TWI775907B - Manufacturing method of base material for metal mask, manufacturing method of metal mask for vapor deposition, base material for metal mask, and metal mask for vapor deposition - Google Patents

Abstract

At least one of the surface and the back surface of the metal rolled sheet having the surface and the surface opposite to the surface, that is, the back surface, is the object to be processed. The method for producing a base material for a metal mask is to etch the object to be processed with an acid etching solution of 3 μm or more, so that the thickness of the rolled metal sheet is reduced to 10 μm or less and becomes a resist having a surface roughness Rz of 0.2 μm or more The processing object is roughened by processing the surface to obtain a metal sheet for a metal mask.

Description

Manufacturing method of base material for metal mask, manufacturing method of metal mask for vapor deposition, base material for metal mask, and metal mask for vapor deposition

The present invention relates to a method for producing a metal mask substrate, a method for producing a metal mask for vapor deposition using the substrate for metal mask, the substrate for metal mask, and a metal mask for vapor deposition.

One of the display devices manufactured using the vapor deposition method is known as an organic EL display. The organic layer included in the organic EL display is a stack of organic molecules sublimated in the vapor deposition step. The opening of the metal mask used in the vapor deposition step is a passage through which sublimated organic molecules pass, and has a shape corresponding to the shape of a pixel in an organic EL display (for example, refer to Patent Document 1).

prior art literature Patent Literature

Patent Document 1 Japanese Patent Application Laid-Open No. 2015-055007

However, with the improvement in display quality of display devices and the progress of high-definition display devices, the above-mentioned organic EL displays, even the metal masks that determine the pixel size, are expected to be high-definition in film formation using the metal masks. . In recent years, an organic EL display has been expected to have a high definition of 700 ppi or more, and therefore, a metal mask that can form an organic layer in such a high-definition organic EL display is expected.

In addition, the high definition of film formation using metal masks is not limited to the manufacture of display devices including organic EL displays, and the use of metals in the formation of wirings provided in various devices, and the use of functional layers in various devices. Evaporation of masks is also expected.

An object of the present invention is to provide a method for producing a metal mask substrate, a method for producing a metal mask for vapor deposition, a substrate for a metal mask, and the Metal mask for vapor deposition.

A method for producing a base material for a metal mask for solving the above-mentioned problems, comprising preparing a rolled metal sheet having a surface and a surface opposite to the surface, that is, a back surface, the surface of the rolled metal sheet and the back surface. At least one of the back surfaces is the object to be processed; and the object to be processed is etched by an acid etching solution of 3 μm or more, so that the thickness of the rolled metal sheet is reduced to 10 μm or less, and the surface roughness Rz of 0.2 μm or more can be obtained. The resist is roughened by the method of treating the surface to obtain a metal sheet for a metal mask.

A method for producing a metal mask for vapor deposition for solving the above-mentioned problems, comprising: forming a base material for a metal mask having at least one treated surface for a resist; and forming a resist layer on one of the treated surfaces for a resist; A resist mask is formed by patterning the resist layer; and the metal mask substrate is etched using the resist mask. The said base material for metal masks is formed using the manufacturing method of the said base material for metal masks.

A metal mask base material for solving the above-mentioned problems includes a metal flake having a surface and a surface opposite to the surface, that is, a back surface, at least one of the surface and the back surface is a resist-treated surface, and the metal flake has a The thickness is 10 μm or less, and the surface roughness Rz of the resist-treated surface is 0.2 μm or more.

A metal mask for vapor deposition to solve the above-mentioned problems includes a base material for a metal mask, the base material for a metal mask is the above-mentioned base material for a metal mask, and the metal flakes contained in the base material for a metal mask are It has a plurality of through holes penetrating between the front surface and the back surface.

According to the above configuration, since the thickness of the metal mask sheet is 10 μm or less, the depth of the mask opening formed in the metal mask sheet can be 10 μm or less. Therefore, the shadow portion of the metal mask for vapor deposition can be reduced when the film-forming object is viewed from the vapor-deposited particles, that is, the shadow effect can be suppressed, so that the film-forming object can have a shape that follows the shape of the mask opening, and further High-definition film formation using a metal mask for vapor deposition is sought. Furthermore, when forming the mask opening in the sheet for metal mask, first, when forming the resist layer on the treated surface for resist, the adhesion between the resist layer and the base material for metal mask can be improved more than before roughening . In addition, since the reduction in shape accuracy due to peeling of the resist layer from the metal mask sheet, etc. can be suppressed when forming the mask opening, it is possible to achieve high film formation using the metal mask for vapor deposition in this regard. streamline.

In the manufacturing method of the said base material for metal masks, the said processing object may be both the said front surface and the said back surface.

According to the above-mentioned configuration, a resist layer can be formed on any of the treated surfaces for resists regardless of whether it is the treated surface for resists formed from the front surface or the treated surface for resists formed from the back surface. Therefore, it is possible to suppress that it is difficult to obtain the adhesion between the resist layer and the base material for a metal mask due to the wrong surface on which the resist layer is formed, and even to suppress a decrease in yield when manufacturing the metal mask for vapor deposition.

In the above-mentioned manufacturing method of the base material for a metal mask, the object to be treated may be any one of the front surface and the back surface, and the manufacturing method may further comprise laminating a resin-made support layer on the surface opposite to the object to be treated, and the aforementioned The above-mentioned processing object is etched in the state in which the metal rolled sheet and the said support layer are laminated|stacked, and the base material for metal masks in which the said sheet for metal masks and the said support layer are laminated|stacked is obtained by this.

In the above-mentioned method for producing a base material for a metal mask, the etching may include etching the first treatment object of one of the front surface and the back surface, and then etching the second treatment object of the other one of the front surface and the back surface. The method further includes after etching the first treatment object, laminating a resin-made support layer on the treated surface of the resist obtained by etching the first treatment object, and laminating the metal rolling sheet and the support layer on the surface. The said 2nd process object is state-etched, and by this, the base material for metal masks in which the said sheet for metal masks and the said support layer are laminated|stacked is obtained.

According to the above configuration, the fragility of the metal mask sheet due to the thickness of the metal mask sheet being 10 μm or less can be reduced during the conveyance of the metal mask sheet or the post-processing of the metal mask sheet. The handling of the sheet metal mask is troublesome.

In the above-mentioned manufacturing method of the base material for a metal mask, it is preferable that the metal rolled sheet is an invar rolled sheet, and the metal mask sheet is an invar steel.

According to the above configuration, when the film formation object is a glass substrate, the linear expansion coefficient of the glass substrate and the linear expansion coefficient of Hengfan steel are approximately the same, so the metal mask formed of the metal mask base material can be applied to the glass substrate. Film formation, that is, a metal mask whose shape accuracy has been improved can be applied to film formation on a glass substrate.

In the above-mentioned method for producing a metal mask for vapor deposition, the base material for metal mask includes a laminate of the sheet for metal mask and a resin-made support layer, and the metal mask on which the resist mask is formed is formed. More preferably, the support layer is chemically removed from the metal mask substrate by exposing the substrate to an alkaline solution.

According to the above configuration, since the external force does not act on the metal mask sheet, compared with the case where the support layer is physically peeled off from the metal mask sheet, the occurrence of wrinkles and deformation in the metal mask sheet can be suppressed.

In the above-mentioned metal mask base material, the treated surface for the resist may have a plurality of depressions in the shape of an elliptical hammer, that is, particle traces, and the longitudinal directions of the particle traces may be aligned.

Metal flakes are usually produced by rolling, so that particles such as oxides of deoxidizers added during the production process of the metal flakes are not mixed into the metal flakes. The particles mixed into the surface of the metal flakes have an elliptical hammer shape extending in the rolling direction of the metal material and having a long axis in the rolling direction. If such particles remain on the resist-treated surface where the mask openings are to be formed, the etching for forming the mask openings may be hindered by the particles.

