CN103352224B - A kind of two-sided engraving method for metal products - Google Patents
A kind of two-sided engraving method for metal products Download PDFInfo
- Publication number
- CN103352224B CN103352224B CN201310275951.5A CN201310275951A CN103352224B CN 103352224 B CN103352224 B CN 103352224B CN 201310275951 A CN201310275951 A CN 201310275951A CN 103352224 B CN103352224 B CN 103352224B
- Authority
- CN
- China
- Prior art keywords
- metal products
- etching
- sided
- mask layer
- carry out
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- ing And Chemical Polishing (AREA)
Abstract
The present invention discloses a kind of two-sided engraving method for metal products, and described method comprises following process: carry out mask process at the upper surface of metal products and lower surface, and described upper surface is corresponding consistent with the mask layer pattern of lower surface; First the metal products upper surface after mask or lower surface are placed in etching machine and carry out spray etching, then metal products is overturn, the lower surface of metal products or upper surface are placed in etching machine and carry out spray etching, complete the two-sided etching to metal products; Demoulding process is carried out to the metal products after two-sided etching, removing mask layer, and carry out cleaning, polishing aftertreatment.The method of the invention can process the good micro-through-hole result of dimensional precision on metal products, and side etching quantity is little, and working (machining) efficiency is high, is applicable to the demand of scale operation processing.
Description
Technical field
The present invention relates to one and carry out etching method in surface of metal product, especially a kind of upper and lower surface at metal products carries out two-sided etching method.
Background technology
Usually need to process the structures such as the minute sized pit of large aspect ratio, circular hole in precision optical machinery processing, the shortcomings such as processing difficulties, size deviation are larger can be there is, be difficult to meet processing request.Because the existence of mechanical stress in traditional mechanical workout, the forming accuracy of micro-structure can be caused to be deteriorated, and the shape characteristic in aperture is poor, the micro-electrochemical machining method equipment adopted in current high precision processing is complicated, tooling cost is high, and working (machining) efficiency is lower, is not suitable for the demand of scale operation.And etching and processing scheme is with its high precision, high-level efficiency, the advantage of low cost is widely used in microelectromechanical systems manufacture, pcb board printing, metal fine processing and other fields.
Chemical milling ratio juris utilizes metal and etching reagent (pharmaceutical chemicals) to carry out chemical reaction form solvable object and remove work material, by controlling to wish to be removed part and the object of processing is assigned to reach in protected portion.Carrying out patterned mask to stainless steel surface, to not needing the region processed to protect, the position of processing does not process, and namely non-masked areas and etching solution carry out chemical reaction, form corresponding microtexture.
Summary of the invention
The object of the invention is to overcome the deficiencies in the prior art part and a kind of two-sided engraving method for processing high precision, large aspect ratio microsize through hole in surface of metal product is provided; In addition, another object of the present invention is to provide a kind of metal products adopting the two-sided etching and processing of method described above to go out.
For achieving the above object, the present invention takes following technical scheme: a kind of two-sided engraving method for metal products, comprises the following steps:
(1) carry out mask process at the upper surface of metal products and lower surface, described upper surface is corresponding consistent with the mask layer pattern of lower surface;
(2) first the metal products upper surface after mask or lower surface are placed in etching machine and carry out spray etching, then metal products is overturn, the lower surface of metal products or upper surface are placed in etching machine and carry out spray etching, complete the two-sided etching to metal products; Etching solution in described two-sided etching comprises the component of following mass ratio: iron trichloride 20 ~ 40%, hydrochloric acid 3 ~ 5%, nitric acid 1 ~ 2%, hydrofluoric acid 0.3 ~ 0.5%, hydrogen peroxide 0.2 ~ 0.4%, sodium-chlor 0.1 ~ 0.3%, surplus are water;
(3) demoulding process is carried out to the metal products after two-sided etching, removing mask layer, and carry out cleaning, polishing aftertreatment.
As the preferred implementation of the two-sided engraving method for metal products of the present invention, before the mask process of carrying out step (1), first surface finish process is carried out to metal products, the roughness≤1.6Ra of the surface of metal product after process.Described metal products, before carrying out mask process, first carries out the pre-treatments such as surface finish, makes the roughness≤1.6Ra of the surface of metal product after processing, can meet the adhesion requirements of mask layer to surface of metal product, better facilitate subsequent masks process.
