JP2015129334A - Method of manufacturing laminate mask, laminate mask, and laminate mask with protective film - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method of manufacturing a laminate mask that can improve patterning precision of vapor deposition.SOLUTION: In a method of manufacturing a laminate mask, a first surface-side resin layer 43 is provided on a first surface 21a of a metal base material 21 and a second surface-side resin layer 46 is provided on a second surface 21b of the metal base material 21 first. Then the first surface-side resin layer 43 and second surface-side resin layer 46 are exposed and developed so as to form a first surface-side resin layer opening part 44 and a second surface-side resin layer opening part 47. A base material hole 30 is formed by etching the metal base material 21 through the first surface-side resin layer opening part 44 from the side of the first surface 21a. A wall surface 48 of the second surface-side resin layer opening part 47 is arranged more inside a through hole 25 than a wall surface 31 of the base material hole 30.

Description

  The present invention relates to a method for manufacturing a laminated mask used for depositing a deposition material on a substrate through a plurality of through holes provided in a desired pattern, and more particularly to a laminated mask that can improve the patterning accuracy of deposition. It relates to a manufacturing method. The present invention also relates to a laminated mask and a laminated mask with a protective film used for depositing a deposition material on a substrate through a plurality of through holes provided in a desired pattern. The present invention relates to an improved laminated mask and a laminated mask with a protective film.

  Conventionally, a method of forming a thin film with a desired pattern using a mask for vapor deposition including through holes arranged in a desired pattern is known. In recent years, vapor deposition is sometimes used when a very expensive material is formed, for example, when an organic material is vapor-deposited on a substrate at the time of manufacturing an organic EL display device. In general, a mask for vapor deposition can be manufactured by forming a through hole in a metal plate by etching using a photolithography technique (for example, Patent Document 1).

  In the case where a deposition material is deposited on a substrate using a deposition mask, the deposition material is deposited on the substrate along the shape of the through holes, and pixels are formed on the substrate.

JP 2004-39319 A

  By the way, when a through hole is formed in a metal plate of an evaporation mask by etching, if there is an obstacle such as dust at the position where the through hole is formed, the metal plate material remains and a defective portion is formed. As a result, defects may occur in the through holes. That is, there may be a problem that the formed through hole is smaller than a desired shape and a problem that the through hole is not formed at a desired position. In this case, a countermeasure may be considered in which the defective portion of the metal plate is irradiated with laser light to sublimate and remove the metal material in the defective portion, and the planar shape of the through hole is corrected to a desired shape.

  However, when irradiating a defective part of a metal plate with a laser beam, it is difficult to remove the defective part with high accuracy. For this reason, there exists a problem that the precision of the shape of a through-hole falls and it becomes difficult to improve the precision of vapor deposition patterning.

  The present invention has been made in consideration of such points, and an object of the present invention is to provide a method for manufacturing a laminated mask, a laminated mask, and a laminated mask with a protective film that can improve the patterning accuracy of vapor deposition.

The present invention
In a manufacturing method of a laminated mask having a plurality of through holes and used for depositing a deposition material on a substrate through the through holes,
Preparing a metal substrate having a first surface and a second surface provided on the opposite side of the first surface and disposed on the substrate side during vapor deposition;
Providing a first surface-side resin layer on the first surface of the metal substrate, and providing a second surface-side resin layer on the second surface of the metal substrate;
The first surface side resin layer and the second surface side resin layer are exposed and developed to form a first surface side resin layer opening in the first surface side resin layer, and the second surface side Forming a second surface side resin layer opening in the resin layer;
Etching the metal substrate from the first surface side through the first surface-side resin layer opening, the metal substrate communicating with the second surface-side resin layer opening, and Forming a base material hole that defines the through hole together with the second surface side resin layer opening, and
The method for producing a laminated mask, wherein the wall surface of the second surface side resin layer opening is disposed inside the through hole rather than the wall surface of the base material hole,
I will provide a.

  In the method for manufacturing a laminated mask according to the present invention, the first surface side resin layer opening communicates with the base material hole and defines the through hole together with the base material hole and the second surface side resin layer opening. You may do it.

  In the method for manufacturing a laminated mask according to the present invention, the first surface side resin layer and the second surface side resin layer may have alkali resistance.

  In the method for manufacturing a laminated mask according to the present invention, after the step of forming the first surface side resin layer opening and the second surface side resin layer opening, the step of etching the metal substrate from the first surface side Before, the protective film may be provided on the surface of the second surface side resin layer opposite to the metal substrate side.

  In the method for producing a laminated mask according to the present invention, the protective film may be peelable from the second surface side resin layer by irradiating UV light.

  In the method for manufacturing a laminated mask according to the present invention, after the step of forming the first surface side resin layer opening and the second surface side resin layer opening, the step of etching the metal substrate from the first surface side Before the step, the outline of the second surface side resin layer opening may be corrected by irradiating the defective portion of the second surface side resin layer with laser light to remove the defective portion.

  In the method of manufacturing a laminated mask according to the present invention, the first surface side resin layer and the second surface side resin layer are formed of a rubber-based photosensitive resin or an acrylic negative photosensitive resin containing an azide compound. It may be.

  In the method for manufacturing a laminated mask according to the present invention, when the metal substrate is etched from the first surface side, the first surface side resin layer in the region where the through hole is formed is removed. Good.

  In the method of manufacturing a laminated mask according to the present invention, in the step of etching the metal base material from the first surface side, the front edge of the wall surface of the base material hole is another base material hole adjacent to the base material hole. You may make it merge with the front-end edge of the wall surface of.

  In the method of manufacturing a laminated mask according to the present invention, after the step of etching the second surface side resin layer, before the step of etching the metal substrate from the first surface side, the second surface side resin layer opening is performed. Etching the metal base material from the second surface side through a portion, and further forming a base material recess on the second surface side of the metal base material, the metal base material being the first surface side In the etching step, the base material hole may be formed so as to include the base material recess.

The present invention
In a laminated mask having a plurality of through holes and used for depositing a deposition material on a substrate through the through holes,
A metal substrate having a first surface and a second surface provided on the opposite side of the first surface and disposed on the substrate side during vapor deposition;
A second surface side resin layer provided on the second surface of the metal substrate,
The metal substrate has a substrate hole,
The second surface side resin layer has a second surface side resin layer opening that communicates with the base material hole and defines the through hole together with the base material hole,
The wall surface of the second surface side resin layer opening is disposed inside the through hole rather than the wall surface of the base material hole,
The second surface side resin layer is formed of a rubber-based photosensitive resin or an acrylic negative photosensitive resin containing an azide compound, a laminated mask,
I will provide a.

  The laminated mask according to the present invention further includes a first surface side resin layer provided on the first surface of the metal base material, and the first surface side resin layer communicates with the base material hole and the base material. A first surface-side resin layer opening defining the through hole together with a hole and the second surface-side resin layer opening, wherein the first surface-side resin layer is the same as the second surface-side resin layer; The wall surface of the second surface side resin layer opening may be formed inside the through hole from the wall surface of the first surface side resin layer opening.

  In the laminated mask according to the present invention, the first surface side resin layer and the second surface side resin layer may have alkali resistance.

  In the laminated mask according to the present invention, the front edge of the wall surface of the base material hole may be joined with the front edge of the wall surface of another base material hole adjacent to the base material hole.

The present invention
The laminated mask described above;
A protective film provided with a protective film provided on a surface opposite to the metal substrate side of the second surface side resin layer, and a laminated mask with a protective film,
I will provide a.

  In the laminated mask with a protective film according to the present invention, the protective film may be peelable from the second surface side resin layer by irradiation with UV light.