In this regard, according to the above configuration, the treated surface for the resist has a plurality of particle traces in the shape of an elliptical hammer whose major axis is aligned. That is, since the above-mentioned particles are removed from the treated surface for the resist, the mask is formed when the When opening, the accuracy of the shape and size of the opening of the mask can also be improved.

According to the present invention, high-definition film formation using a metal mask for vapor deposition can be achieved.

10‧‧‧Substrate for metal mask

11, 31, 71‧‧‧Hengfan steel sheet

11a, 21a, 31a, 41a, 51a‧‧‧surface

11b, 21b, 31b, 41b, 51b‧‧‧Back

11c, 23a, 31e, 41c, 51c‧‧‧Through hole

12‧‧‧Support Layer

12a‧‧‧Polyimide frame

21‧‧‧Hengfan Steel Rolled Sheet

21c, 71a‧‧‧ treated surface for resist

22‧‧‧Resistant layer

23‧‧‧Resistant Mask

31c‧‧‧1st hole

31d‧‧‧2nd hole

41‧‧‧Metal mask sheet for vapor deposition

51, 61, 62‧‧‧Metal mask for vapor deposition

52‧‧‧Framework

53‧‧‧Second layer

72‧‧‧First particle scar

73‧‧‧Second particle scar

C‧‧‧Central part

S1‧‧‧First surface part

S2‧‧‧Second surface layer

1 : is a perspective view which shows the three-dimensional structure of the base material for metal masks in one Embodiment which actualized the base material for metal masks of this invention.

FIG. 2 is a step diagram showing a step of preparing a rolled sheet of Hengfan steel in a method of manufacturing a metal mask for vapor deposition.

FIG. 3 is a step diagram showing a step of etching the back surface of a rolled sheet of Hengfan steel in a method for producing a metal mask for vapor deposition.

4 is a process diagram showing a step of forming a support layer on the treated surface for resists of a rolled sheet of Hengfan Steel in a method for producing a metal mask for vapor deposition.

FIG. 5 is a step diagram showing a step of etching the surface of a rolled sheet of Hengfan steel in a method for producing a metal mask for vapor deposition.

Figure 6 is a schematic diagram showing the distribution of metal oxides in a rolled sheet of Hengfan Steel.

FIG. 7 is a step diagram showing a step of forming a resist layer in a method of manufacturing a metal mask for vapor deposition.

FIG. 8 is a process diagram showing a step of forming a resist mask in a method of manufacturing a metal mask for vapor deposition.

FIG. 9 is a step diagram showing a step of etching a constant-grade steel sheet in a method of manufacturing a metal mask for vapor deposition.

10 is a cross-sectional view showing a cross-sectional shape of a through hole formed by etching both the surface and the back surface of a steel sheet.

FIG. 11 is a process diagram showing a step of removing the resist mask in the manufacturing method of the metal mask for vapor deposition.

FIG. 12 is a step diagram showing a step of chemically removing the support layer in the method for producing a metal mask for vapor deposition.

13 is a cross-sectional view showing a cross-sectional structure of the metal mask for vapor deposition attached to the frame.

FIG. 14 is a plan view showing the planar structure of the metal mask for vapor deposition attached to the frame.

FIG. 15 is an SEM image of the surface in the rolled sheet of Hengfan Steel in Test Example 1. FIG.

FIG. 16 is an SEM image of the treated surface for resists in the Hengfan steel sheet of Test Example 2. FIG.

FIG. 17 is an SEM image of the treated surface for resist in the Hengfan steel sheet of Test Example 3. FIG.

FIG. 18 is an SEM image of the treated surface for resist in the Hengfan steel sheet of Test Example 4. FIG.

FIG. 19 is an SEM image of the first particle scar taken.

FIG. 20 is an SEM image of the second particle scar taken.

FIG. 21 is a cross-sectional view showing a cross-sectional structure of a metal mask and a frame in a modification.

FIG. 22 is a cross-sectional view showing a cross-sectional structure of a metal mask and a frame in a modification.

FIG. 23 is a plan view showing the planar structure of a constant-band steel sheet in a modification.

1 to 20 , an embodiment in which a method for manufacturing a metal mask substrate, a method for manufacturing a metal mask for vapor deposition, a substrate for metal mask, and a metal mask for vapor deposition is embodied will be described. In the present embodiment, as an example of the metal mask for vapor deposition, a metal mask for vapor deposition for forming an organic layer included in an organic EL device will be described. Hereinafter, the structure of the base material for a metal mask, the manufacturing method of the metal mask for vapor deposition including the manufacturing method of the base material for a metal mask, and a test example are demonstrated.

[Constitution of base material for metal mask]

The structure of the base material for a metal mask will be described with reference to FIG. 1 .

As shown in FIG. 1 , the base material 10 for a metal mask is an example of a sheet for a metal mask, and includes a metal mask sheet made of Hengfan Steel, that is, a Hengfan steel sheet 11, and the Hengfan steel sheet 11 has a surface 11a and a surface The surface opposite to 11a, that is, the back surface 11b. In the Hengfan steel sheet 11 , the front surface 11 a and the back surface 11 b are treated surfaces for a resist, and are surfaces on which a resist layer can be formed when the Hengfan steel sheet 11 is etched.

The thickness T1 of the steel sheet 11 is 10 μm or less, and the surface roughness Rz in the front surface 11 a and the surface roughness Rz in the back surface 11 b are 0.2 μm or less.

Since the thickness of the Hengfan steel sheet 11 is 10 μm or less, the depth of the mask opening formed in the Hengfan steel sheet 11 can be set to 10 μm or less. Therefore, the portion that becomes shadow of the metal mask for vapor deposition when the film-forming object is viewed from the vapor-deposited particles is reduced, that is, the shadow effect can be suppressed, so that the film-forming object obtains a shape that follows the shape of the mask opening, even, High-definition film formation using the metal mask for vapor deposition can be achieved.

Furthermore, when forming the mask opening in the constant-grade steel sheet 11, first, when the resist layer is formed on the surface 11a, the adhesion between the resist layer and the constant-grade steel sheet 11 can be improved more than before roughening. In addition, the reduction in shape accuracy due to peeling of the resist layer from the steel sheet 11 or the like can be suppressed during the formation of the mask opening, and in this regard, it is possible to achieve high definition of the film formation using the metal mask for vapor deposition. .

The forming material of the Hengfan steel sheet 11 is a nickel-iron alloy containing 36% by mass of nickel and iron, that is, Hengfan Steel, and the thermal expansion coefficient of the Hengfan steel sheet 11 is about 1.2×10 ⁻⁶ /°C.

The thermal expansion coefficient of the steel sheet 11 is approximately the same as the thermal expansion coefficient of a glass substrate which is an example of a film-forming object. Therefore, the metal mask for vapor deposition manufactured using the base material 10 for metal mask is suitable for forming a film on a glass substrate, that is, the metal mask for vapor deposition with improved shape accuracy can be used for forming a glass substrate. membrane.

The surface roughness Rz in the surface of the Hengfan steel sheet 11 is a value measured according to the method of JIS B 0601-2001. The surface roughness Rz is the maximum height in the profile curve with the reference length.

The base material 10 for a metal mask further includes a resin-made support layer 12 , and the base material 10 for a metal mask is a laminate of the Hengfan steel sheet 11 and the support layer 12 . The back surface 11b of the Hengfan steel sheet 11 is in close contact with the support layer 12 . The material for forming the support layer 12 is, for example, at least one of polyimide and negative resist. The support layer 12 may be one layer made of polyimide or one layer made of negative resist. Alternatively, the support layer 12 may be a laminate of a layer made of polyimide and a layer made of a negative resist.

Among them, the thermal expansion coefficient of polyimide exhibits the same tendency as the thermal expansion coefficient of Hengfan steel in terms of temperature dependence, and the value of the thermal expansion coefficient is the same degree. Therefore, if the material for forming the support layer 12 is polyimide, compared with the configuration in which the support layer 12 is made of a resin other than polyimide, the change in temperature in the base material 10 for metal mask not only reduces the The occurrence of warpage in the metal mask base material 10 is suppressed, and the occurrence of warpage in the steel sheet 11 is also suppressed.