As the preferred implementation of the two-sided engraving method for metal products of the present invention, in the mask process of described step (1), the mask layer pattern of described metal products upper surface and lower surface is the circular cavernous structure of array distribution.When the upper surface of described metal products and the mask layer pattern of lower surface are the circular cavernous structure of array distribution; circular hole place is the exposed region of surface of metal product; cover without mask layer; the capped protection of elsewhere; in subsequent etch process; exposed circular hole place is etched removal, and forms circle hole shape pit on the surface of metal products.Because described metal products upper surface is identical and unanimously corresponding with the mask layer pattern of lower surface, therefore follow-up respectively two-sided etching is carried out to the upper surface of metal products and lower surface time, described metal products upper surface and the exposed border circular areas of lower surface corresponding, after two-sided etching and processing, manhole can be formed on described metal products.Certainly, described mask layer pattern is not limited to the circular cavernous structure of array distribution, also can be the cavernous structures such as square, pentagon, the Polygons of array distribution, according to the shape needing the through hole formed on metal products, determine the shape of described mask layer pattern.
As the preferred implementation of the two-sided engraving method for metal products of the present invention, carry out mask process at the upper surface of metal products and lower surface and specifically comprise following process: at upper surface and the lower surface coating sensitive materials of metal products, described upper surface with the sensitive materials of lower surface attach the film that pattern is completely corresponding identical, pattern on the described film is the circle of array distribution, then exposure-processed is carried out, after exposure, the film is removed, and the uncured sensitive materials of the cleaning described metal products upper surface of removing and lower surface, the sensitive materials that described metal products upper surface and lower surface solidify is mask layer.The key of mask makes the mask layer pattern of metal products upper and lower surface completely corresponding identical, the precision of such guarantee through hole that two-sided etching and processing goes out on metal products.For this reason, the first upper surface at described metal products and lower surface evenly apply sensitive materials, then circular dimension, the on all four whole Zhang Feilin of pattern-pitch is designed as exposing material, with whole Zhang Feilin mid-line for line of delimitation, by folding for the film separately symmetrical, with position, the film is attached in the same way on the sensitive materials of described metal products upper and lower surface, to ensure that the center of circle circular on film pattern in described metal products upper and lower surface is aimed at.Then exposure-processed is carried out, on the described film, circular pattern section is black, light tight, and elsewhere is transparent, energy printing opacity, therefore in exposure process, place transparent on the light therethrough film, react with the sensitive materials of metal products upper surface and lower surface, the sensitive materials corresponding with the transparent place of the described film is made to be fixed on upper surface and the lower surface of described metal products, form mask layer, and described metal products upper surface and the lower surface sensitive materials corresponding with the circular pattern section of the film uncured.After exposure-processed, the film is removed from the upper surface of described metal products and lower surface, and clean sensitive materials uncured on described metal products upper surface and lower surface, the circular cavernous structure mask layer of completely corresponding identical array distribution is namely formed at upper surface and the lower surface of described metal products.
Sensitive materials described above is the sensitive materialss such as photosensitive blue oil, photosensitive green oil, photoresist material.
As the preferred implementation of the two-sided engraving method for metal products of the present invention, the circular pattern diameter 0.15 ~ 0.2mm less of the Circularhole diameter that need process on described metal products on the described film.On the described film, the diameter of circular pattern is less than the Circularhole diameter described metal products needing process, because in etching reaction process, etching solution preferentially occurs in the exposed circular hole region of non-mask on metal products, also can occur to side direction while vertical direction is carried out along with being etched in, there is micro-lateral erosion in the circular hole periphery mask overlay area namely formed to surface of metal product, therefore only has the diameter of circular pattern on the described film to be less than described metal products needs the round diameter processed, namely the diameter of described mask layer circular hole is less than the round diameter described metal products needing process, the circular hole of the diameter of design just can be processed accurately on described metal products.In order to improve the precision of the circular hole of etching and processing on metal products and reduce the lateral erosion of circular hole import and export, specific requirement is had to the poroid scantlings of the structure of the circle of mask layer pattern, usually, circular pattern diameter 0.15 ~ 0.2mm less of the Circularhole diameter needing to process on described metal products on the described film, such as when needing that to process diameter on metal products be the manhole of 1mm, in masking steps, the diameter of the circular pattern that the described film designs can be 0.8 ~ 0.85mm; Certainly, described size is not absolute, if etching solution is comparatively large to the lateral erosion of metal products in etching process, suitably can reduce the diameter of circular pattern on the film, such as can on the basis of original size, then by the reduced 0.03 ~ 0.08mm of circular pattern on the film.In actually operating engineering, can according to the size of side etching quantity and other conditions, rationally determine difference circular pattern diameter and described metal products needing the described film Circularhole diameter processed.