  According to the present invention, the patterning accuracy of vapor deposition can be improved.

FIG. 1 is a diagram for explaining an embodiment of the present invention, and is a schematic plan view showing an example of a laminated mask device including a laminated mask. FIG. 2 is a view for explaining a method of vapor deposition using the laminated mask apparatus shown in FIG. FIG. 3 is a plan view showing the laminated mask shown in FIG. FIG. 4 is a partially enlarged plan view of the laminated mask shown in FIG. FIG. 5 is a cross-sectional view corresponding to a cross section taken along the line II of FIG. 4 and showing a laminated mask with a protective film. FIG. 6 is a cross-sectional view illustrating a state in which the laminated mask with protective film shown in FIG. 5 is welded to the frame of the laminated mask device. FIG. 7 is a cross-sectional view showing a state where the protective film is peeled from the laminated mask. FIG. 8 is a schematic diagram for entirely explaining an example of the manufacturing method of the laminated mask shown in FIG. FIG. 9 is a view for explaining an example of a method for manufacturing a laminated mask, and is a view showing a metal plate. FIG. 10 is a diagram for explaining an example of a method for manufacturing a laminated mask, and is a diagram for explaining a process of forming a first surface side resin layer and a second surface side resin layer on a laminate. . FIG. 11 is a diagram for explaining an example of a method for manufacturing a laminated mask, and is a diagram for explaining a process of exposing a resin layer. FIG. 12 is a diagram for explaining an example of a method for manufacturing a laminated mask, and is a diagram for explaining a process of developing a resin layer. FIG. 13 is a diagram for explaining an example of a method for manufacturing a laminated mask, and is a diagram for explaining a process of etching a metal plate from the second surface side. FIG. 14 is a view for explaining an example of a method for manufacturing a laminated mask, and is a view for explaining a process in which a protective film is provided. FIG. 15 is a diagram for explaining an example of a method for manufacturing a laminated mask, and is a diagram for explaining a process in which a metal plate is etched from the first surface side. FIG. 16 is a cross-sectional view showing a modification of the laminated mask with a protective film shown in FIG.

  Hereinafter, an embodiment of the present invention will be described with reference to the drawings. In the drawings attached to the present specification, for the sake of illustration and ease of understanding, the scale, the vertical / horizontal dimension ratio, and the like are appropriately changed and exaggerated from those of the actual product.

  1 to 15 are diagrams for explaining one embodiment of the present invention. In the following embodiments and modifications thereof, in order to deposit an evaporation material such as an organic light emitting material on a glass substrate in a desired pattern through a plurality of through-holes described later when manufacturing an organic EL display device The laminated mask used, the laminated mask with protective film, and the method for producing the laminated mask will be described as examples. However, the present invention is not limited to such an application, and the present invention can be applied to a laminated mask, a laminated mask with a protective film, and a method for producing a laminated mask used for various purposes.

  In the present specification, the terms “plate”, “sheet”, and “film” are not distinguished from each other only based on the difference in names. For example, “a plate” is a concept that includes a member that can be called a sheet or a film. Therefore, for example, a “metal plate” is distinguished from a member called “a metal sheet” or “a metal film” only by a difference in the name. Can't be done.

  In addition, “plate surface (sheet surface, film surface)” means a target plate-like member (sheet-like) when the target plate-like (sheet-like, film-like) member is viewed as a whole and globally. It refers to the surface that coincides with the plane direction of the member or film-like member. Moreover, the normal direction used with respect to a plate-like (sheet-like, film-like) member refers to the normal direction with respect to the plate | board surface (sheet surface, film surface) of the said member.

  Furthermore, as used in this specification, the shape and geometric conditions and the degree thereof are specified. For example, terms such as “parallel”, “orthogonal”, “identical”, “concentric”, length and angle values, etc. Is not limited to the strict meaning and should be interpreted to include a range where a similar function can be expected.

  First, an example of a laminated mask device including a laminated mask to be a manufacturing method will be described mainly with reference to FIGS. Here, FIG. 1 is a schematic plan view showing an example of a laminated mask device including a laminated mask, FIG. 2 is a diagram for explaining how to use the laminated mask device shown in FIG. 1, and FIG. FIG. 2 is a plan view showing the laminated mask shown in FIG. 1. FIG. 4 is a partially enlarged plan view of the laminated mask, and FIG. 5 is a view corresponding to a cross section taken along line II in FIG.

  1 and 2 has an opening 15a, a metal frame 15 (metal frame) formed in a frame shape, and a lamination mask on the opening 15a of the frame 15. 20 and a plurality of strip-shaped laminated masks 20 arranged in parallel in the width direction (direction orthogonal to the longitudinal direction, lateral direction). Of these, the laminated mask 20 is generally formed in a sheet shape, and includes a metal plate 21, a first surface-side resin layer 43 provided on the surface of the metal plate 21 on the frame 15 side, and the metal plate 21. And a second surface-side resin layer 46 provided on the surface opposite to the frame 15 side (see FIGS. 5 and 6). Such a laminated mask 20 is provided with a large number of through holes 25. As shown in FIG. 2, the laminated mask device 10 is supported in a vapor deposition device 90 so that the second surface side resin layer 46 of the laminated mask 20 faces a substrate that is a vapor deposition target, for example, a glass substrate 92. , Used for vapor deposition of the vapor deposition material on the glass substrate 92.

  In the vapor deposition apparatus 90, the glass substrate 92 is arrange | positioned in the opening part 15a of the flame | frame 15, and the lamination | stacking mask 20 and the glass substrate 92 come into close_contact | adherence by the magnetic force from a magnet not shown. In the vapor deposition apparatus 90, a crucible 94 for accommodating a vapor deposition material (for example, an organic light emitting material) 98 and a heater 96 for heating the crucible 94 are disposed below the glass substrate 92 sandwiching the laminated mask apparatus 10. Has been. The vapor deposition material 98 in the crucible 94 is vaporized or sublimated by heating from the heater 96 and adheres to the surface of the glass substrate 92. As described above, a large number of through holes 25 are formed in the laminated mask 20, and the vapor deposition material 98 adheres to the glass substrate 92 through the through holes 25. As a result, the vapor deposition material 98 is formed on the surface of the glass substrate 92 in a desired pattern corresponding to the position of the through hole 25 of the laminated mask 20.

  As shown in FIGS. 1 and 3, in the present embodiment, the laminated mask 20 has a belt-like substantially square shape in plan view, more precisely, a belt-like substantially rectangular shape in plan view. The laminated mask 20 includes a plurality of effective regions 22 arranged in the longitudinal direction of the laminated mask 20 and having a plurality of through holes 25 formed in a regular arrangement, and a surrounding region 23 surrounding each effective region 22. Yes. Of these, the surrounding region 23 is not a region through which a deposition material intended to be deposited on the substrate passes. For example, in the laminated mask 20 used for vapor deposition of the organic light emitting material for the organic EL display device, the effective region 22 is a region on the substrate (glass substrate 92) where the organic light emitting material is vapor deposited to form a pixel. That is, it is a region in the laminated mask 20 that faces an area on the substrate that forms the display surface of the produced organic EL display device substrate. However, through holes and recesses may be formed in the peripheral region 23 for various purposes. In the example shown in FIG. 1, each effective region 22 has a substantially rectangular shape in plan view, more precisely, a substantially rectangular shape in plan view.

  In the illustrated example, the plurality of effective regions 22 are arranged at predetermined intervals along the longitudinal direction of the laminated mask 20. Such a laminated mask 20 including a plurality of effective regions 22 is arranged in the width direction to constitute the laminated mask device 10 shown in FIG. One effective area 22 corresponds to one organic EL display device, and multi-layer deposition is possible in the laminated mask device 10 shown in FIG.