[Manufacturing method of metal mask for vapor deposition]

A method of manufacturing the metal mask for vapor deposition will be described with reference to FIGS. 2 to 12 .

As shown in FIG. 2 , the method of manufacturing a metal mask for vapor deposition includes a method of manufacturing a base material 10 for a metal mask. As for the method of manufacturing the base material 10 for a metal mask, first, an example of a rolled metal sheet is prepared. The Hengfan Steel Rolled Sheet 21. The rolled sheet 21 of Hengfan Steel has a surface 21a and a surface opposite to the surface 21a, that is, a back surface 21b, and the surface 21a and the back surface 21b of the rolled sheet 21 of Hengfan Steel are the objects to be processed in the manufacturing method of the base material 10 for a metal mask. .

The rolled sheet 21 of Hengfan Steel is obtained by rolling a base material made of Hengfan Steel and annealing the rolled base material. The surface roughness Rz in each of the surface 21a and the back surface 21b of the rolled sheet 21 of Hengfan steel is higher than that of the base material only by the amount of the step difference between the surface and the back surface of the base material being small by rolling the rolled sheet 21 of Hengfan steel. The surface roughness Rz of the front and back surfaces of the material is also small.

The thickness T2 of the Hengfan Steel rolled sheet 21 is, for example, 10 μm or more and 100 μm or less, and more preferably 10 μm or more and 50 μm or less.

As shown in FIG. 3 , the back surface 21b, which is one of the processing targets and is the first example of the processing target to be etched first among the two processing targets, is etched by 3 μm or more with an acidic etching solution. The difference between the back surface 21b of the rolled Hengfan steel sheet 21 before etching and the back surface of the rolled Hengfan steel sheet 21 after etching, that is, the resist treated surface 21c is the etching thickness T3, which is 3 μm or more.

By etching the back surface 21b, the thickness of the Hengfan steel rolled sheet 21 is made smaller than the thickness before etching, and the back surface 21b is roughened so that the resist treated surface 21c has a surface roughness Rz of 0.2 μm or more.

The acidic etching solution may be an etching solution capable of etching Hengfan steel and a solution having a rougher composition than before etching of the back surface 21b of the Hengfan steel rolled sheet 21 . The acidic etching solution is, for example, a solution in which any one of perchloric acid, hydrochloric acid, sulfuric acid, formic acid, and acetic acid is mixed with ferric perchlorate solution and a mixed solution of ferric perchlorate solution and ferric chloride solution. The etching of the back side 21b can be a liquid immersion method in which the rolled sheet 21 of Hengfan Steel is immersed in an acid etching solution, a spray type in which an acid etching liquid is sprayed on the back side 21b of the rolled sheet 21 of Hengfan Steel, or a spray method of spraying acid etching solution on the back side 21b of the rolled sheet 21 of Hengfan Steel. A rotary type in which the acid etching solution is dropped on the rolled sheet 21 of Hengfan steel which is rotated by the rotary device.

The etching thickness T3 may be at least 3 μm, preferably 10 μm or more, and more preferably 15 μm or more.

As shown in FIG. 4, after the back surface 21b of the Hengfan steel rolled sheet 21 is etched, the above-mentioned resin-made support layer 12 is laminated on the resist treated surface 21c obtained by etching the back surface 21b. The thickness T4 of the support layer 12 is, for example, 10 μm or more and 50 μm or less.

Even if the thickness of the Hengfan steel rolled sheet 21 is 10 μm or less, in the manufacturing process of the metal mask substrate 10 , the strength of the laminate of the support layer 12 and the Hengfan steel rolled sheet 21 is reduced to reduce the fragility caused by the laminate. The thickness of the support layer 12 is more preferably 10 μm or more in order to increase the degree of troublesome handling.

Moreover, in order to prevent the time required for removing the support layer 12 from the base material 10 for metal masks with an alkaline solution from being too long, the thickness of the support layer 12 is more preferably 50 μm or less.

The support layer 12 can be laminated on the processed surface 21c for resists by sticking to the processed surface 21c for resists after being formed into a sheet shape. Alternatively, the support layer 12 may be laminated on the resist-treated surface 21c by applying the coating liquid for forming the support layer 12 onto the resist-treated surface 21c.

In addition, when the support layer 12 contains the layer made of the above-mentioned negative resist, after the film of the negative resist is attached to the resist treatment surface 21c, or the negative resist is applied to the resist treatment After the surface 21c, ultraviolet rays are irradiated to the whole of the negative resist to form the support layer 12.

As shown in FIG. 5 , in the state where the Hengfan steel rolled sheet 21 and the support layer 12 are stacked, an example of the second processing object etched after the first processing object is compared with the acid etching solution, namely the Hengfan steel rolled sheet 21. The surface 21a of the etched 3 μm or more. The difference between the surface 21a of the Hengfan steel rolled sheet 21 before etching and the Hengfan steel rolled sheet 21 after etching, that is, the difference between the surface 11a of the Hengfan steel sheet 11 is the etching thickness T5, and the etching thickness T5 is 3 μm above.

In this way, the etching of the Hengfan steel rolled sheet 21 includes etching the back surface 21b of the Hengfan steel rolled sheet 21, which is an example of the first processing object, and then etching the surface 21a, an example of the second processing object.

By the etching of the surface 21a, the thickness T2 of the rolled sheet 21 of Hengfan steel previously described using FIG. 2 is 10 μm or less, and the surface 21a is etched so that the surface 21a can have a surface roughness Rz of 0.2 μm or more. coarsening. Thereby, the constant-grade steel sheet 11 which is an example of the metal sheet for metal mask and the metal sheet, that is, the constant-grade steel sheet 11, and the surface roughness Rz of each of the front surface 11 a and the back surface 11 b is obtained is 0.2 μm or more, and the constant-grade steel sheet 11 is obtained, and The base material 10 for a metal mask is laminated with a constant steel sheet 11 and a support layer 12 .

Since both the front surface 21a and the back surface 21b of the rolled sheet 21 of Hengfan Steel are etched, no matter whether the resist-treated surface formed from the surface 21a or the resist-treated surface 21c formed from the back surface 21b, any resist can be treated A resist layer is formed with the treated surface. Therefore, it is possible to suppress not only the difficulty in obtaining the adhesion between the resist layer and the metal mask substrate 10 due to the wrong surface on which the resist layer is to be formed, but also to prevent the production of the metal mask 51 for vapor deposition from being satisfactory. rate decreased.

In addition, the base material 10 for a metal mask is a laminated body of the constant steel sheet 11 and the support layer 12 . Therefore, in the conveying of the steel sheet 11 or the post-processing of the steel sheet 11, it is possible to reduce the fragility of the steel sheet 11 caused by the thickness of the steel sheet 11 being 10 μm or less, resulting in the reduction of the permanent steel sheet. Handling of the steel sheet 11 is troublesome.

The acidic etching liquid may be any of the acidic etching liquids used for the etching of the back surface 21b, and it is more preferably the same as the acidic etching liquid used for the etching of the back surface 21b. In addition, the etching of the surface 21a may be any of a liquid immersion type, a spray type, and a rotary type, but the same method as the etching of the back surface 21b is more preferable.

The etching thickness T5 may be at least 3 μm, preferably 10 μm or more, and more preferably 15 μm or more. The etching thickness T5 and the above-mentioned etching thickness T3 may be the same size, or may be different sizes from each other.

In addition, when forming the base material of the Hengfan steel rolled sheet 21, usually, in order to remove oxygen mixed in the base material forming material, granular aluminum, magnesium, etc., as a deoxidizer, for example, are mixed with the base material forming material. Aluminum and magnesium are oxidized and contained in the material for forming the base material in the state of metal oxides such as alumina and magnesia. When the base metal is formed, most of the metal oxide is removed from the base metal, but a part of the metal oxide remains inside the base metal.