As the preferred implementation of the two-sided engraving method for metal products of the present invention, the thickness of described mask layer is 30 ~ 50 μm.Usually, the thickness of described mask layer is 30 ~ 50 μm, described mask layer can the corrosion of etching resistant liquid in follow-up etching process, in actual mechanical process, the thickness of described mask layer can in above-mentioned scope choose reasonable, certainly also can carry out suitable adjustment a little more than or lower than above-mentioned thickness range.
As the preferred implementation of the two-sided engraving method for metal products of the present invention, in described step (2), carrying out etching solution for etching spray pressure to the upper surface of described metal products and lower surface is 1.0 ~ 1.8psi, and spray time is 1 ~ 1.5min.As the more preferably embodiment of the two-sided engraving method for metal products of the present invention, in described step (2), carrying out etching solution for etching spray pressure to the upper surface of described metal products and lower surface is 1.4psi, and spray time is 1.2min.In order to ensure etch precision, etching period is short, and the spray pressure of the etching solution of selection will try one's best greatly, contriver through research discovery, when described etching solution spray pressure be 1.0 ~ 1.8psi, spray time be 1 ~ 1.5min time, etch precision better; And when etching solution spray pressure be 1.4psi, spray time be 1.2min time, etching precision better.
As the preferred implementation of the two-sided engraving method for metal products of the present invention, in described step (2), the temperature of the upper surface of described metal products and lower surface being carried out to etching solution for etching is 35 ~ 45 DEG C.Present inventor finds through large quantity research, and when the temperature of described etching solution is 35 ~ 45 DEG C, now the activity of etching solution is higher, and speed of reaction is very fast, and etching efficiency is higher.
In addition, present invention also offers a kind of metal products adopting method described above to carry out two-sided etching and processing.Adopt method described above to carry out the metal products of two-sided etching and processing, described metal products can be formed the good micro-through-hole structure of dimensional precision, side etching quantity is little, can meet the requirement of fine structure.
Metal products of the present invention can be the metal products such as stainless steel, die steel.
The method of the invention first carries out mask process at the upper surface of metal products and lower surface; described upper surface is corresponding consistent with mask pattern on lower surface; during to make follow-up two-sided etching; correspondence is consistent completely with lower surface being wished removed part and protected part for described upper surface, can etch accurately and form through hole on described metal products.When carrying out two-sided etching to the metal products after mask, first the one side of the metal products after mask is placed in etching machine and carries out spray etching, after having etched, metal products is overturn, the another side of metal products is placed in etching machine and carries out spray etching, realize the two-sided etching and processing to metal products.After having etched, the mask layer of metal products upper surface and lower surface is removed, and carry out as required cleaning, the aftertreatment such as polishing.Two-sided engraving method for metal products of the present invention, can process the good micro-through-hole result of dimensional precision on metal products, side etching quantity is little, and working (machining) efficiency is high, is applicable to the demand of scale operation processing.
Accompanying drawing explanation
Fig. 1 is the structural representation adopting the method for the invention to carry out the metal products after two-sided etching and processing.
Fig. 2 is the cross-sectional view adopting the method for the invention to carry out the through hole that mask layer and machining are formed in two-sided etch process.
In figure, 10 is metal products, 20 is that through hole, 30 is mask layer, the R1 Circularhole diameter that to be Circularhole diameter, the R2 processed on metal products be on mask layer.
Embodiment
For better the object, technical solutions and advantages of the present invention being described, below in conjunction with the drawings and specific embodiments, the invention will be further described.
