- 229920001721 polyimide Polymers 0.000 claims abstract description 99
- 239000000463 material Substances 0.000 claims description 31
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 29
- 239000002245 particle Substances 0.000 claims description 11
- 239000000377 silicon dioxide Substances 0.000 claims description 8
- 239000007787 solid Substances 0.000 claims description 8
- 238000001514 detection method Methods 0.000 claims description 6
- 235000012239 silicon dioxide Nutrition 0.000 claims description 6
- 238000000034 method Methods 0.000 abstract description 23
- 230000008569 process Effects 0.000 abstract description 18
- 239000010408 film Substances 0.000 description 141
- -1 pylyl groups Chemical group 0.000 description 56
- 239000004642 Polyimide Substances 0.000 description 49
- 239000002966 varnish Substances 0.000 description 34
- 125000000962 organic group Chemical group 0.000 description 27
- 229910052731 fluorine Inorganic materials 0.000 description 21
- 125000003118 aryl group Chemical group 0.000 description 20
- 230000008859 change Effects 0.000 description 19
- 239000010410 layer Substances 0.000 description 19
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 18
- 239000011737 fluorine Substances 0.000 description 18
- 239000010954 inorganic particle Substances 0.000 description 17
- 125000001424 substituent group Chemical group 0.000 description 17
- 239000002904 solvent Substances 0.000 description 16
- 238000005452 bending Methods 0.000 description 15
- 230000000052 comparative effect Effects 0.000 description 14
- 238000001035 drying Methods 0.000 description 14
- 125000005647 linker group Chemical group 0.000 description 11
- 238000004519 manufacturing process Methods 0.000 description 11
- 229920000642 polymer Polymers 0.000 description 11
- 238000002834 transmittance Methods 0.000 description 11
- YEJRWHAVMIAJKC-UHFFFAOYSA-N 4-Butyrolactone Chemical compound O=C1CCCO1 YEJRWHAVMIAJKC-UHFFFAOYSA-N 0.000 description 10
- 125000003277 amino group Chemical group 0.000 description 9
- 239000011521 glass Substances 0.000 description 9
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 9
- 239000011164 primary particle Substances 0.000 description 9
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 8
- GTDPSWPPOUPBNX-UHFFFAOYSA-N ac1mqpva Chemical compound CC12C(=O)OC(=O)C1(C)C1(C)C2(C)C(=O)OC1=O GTDPSWPPOUPBNX-UHFFFAOYSA-N 0.000 description 8
- 125000001153 fluoro group Chemical group F* 0.000 description 8
- 125000001931 aliphatic group Chemical group 0.000 description 7
- 239000011248 coating agent Substances 0.000 description 7
- 238000000576 coating method Methods 0.000 description 7
- 150000004985 diamines Chemical class 0.000 description 7
- 125000006158 tetracarboxylic acid group Chemical group 0.000 description 7
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 6
- 150000001263 acyl chlorides Chemical class 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 6
- 239000002184 metal Substances 0.000 description 6
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 5
- 150000004703 alkoxides Chemical class 0.000 description 5
- 150000004984 aromatic diamines Chemical class 0.000 description 5
- 239000003795 chemical substances by application Substances 0.000 description 5
- 238000004040 coloring Methods 0.000 description 5
- 238000005259 measurement Methods 0.000 description 5
- 239000000126 substance Substances 0.000 description 5
- 230000001629 suppression Effects 0.000 description 5
- IAZDPXIOMUYVGZ-UHFFFAOYSA-N Dimethylsulphoxide Chemical compound CS(C)=O IAZDPXIOMUYVGZ-UHFFFAOYSA-N 0.000 description 4
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 4
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 description 4
- 125000002015 acyclic group Chemical group 0.000 description 4
- 125000002723 alicyclic group Chemical group 0.000 description 4
- 125000000217 alkyl group Chemical group 0.000 description 4
- 125000004432 carbon atom Chemical group C* 0.000 description 4
- 125000005843 halogen group Chemical group 0.000 description 4
- 238000002360 preparation method Methods 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 229920006395 saturated elastomer Polymers 0.000 description 4
- 239000003566 sealing material Substances 0.000 description 4