As shown in FIG. 6 , in the rolled sheet 21 of Hengfan steel, the part including the center of the rolled steel sheet 21 in the thickness direction is the central part C, the part including the surface 21a is the first surface layer part S1, and the part including the back surface 21b is the second surface layer portion S2. More metal oxides are distributed in the first surface layer part S1 and the second surface layer part S2 than in the center part C.

When a metal mask for vapor deposition is formed by etching the Hengfan steel sheet 11, the metal oxide becomes a factor that the resist is peeled off from the Hengfan steel sheet 11 or the Hengfan steel sheet 11 is etched excessively.

As described above, in the manufacturing method of the base material 10 for a metal mask, since the surface 21 a and the back surface 21 b of the rolled sheet 21 of Hengfan steel are etched, the first surface layer portion S1 and the second surface layer portion S1 and the second surface layer containing many metal oxides are etched. At least a part of the surface layer portion S2 is removed. Therefore, compared with the case where the surface 21a and the back surface 21b of the rolled sheet 21 of Hengfan steel are not etched, the resist peeling due to metal oxides or excessive etching of the Hengfan steel sheet 11 can be suppressed, and the metal masking can also be suppressed. The case where the precision of etching with the base material 10 is lowered.

As shown in FIG. 7 , a resist layer 22 is formed on the surface 11 a of the Hengfan steel sheet 11 . The resist layer 22 can be formed on the surface 11a by attaching to the surface 11a after being formed into a sheet shape. Alternatively, the resist layer 22 may be formed on the surface 11a by applying a coating liquid for forming the resist layer 22 to the surface 11a.

The formation material of the resist layer 22 may be a negative type resist or a positive type resist. In addition, when the material for forming the support layer 12 is a negative type resist, it is more preferable that the resist layer 22 is also formed of the same material as the support layer 12 .

As shown in FIG. 8 , the resist mask 23 is formed by patterning the resist layer 22 . The resist mask 23 has a plurality of through holes 23 a for etching the constant-scale steel sheet 11 .

When the forming material of the resist layer 22 is a negative type resist, the resist layer 22 is exposed to light by irradiating ultraviolet rays to the portion of the resist layer 22 other than the portion corresponding to each through hole 23 a of the resist mask 23 . Then, the resist layer 22 is developed with a developer to obtain a resist mask 23 having a plurality of through holes 23a.

When the forming material of the resist layer 22 is a positive type resist, the portion of the resist layer 22 corresponding to each through hole 23 a of the resist mask 23 is irradiated with ultraviolet rays to expose the resist layer 22 . Then, the resist layer 22 is developed with a developer to obtain a resist mask 23 having a plurality of through holes 23a.

As shown in FIG. 9 , the Hengfan steel sheet 11 is etched using the resist mask 23 . The etching of the Hengfan steel sheet 11, for example, uses a ferric chloride solution. Thereby, a plurality of through-holes 11c , that is, mask openings, are formed in the constant-grade steel sheet 11 penetrating between the front surface 11a and the back surface 11b. In the cross section along the thickness direction of the steel sheet 11, the inner peripheral surface of each through hole 11c has a substantially arc shape, and the opening area on the front surface 11a of each through hole 11c is larger than the opening area on the back surface 11b.

Since the thickness of the Hengfan steel sheet 11 is 10 μm or less, even if the Hengfan steel sheet 11 is etched only from the surface 11a, the mask of the Hengfan steel sheet 11 can be opened. 11c forms a through-hole 11c which is formed too large to penetrate between the front surface 11a and the back surface 11b.

As shown in FIG. 10 , the thickness T6 of the constant steel sheet 31 is larger than the thickness T1 of the constant steel sheet 11 , that is, the thickness T6 of the constant steel sheet 31 is greater than 10 μm. In this case, in order to make the area of the opening in the surface 31a of the constant steel sheet 31 the same as the area of the opening in the surface 11a of the constant steel sheet 11, and to form a through hole penetrating the surface 31a and the back surface 31b, It is necessary to etch the constant steel sheet 31 from the surface 31a and the back surface 31b.

Thereby, the through-hole 31e which consists of the 1st hole 31c opened in the front surface 31a, and the 2nd hole 31d opened in the back surface 31b is formed. In the direction perpendicular to the thickness of the steel sheet 31, the opening area of the connecting portion of the first hole 31c and the second hole 31d is smaller than the opening area of the second hole 31d on the back surface 31b.

In the case where the constant-grade steel sheet 31 having such through holes 31e is used as a metal mask for vapor deposition, the constant-grade steel sheet 31 is in a state where the back surface 31b of the constant-grade steel sheet 31 faces the film-forming object. It is arranged between the vapor deposition source and the film formation target. Since the connection part of the constant-fan steel sheet 31 forms a part that is shadowed by the metal mask for vapor deposition when the film-forming object is viewed from the vapor-deposited particles, it is difficult to obtain the second hole 31d in the film-forming object with this amount alone. The shape of the mask opening. Therefore, the depth of the second hole 31d, in other words, the distance between the back surface 31b and the connecting portion is preferably smaller.

In this regard, according to the through-holes 11c of the Hengfan steel sheet 11, only the amount without a connecting portion can be reduced compared with the above-mentioned Hengfan steel sheet 31 when the film formation object is viewed from the vapor deposition particles. The shadow part of the metal mask. As a result, a shape that more closely follows the shape of the mask opening can be obtained in the film-forming object.

As shown in FIG. 11 , the resist mask 23 previously described using FIG. 9 and located on the metal mask substrate 10 is removed. In addition, when removing the resist mask 23 from the laminate of the metal mask base material 10 and the resist mask 23, it may be on the opposite side of the surface of the support layer 12 that is in contact with the constant steel sheet 11. A protective layer for protecting the support layer 12 is formed on the upper surface. According to the protective layer, dissolution of the support layer 12 due to the solution for removing the resist mask 23 can be suppressed.

As shown in FIG. 12 , after removing the resist mask 23 , the metal mask substrate 10 is exposed to an alkaline solution, thereby chemically removing the support layer 12 from the metal mask substrate 10 . Thereby, the metal mask sheet 41 for vapor deposition is obtained. The metal mask sheet 41 for vapor deposition has a surface 41 a corresponding to the surface 11 a of the constant steel sheet 11 , a back surface 41 b corresponding to the back surface 11 b of the constant steel sheet 11 , and a through hole 11 c of the constant steel sheet 11 . The through hole 41c.

At this time, since the support layer 12 is chemically removed from the metal mask base material 10 , external force does not act on the Hengfan steel sheet 11 compared to the case where the support layer 12 is physically peeled off from the Hengfan steel sheet 11 . As for the sheet 11, the occurrence of wrinkles or deformation of the Hengfan steel sheet 11 is suppressed.

The alkaline solution may be any solution as long as the support layer 12 can be peeled off from the Hengfan steel sheet 11 by dissolving the support layer 12 , for example, an aqueous sodium hydroxide solution. When exposing the metal mask substrate 10 to the alkaline solution, the metal mask substrate 10 may be immersed in the alkaline solution, or the support layer 12 of the metal mask substrate 10 may be sprayed with the alkaline solution, or An alkaline solution is dropped on the support layer 12 of the base material 10 for a metal mask which is rotated by a spinner.

As shown in FIG. 13 , a metal mask 51 for vapor deposition having a predetermined length is cut out from the metal mask sheet 41 for vapor deposition. The metal mask 51 for vapor deposition has a surface 51a corresponding to the surface 41a of the metal mask sheet 41 for vapor deposition, a back surface 51b corresponding to the back surface 41b of the metal mask sheet 41 for vapor deposition, and a metal mask for vapor deposition The cover sheet 41 is a through hole 51c corresponding to the through hole 41c.