The present invention is used for a kind of embodiment of the two-sided engraving method of metal products, comprises the following steps:
(1) carry out mask process at the upper surface of metal products and lower surface, described upper surface is corresponding consistent with the mask layer pattern of lower surface;
(2) first the metal products upper surface after mask or lower surface are placed in etching machine and carry out spray etching, then metal products is overturn, the lower surface of metal products or upper surface are placed in etching machine and carry out spray etching, complete the two-sided etching to metal products; Etching solution in described two-sided etching comprises the component of following mass ratio: iron trichloride 20 ~ 40%, hydrochloric acid 3 ~ 5%, nitric acid 1 ~ 2%, hydrofluoric acid 0.3 ~ 0.5%, hydrogen peroxide 0.2 ~ 0.4%, sodium-chlor 0.1 ~ 0.3%, surplus are water;
(3) demoulding process is carried out to the metal products after two-sided etching, removing mask layer, and carry out cleaning, polishing aftertreatment.
Method described above first carries out mask process at the upper surface of metal products and lower surface; described upper surface is corresponding consistent with mask pattern on lower surface; during to make follow-up two-sided etching; correspondence is consistent completely with lower surface being wished removed part and protected part for described upper surface, can etch accurately and form through hole on described metal products.When carrying out two-sided etching to the metal products after mask, first the one side of the metal products after mask is placed in etching machine and carries out spray etching, after having etched, metal products is overturn, the another side of metal products is placed in etching machine and carries out spray etching, realize the two-sided etching and processing to metal products.After having etched, the mask layer of metal products upper surface and lower surface is removed, and carry out as required cleaning, the aftertreatment such as polishing.
Carrying out in two-sided etching process to metal products, the etching solution of employing comprises the component of following mass ratio: iron trichloride 20 ~ 40%, hydrochloric acid 3 ~ 5%, nitric acid 1 ~ 2%, hydrofluoric acid 0.3 ~ 0.5%, hydrogen peroxide 0.2 ~ 0.4%, sodium-chlor 0.1 ~ 0.3%, surplus are water.Described etching solution can adopt following methods to be prepared from: first that iron trichloride is soluble in water, after waiting the temperature cooling of solution, then adds hydrochloric acid, nitric acid, hydrofluoric acid, hydrogen peroxide and sodium-chlor, is mixed by solution, obtain etching solution described above.In the preparation process of described etching solution, because a large amount of heat can be discharged during iron trichloride powder dissolution, cause solution temperature to raise, after therefore will waiting the temperature cooling of solution, then add hydrochloric acid, nitric acid, hydrofluoric acid, hydrogen peroxide and sodium-chlor.Fe in liquor ferri trichloridi
3+chemical reaction can be there is with the Fe in stainless steel composition, carry out etching and dissolve; H in acid
+can damage containing the complex oxide of Cr etc. and oxyhydroxide stainless steel surface with sodium-chlor, thus promote carrying out smoothly of etching reaction; Cl in sodium-chlor and hydrochloric acid
-it is a kind of complexing agent, with indissoluble in institute etching metal composition Ni, Cr plasma be combined, generate soluble salt, enhance the ablation ability of etching solution to metal, improve speed of reaction, make whole etch systems have etch-rate simultaneously and stablize, etch uniform feature; Add sodium-chlor and can supplement Cl
-consumption; Hydrofluoric acid can dissolve Ti, Ni, the Cr of indissoluble in stainless steel, improves etching performance and etching efficiency; Nitric acid can by the Fe of etching reaction
2+oxidation regenerates Fe
3+, Fe in make-up solution
3+consumption, impel etching reaction rate holds steady, nitric acid can dissolve the oxidation products generated by etching reaction simultaneously, avoid oxidizing substance in the deposition of finished surface, improve the smooth finish of finished surface, play the effect of polishing, the passive film that machined surface in etching reaction process is formed can dissolve by hydrogen peroxide in time, promote the generation of etching reaction, maintain the stable of etch-rate.Present inventor draws through large quantity research, when described etching solution adopts the combination of the above composition and content, has the advantages such as side etching quantity is little, etch-rate is fast.
Preferably, before the mask process of carrying out step (1), first surface finish process is carried out to metal products, the roughness≤1.6Ra of the surface of metal product after process.Described metal products, before carrying out mask process, first carries out the pre-treatments such as surface finish, makes the roughness≤1.6Ra of the surface of metal product after processing, can meet the adhesion requirements of mask layer to surface of metal product, better facilitate subsequent masks process.