  As shown in FIG. 4, in the illustrated example, the plurality of through holes 25 formed in each effective region 22 are arranged at predetermined pitches along two directions orthogonal to each other in the effective region 22. Yes. FIG. 4 shows an example in which each through-hole 25 has a substantially rectangular shape in a plan view, more precisely, a substantially rectangular outline in a plan view. More specifically, a first surface side resin layer opening 44 of the first surface side resin layer 43, which will be described later, a base hole 30, and a second surface side resin layer opening 47 of the second surface side resin layer 46, The first surface side resin layer opening 44, the base material hole 30, and the second surface side resin layer opening each having a substantially rectangular shape or a substantially rectangular shape in plan view and communicating with each through hole 25. One portion 47 is formed one by one.

  An example of the through hole 25 formed in the laminated mask 20 will be described in more detail with reference mainly to FIGS. 4 and 5.

  FIG. 4 is a partial plan view showing the laminated mask 20 from the first surface 20a side. FIG. 5 is a view corresponding to a cross section taken along line II of FIG.

  As shown in FIGS. 4 and 5, the laminated mask 20 includes a metal plate (metal substrate) 21 having a first surface 21 a and a second surface 21 b provided on the side opposite to the first surface 21 a. The first surface side resin layer 43 provided on the first surface 21a of the metal plate 21 and the second surface side resin layer 46 provided on the second surface 21b of the metal plate 21 are provided. Among these, the 2nd surface 21b of the metal plate 21 is arrange | positioned at the glass substrate 92 side at the time of vapor deposition (namely, when attached in the vapor deposition apparatus 90).

  The metal plate 21 can be formed of 36% Ni invar material, and the thickness of the metal plate 21 is preferably 10 μm to 100 μm, for example.

  The first surface side resin layer 43 and the second surface side resin layer 46 function as a mask (or resist) when the metal plate 21 is etched. For this reason, the 1st surface side resin layer 43 and the 2nd surface side resin layer 46 are etching resistance with respect to etching liquids, such as iron chloride 2nd aqueous solution used when etching the metal plate 21, and the metal plate 21 It is preferable to have adhesion. Further, the first surface side resin layer 43 and the second surface side resin layer 46 have alkali resistance against an alkaline cleaning liquid used for cleaning the laminated mask after being deposited on the glass substrate 92. It is preferable. In this case, even when the laminated mask is cleaned with an alkaline cleaning liquid, it is possible to prevent the first surface side resin layer 43 and the second surface side resin layer 46 from being removed. That is, the first surface side resin layer 43 and the second surface side resin layer 46 can function as permanent resists. Further, the first surface side resin layer 43 and the second surface side resin layer 46 support the metal plate 21 after the etching and deform the metal plate 21 (especially, the effective region 22 in which a large number of through holes 25 are formed). It can also be suppressed. In addition, it is preferable that the 1st surface side resin layer 43 and the 2nd surface side resin layer 46 have the transmittance | permeability with respect to the YAG laser beam L1 mentioned later.

  The first surface side resin layer 43 and the second surface side resin layer 46 can be formed of the same material, and include the above-described etching resistance, adhesion, alkali resistance, and laser light transmission. The material which has property is suitable. For example, the first surface side resin layer 43 and the second surface side resin layer 46 are preferably formed of a rubber-based photosensitive material containing an azide compound or an acrylic negative photosensitive resin. As such a photosensitive material, for example, OMR83 manufactured by Tokyo Ohka Kogyo Co., Ltd. can be used. Moreover, it is suitable for the thickness of the 1st surface side resin layer 43 and the 2nd surface side resin layer 46 to be 1 micrometer-10 micrometers, especially 3 micrometers, for example. In this case, as will be described later, when spot welding the laminated mask 20 to the frame 15 of the laminated mask device 10, the first surface side resin layer 43 is interposed between the metal plate 21 and the frame 15, Even in this case, the metal plate 21 can be reliably spot-welded to the frame 15. Further, the vapor deposition material 98 can be uniformly deposited in the region facing the through-hole 25 on the glass substrate 92, and the vapor deposition material 98 can be deposited with a desired pattern while effectively improving the utilization efficiency of the vapor deposition material 98. And can be carried out with high accuracy. Furthermore, the thermal expansion coefficient of the laminated mask 20 according to the present embodiment can be made substantially the same as that of the frame 15 of the laminated mask device 10. That is, when the first surface side resin layer 43 and the second surface side resin layer 46 are formed thick, the influence of the thermal expansion coefficients of the first surface side resin layer 43 and the second surface side resin layer 46 is increased. However, when the first surface side resin layer 43 and the second surface side resin layer 46 are thinly formed, the influence of the thermal expansion coefficient of the first surface side resin layer 43 and the second surface side resin layer 46 is reduced. can do. For this reason, the thermal expansion coefficient of the laminated mask 20 can be made substantially the same as the thermal expansion coefficient of the frame 15 of the laminated mask apparatus 10.

  The plurality of through holes 25 include a first surface 20a that is one side along the normal direction of the laminated mask 20, and a second surface 20b that is the other side along the normal direction of the laminated mask 20. The first surface side resin layer 43 and the second surface side resin layer 46 are penetrated. That is, the through hole 25 penetrates the laminated mask 20.

  In the illustrated example, as will be described in detail later, a base material hole 30 is provided on the first surface 21 a side of the metal plate 21. That is, the base material hole 30 is formed in the metal plate 21 by etching from the side of the first surface 21 a of the metal plate 21 that is one side in the normal direction of the laminated mask 20. The substrate hole 30 forms a through hole 25.

  As shown in FIG. 5, the lamination mask 20 is laminated from one side in the normal direction to the other side, that is, from the first surface 20a side to the second surface 20b side of the lamination mask 20. The cross-sectional area of each base material hole 30 in the cross section along the plate surface of the laminated mask 20 at each position along the normal direction of the mask 20 gradually decreases. In other words, in the cross section along the normal direction of the laminated mask 20, the width of each substrate hole 30 along the plate surface of the laminated mask 20 at each position along the normal direction of the laminated mask 20 is the laminated mask 20. The size gradually decreases from the first surface 20a side toward the second surface 20b side. In particular, in the illustrated example, the cross-sectional area of each base material hole 30 continues to change so as to decrease from the first surface 20a side of the laminated mask 20 toward the second surface 20b side.

  The first surface side resin layer 43 has a first surface side resin layer opening 44 that defines the through hole 25. The first surface side resin layer opening 44 is connected substantially concentrically to the base material hole 30, and the wall surface 45 of the first surface side resin layer opening 44 extends along the normal direction of the laminated mask 20. It is formed as follows. Further, the outline of the first surface side resin layer opening 44 in plan view is smaller than the outline of the base material hole 30 on the first surface 21 a of the metal plate 21.

  The second surface side resin layer 46 has a second surface side resin layer opening 47 that defines the through hole 25. The second surface side resin layer opening 47 is connected to the base hole 30 substantially concentrically, and the wall surface 48 of the second surface side resin layer opening 47 extends along the normal direction of the laminated mask 20. It is formed as follows. Further, the wall surface 48 of the second surface side resin layer opening 47 is disposed inside the through hole 25 relative to the wall surface 45 of the first surface side resin layer opening 44 and the wall surface 31 of the base material hole 30. In other words, in the cross-sectional view shown in FIG. 5, the second surface side resin layer 46 is formed so as to protrude into the through hole 25. In this way, the second surface side resin layer opening 47 is a portion having the minimum cross-sectional area of the through hole 25 and has a cross-sectional area smaller than the cross-sectional area of the through-hole 42 of the metal plate 21 described later. doing.