Furthermore, when vapor deposition of the organic layer is performed, the metal mask 51 for vapor deposition is attached to the frame. That is, the metal mask 51 for vapor deposition is used for vapor deposition of the organic layer in a state of being attached to the metal frame 52 via the adhesive layer 53 . In the metal mask 51 for vapor deposition, a part of the back surface 51b of the metal mask 51 for vapor deposition faces a part of the frame 52, and the next layer 53 is located between the metal mask 51 for vapor deposition and the frame 52 . In addition, a part of the surface 51a of the metal mask 51 for vapor deposition and a part of the frame 52 may be opposed to the metal mask 51 for vapor deposition, and the adhesive layer 53 may be located on the metal mask 51 for vapor deposition. The surface 51 a and the frame 52 are attached to the frame 52 through the adhesive layer 53 .

As shown in FIG. 14 , in a plan view facing the surface 51 a of the metal mask for vapor deposition 51 , the metal mask for vapor deposition 51 has a rectangular shape, and the frame 52 has a rectangular frame shape. Each through hole 51c has a rectangular shape in a plan view facing the surface 51a. That is, the opening of the surface 51a in the through hole 51c has a rectangular shape. In addition, the opening in the back surface 51b among the through-holes 51c also has a rectangular shape. The plurality of through holes 51c are arranged at equal intervals along one direction and at equal intervals along the other direction orthogonal to one direction. The metal mask 51 for vapor deposition is arranged between the vapor deposition source and the object to be film-formed in a state where the back surface 51b of the metal mask for vapor-deposition 51 faces the object to be film-formed.

In addition, in FIG. 14, the left-right direction of a paper surface is the arrangement|sequence direction of the pixel in a film formation object. In FIG. 14, the distance between the through-holes 51c adjacent to each other in the left-right direction is smaller than the width of the through-hole 51c in the left-right direction, but the distance between the through-holes 51c adjacent to each other in the left-right direction is the through-hole in the left-right direction More preferably, the width of 51c is more than 2 times.

[Test example]

A test example will be described with reference to FIGS. 15 to 20 .

[Test Example 1]

A rolled sheet of Hengfan steel having a thickness of 30 μm was prepared and used as the rolled sheet of Hengfan steel of Test Example 1.

[Test Example 2]

Prepare a rolled sheet of Hengfan Steel with a thickness of 30 μm, spray an acid etchant on the surface of the rolled sheet of Hengfan Steel to etch the surface of the rolled sheet of Hengfan Steel by 3 μm, and obtain the Hengfan of Test Example 2 with a surface treated with a resist. Steel sheet. In addition, as the acidic etching solution, a solution in which perchloric acid was mixed with a mixed solution of a ferric perchlorate solution and a ferric chloride solution was used.

[Test Example 3]

A Hengfan steel rolled sheet with a thickness of 30 μm was prepared, and the surface of the Hengfan steel rolled sheet was etched by 4.5 μm under the same conditions as in Test Example 2 to obtain a Hengfan steel sheet of Test Example 3 having a treated surface for resist.

[Test Example 4]

A Hengfan steel rolled sheet with a thickness of 30 μm was prepared, and the surface of the Hengfan steel rolled sheet was etched by 10 μm under the same conditions as in Test Example 2 to obtain a Hengfan steel sheet of Test Example 4 having a treated surface for resist.

[Surface shot with scanning electron microscope]

The surface of Test Example 1 and the resist-treated surface in each of Test Examples 2 to 4 were photographed with a scanning electron microscope to generate SEM images. In a scanning electron microscope (JSM-7001F, manufactured by JEOL Ltd.), the magnification was 10,000 times, the acceleration voltage was 10.0 kV, and the operating distance was 9.7 mm.

As shown in FIG. 15 , it was confirmed that the flatness of the surface of the rolled sheet of Hengfan steel of Test Example 1 was the highest, and it was confirmed that the surface of the rolled sheet of Hengfan steel of Test Example 1 extended in the vertical direction on the paper. Calender marks of stripes. As shown in FIG. 16 and FIG. 17 , it was confirmed that a level difference was formed between the resist-treated surface of the Hengfan steel sheet of Test Example 2 and the resist-treated surface of the Hengfan steel sheet of Test Example 3. As shown in FIG. 18 , it was confirmed that the resist-treated surface in the Hengfan steel sheet of Test Example 4 was more formed than the resist-treated surface of the Hengfan steel sheet of Test Example 2 and the surface of Test Example 3. The treated surface of the resist in the Hengfan steel sheet has a large level difference. In addition, it was confirmed that on the treated surface for the resist in each of the constant standard steel sheets shown in FIGS. 16 to 18 , the rolling marks were almost eliminated by etching.

[Measurement of Surface Roughness Using Atomic Force Microscope]

A test piece containing the surface of the surface of the rolled sheet of Hengfan steel of Test Example 1 was prepared, and a test piece containing the surface of the resist treated surface of the Hengfan steel sheet of each of Test Examples 2 to 4 was prepared. Then, on the surface of each test piece, the surface roughness in the area having a square shape having a side length of 5 μm, that is, in the scanning area was measured.

The surface roughness on the surface of each test example was measured using an atomic force microscope (AFM5400L, manufactured by Hitachi High-tech Science Co., Ltd.) by a method in accordance with JIS B 0601-2001. The measurement results of the surface roughness are shown in Table 1 below. In addition, the surface area ratio in each test piece was calculated as the ratio of the surface area of the scanning area to the area of the scanning area based on the measurement results. In other words, the surface area ratio is the value of the area of the scan area divided by the surface area of the scan area.

In addition, among the parameters of the surface roughness described in Table 1, Rz is the maximum height of the sum of the height of the largest mountain and the depth of the deepest valley among the profile curves with the reference length, and Ra is the profile curve with the reference length. The arithmetic mean roughness. Rp is the height of the highest mountain among the profiles with the reference length, and Rv is the depth of the deepest valley among the profiles with the reference length. In addition, below, the unit of each of Rz, Ra, Rp, and Rv is micrometer.

As shown in Table 1, with regard to the surface of the rolled sheet of Hengfan Steel of Test Example 1, it was confirmed that the surface roughness Rz was 0.17, the surface roughness Ra was 0.02, the surface roughness Rp was 0.08, and the surface roughness Rv was 0.09. In addition, it was confirmed that the surface area ratio was 1.02 for the surface in the rolled sheet of Hengfan Steel of Test Example 1.

The surface roughness Rz was 0.24, the surface roughness Ra was 0.02, the surface roughness Rp was 0.12, and the surface roughness Rv was 0.12. In addition, it was confirmed that the surface area ratio of the treated surface for the resist in the Hengfan steel sheet of Test Example 2 was 1.23.

The surface roughness Rz was 0.28, the surface roughness Ra was 0.03, the surface roughness Rp was 0.15, and the surface roughness Rv was 0.13. In addition, it was confirmed that the surface area ratio of the treated surface for the resist in the Hengfan steel sheet of Test Example 3 was 1.13.

The surface roughness Rz was 0.30, the surface roughness Ra was 0.03, the surface roughness Rp was 0.17, and the surface roughness Rv was 0.13. In addition, it was confirmed that the surface area ratio of the treated surface for the resist in the Hengfan steel sheet of Test Example 4 was 1.22.

In this way, it was confirmed that the surface roughness Rz of the treated surface for the resist was 0.2 μm or more for the Hengfan steel sheet obtained by etching the surface of the Hengfan steel rolled sheet by 3 μm or more. Furthermore, it was confirmed that the larger the etching thickness, the larger the surface roughness Rz in the resist-treated surface. Therefore, the etching thickness on the surface of the rolled sheet of Hengfan steel is preferably 4.5 μm, more preferably 10 μm.

Furthermore, a rolled sheet of Hengfan steel having a thickness of 30 μm was prepared, and the surface and the back of the rolled sheet of Hengfan steel were each etched by 10 μm under the above-mentioned conditions, thereby obtaining a rolled sheet of Hengfan steel with a thickness of 10 μm. At this time, a sheet made of polyimide having a thickness of 20 μm was attached as a support layer to the treated surface for resists obtained from the back surface of the rolled sheet of Hengfan Steel.