Preferably, in the mask process of described step (1), the mask layer pattern of described metal products upper surface and lower surface is the circular cavernous structure of array distribution.When the upper surface of described metal products and the mask layer pattern of lower surface are the circular cavernous structure of array distribution; circular hole place is the exposed region of surface of metal product; cover without mask layer; the capped protection of elsewhere; in subsequent etch process; exposed circular hole place is etched removal, and forms circle hole shape pit on the surface of metal products.Because described metal products upper surface is identical and unanimously corresponding with the mask layer pattern of lower surface, therefore follow-up respectively two-sided etching is carried out to the upper surface of metal products and lower surface time, described metal products upper surface and the exposed border circular areas of lower surface corresponding, after two-sided etching and processing, manhole can be formed, as shown in Figure 1 on described metal products.Certainly, described mask layer pattern is not limited to the circular cavernous structure of array distribution, also can be the cavernous structures such as square, pentagon, the Polygons of array distribution, according to the shape needing the through hole formed on metal products, determine the shape of described mask layer pattern.
Preferably, carry out mask process at the upper surface of metal products and lower surface and specifically comprise following process: at upper surface and the lower surface coating sensitive materials of metal products, described upper surface with the sensitive materials of lower surface attach the film that pattern is completely corresponding identical, pattern on the described film is the circle of array distribution, then exposure-processed is carried out, after exposure, the film is removed, and the cleaning described metal products upper surface of removing and the uncured sensitive materials of lower surface, the sensitive materials that described metal products upper surface and lower surface solidify is mask layer.The key of mask makes the mask layer pattern of metal products upper and lower surface completely corresponding identical, the precision of such guarantee through hole that two-sided etching and processing goes out on metal products.For this reason, the first upper surface at described metal products and lower surface evenly apply sensitive materials, then circular dimension, the on all four whole Zhang Feilin of pattern-pitch is designed as exposing material, with whole Zhang Feilin mid-line for line of delimitation, by folding for the film separately symmetrical, with position, the film is attached in the same way on the sensitive materials of described metal products upper and lower surface, to ensure that the center of circle circular on film pattern in described metal products upper and lower surface is aimed at.Then exposure-processed is carried out, on the described film, circular pattern section is black, light tight, and elsewhere is transparent, energy printing opacity, therefore in exposure process, place transparent on the light therethrough film, react with the sensitive materials of metal products upper surface and lower surface, the sensitive materials corresponding with the transparent place of the described film is made to be fixed on upper surface and the lower surface of described metal products, form mask layer, and described metal products upper surface and the lower surface sensitive materials corresponding with the circular pattern section of the film uncured.After exposure-processed, the film is removed from the upper surface of described metal products and lower surface, and clean sensitive materials uncured on described metal products upper surface and lower surface, the circular cavernous structure mask layer of completely corresponding identical array distribution is namely formed at upper surface and the lower surface of described metal products.
Sensitive materials described above is the sensitive materialss such as photosensitive blue oil, photosensitive green oil, photoresist material.
Preferably, the circular pattern diameter 0.15 ~ 0.2mm less of the Circularhole diameter that need process on described metal products on the described film.On the described film, the diameter of circular pattern is less than the Circularhole diameter described metal products needing process, because in etching reaction process, etching solution preferentially occurs in the exposed circular hole region of non-mask on metal products, also can occur to side direction while vertical direction is carried out along with being etched in, there is micro-lateral erosion in the circular hole periphery mask overlay area namely formed to surface of metal product, therefore only has the diameter of circular pattern on the described film to be less than described metal products needs the round diameter processed, namely the diameter R2 of described mask layer 30 circular hole is less than the Circularhole diameter R1(that described metal products 10 needs process as shown in Figure 2), the circular hole of the diameter of design just can be processed accurately on described metal products.Can be found out by accompanying drawing 2, due to lateral erosion effect, the Circularhole diameter R1 that described metal products 10 processes is greater than the Circularhole diameter R2 of described mask layer 30.In order to improve the precision of the circular hole of etching and processing on metal products and reduce the lateral erosion of circular hole import and export, specific requirement is had to the poroid scantlings of the structure of the circle of mask layer pattern, usually, circular pattern diameter 0.15 ~ 0.2mm less of the Circularhole diameter needing to process on described metal products on the described film, such as when needing that to process diameter on metal products be the manhole of 1mm, in masking steps, the diameter of the circular pattern that the described film designs can be 0.8 ~ 0.85mm; Certainly, described size is not absolute, if etching solution is comparatively large to the lateral erosion of metal products in etching process, suitably can reduce the diameter of circular pattern on the film, such as can on the basis of original size, then by the reduced 0.03 ~ 0.08mm of circular pattern on the film.In actually operating engineering, can according to the size of side etching quantity and other conditions, rationally determine difference circular pattern diameter and described metal products needing the described film Circularhole diameter processed.