  As shown in FIG. 5, the through hole 25 includes a base material hole 30 formed from the first surface 20 a side of the laminated mask 20, a first surface side resin layer opening 44, and a second surface side resin layer. It is defined by the connection with the opening 47. As shown in FIGS. 4 and 5, in the illustrated example, the base material hole 30, the first surface side resin layer opening 44, and the second surface side resin layer opening 47 are provided for one through hole 25. Each one is formed. Therefore, one through hole 30 is connected to the first surface side resin layer opening 44 and the second surface side resin layer opening 48 provided corresponding to the substrate hole 30, so that each through hole 25 is formed.

  As shown in FIG. 5, the wall surface 31 of the base material hole 30 and the second surface 21 b of the metal plate 21 are connected via a circumferential connection portion 41. The connecting portion 41 is defined by a merge line where the wall surface 31 of the base material hole 30 inclined with respect to the normal direction of the laminated mask and the second surface 21b merge. The connection portion 41 defines a through portion 42 in which the area of the through hole 25 in the plan view of the laminated mask 20 is the smallest in the region of the metal plate 21.

  As shown in FIG. 5, two adjacent through holes 25 are separated from each other along the plate surface of the laminated mask 20 on the first surface 20 a of the laminated mask 20. That is, when the base material hole 30 is formed by etching the metal plate 21 from the first surface 21a side of the metal plate 21 corresponding to the first surface 20a of the laminated mask 20 as in the manufacturing method described later. The first surface 21 a of the metal plate 21 remains between the two adjacent base material holes 30.

  Since the two adjacent through holes 25 are separated from each other along the plate surface of the laminated mask 20, the strength of the laminated mask can be improved. Accordingly, it is possible to effectively suppress deformation of the laminated mask 20 in the effective region 22 when the laminated mask 20 is stretched on the frame 15, thereby effectively performing deposition in a desired pattern. Can be implemented. Further, in this case, deformation of the effective region 22 in which a large number of through holes 25 are formed during handling processing such as conveyance and cutting of the long metal plate 71 described later, removal of a protective film 84 described later, and attachment to the frame 15. Can be effectively suppressed.

  When the laminated mask device 10 is accommodated in the vapor deposition device 90 as shown in FIG. 2, the first surface side resin layer 43 of the laminated mask 20 holds the vapor deposition material 98 as shown by a two-dot chain line in FIG. 5. Located on the crucible 94 side, the second surface side resin layer 46 of the laminated mask 20 faces the glass substrate 92. Therefore, the vapor deposition material 98 first passes through the first surface side resin layer opening 44, and then passes through the base material hole 30 with a gradually decreasing cross-sectional area, and then the second surface side resin layer opening. It passes through the portion 47 and adheres to the glass substrate 92.

  The base material hole 30 is formed by etching the first surface 21a of the metal plate 21, as will be described in detail later. The wall surface of the hole (or recess) formed by etching generally has a curved surface that is convex toward the erosion direction. Therefore, the wall surface of the hole formed by the etching is cut off in the region which is the etching start side, and the normal line of the metal plate 21 is formed in the region opposite to the etching start side, that is, the deepest side of the hole. It becomes relatively large with respect to the direction.

  As described above, in the present embodiment, the through holes 25 are arranged in a predetermined pattern in each effective region 22. As an example, when the laminated mask 20 (laminated mask device 10) is used to produce a display (about 2 to 5 inches) such as a mobile phone or a digital camera, the arrangement pitch P of the through holes 25 is 58 μm (440 ppi). The thickness can be about 254 μm (100 ppi) or less. If color display is desired, the laminated mask 20 (laminated mask device 10) and the glass substrate 92 are moved relative to each other along the direction in which the through holes 25 are arranged, so that the organic light emitting material for red is used. The organic light emitting material for green and the organic light emitting material for blue may be deposited in order. Further, when the laminated mask 20 (laminated mask device 10) is used for manufacturing a mobile phone display, the width (slit width) W along the direction in which the through holes 25 are arranged is 28 μm or more and 84 μm or less. Can be about.

  Next, the laminated mask 50 with a protective film will be described.

  As shown in FIG. 5, the laminated mask 50 with the protective film was affixed to the above-described laminated mask 20 and the surface opposite to the metal plate 21 side of the second surface side resin layer 46 of the laminated mask 20. And a protective film 84. Thus, by sticking the protective film 84 to the laminated mask 20, it is possible to effectively suppress the deformation of the laminated mask 20, particularly the deformation of the effective region 22 in which many through holes 25 are formed.

  As will be described later, the protective film 84 is attached to the second surface side resin layer 46 after etching the metal plate 21 from the second surface 21b side to form the base material recess 35 (see FIG. 13). Then, it is preferable to form the base material hole 30 by etching the metal plate 21 from the first surface 21a side with the protective film 84 attached. That is, when the base material hole 30 is formed, depending on the shape or size of the through hole 25, there is a possibility that the effective region 22 is deformed during the handling process as described above. However, the deformation of the effective region 22 can be effectively suppressed by attaching the protective film 84 before the base material hole 30 is formed.

  It is preferable that the protective film 84 has etching resistance against an etching solution (for example, ferric chloride aqueous solution) for etching the long metal plate 71 described later. Thus, when the base material hole 30 is formed at the time of manufacturing the laminated mask 20 described later, the base material concave portion 35 is sealed by the protective film 84 and the base material concave portion 35 is etched. It can prevent, and it can prevent that the shape of the base-material recessed part 35 is impaired.

  As shown in FIG. 6, the protective film 84 includes a protective film base 84 a and an adhesive layer 84 b provided on one surface of the protective film base 84 a. Among these, the adhesive layer 84 b is adhered to the second surface side resin layer 46, and the protective film 84 is attached to the laminated mask 20. It is preferable that the protective film 84 can be peeled from the second surface side resin layer 46 by irradiating with UV light L4 (see FIG. 7). That is, the protective film 84 cannot be peeled off from the second surface side resin layer 46 during the etching process or the like until the UV light is irradiated, but after the UV light is irradiated, the protective film 84 is removed from the second surface side resin layer 46. It is preferable that it can be easily peeled off. Specifically, it is preferable that the adhesive layer 84b is formed of a material whose adhesive strength is reduced when irradiated with UV light. In this case, the protective film 84 can be easily peeled from the laminated mask 20 by irradiating the protective film 84 attached to the laminated mask 20 with UV light. In addition, as a material of the protective film base material 84a, what is necessary is just a material which has the intensity | strength which can suppress that the effective area | region 22 of the lamination | stacking mask 20 deform | transforms at the time of handling processing, for example, mentions polyethylene terephthalate (PET). Can do. Further, as described above, the material of the adhesive layer 84b may be a material whose adhesive strength is reduced by irradiating UV light, and examples thereof include acrylic materials.

  Furthermore, it is preferable that the protective film 84 has transparency to the YAG laser light L1 (see FIG. 6). In this case, as will be described later, the YAG laser beam L1 is irradiated from the laser beam irradiation unit 85 onto the frame 15 of the lamination mask device 10 with the lamination mask 20 (the lamination mask 50 with the protection film) to which the protection film 84 is attached. And spot welding can be performed.

  The laminated mask 20 to which the protective film 84 as described above is attached is arranged in parallel on the opening 15 a of the frame 15 of the laminated mask device 10 and attached to the frame 15. The frame 15 holds the laminated mask in a tensioned state so as to prevent the laminated mask 20 from being bent. In this case, as shown in FIGS. 2 and 6, the first surface side resin layer 43 of the laminated mask 20 is positioned on the crucible 94 side holding the vapor deposition material 98.