Based on such a Hengfan steel sheet, the inventors of the present application confirmed that only the Hengfan steel sheet is etched from the surface of the Hengfan steel sheet, and a through hole penetrating between the surface and the back of the Hengfan steel sheet can be formed. It was also confirmed by the inventors of the present invention that the opening area on the surface of the constant-fan steel sheet and the opening area on the backside of the constant-fan steel sheet have desired sizes, respectively.

Moreover, after sticking a dry film resist on the surface of the rolled sheet of Hengfan Steel of Test Example 1, and patterning the dry film resist, the rolled sheet of Hengfan Steel of Test Example 1 was etched to form a plurality of recesses on the surface.

Then, a dry film resist was attached to the resist-treated surface of the Hengfan steel sheet of each of Test Examples 2 to 4, and after patterning the dry film resist, each of Test Examples 2 to 4 was The Hengfan steel sheet is etched to form a plurality of concave parts on the treated surface for resist. In addition, in Test Examples 2 to 4, the same method as that of Test Example 1 was used for the patterning method of the dry film resist, and the etching conditions of the Hengfan steel sheet were set to the same conditions as those of Test Example 1.

In each of Test Examples 2 to 4, it was confirmed that the variation in the size of the openings in the resist-treated surface was smaller than the variation in the size of the openings in Test Example 1. That is, as in each of Test Examples 2 to 4, it was confirmed that if the surface roughness Rz is 0.2 μm or more, the adhesion between the transmission resist layer and the constant-grade steel sheet is improved, and the shape accuracy in the mask opening 5 is improved. Decrease is suppressed.

[Test Example 5]

A rolled sheet of Hengfan steel having a thickness of 30 μm was prepared and used as the rolled sheet of Hengfan steel of Test Example 5.

[Test Example 6]

A Hengfan steel rolled sheet with a thickness of 30 μm was prepared, and the surface of the Hengfan steel rolled sheet was etched by 3 μm under the same conditions as in Test Example 2 to obtain a Hengfan steel sheet of Test Example 6 having a treated surface for resist.

[Test Example 7]

A Hengfan steel rolled sheet with a thickness of 30 μm was prepared, and the surface of the Hengfan steel rolled sheet was etched by 10 μm under the same conditions as in Test Example 2 to obtain a Hengfan steel sheet of Test Example 7 having a treated surface for resist.

[Test Example 8]

A rolled Hengfan steel sheet with a thickness of 30 μm was prepared, and the surface of the rolled Hengfan steel sheet was etched by 15 μm under the same conditions as in Test Example 2 to obtain a Hengfan steel sheet of Test Example 8 having a treated surface for resist.

[Test Example 9]

A Hengfan steel rolled sheet with a thickness of 30 μm was prepared, and the surface of the Hengfan steel rolled sheet was etched by 16 μm under the same conditions as in Test Example 2 to obtain a Hengfan steel sheet of Test Example 9 having a treated surface for resist.

[Count of particle marks]

Three test pieces including the surface of a part of the surface of the rolled sheet of Hengfan Steel of Test Example 5 and having a square shape with a side length of 2 mm were prepared. In addition, three test pieces including the surface of a part of the resist-treated surface of the Hengfan steel sheet of each of Test Examples 6 to 9 and having a square shape of 2 mm in length were prepared.

The surface of each test piece was observed using a scanning electron microscope (same as above), and the particle traces of each test piece were counted. In addition, the particle traces are traces of metal oxide particles detached from the Hengfan steel rolled sheet or the Hengfan steel sheet, and at least one of the first particle trace and the second particle trace was confirmed in each test piece. The results of counting particle traces are shown in Table 2 below.

As shown in FIG. 19 , the first particle traces are defined as a substantially circular region and have hemispherical depressions in a plan view facing the surface of the test piece. It was confirmed that the diameter of the first particle traces was 3 μm or more and 5 μm or less.

On the other hand, as shown in FIG. 20 , the second particle traces have a substantially elliptical region and have elliptical hammer-shaped depressions in a plan view facing the surface of the test piece. It was confirmed that the major axis of the second particle traces was 3 μm or more and 5 μm or less.

When imaging the 1st particle trace and the 2nd particle trace, in a scanning electron microscope, the magnification was set to 5000 times, the acceleration voltage was set to 10.0 kV, and the operating distance was set to 9.7 mm.

As shown in Table 2, in Test Example 5, it was confirmed that the test piece 1 had one first particle trace, and it was confirmed that neither the test piece 2 nor the test piece 3 had particle traces. That is, in Test Example 5, it was confirmed that the total of the first particle traces was one, and the total of the second particle traces was zero.

In Test Example 6, it was confirmed that Test Piece 1 had four first particle traces and one second particle trace, Test Piece 2 had nine first particle traces, and Test Example 3 had eight first particle traces and two first particle traces. 2 particle marks. That is, in Test Example 6, it was confirmed that the total of the first particle traces was 21, and the total of the second particle traces was three.

In Test Example 7, it was confirmed that the test piece 1 had five first particle traces and one second particle trace, the test piece 2 had six first particle traces and one second particle trace, and the test piece 3 had five first particle traces. 1 particle scar and 2 2nd particle scars. That is, in Test Example 7, it was confirmed that the total of the first particle traces was 16, and the total of the second particle traces was four.

In Test Example 8, it was confirmed that the test piece 1 had five first particle traces, the test piece 2 had two first particle traces, and the test piece 3 had six first particle traces and one second particle trace. That is, in Test Example 8, it was confirmed that the total of the first particle traces was 13, and the total of the second particle traces was one.

In Test Example 9, it was confirmed that the test piece 1 had four first particle marks, the test piece 2 had five first particle marks, and the test piece 3 had five first particle marks. 3 There are no second particle marks at all. That is, in Test Example 9, it was confirmed that the total number of the first particle traces was 14.

In addition, in Test Example 6 and Test Example 7 having a plurality of second particle traces, it was confirmed that the longitudinal direction of each second particle trace was aligned, and the longitudinal direction was the same as that of the constant-grade steel rolling used to form the constant-grade steel sheet. The calendering directions of the sheets are parallel.

In this way, when the surface of the Hengfan steel rolled sheet is etched by 16 μm or more, the second particle traces can be removed from the resist treatment surface of the Hengfan steel sheet. In addition, it was confirmed that the number of the first particle marks could be reduced by etching the surface of the rolled sheet of Hengfan steel by 10 μm or more, and it was confirmed that the number of the first grain marks could be reduced by etching the surface of the rolled sheet of Hengfan steel by 15 μm or more. quantity.

From these results, it can be said that by etching the surface of the Hengfan steel rolled sheet by 10 μm or more, more preferably 15 μm or more, the metal oxide particles in the Hengfan steel rolled sheet can be reduced. Therefore, it can be said that the surface of the rolled sheet of Hengfan steel should be etched by 10 μm or more for the accuracy of the shape of the through hole formed by the etching of the metal mask base material, in order to suppress the influence of the separation of the metal oxide. More preferably, it is effective to etch 15 μm or more.

As described above, according to one embodiment of the manufacturing method of the base material for metal mask, the manufacturing method of the metal mask for vapor deposition, the base material for metal mask, and the metal mask for vapor deposition, the following examples can be obtained. Effect.

(1) Since the thickness of the constant steel sheet 11 is 10 μm or less, the depth of the mask opening formed in the constant steel sheet 11 can be set to 10 μm or less. Therefore, the shadow part of the metal mask 51 for vapor deposition can be reduced when viewed from the deposition particles, that is, the shadow effect can be suppressed, so that not only the shape of the deposition object can follow the shape of the mask opening, but also the shadow effect can be suppressed. Furthermore, the high definition of the film formation using the metal mask 51 for vapor deposition can be achieved.

In addition, when the mask opening is formed in the constant-grade steel sheet 11, the adhesion between the resist layer 22 and the constant-grade steel sheet 11 can be improved even more than before roughening. In addition, the reduction in shape accuracy caused by peeling off of the resist layer 22 from the steel sheet 11 can be suppressed during the formation of the mask opening. Therefore, in this regard, a formation using the metal mask 51 for vapor deposition can be achieved. High-definition film.