Preferably, the thickness of described mask layer is 30 ~ 50 μm.Usually, the thickness of described mask layer is 30 ~ 50 μm, described mask layer can the corrosion of etching resistant liquid in follow-up etching process, in actual mechanical process, the thickness of described mask layer can in above-mentioned scope choose reasonable, certainly also can carry out suitable adjustment a little more than or lower than above-mentioned thickness range.
Preferably, in described step (2), carrying out etching solution for etching spray pressure to the upper surface of described metal products and lower surface is 1.0 ~ 1.8psi, and spray time is 1 ~ 1.5min.As the more preferably embodiment of the two-sided engraving method for metal products of the present invention, in described step (2), carrying out etching solution for etching spray pressure to the upper surface of described metal products and lower surface is 1.4psi, and spray time is 1.2min.In order to ensure etch precision, etching period is short, and the spray pressure of the etching solution of selection will try one's best greatly, contriver through research discovery, when described etching solution spray pressure be 1.0 ~ 1.8psi, spray time be 1 ~ 1.5min time, etch precision better; And when etching solution spray pressure be 1.4psi, spray time be 1.2min time, etching precision better.
Preferably, in described step (2), the temperature of the upper surface of described metal products and lower surface being carried out to etching solution for etching is 35 ~ 45 DEG C.Present inventor finds through large quantity research, and when the temperature of described etching solution is 35 ~ 45 DEG C, now the activity of etching solution is higher, and speed of reaction is very fast, and etching efficiency is higher.
Method described above is adopted to carry out the metal products of two-sided etching and processing as shown in Figure 1, can be found out by accompanying drawing 1, method described above is adopted to carry out the metal products 10 of two-sided etching and processing, described metal products 10 can be formed good small manhole 20 structure of dimensional precision, side etching quantity is little, can meet the requirement of fine structure.
Metal products described above can be the metal products such as stainless steel, die steel.
Finally to should be noted that; above embodiment is only in order to illustrate technical scheme of the present invention but not limiting the scope of the invention; although be explained in detail the present invention with reference to preferred embodiment; those of ordinary skill in the art is to be understood that; can modify to technical scheme of the present invention or equivalent replacement, and not depart from essence and the scope of technical solution of the present invention.
Claims (8)
1., for a two-sided engraving method for metal products, it is characterized in that, comprise the following steps:
(1) carry out mask process at the upper surface of metal products and lower surface, described upper surface is corresponding consistent with the mask layer pattern of lower surface;
(2) first the metal products upper surface after mask or lower surface are placed in etching machine and carry out spray etching, then metal products is overturn, the lower surface of metal products or upper surface are placed in etching machine and carry out spray etching, complete the two-sided etching to metal products; Etching solution in described two-sided etching comprises the component of following mass ratio: iron trichloride 20 ~ 40%, hydrochloric acid 3 ~ 5%, nitric acid 1 ~ 2%, hydrofluoric acid 0.3 ~ 0.5%, hydrogen peroxide 0.2 ~ 0.4%, sodium-chlor 0.1 ~ 0.3%, surplus are water;
(3) demoulding process is carried out to the metal products after two-sided etching, removing mask layer, and carry out cleaning, polishing aftertreatment;
Carry out mask process at the upper surface of metal products and lower surface and specifically comprise following process: at upper surface and the lower surface coating sensitive materials of metal products, described upper surface with the sensitive materials of lower surface attach the film that pattern is completely corresponding identical, pattern on the described film is the circle of array distribution, then exposure-processed is carried out, after exposure, the film is removed, and the cleaning described metal products upper surface of removing and the uncured sensitive materials of lower surface, the sensitive materials that described metal products upper surface and lower surface solidify is mask layer;
Circular pattern diameter 0.15 ~ 0.2mm less of the Circularhole diameter that need process on described metal products on the described film.
2., as claimed in claim 1 for the two-sided engraving method of metal products, it is characterized in that, before the mask process of carrying out step (1), first surface finish process is carried out to metal products, the roughness≤1.6Ra of the surface of metal product after process.