  The laminated mask 20 and the frame 15 are fixed to each other, for example, by spot welding. That is, as shown in FIG. 6, the YAG laser light L1 is irradiated from the laser light irradiation unit 85 provided on the protective film 84 side toward the frame 15, and the irradiated YAG laser light L1 is applied to the protective film 84 and the first film. A welded portion 86 is formed on the metal plate 21 and the frame 15 by the energy of the YAG laser beam L1 that is transmitted through the two-surface resin layer 46. In addition, although the 1st surface side resin layer 43 is interposed between the metal plate 21 and the flame | frame 15, by reducing the thickness of the 1st surface side resin layer 43 as above-mentioned, laser beam L1. By connecting the melted portion of the metal plate 21 and the melted portion of the frame 15, the welded portion 86 penetrates the first surface side resin layer 43, and the metal plate 21 is spot welded to the frame 15. it can.

  The protective film 84 is peeled from the metal plate 21 as shown in FIG. 7 by being irradiated with UV light after welding. Thereby, the laminated mask 20 to which the protective film 84 is not attached is attached to the frame 15. Thereafter, the laminated mask device 10 is attached to the vapor deposition device 90 shown in FIG.

  The laminated mask device 10 is held inside a vapor deposition device 90 that is in a high temperature atmosphere. Therefore, the laminated mask 20 and the frame 15 are preferably formed of the same material having a low coefficient of thermal expansion in order to prevent the laminated mask 20 and the frame 15 from being bent or generating thermal stress. As such a material, for example, a 36% Ni invar material can be used.

  According to the laminated mask 20 as described above, the wall surface 48 of the second surface side resin layer opening 48 that defines a part of the through hole 25 is the wall surface 45 of the first surface side resin layer opening 44 and the base material. It is arranged inside the through hole 25 rather than the wall surface 31 of the hole 30. In this case, the portion of the through hole 25 having the minimum cross-sectional area can be defined by the second surface side resin layer opening 47 having a good shape accuracy. That is, since the second surface side resin layer opening 47 can be formed by exposure and development, the portion of the through hole 25 having the minimum cross-sectional area can be accurately formed by exposure and development. For this reason, the precision of the shape of the through-hole 25 can be improved, and the patterning precision of vapor deposition can be improved. In particular, in an organic EL display device, it is desired to pattern an expensive vapor deposition material 98 on the substrate 92 with a high-definition pattern. For this reason, the laminated mask 20 of the present embodiment is particularly suitable as a laminated mask used for manufacturing an organic EL display device.

  Further, according to the laminated mask 20 as described above, the first surface side resin layer 43 and the second surface side resin layer 46 are formed on both surfaces (the first surface 21a and the second surface 21b) of the metal plate 21, respectively. ing. As a result, the first surface side resin layer 43 and the second surface side resin layer 46 can support the metal plate 21 from both sides, prevent the metal plate 21 from warping, and stabilize the shape of the metal plate 21. be able to.

  Moreover, according to the laminated mask 50 with a protective film as described above, the effective region 22 in which a large number of through holes 25 are formed is supported by the protective film 84. Thereby, the deformation of the effective region 22 can be effectively suppressed, and the vapor deposition material 98 can be patterned on the glass substrate 92 with high accuracy.

  Next, a method for manufacturing such a laminated mask 20 will be described mainly with reference to FIGS.

  FIG. 8 shows a manufacturing apparatus 60 for manufacturing the laminated mask 20. As shown in FIG. 8, first, a wound body 62 in which a long metal plate 71 is wound around a supply core 61 is prepared. Then, when the supply core 61 rotates and the wound body 62 is rewound, a long metal plate 71 extending in a strip shape is supplied as shown in FIG. The first surface-side resin layer 43 and the second surface-side resin layer 46 are stacked on the long metal plate 71 to form a long laminate 70. The through-hole 25 is formed in this laminated body 70, the protective film 84 is affixed, and it cut | disconnects after that, and the laminated mask 50 with a sheet-like protective film is obtained. Therefore, as described above, the long metal plate 71 is made of, for example, 36% Ni invar material. However, the sheet is not limited to this, and a sheet made of stainless steel, copper, iron, or aluminum can be used as the long metal plate 71.

  The supplied long metal plate 71 (see FIG. 9) is transported to an etching apparatus (etching means) 64 by a transport roller 65. Each process shown in FIGS. 10 to 15 is performed by the etching means 64.

  In the etching means 64, first, the unrolled long metal plate 71 is subjected to a surface treatment, and the first surface 71a and the second surface 71b of the long metal plate 71 are degreased.

  Subsequently, as shown in FIG. 10, the first surface side resin layer 43 is formed on the first surface 71 a of the long metal plate 71, and the second surface on the second surface 71 b of the long metal plate 71. A side resin layer 46 is formed. Specifically, on the first surface 71a of the long metal plate 71 and on the second surface 71b of the long metal plate 71, a photosensitive material of a liquid rubber-based photosensitive material containing the azide compound described above, or a liquid A photosensitive material of an acrylic negative photosensitive resin is applied and cured. In this way, the first surface side resin layer 43 and the second surface side resin layer 46 are formed on the long metal plate 71. When an acrylic negative photosensitive resin is used, these resin layers can be formed by laminating a dry film resist on the first surface 71 a and the second surface 71 b of the long metal plate 71. In this case, the dry film resist has a thickness of 2 μm to 15 μm and is preferably laminated using a vacuum laminator. Thereby, it is possible to prevent bubbles from entering between the dry film resist and the long metal plate 71 and to prevent a defect from occurring in the subsequent etching process. Moreover, when using such a dry film resist, it is preferable to bake at a temperature of 150 ° C. or higher after exposure and development. As a result, the strength of the resin layer can be improved, and it can have alkali resistance against the alkaline cleaning liquid used for cleaning the laminated mask.

  Next, as shown in FIGS. 11 and 12, the first surface side resin layer 43 and the second surface side resin layer 46 are exposed and developed. In this case, first, a first glass dry plate (first exposure mask) 67 and a second glass dry plate (second exposure mask) 48 are prepared so as not to transmit light to the regions to be removed of the resin layers 43 and 46. . Subsequently, the first glass dry plate 67 is disposed above the first surface side resin layer 43, and the second glass dry plate 68 is disposed below the second surface side resin layer 46. At this time, the first glass dry plate 67 and the second glass dry plate 68 are aligned with each other. Next, the exposure light L <b> 2 is irradiated, the first surface side resin layer 43 is exposed through the first glass dry plate 67, and the second surface side resin layer 46 is exposed through the second glass dry plate 68. (See FIG. 11). At this time, it is preferable that the first surface side resin layer 43 and the second surface side resin layer 46 are exposed simultaneously. Then, the 1st surface side resin layer 43 and the 2nd surface side resin layer 46 are developed using a sodium carbonate solution (refer FIG. 12). As a result, the unexposed region of the resin layer is removed, and the first surface side resin layer opening 44 is formed in a desired pattern in the first surface side resin layer 43, and the second surface side resin is formed. A second surface side resin layer opening 47 is formed in the layer 46 in a desired pattern. At this time, the first surface side resin layer opening 44 has a planar shape corresponding to the planar shape of the base material hole 30 formed in the metal plate 21 of the laminated mask 20, and the second surface side resin layer opening 47. Has a planar shape corresponding to the planar shape of the substrate recess 35 formed in the metal plate 21 of the laminated mask 20. Thereafter, the first surface side resin layer 43 and the second surface side resin layer 46 are baked (cured).

  Here, an example in which the first surface side resin layer 43 and the second surface side resin layer 46 are negative resists is described. However, the present invention is not limited to this, and a positive resist may be used for the resin layers 43 and 46.

  Next, as shown in FIG. 13, the long metal plate 71 is etched from the second surface 71b side. In this case, the long metal plate 71 is etched from the second surface 71b side of the long metal plate 71 by the sprayed etchant (for example, ferric chloride solution) using the second surface side resin layer 46 as a mask. . As a result, as shown in FIG. 13, the long metal plate 71 is etched through the second surface side resin layer opening 47, and the base material recess 35 is formed on the second surface 71 b side of the long metal plate 71. Is done. That is, erosion by the etchant proceeds in the region of the second surface side resin layer opening 47 in the long metal plate 71. As described above, a large number of base material recesses 35 are formed in the long metal plate 71 from the second surface 71b side. The erosion by the etching solution does not proceed only in the normal direction (thickness direction) of the long metal plate 71 but also in the direction along the plate surface of the long metal plate 71 from the second surface side resin layer opening 47. move on. For this reason, the outline of the substrate recess 35 on the second surface 71 b of the long metal plate 71 in plan view is larger than the outline of the second surface side resin layer opening 47.

  The cross-sectional area of each substrate recess 35 in the cross section along the plate surface of the laminated mask 20 at each position along the normal direction of the laminated mask 20 is one from the other side in the normal direction of the laminated mask 20. That is, it gradually decreases from the second surface 20b side of the laminated mask 20 toward the first surface 20a side. In other words, in the cross section along the normal direction of the laminated mask 20, the width of each substrate recess 35 along the plate surface of the laminated mask 20 at each position along the normal direction of the laminated mask 20 is the laminated mask 20. The size gradually decreases from the second surface 20b side toward the first surface 20a side. In particular, in the illustrated example, the cross-sectional area of each substrate recess 35 continues to change so as to decrease from the second surface 20b side of the laminated mask 20 toward the first surface 20a side. The substrate recess 35 has a shape similar to that of the corresponding substrate hole 30 and the second surface side resin layer opening 47 (in the present embodiment, a substantially rectangular shape or a substantially rectangular outline) in plan view. It is suitable to have.

  Here, when there is a defect in the contour of the second surface side resin layer opening 47 formed in the second surface side resin layer 46, the contour of the second surface side resin layer opening 47 is corrected. Can do. That is, the contour of the second surface side resin layer opening 47 is inspected, and the material of the second surface side resin layer 46 remains in the region where the second surface side resin layer opening 47 is to be formed. When formed, the defect portion 49 can be removed by irradiating the defect portion 49 with YAG laser light L3 to sublimate the material of the defect portion 49. Thus, the contour of the second surface side resin layer opening 47 can be corrected, the accuracy of the contour of the second surface side resin layer opening 47 can be improved, and the yield can be improved. Such correction by laser light irradiation is performed when the material of the second surface side resin layer 46 remains in a part of the region where the second surface side resin layer opening 47 is to be formed (that is, the second surface side). And the material of the second surface side resin layer 46 in the entire region where the second surface side resin layer opening 47 is to be formed. Can also be carried out (ie, when the second surface side resin layer opening 47 to be formed is not formed).

  Then, as shown in FIG. 14, the protective film 84 is affixed on the surface of the 2nd surface side resin layer 46 on the opposite side to the elongate metal plate 71 side. Thereby, the base material recess 35 formed as described above is covered with the protective film 84. That is, the base material recess 35 is sealed by the protective film 84 having etching resistance to the etching solution. The protective film 84 is preferably attached to the second surface 71b of the long metal plate 71 so that the etching solution used in the following steps does not enter.

  Next, as shown in FIG. 15, the second etching is performed on the long metal plate 71, and the long metal plate 71 is etched from the first surface 71a side. In this case, the long metal plate 71 is etched from the first surface 71a side of the long metal plate 71 by the sprayed etchant (for example, ferric chloride aqueous solution) using the first surface side resin layer 43 as a mask. Is done. As a result, as shown in FIG. 15, the first surface 71 a of the long metal plate 71 is etched through the first surface side resin layer opening 44, and the base material hole 30 is formed in the long metal plate 71. . That is, erosion by the etchant proceeds in the region of the first surface side resin layer opening 44. In this manner, a large number of substrate holes 30 are formed in the long metal plate 71 from the first surface 71a side. The erosion by the etching solution does not proceed only in the normal direction (thickness direction) of the long metal plate 71 but also in the direction along the plate surface of the long metal plate 71 from the first surface side resin layer opening 44. move on. For this reason, the outline of the substrate hole 30 on the first surface 71 a of the long metal plate 71 in plan view is larger than the outline of the first surface side resin layer opening 44.

  The etching from the first surface 71 a side is performed until the base material hole 30 formed by the etching reaches the second surface side resin layer 46. Thus, the through hole 25 defined by the base material hole 30 and the second surface side resin layer opening 47 communicated with each other is formed. At this time, the base material hole 30 is formed so as to include the base material recess 35, and the base material recess 35 does not remain.

  Moreover, the precision of the shape of the base material hole 30 can be improved by performing the 2nd time etching from the 1st surface 71a side after forming the base material recessed part 35 as mentioned above. That is, when the base material hole 30 is formed by etching from the first surface 71 a side without forming the base material recess 35, when the base material hole 30 reaches the second surface side resin layer 46, The hole 30 may rapidly expand in the direction along the plate surface of the laminated mask 20, and the shape accuracy of the base material hole 30 may be impaired. However, by forming the base material recess 35 in advance on the second surface 71b side as in the present embodiment, the base material hole 30 formed from the first surface 71a side by etching is first formed on the base surface. It reaches the material recess 35 and then reaches the second surface side resin layer 46. This can suppress the base material hole 30 from rapidly expanding in the direction along the plate surface of the laminated mask 20. For this reason, the precision of the shape of the base material hole 30 can be improved.

  In addition, since the protective film 84 is affixed on the second surface 71 b side of the long metal plate 71, etching is not performed from the second surface 71 b side of the long metal plate 71. Further, even when the base material hole 30 is connected to the base material recess 35 by the progress of etching from the first surface 71a side, the base material recess 35 is sealed by the protective film 84, so that the etching solution is The flow from the substrate hole 30 through the substrate recess 35 is prevented. For this reason, it can prevent that the base material hole 30 is etched excessively, and can make the shape of each base material hole 30 uniform.

  In this way, the etching from the first surface 71a side of the long metal plate 71 proceeds by a preset amount, and the second etching for the long metal plate 71 is completed. Thereby, the base material hole 30 and the 1st surface side resin layer opening which are mutually connected to the laminated body 70 which the elongate metal plate 71, the 1st surface side resin layer 43, and the 2nd surface side resin layer 46 have. Through hole 25 defined by 44 and second surface side resin layer opening 47 is formed.

  As shown in FIG. 8, the laminated body 70 with a long protective film in which a large number of through-holes 25 are formed as described above is transported rollers 65, 65 that rotate while sandwiching the laminated body 70. Thus, the sheet is conveyed to a cutting device (cutting means) 66. In the cutting device 66, the long laminated body 70 is cut into a predetermined length. In this way, a laminated mask 50 with a sheet-like protective film is obtained. The supply core 61 described above is rotated via the tension acting on the long metal plate 71 by the rotation of the transport rollers 65 and 65 so that the long metal plate 71 is supplied from the wound body 62. It has become.

  As described above, the laminated mask 20 in which a large number of through holes 25 are formed, and the laminated mask 20 (the laminated mask with protective film 50) to which the protective film 84 is attached is obtained. Then, the obtained laminated mask 50 with the protective film is attached to the frame 15. The frame 15 is attached to the metal plate 21 of the laminated mask 50 with the protective film via the first surface side resin layer 43.

  When the laminated mask with protective film 50 is attached to the frame 15, in order to prevent the laminated mask with protective film 50 from being bent, the laminated mask with protective film 50 is stretched by applying tension to the laminated mask with protective film 50. The state is held and fixed to the frame 15 by spot welding, for example. As described above, the spot welding is performed by irradiating the YAG laser beam L1 toward the frame 15 from the laser beam irradiation unit 85 provided on the protective film 84 side (see FIG. 6).

  After spot welding, the protective film 84 is irradiated with UV light, and the protective film 84 is peeled (removed) from the second surface side resin layer 46. Thereby, the laminated mask 20 from which the protective film 84 is removed from the laminated mask 50 with the protective film is obtained, and the laminated mask device 10 in which the laminated mask 20 is attached to the frame 15 is obtained. By attaching the laminated mask device 10 to the vapor deposition device 90, it becomes possible to deposit the vapor deposition material 98 on the glass substrate 92.

  According to the manufacturing method of the laminated mask according to the present embodiment as described above, the second surface side resin layer opening 47 defining a part of the through hole 25 is formed by exposure and development, and the wall surface 28 is formed. The first surface side resin layer opening 44 and the wall surface 45 of the first surface side resin layer 30 and the wall surface 31 of the base material hole 30 can be disposed inside the through hole 25. In this case, the portion having the minimum cross-sectional area of the through hole 25 can be formed with high accuracy. In addition, when a defect occurs in the contour of the second surface side resin layer opening 47, the contour of the second surface side resin layer opening 47 can be easily and accurately corrected. For this reason, the precision of the shape of the through-hole 25 can be improved, and the patterning precision of vapor deposition can be improved.

  In addition, according to the method for manufacturing the laminated mask according to the present embodiment, the first surface side resin layer 43 and the second surface side resin layer are formed on both surfaces (the first surface 71a and the second surface 71b) of the long metal plate 71. 46 is formed, among which the first surface side resin layer 43 is exposed by the first glass dry plate 67, and the second surface side resin layer 46 is aligned with the first glass dry plate 67. After exposure by the dry plate 68, the resin layers 43 and 46 are developed to form the first surface side resin layer opening 45 and the second surface side resin layer opening 47. That is, the first glass dry plate 67 and the second glass dry plate 68 are aligned with each other, and the first surface side resin layer 43 and the second surface side resin layer 46 are exposed, thereby defining the first through hole 25. The accuracy of the positional relationship between the first surface side resin layer opening 44 and the second surface side resin layer opening 47 can be improved. For this reason, the precision of the shape of the through-hole 25 can be improved, and the patterning precision of vapor deposition can be improved.

  In addition, according to the method for manufacturing the laminated mask according to the present embodiment, after the base material recess 35 is formed on the second surface 71 b side of the long metal plate 71, the first surface 71 a of the long metal plate 71 is formed. Before the base material hole 30 is formed on the side, the protective film 84 is attached to the second surface side resin layer 46, and the laminated mask 50 with the protective film can be obtained. Thereby, the long metal plate 71 in which the base material hole 30 is formed can be supported by the protective film 84, and the deformation of the effective region 22 in which many through holes 25 are formed can be suppressed. In particular, when the protective film 84 is removed after being welded to the frame 15 of the laminated mask device 10, it is possible to effectively suppress deformation of the effective region 22 of the laminated mask 20 loaded with tension. For this reason, the patterning precision of vapor deposition can be improved.

  As mentioned above, although embodiment of this invention was described in detail, the manufacturing method of a lamination mask by this invention, a lamination mask, and a lamination mask with a protective film are not limited to the above-mentioned embodiment at all. Various modifications can be made without departing from the spirit of the present invention.

  For example, the pattern of the through holes 25 formed in the laminated mask 20 is not limited to the form shown in FIG. The arrangement pattern of the through holes 25 shown in FIG. 4 is merely an example, and the through holes 25 may be arranged in various patterns.

  Further, the shape of the through hole 25 is not limited to the planar shape shown in FIG. For example, each through-hole 25 may have a belt-like substantially square shape in plan view, more precisely a belt-like substantially rectangular contour in plan view, or a slit-like elongated contour. In this case, each of the first-surface-side resin layer opening 44 and the second-surface-side resin layer opening 47 of the base material hole 30 has a substantially rectangular shape in a plan view, more precisely, a substantially rectangular shape in a strip shape. The substrate hole 30, the first surface side resin layer opening 44, and the second surface side resin layer opening 47 are formed one by one in the elongated through hole 25 having an outline or a slit-like elongated shape. The In this case, each through hole 25 is preferably formed to extend in the longitudinal direction of the laminated mask 20.

  Further, in the above-described embodiment, the laminated mask 20 includes the metal plate 21, the first surface side resin layer 43 provided on the first surface 21 a of the metal plate 21, and the second surface 21 b of the metal plate 21. The example which has the 2nd surface side resin layer 46 provided in was demonstrated. However, the present invention is not limited to this, and as shown in FIG. 16, the laminated mask 20 may not be provided with the first surface side resin layer 43. That is, the first surface side resin layer 43 may be removed during the step of etching the metal plate 21 from the first surface 21a side.

  In the example shown in FIG. 16, the two adjacent through holes 25 are connected to each other. That is, the leading edge (upper edge, edge located on one side along the normal direction of the laminated mask) 32 of the wall surfaces 31 of all the base material holes 30 in the effective region 22 is preferably over the entire circumference. The tip edge 32 of the wall surface 31 of another substrate hole 30 adjacent to the substrate hole 30 is joined.

  Here, in the entire region within the effective area 22 of the laminated mask 20, the first surface 20a of the laminated mask 20 is formed by the wall surface 31 of the base material hole 30 facing one side in the normal direction of the laminated mask. Yes. As a result, in the entire region within the effective region 22 of the laminated mask 20, the first surface 20a of the laminated mask 20 forms an uneven surface.

According to such a laminated mask 20, the inclination angle θ ₁ formed by the wall surface 31 of the base material hole 30 with respect to the normal direction of the laminated mask can be effectively increased in the entire effective region 22. That is, in the cross section of FIG. 16 orthogonal to the sheet surface of the laminated mask 20, the second surface side resin layer opening 47 that is the portion having the minimum cross-sectional area of the through hole 25 and the other wall surface 31 of the base hole 30. The minimum angle θ ₁ formed by the straight line X passing through an arbitrary position with respect to the normal direction of the laminated mask 20 can be sufficiently increased, thereby effectively using the deposition material 98 efficiently. While improving, vapor deposition with a desired pattern can be stably performed with high accuracy.

  When the base plate hole 30 is formed by etching the metal plate 21 from the first surface 21 a side of the metal plate 21 that corresponds to the first surface 20 a of the stacked mask 20, the effective region 22 of the stacked mask 20 is obtained. In the entire region of the metal plate 21 that forms the above, the first surface 21a of the metal plate 21 is eroded by etching. That is, the maximum thickness Ta in the effective region 22 along the normal direction of the laminated mask is less than 100% of the maximum thickness Tb in the surrounding region 23 along the normal direction of the laminated mask. Thus, it is preferable from the viewpoint of improving the utilization efficiency of the vapor deposition material that the thickness in the effective region 22 is generally reduced. On the other hand, from the viewpoint of the strength of the laminated mask, the maximum thickness Ta in the effective region 22 along the normal direction of the laminated mask is 50 of the maximum thickness Tb in the surrounding region 23 along the normal direction of the laminated mask. % Or more is preferable. When the maximum thickness Ta in the effective area 22 is 50% or more of the maximum thickness Tb in the surrounding area 23, the effective area 22 of the stacked mask 20 when the stacked mask 20 is stretched on the frame 15 is used. Therefore, it is possible to effectively suppress vapor deposition in a desired pattern. Further, in this case, the deformation of the effective region 22 in which a large number of through holes 25 are formed during handling processing such as conveyance and cutting of the long metal plate 71, removal of the second surface side protective film 84, and attachment to the frame 15. Can be effectively prevented.

Furthermore, in the illustrated example, due to the manufacturing method described above, the outer side of the portion 33 where the tip edges 32 of the wall surfaces 31 of the two substrate holes 30 meet in the cross section along the normal direction of the laminated mask. The contour has a chamfered shape. As described above, generally, the wall surface of the hole formed by etching has a curved surface shape that is convex toward the main traveling direction by etching. Therefore, when the two base material holes 30 formed by etching are simply partially overlapped, as shown by a two-dot chain line in FIG. 21, the joining portion 33 is the normal line of the laminated mask serving as the etching start side. It becomes a pointed shape toward one side along the direction. On the other hand, in the laminated mask 20 shown in the figure, the sharp portion in the merge portion 33 is chamfered. As understood from FIG. 21, the chamfering can effectively increase the above-described angle θ ₁ formed by the wall surface 31 with respect to the normal direction of the laminated mask 20. Thereby, the utilization efficiency of the vapor deposition material 98 can be improved more effectively, and vapor deposition with a desired pattern can be carried out with high accuracy and stability.

  As a result, in the cross section along the normal direction of the laminated mask, the outer contour of the portion 33 where the tip edges 32 of the wall surfaces 31 of the two base material holes 30 meet is the one along the normal direction of the laminated mask. It becomes a curved shape that bulges toward the side.

  In the step of forming the base material hole 30 shown in FIG. 16, when etching proceeds, a joining portion 33 formed by joining two adjacent base material holes 30 is separated from the first surface side resin layer 43, Etching due to etching also proceeds in the normal direction (thickness direction) of the long metal plate 71 in the joining portion 33 below the first surface side resin layer 43. Thereby, the merging portion 33 that is pointed toward one side along the normal direction of the laminated mask is etched and chamfered from one side along the normal direction of the laminated mask. At this time, the joining portion 33 is separated from the first surface side resin layer 43, whereby the first surface side resin layer 43 in the effective region 22 can be removed.

20 laminated mask 20a first surface 20b second surface 21 metal plate 21a first surface 21b second surface 25 through hole 30 base material hole 31 wall surface 35 base material recess 36 wall surface 43 first surface side resin layer 44 first surface side resin Layer opening portion 45 Wall surface 46 Second surface side resin layer 47 Second surface side resin layer opening portion 48 Wall surface 49 Defect portion 50 Laminated mask 70 with protective film Laminated body 71 Long metal plate 71a First surface 71b Second surface 84 Protection the film

Claims (16)

In a manufacturing method of a laminated mask having a plurality of through holes and used for depositing a deposition material on a substrate through the through holes,
Preparing a metal substrate having a first surface and a second surface provided on the opposite side of the first surface and disposed on the substrate side during vapor deposition;
Providing a first surface-side resin layer on the first surface of the metal substrate, and providing a second surface-side resin layer on the second surface of the metal substrate;
The first surface side resin layer and the second surface side resin layer are exposed and developed to form a first surface side resin layer opening in the first surface side resin layer, and the second surface side Forming a second surface side resin layer opening in the resin layer;
Etching the metal substrate from the first surface side through the first surface-side resin layer opening, the metal substrate communicating with the second surface-side resin layer opening, and Forming a base material hole that defines the through hole together with the second surface side resin layer opening, and
The method of manufacturing a laminated mask, wherein a wall surface of the second surface side resin layer opening is disposed inside the through hole rather than a wall surface of the base material hole.   The said 1st surface side resin layer opening part is connected to the said base material hole, and defines the said through-hole with the said base material hole and the said 2nd surface side resin layer opening part. The manufacturing method of the laminated mask of description.   The method for manufacturing a laminated mask according to claim 1, wherein the first surface side resin layer and the second surface side resin layer have alkali resistance.   After the step of forming the first surface side resin layer opening and the second surface side resin layer opening, before the step of etching the metal substrate from the first surface side, the second surface side resin The method for producing a laminated mask according to any one of claims 1 to 3, wherein a protective film is provided on a surface of the layer opposite to the metal substrate side.   The method for producing a laminated mask according to claim 4, wherein the protective film is peelable from the second surface side resin layer by irradiating UV light.   After the step of forming the first surface side resin layer opening and the second surface side resin layer opening, before the step of etching the metal substrate from the first surface side, the second surface side resin 6. The laminate according to claim 1, wherein a contour of the second surface side resin layer opening is corrected by irradiating a defective portion of the layer with a laser beam to remove the defective portion. Mask manufacturing method.   The said 1st surface side resin layer and the said 2nd surface side resin layer are formed of the rubber-type photosensitive resin or acrylic type negative photosensitive resin containing an azide compound, The any one of Claim 1 thru | or 6 characterized by the above-mentioned. A method for producing the laminated mask according to claim 1.   2. The laminated mask manufacturing method according to claim 1, wherein when the metal substrate is etched from the first surface side, the first surface-side resin layer in a region where the through hole is formed is removed. Method.   When etching the metal base material from the first surface side, the front edge of the wall surface of the base material hole joins the front edge of the wall surface of another base material hole adjacent to the base material hole. A method for manufacturing a laminated mask according to claim 8. After the step of etching the second surface side resin layer, before the step of etching the metal substrate from the first surface side, the metal substrate is moved through the second surface side resin layer opening. Etching from the second surface side, further comprising the step of forming a substrate recess in the second surface side of the metal substrate,
The step of etching the metal substrate from the first surface side, the substrate hole is formed so as to include the substrate recess. A method for manufacturing a laminated mask. In a laminated mask having a plurality of through holes and used for depositing a deposition material on a substrate through the through holes,
A metal substrate having a first surface and a second surface provided on the opposite side of the first surface and disposed on the substrate side during vapor deposition;
A second surface side resin layer provided on the second surface of the metal substrate,
The metal substrate has a substrate hole,
The second surface side resin layer has a second surface side resin layer opening that communicates with the base material hole and defines the through hole together with the base material hole,
The wall surface of the second surface side resin layer opening is disposed inside the through hole rather than the wall surface of the base material hole,
The laminated mask, wherein the second surface side resin layer is formed of a rubber-based photosensitive resin or an acrylic negative-type photosensitive resin containing an azide compound. A first surface-side resin layer provided on the first surface of the metal substrate;
The first surface-side resin layer has a first surface-side resin layer opening that communicates with the substrate hole and defines the through hole together with the substrate hole and the second surface-side resin layer opening. ,
The first surface side resin layer is formed of the same material as the second surface side resin layer,
The laminated mask according to claim 11, wherein the wall surface of the second surface side resin layer opening is disposed inside the through hole from the wall surface of the first surface side resin layer opening.   The laminated mask according to claim 11 or 12, wherein the first surface side resin layer and the second surface side resin layer have alkali resistance.   The front end edge of the wall surface of the base material hole joins the front end edge of the wall surface of another base material hole adjacent to the base material hole. Laminated mask. The laminated mask according to any one of claims 11 to 14,
A laminated mask with a protective film, comprising: a protective film provided on a surface opposite to the metal substrate side of the second surface side resin layer.   The laminated mask with a protective film according to claim 15, wherein the protective film is peelable from the second surface side resin layer by irradiating UV light.

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