(2) Regardless of whether it is the treated surface for resist formed by the surface 21a of the rolled sheet 21 of Hengfan Steel or the treated surface 21c for resist formed from the back 21b of the rolled sheet 21 of Hengfan Steel, for any treated surface for resist Both resist layers 22 may be formed. Therefore, it is possible not only to suppress the difficulty in obtaining the adhesion between the resist layer 22 and the metal mask base material 10 due to the wrong surface of the object for forming the resist layer 22 , but also to suppress the production of the metal mask 51 for vapor deposition. yield decreased.

(3) In the transport of the steel sheet 11 or the post-processing of the steel sheet 11, it is possible to reduce the fragility of the steel sheet 11 caused by the thickness of the steel sheet 11 being 10 μm or less. The handling of the Hengfan steel sheet 11 is troublesome.

(4) Compared with the case where the support layer 12 is physically peeled off from the Hengfan steel sheet 11, since the external force does not act on the Hengfan steel sheet 11, the occurrence of wrinkles or deformation in the Hengfan steel sheet 11 is suppressed. .

In addition, the above-mentioned embodiment can be suitably changed and implemented as follows.

The support layer 12 can also be physically peeled off from the Hengfan steel sheet 11 . That is, external force may be applied to at least one of the support layer 12 and the constant steel sheet 11 so that peeling occurs at the interface between the support layer 12 and the constant steel sheet 11 . Even with such a configuration, roughening is performed so that the surface roughness Rz of the treated surface for resist becomes 0.2 μm or more, and etching is performed so that the thickness of the rolled steel sheet 21 after etching becomes 10 μm or less. The rolled sheet 21 of Hengfan Steel can obtain the same effect as the above-mentioned (1).

However, as described above, it is more preferable that the support layer 12 is chemically removed from the base material 10 for metal mask by an alkaline solution in terms of suppressing the wrinkle or deformation of the constant steel sheet 11 .

Regarding the etching of the surface 21a and the back surface 21b of the rolled sheet 21 of Hengfan Steel, the back surface 21b may be etched before the surface 21a, or the surface 21a and the back surface 21b may be etched simultaneously. Regardless of the order in which the front surface 21a and the back surface 21b are etched, roughening is performed so that the surface roughness Rz of the resist-treated surface can be 0.2 μm or more, and the thickness in the etched Hengfan steel rolled sheet 21 can be adjusted. When the rolled sheet 21 of Hengfan steel is etched so as to be 10 μm or less, the same effect as the above-mentioned (1) can be obtained.

The processing object in the Hengfan Steel rolled sheet 21 may be only the surface 21a of the Hengfan Steel rolled sheet 21, or only the back surface 21b. Even with such a configuration, roughening is performed so that the surface roughness Rz of the treated surface for resist becomes 0.2 μm or more, and etching is performed so that the thickness of the rolled steel sheet 21 after etching becomes 10 μm or less. The rolled sheet 21 of Hengfan Steel can obtain the same effect as the above-mentioned (1).

When the processing object in the rolled sheet 21 of Hengfan Steel is only the surface 21a, before etching the surface 21a, a support layer 12 is laminated on the back surface 21b, and the surface 21a is etched in the state where the rolled sheet 21 of Hengfan Steel and the support layer 12 are laminated better. When the object to be processed is only the back surface 21b, the support layer 12 is formed on the front surface 21a before the back surface 21b is etched, and the back surface 21b is etched in a state where the rolled sheet 21 and the support layer 12 are stacked. Even with such a configuration, the same effect as the above-mentioned (3) can be obtained.

The etching of the processing object in the Hengfan steel rolled sheet 21 is that no matter whether the processing object is any one of the surface 21a and the back 21b or both the surface 21a and the back 21b, the Hengfan steel rolled sheet 21 may not be formed with a support layer. 12 in the state. Even with such a configuration, roughening is performed so that the surface roughness Rz of the treated surface for resist becomes 0.2 μm or more, and etching is performed so that the thickness of the rolled steel sheet 21 after etching becomes 10 μm or less. The rolled sheet 21 of Hengfan Steel can obtain the same effect as the above-mentioned (1).

In this case, the base material for a metal mask does not have the structure of the support layer 12 , that is, it may only have the structure of the constant steel sheet 11 . Alternatively, after obtaining the Hengfan steel sheet 11 from the Hengfan steel rolling sheet 21, one area of the Hengfan steel sheet 11 can be layered with the support layer 12 to obtain a laminate of the Hengfan steel sheet 11 and the supporting layer 12, That is, the base material for metal mask.

As shown in FIG. 21 , if the forming material of the support layer 12 is polyimide, when the support layer 12 is removed from the base material 10 for a metal mask, one of the support layers 12 can also be placed in the base material 10 for a metal mask. Only the portion in the thickness direction that overlaps with the through hole 11 c of the constant steel sheet 11 is removed from the constant steel sheet 11 . In other words, when removing the support layer 12 from the base material 10 for metal mask, only the edge of the support layer 12 among the support layers 12 in the plan view opposite to the back surface 11b of the Hengfan steel sheet 11 may be All the through-holes 11c are removed except for the part outside.

In such a configuration, the metal mask 61 for vapor deposition is composed of the steel sheet 11 and the polyimide frame 12a having a rectangular frame shape. The Hengfan steel sheet 11 has a plurality of through holes 11c, and the polyimide frame 12a has a rectangular frame shape enclosing all the through holes 11c in a plan view facing the back surface 11b of the Hengfan steel sheet 11.

The polyimide frame 12 a included in the metal mask 61 for vapor deposition can function as an adhesive layer when the metal mask 61 for vapor deposition is attached to the frame 52 . Therefore, the metal mask 61 for vapor deposition is attached to the frame 52 in a state where the polyimide frame 12a in the metal mask 61 for vapor deposition is in contact with the frame 52 .

As shown in FIG. 22 , if the forming material of the support layer 12 is polyimide, the support layer 12 may not be removed from the base material 10 for metal masks. In such a configuration, the metal mask 62 for vapor deposition is supported by the constant steel sheet 11 having a plurality of through holes 11c and the back surface 11b of the constant steel sheet 11 when it is attached to the frame 52 as a whole. layer 12.

The support layer 12 included in the metal mask 62 for vapor deposition is similar to the polyimide frame 12a described above, and functions as an adhesive layer when the metal mask 62 for vapor deposition is attached to the frame 52 . Therefore, the metal mask 62 for vapor deposition is attached to the frame 52 in a state where the support layer 12 in the metal mask 62 for vapor deposition is in contact with the frame 52 .

In addition, in such a metal mask 62 for vapor deposition, after the metal mask 62 for vapor deposition is attached to the frame 52, only one of the support layers 12 in the thickness direction and constant direction of the base material 10 for metal mask is applied. What is necessary is just to remove the part where the through-hole 11c which the steel sheet 11 has the overlapped part is removed from the steel sheet 11 of the constant steel. In other words, in the plan view facing the back surface 11b of the steel sheet 11, only the portion of the support layer 12 that is the edge portion of the support layer 12 and is located outside of all the through holes 11c may be removed.

FIG. 23 is a plan view of the Hengfan steel sheet, showing the plane structure in a plan view facing the treatment surface for the resist obtained by etching the processing object in the Hengfan steel rolled sheet 21 . In addition, in FIG. 23, in order to clarify the distinction between the 1st particle traces and the 2nd particle traces and the parts other than those in the treated surface for resists, the circle|dots are attached to the 1st particle traces and the 2nd particle traces.

As shown in FIG. 23 , when the thickness of the processed object of the Hengfan steel rolled sheet 21 is 3 μm or more and 10 μm or less, the resist treatment surface 71 a of the Hengfan steel sheet 71 has a plurality of first particle traces 72 and a plurality of The second particle scar 73. Each of the first particle traces 72 has a hemispherical depression, and the diameter of the first particle traces 72 , that is, the first diameter D1 is 3 μm or more and 5 μm or less.