3., as claimed in claim 1 for the two-sided engraving method of metal products, it is characterized in that, in the mask process of described step (1), the mask layer pattern of described metal products upper surface and lower surface is the circular cavernous structure of array distribution.
4., as claimed in claim 1 for the two-sided engraving method of metal products, it is characterized in that, the thickness of described mask layer is 30 ~ 50 μm.
5. as claimed in claim 1 for the two-sided engraving method of metal products, it is characterized in that, in described step (2), carrying out etching solution for etching spray pressure to the upper surface of described metal products and lower surface is 1.0 ~ 1.8psi, and spray time is 1 ~ 1.5min.
6. as claimed in claim 5 for the two-sided engraving method of metal products, it is characterized in that, in described step (2), carrying out etching solution for etching spray pressure to the upper surface of described metal products and lower surface is 1.4psi, and spray time is 1.2min.
7. the two-sided engraving method for metal products as described in claim 1 or 5 or 6, is characterized in that, in described step (2), the temperature of the upper surface of described metal products and lower surface being carried out to etching solution for etching is 35 ~ 45 DEG C.
8. one kind adopts as above arbitrary described method to carry out the metal products of two-sided etching and processing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310275951.5A CN103352224B (en) | 2013-07-01 | 2013-07-01 | A kind of two-sided engraving method for metal products |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310275951.5A CN103352224B (en) | 2013-07-01 | 2013-07-01 | A kind of two-sided engraving method for metal products |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103352224A CN103352224A (en) | 2013-10-16 |
| CN103352224B true CN103352224B (en) | 2015-09-23 |
Family
ID=49308632
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310275951.5A Expired - Fee Related CN103352224B (en) | 2013-07-01 | 2013-07-01 | A kind of two-sided engraving method for metal products |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103352224B (en) |
Families Citing this family (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102509663B1 (en) * | 2015-07-17 | 2023-03-14 | 도판 인사츠 가부시키가이샤 | Method for producing base for metal masks, method for producing metal mask for vapor deposition, base for metal masks, and metal mask for vapor deposition |
| CN105441946A (en) * | 2015-12-04 | 2016-03-30 | 宁波东盛集成电路元件有限公司 | Metal etching processing technology stable in product quality |
| KR101786391B1 (en) * | 2016-10-06 | 2017-11-16 | 주식회사 포스코 | Alloy metal foil for deposition mask, deposition mask using the alloy metal foil and method for preparing them, and method for preparing organic electroluminescent device |
| CN106852052B (en) * | 2017-03-30 | 2019-07-26 | 维沃移动通信有限公司 | A kind of metal shell processing method, metal shell and electronic equipment |
| CN107218326A (en) * | 2017-07-25 | 2017-09-29 | 昆山弗莱吉电子科技有限公司 | A kind of preparation method of VCM shell fragments |
| KR102028458B1 (en) * | 2017-12-12 | 2019-10-04 | 한국제이씨씨(주) | Method of manufacturing porous current collector |
| CN108251794A (en) * | 2018-01-19 | 2018-07-06 | 昆山国显光电有限公司 | The post-processing approach and mask plate of mask plate |
| US10941342B2 (en) * | 2018-07-23 | 2021-03-09 | Samsung Display Co., Ltd. | Etchant composition and method of manufacturing wiring substrate using the same |
| CN109440108B (en) * | 2018-11-19 | 2020-06-16 | 浙江大学 | Copper foil puncher based on chemical etching and production process thereof |
| CN110519917B (en) * | 2019-08-27 | 2021-08-17 | 江苏上达电子有限公司 | Method for manufacturing through hole |
| CN110923714A (en) * | 2019-09-26 | 2020-03-27 | 宁波福至新材料有限公司 | Etching solution and etching method for titanium foil micropore pattern |
| CN110823667B (en) * | 2019-11-18 | 2021-02-26 | 燕山大学 | Metallographic corrosive agent for high-strength titanium alloy and preparation method of metallographic sample of high-strength titanium alloy |
| CN111090222A (en) * | 2020-02-24 | 2020-05-01 | 昆山弗莱吉电子科技有限公司 | Efficient preparation method of VCM elastic sheet |
| CN111607794B (en) * | 2020-06-17 | 2022-05-27 | 宁波福至新材料有限公司 | Method for improving etching quality of metal product |