- 239000002210 silicon-based material Substances 0.000 description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical group [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 3
- 150000001491 aromatic compounds Chemical class 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 3
- 229910052799 carbon Inorganic materials 0.000 description 3
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 3
- 238000011156 evaluation Methods 0.000 description 3
- 238000005227 gel permeation chromatography Methods 0.000 description 3
- 125000005842 heteroatom Chemical group 0.000 description 3
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 3
- 150000003961 organosilicon compounds Chemical class 0.000 description 3
- 229920000139 polyethylene terephthalate Polymers 0.000 description 3
- 239000005020 polyethylene terephthalate Substances 0.000 description 3
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 3
- DLFVBJFMPXGRIB-UHFFFAOYSA-N Acetamide Chemical compound CC(N)=O DLFVBJFMPXGRIB-UHFFFAOYSA-N 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 2
- 229920000178 Acrylic resin Polymers 0.000 description 2
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 2
- BOTDANWDWHJENH-UHFFFAOYSA-N Tetraethyl orthosilicate Chemical compound CCO[Si](OCC)(OCC)OCC BOTDANWDWHJENH-UHFFFAOYSA-N 0.000 description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 2
- 150000008065 acid anhydrides Chemical class 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 125000002877 alkyl aryl group Chemical group 0.000 description 2
- 125000002947 alkylene group Chemical group 0.000 description 2
- 239000003963 antioxidant agent Substances 0.000 description 2
- 125000003710 aryl alkyl group Chemical group 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 125000000753 cycloalkyl group Chemical group 0.000 description 2
- 150000001991 dicarboxylic acids Chemical class 0.000 description 2
- 239000006185 dispersion Substances 0.000 description 2
- 239000003063 flame retardant Substances 0.000 description 2
- 230000009477 glass transition Effects 0.000 description 2
- 125000001072 heteroaryl group Chemical group 0.000 description 2
- 125000000592 heterocycloalkyl group Chemical group 0.000 description 2
- 239000000314 lubricant Substances 0.000 description 2
- 229920002521 macromolecule Polymers 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 238000006068 polycondensation reaction Methods 0.000 description 2
- 239000003381 stabilizer Substances 0.000 description 2
- 230000000930 thermomechanical effect Effects 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- WYTZZXDRDKSJID-UHFFFAOYSA-N (3-aminopropyl)triethoxysilane Chemical compound CCO[Si](OCC)(OCC)CCCN WYTZZXDRDKSJID-UHFFFAOYSA-N 0.000 description 1
- NGNBDVOYPDDBFK-UHFFFAOYSA-N 2-[2,4-di(pentan-2-yl)phenoxy]acetyl chloride Chemical compound CCCC(C)C1=CC=C(OCC(Cl)=O)C(C(C)CCC)=C1 NGNBDVOYPDDBFK-UHFFFAOYSA-N 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 150000008064 anhydrides Chemical class 0.000 description 1
- 229910002092 carbon dioxide Inorganic materials 0.000 description 1
- 239000001569 carbon dioxide Substances 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 125000000118 dimethyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005401 electroluminescence Methods 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 239000002346 layers by function Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 239000006082 mold release agent Substances 0.000 description 1
- 125000002950 monocyclic group Chemical group 0.000 description 1
- PHQOGHDTIVQXHL-UHFFFAOYSA-N n'-(3-trimethoxysilylpropyl)ethane-1,2-diamine Chemical compound CO[Si](OC)(OC)CCCNCCN PHQOGHDTIVQXHL-UHFFFAOYSA-N 0.000 description 1
- 125000005010 perfluoroalkyl group Chemical group 0.000 description 1
- 125000000843 phenylene group Chemical group C1(=C(C=CC=C1)*)* 0.000 description 1
- 125000003367 polycyclic group Chemical group 0.000 description 1
- 229920006254 polymer film Polymers 0.000 description 1
- 238000001955 polymer synthesis method Methods 0.000 description 1
- 230000000379 polymerizing effect Effects 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000011856 silicon-based particle Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000009864 tensile test Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 239000004408 titanium dioxide Substances 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- 125000002023 trifluoromethyl group Chemical group FC(F)(F)* 0.000 description 1
- 239000013585 weight reducing agent Substances 0.000 description 1
- 230000002087 whitening effect Effects 0.000 description 1
- 230000037303 wrinkles Effects 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/18—Manufacture of films or sheets
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
- C08K3/36—Silica
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
- C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2379/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2361/00 - C08J2377/00
- C08J2379/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C08J2379/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- General Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Theoretical Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Human Computer Interaction (AREA)
- Materials Engineering (AREA)
- Laminated Bodies (AREA)
- Manufacture Of Macromolecular Shaped Articles (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Position Input By Displaying (AREA)
- Switches That Are Operated By Magnetic Or Electric Fields (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2017-243930 | 2017-12-20 | ||
| JP2017243930A JP6987633B2 (ja) | 2017-12-20 | 2017-12-20 | タッチセンサーパネル用透明フィルム基材及びそれを用いたタッチセンサーパネル |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201930470A TW201930470A (zh) | 2019-08-01 |
| TWI780283B true TWI780283B (zh) | 2022-10-11 |
Family
ID=66994684
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW107145627A TWI780283B (zh) | 2017-12-20 | 2018-12-18 | 觸控感測器面板用透明膜基材及使用其之觸控感測器面板 |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP6987633B2 (ja) |
| KR (1) | KR20200098641A (ja) |
| CN (1) | CN111491987A (ja) |
| TW (1) | TWI780283B (ja) |
| WO (1) | WO2019124368A1 (ja) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2019052287A (ja) * | 2017-09-15 | 2019-04-04 | 住友化学株式会社 | タッチセンサーパネル用透明フィルム基材及びそれを用いたタッチセンサーパネル |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW201641539A (zh) * | 2015-03-19 | 2016-12-01 | 三菱瓦斯化學股份有限公司 | 聚醯亞胺樹脂 |
| TW201718727A (zh) * | 2015-07-22 | 2017-06-01 | 住友化學股份有限公司 | 樹脂膜、積層體、光學構件、氣體阻障材及觸碰感測器基材 |
| TW201734132A (zh) * | 2015-12-09 | 2017-10-01 | 鐘化股份有限公司 | 聚醯胺酸、聚醯亞胺、聚醯胺酸溶液、聚醯亞胺積層體、可饒性裝置基板、及彼等之製造方法 |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4247448B2 (ja) | 2002-09-17 | 2009-04-02 | 三菱瓦斯化学株式会社 | 透明導電性フィルム |
| US9856399B2 (en) * | 2013-04-04 | 2018-01-02 | Mitsui Chemicals, Inc. | Polyamic acid, varnish containing same, and polyimide film |
| US11078378B2 (en) * | 2015-03-31 | 2021-08-03 | Asahi Kasei Kabushiki Kaisha | Polyimide film, polyimide varnish, and product and layered product using the polyimide film |
| CN107683308A (zh) * | 2015-07-22 | 2018-02-09 | 住友化学株式会社 | 聚酰亚胺系清漆、使用其的聚酰亚胺系膜的制造方法、及聚酰亚胺系膜 |
| JP2017066354A (ja) * | 2015-10-02 | 2017-04-06 | Ｊｘエネルギー株式会社 | ポリアミド酸、ポリアミド酸溶液、ポリイミド、ポリイミド溶液、ポリイミドを用いたフィルム |
| WO2017150377A1 (ja) * | 2016-03-03 | 2017-09-08 | 大日本印刷株式会社 | ポリイミドフィルム、ポリイミドフィルムの製造方法、及びポリイミド前駆体樹脂組成物 |
-
2017
- 2017-12-20 JP JP2017243930A patent/JP6987633B2/ja active Active
-
2018
- 2018-12-18 TW TW107145627A patent/TWI780283B/zh not_active IP Right Cessation
- 2018-12-18 KR KR1020207020381A patent/KR20200098641A/ko not_active Application Discontinuation
- 2018-12-18 CN CN201880081495.1A patent/CN111491987A/zh active Pending
- 2018-12-18 WO PCT/JP2018/046546 patent/WO2019124368A1/ja active Application Filing
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW201641539A (zh) * | 2015-03-19 | 2016-12-01 | 三菱瓦斯化學股份有限公司 | 聚醯亞胺樹脂 |
| TW201718727A (zh) * | 2015-07-22 | 2017-06-01 | 住友化學股份有限公司 | 樹脂膜、積層體、光學構件、氣體阻障材及觸碰感測器基材 |
| TW201734132A (zh) * | 2015-12-09 | 2017-10-01 | 鐘化股份有限公司 | 聚醯胺酸、聚醯亞胺、聚醯胺酸溶液、聚醯亞胺積層體、可饒性裝置基板、及彼等之製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP6987633B2 (ja) | 2022-01-05 |
| KR20200098641A (ko) | 2020-08-20 |
| WO2019124368A1 (ja) | 2019-06-27 |
| JP2019108509A (ja) | 2019-07-04 |
| CN111491987A (zh) | 2020-08-04 |
| TW201930470A (zh) | 2019-08-01 |
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| GD4A | Issue of patent certificate for granted invention patent | ||
| MM4A | Annulment or lapse of patent due to non-payment of fees |