Each of the second particle traces 73 has an ellipsoid-shaped depression, the major axis of the second particle traces 73 , that is, the second diameter D2 is 3 μm or more and 5 μm or less, and the major axis directions of the second particle traces 73 are aligned. The longitudinal direction of each of the second particle traces 73 is a direction parallel to the rolling direction of the Hengfan steel sheet 71 .

Since the Hengfan steel sheet 71 is produced by general rolling, the Hengfan steel sheet 71 is often mixed with particles made of oxides such as a deoxidizer added during the manufacturing process of the Hengfan steel sheet 71 . Part of the particles mixed in the surface of the constant steel sheet 71 is extended in the rolling direction of the constant steel sheet 71, and has an elliptical hammer shape having a long diameter in the rolling direction. When such particles remain in the portion where the mask opening is to be formed on the resist-treated surface 71a, the etching for forming the mask opening may be hindered by the particles.

In this regard, according to the above-mentioned configuration, the following effects can be obtained.

(5) Since the above-mentioned particles are removed from the resist-treated surface 71a, the resist-treated surface 71a has a plurality of second particle scars 73 in the shape of an elliptical hammer aligned in the longitudinal direction. Therefore, when forming the mask opening, the accuracy of the shape or size of the mask opening can also be improved as compared with the case where particles remain in the constant steel sheet 71 .

If the forming material of the metal rolled sheet, even the forming material of the metal mask sheet and the metal sheet is a pure metal or alloy, it can also be a material other than Hengfan steel.

Each step in the method of manufacturing the metal mask 51 for vapor deposition may be performed on a rolled sheet of constant steel that has been cut in advance into a size corresponding to one metal mask 51 for vapor deposition. In such a case, a mask for vapor deposition can be obtained by removing the resist mask and the support layer from the Hengfan steel sheet equivalent to the Hengfan steel rolled sheet.

Alternatively, each step in the method for producing the base material 10 for metal mask may be performed on a rolled sheet 21 of constant standard steel having a size corresponding to a plurality of metal masks 51 for vapor deposition. On the one hand, the obtained The metal mask base material 10 is cut into a metal mask base material sheet having a size corresponding to one metal mask 51 for vapor deposition. Furthermore, the formation of the resist layer, the formation of the resist mask, the etching of the constant steel sheet, and the removal of the support layer may be performed on the base sheet for metal mask.

The metal mask 51 for vapor deposition may have a shape other than a rectangular shape, for example, a square shape, or a polygonal shape other than a square shape in a plan view facing the surface 51a.

Each of the openings on the front surface 51a and the openings on the back surface 51b among the through holes 51c of the metal mask 51 for vapor deposition may each have a shape other than a rectangular shape such as a square shape and a circular shape, for example.

When the above-mentioned one direction is the first direction and the direction orthogonal to the first direction is the second direction in the plan view facing the surface 51a, the plurality of through holes 51c may be arranged as follows. That is, the plurality of through holes 51c along the first direction constitute one row, and in the first direction, the plurality of through holes 51c are formed at a predetermined pitch. Furthermore, among the plurality of through holes 51c constituting each row, the positions in the first direction overlap each other every other row. On the other hand, in the rows adjacent to each other in the second direction, the positions in the first direction of the plurality of through holes 51c constituting the other row are deviated from the positions in the first direction of the plurality of through holes 51c constituting one row. 1/2 pitch degree. In other words, the plurality of through holes 51c may also be arranged in a checkerboard shape.

In short, in the metal mask 51 for vapor deposition, the plurality of through holes 51c may be arranged so as to correspond to the arrangement of the organic layer formed using the metal mask 51 for vapor deposition. In addition, in the embodiment, the plurality of through holes 51c are arranged so as to correspond to the grid arrangement in the organic EL device. On the one hand, the plurality of through holes 51c in the above-mentioned modification example are arranged to correspond to the triangular shape in the organic EL device. Arranged by way of arrangement.

In the plan view facing the surface 51a, when the above-mentioned one direction is the first direction and the direction orthogonal to the first direction is the second direction, in the above-mentioned embodiment, each through hole 51c is connected to the The other through-holes 51c adjacent to each other in the first direction and the other through-holes 51c adjacent to the second direction are deviated from each other. But not limited to this, the opening in the surface 51a of each through-hole 51c may be connected to the opening in the surface 51a of the other through-holes 51c adjacent to each other in the first direction, or may be adjacent to each other in the second direction. The openings in the surface 51a of the through holes 51c are connected. Alternatively, the opening in the surface 51a of each through hole 51c may be connected to both the first direction and the second direction and the opening in the surface 51a of another through hole 51c adjacent to each other. In such a metal mask for vapor deposition, the thickness of the portion where the two through holes 51c are connected may be thicker than the portion of the outer edge of the metal mask for vapor deposition that is not the position of the through hole 51c, that is, the portion where the through hole 51c is formed. The thickness of the portion not etched in the step is still thin.

The metal mask for vapor deposition is not limited to the metal mask for vapor deposition used when forming the organic layer of the organic EL device, and may be one of wirings provided in various devices such as display devices other than the organic EL device. A metal mask for vapor deposition used for forming or forming functional layers included in various devices.

Claims (8)

A method of manufacturing a base material for a metal mask, comprising: preparing a rolled metal sheet, the rolled metal sheet having a front surface and a back surface, the back surface being a surface opposite to the surface, and at least one of the surface and the back surface of the rolled metal sheet One is the treatment object; and by etching the treatment object with an acid etching solution of 3 μm or more, the treatment object is roughened so as to become a resist treatment surface having a surface roughness Rz of 0.2 μm or more, so as to obtain a metal Sheets made of metal masks. The method for producing a base material for a metal mask according to claim 1, wherein the object to be treated is both the front surface and the back surface. The method for manufacturing a base material for a metal mask according to claim 1, wherein the object to be treated is any one of the front surface and the back surface, and the manufacturing method further comprises layering a support layer made of resin on the area opposite to the object to be treated, The object to be processed is etched in a state where the rolled metal sheet and the support layer are laminated to obtain a base material for a metal mask in which the sheet for metal mask and the support layer are laminated. The method for manufacturing a base material for a metal mask according to claim 2, wherein the etching comprises etching a first object to be processed, and then, etching a second object to be processed, the first object being one of the front surface and the back surface Alternatively, the second treatment object is the other of the front surface and the back surface, and the manufacturing method further includes, after etching the first treatment object, using the resist obtained by etching the first treatment object Treat the support layer made of resin for the surface layer, and etch the second treatment object in the state where the metal rolled sheet and the support layer are stacked, so as to obtain the metal mask that the metal mask sheet and the support layer are laminated. substrate. The method for producing a base material for a metal mask according to claim 1, wherein the rolled metal sheet is a rolled sheet of Hengfan steel, and the sheet for a metal mask is made of Hengfan steel. The method for producing a base material for a metal mask according to any one of claims 1 to 5, wherein the treated surface for the resist has particle traces, the particle traces are a plurality of depressions having an elliptical hammer shape, and the Aligned in the longitudinal direction. A method for manufacturing a metal mask for vapor deposition, comprising: forming a base material for a metal mask having at least one treated surface for resist; forming a resist layer on one of the treated surfaces for resist; The resist layer is patterned to form a resist mask; and the above-mentioned resist mask is used to etch the aforementioned metal mask substrate, and the manufacturing method of the metal mask substrate according to any one of claims 1 to 6 is used. , forming the aforementioned base material for the metal mask. The method for producing a metal mask for vapor deposition as claimed in claim 7, wherein the base material for the metal mask is a laminate comprising the sheet for the metal mask and a resin-made support layer, and further comprises the above-mentioned resist The said support layer is chemically removed from the said base material for metal masks by exposing the said base material for metal masks after agent masking to an alkaline solution.

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