| CN112410867B (en) * | 2020-11-05 | 2023-10-20 | 中国航发北京航空材料研究院 | Processing method of high-temperature alloy closely-arranged hole column array structure |
| CN112941516A (en) * | 2020-12-29 | 2021-06-11 | 苏州运宏电子有限公司 | Precise control type etching solution and etching method thereof |
| CN114807938A (en) * | 2022-04-26 | 2022-07-29 | 扬州赛诺高德电子科技有限公司 | Double-sided etching device and etching process for metal radiating fin |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101222057A (en) * | 2007-12-04 | 2008-07-16 | 大连理工大学 | Production technique for producing metallic flow field plate of micro fuel cell |
| CN101227121A (en) * | 2007-12-26 | 2008-07-23 | 彩虹集团电子股份有限公司 | Production technology of oscillation ring |
| CN101440492A (en) * | 2008-12-09 | 2009-05-27 | 彩虹集团电子股份有限公司 | Grill metal member etching production process capable of reducing corrosion allowance |
| CN101852987A (en) * | 2010-05-19 | 2010-10-06 | 易继红 | Continuous toning process of controllable gray scale of metal surface |
| CN103124470A (en) * | 2011-11-18 | 2013-05-29 | 胡泉凌 | Method for manufacturing plastic metallized three-dimensional circuit |
-
2013
- 2013-07-01 CN CN201310275951.5A patent/CN103352224B/en not_active Expired - Fee Related
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101222057A (en) * | 2007-12-04 | 2008-07-16 | 大连理工大学 | Production technique for producing metallic flow field plate of micro fuel cell |
| CN101227121A (en) * | 2007-12-26 | 2008-07-23 | 彩虹集团电子股份有限公司 | Production technology of oscillation ring |
| CN101440492A (en) * | 2008-12-09 | 2009-05-27 | 彩虹集团电子股份有限公司 | Grill metal member etching production process capable of reducing corrosion allowance |
| CN101852987A (en) * | 2010-05-19 | 2010-10-06 | 易继红 | Continuous toning process of controllable gray scale of metal surface |
| CN103124470A (en) * | 2011-11-18 | 2013-05-29 | 胡泉凌 | Method for manufacturing plastic metallized three-dimensional circuit |
Non-Patent Citations (1)
| Title |
|---|
| "过氧化氢在化学抛光中的应用";何家康;《贵州电镀协会成立二十周年年会论文集》;20041231;第47-50页 * |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103352224A (en) | 2013-10-16 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN103352224B (en) | A kind of two-sided engraving method for metal products | |
| CN100582306C (en) | Stainless steel etching technique | |
| CN107937915A (en) | A kind of microlayer model control method based on laser writing technology | |
| CN102285299B (en) | Object surface metallized decoration method | |
| CN105926017B (en) | A kind of processing method and its Al-alloy products of aluminum alloy surface texture | |
| CN103255416B (en) | A kind of engraving method and etch-polish liquid used thereof | |
| CN102686057A (en) | Electronic device shell and manufacturing method thereof | |
| CN112034540B (en) | Processing method of micro-convex lens array structure | |
| EP2046515B1 (en) | Method for forming continuous channel of the surface of casting roll for the twin roll strip casting process | |
| CN101852987B (en) | Continuous toning process of controllable gray scale of metal surface | |
| CN104419929B (en) | Etching method | |
| CN106216698A (en) | A kind of preparation technology of 3D printing alloy powder | |
| CN103397329B (en) | A kind of production technique of stainless steel dot matrix friction plate | |
| TWI303180B (en) | ||
| WO2015021582A1 (en) | Oxidation treatment of metal surfaces | |
| CN103205697A (en) | Vapor deposition mask plate and method for producing same | |
| CN102758226A (en) | Accurate electroplating machining method for long-grating roller stamping mould for machine tool | |
| CN108048841A (en) | A kind of nameplate processing method | |
| CN112877743A (en) | Manufacturing method of bicolor anodic oxidation | |
| CN101503175B (en) | Method for preparing dimethyl silicone polymer surface nanostructure | |
| CN108319107A (en) | A kind of production method of nano-imprint stamp | |
| CN105887086A (en) | Anchor type three-dimensional etching method | |
| CN106166616A (en) | A kind of preparation method of 3D printing metal dust | |
| CN103173768B (en) | A kind of etching solution and preparation method thereof | |
| CN108585529A (en) | A kind of processing technology of abnormity cut glass product |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150923 Termination date: 20210701 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |