JP2003170352A - Mask for organic molecule vapor deposition and its manufacturing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To form a mask for organic molecule vapor deposition of a ceramic material of less thermal deformation. <P>SOLUTION: The ceramic made mask having a specified opening pattern is formed by devising both surfaces of a ceramic made substrate 1 having specified thickness to have specified surface roughness by applying a blast working means on them on its foundation, providing a photosensitive resin material on the both surfaces applied with such surface work, forming specified masking patterns 2, 2' under a photoresist method and forming a through part 11 having a specified opening form on the ceramic made substrate 1 by applying specified blast work from the both surface sides on the ceramic made substrate 1 on both surfaces of which the masking patterns 2, 2' are formed. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a mask used for manufacturing an organic electroluminescence element (hereinafter referred to as an organic EL element) or an organic light emitting diode (hereinafter referred to as an organic LED) by an organic molecule vapor deposition method. In particular, the present invention relates to a mask for organic molecule vapor deposition in which the mask is formed on the basis of a ceramic flat plate material and a method for manufacturing the same.

[0002]

2. Description of the Related Art Generally, an organic EL element or an organic LE is used.
As shown in FIG. 5, D is between the anode electrode 20 provided on the glass substrate 10 and the cathode 70 made of a metal electrode,
The hole generating layer 30, the hole transporting layer 40, the light emitting layer 50, and the electron transporting layer 60 are provided. Then, each of these layers is covered with a sealing cap 80, and is hermetically sealed with nitrogen gas sealed inside. By the way, in forming (manufacturing) an element having such a structure, particularly in forming the light emitting layer 50, a predetermined light emitting substance is passed through a mask having a predetermined pattern on the glass substrate 10. An organic molecular vapor deposition method for vapor deposition has been adopted.
As a mask used in this organic molecule vapor deposition method, a metal mask made of an iron (Fe) -based metal material is adopted.

[0003]

By the way, in the organic molecule vapor deposition method using this metal mask, the metal mask is deformed due to thermal expansion during the organic molecule vapor deposition work, resulting in an error in the mask pattern. There is a point.
Further, when the organic substance adheres to the peripheral portion of the mask pattern during the vapor deposition operation, the mask itself is made of a metal material such as stainless steel. Therefore, the attached substance should be easily removed with a chemical solvent or the like. There is a problem that you cannot do it. In order to solve such a problem, it is an object of the present invention to provide a ceramic mask for organic molecule vapor deposition and a method for manufacturing the same, in which a mask is formed by applying a blasting process to a ceramic plate material as a base. That is the object (problem) of the present invention.

[0004]

In order to solve the above-mentioned problems, the following measures are taken in the present invention. That is, in the invention according to claim 1, a mask used for forming a light emitting portion of an organic electroluminescence element or the like by an organic molecule vapor deposition method is based on a ceramic substrate having a predetermined thickness, and both surfaces thereof are formed. Both surfaces are made to have a predetermined surface roughness by applying blasting means, and a photosensitive resin material is provided on both surfaces subjected to such surface processing, and a predetermined method is applied there by a photoresist method. A masking pattern is formed, and a blasting process having a predetermined opening form is formed on the ceramic substrate by performing a predetermined blasting process on both sides of the ceramic substrate on which masking patterns are formed on both sides. Then, a structure is formed by which a ceramic mask having a predetermined opening pattern is formed. Was Rukoto. By adopting such a configuration, in the present invention, a vapor deposition mask excellent in heat resistance and capable of easily removing attached organic substances and the like with a chemical solvent and suitable for reuse. Can be obtained efficiently.

Next, the invention according to claim 2 will be described. This is also the same as the first aspect of the invention, and its characteristic is the method of manufacturing a mask used in the organic molecule vapor deposition method.
That is, in the present invention, with respect to a method of manufacturing a mask used when forming a light emitting portion such as an organic electroluminescence element by an organic molecule vapor deposition method, based on a ceramic substrate having a predetermined thickness, on both sides thereof. A surface adjusting step of forming by blasting means so that both surfaces have a predetermined surface roughness, and a photosensitive resin material formed on both surfaces so as to have the predetermined surface roughness. A masking pattern forming step of forming a coating layer and providing a masking pattern of a predetermined form on the photosensitive resin coating layer by a photoresist method, and a predetermined pattern from one surface side on which the masking pattern is provided. First blast grinding for forming one surface side of the ceramic substrate into a concave shape by applying blast processing means And a step of forming a coating film made of a photosensitive resin material on the upper side of the masking pattern made of the photosensitive resin on the surface side that has been blasted into the concave shape to cover the whole, and the provision of such a coating film. A second blast grinding step in which the surface side opposite to the formed surface side is formed by a predetermined blast processing means and blast processing is performed so that a predetermined penetrating portion is formed in the portion of the ceramic substrate. And, in such a state that a predetermined penetrating portion is formed on the ceramic substrate, the masking pattern and the film made of the photosensitive resin material provided on both surface sides of the ceramic substrate are removed by a predetermined solvent. And a photosensitive resin material removing step.

By adopting such a process, the mask of the present invention is suitable for reuse because it is resistant to thermal deformation and the attached organic substances can be easily removed with a chemical solvent. Can be manufactured efficiently. Particularly, in the present invention, since the surface of the ceramic substrate is finished to have an appropriate roughness in the surface adjusting step, the degree of adhesion of the photosensitive resin material is increased, and the grinding means has a predetermined thickness. The residual stress accumulated in the ceramic substrate molded as described above can be removed by subjecting both surfaces to a predetermined blasting process, and distortion, warpage, etc. of the ceramic substrate can be removed. You will be able to remove it. Further, in providing a predetermined through-hole (through-hole) on the ceramic substrate, a blast grinding process is first performed to form a predetermined recess, and a photosensitive resin material is further formed on the surface side. By coating the resin coating on this surface side, the abrasive material is reflected at the resin coating at the time of blast grinding from the opposite side, so that the wall surface of the through hole is sagged. Thus, it is possible to obtain a through hole having a smooth wall surface having no unevenness. As a result, the through holes can be formed (drilled) into a sharp shape. As a result, a mask having an accurate pattern is formed.

Next, the invention according to claim 3 will be described. This one is also the same as the one described in claim 2 in the basic point. That is, in the present invention, the method for manufacturing the organic molecule vapor deposition mask according to claim 2,
Both surface roughnesses of the ceramic substrate in the above-mentioned surface adjusting step are represented by R in the surface roughness display method in JIS standard.
The value of a is within the range of 0.1 to 0.3 μm, or Rma
The value of x is set to fall within the range of 1 to 5 μm. By subjecting both surfaces to blasting so as to have such a surface roughness, innumerable fine irregularities are formed on the surface of the ceramic substrate, and the action of such innumerable irregularities As a result, the degree of adhesion of the photosensitive resin film can be further increased. As a result, since the blast grinding process is performed on the basis of such a masking pattern, the shape of the penetrating portion of the mask formed by this blast grinding process has a more clearly defined contour shape. Will be formed.

Next, the invention according to claim 4 will be described. This one is also the same as the one described in claim 2 in the basic point. That is, in the present invention, the method for manufacturing the organic molecule vapor deposition mask according to claim 2,
The masking pattern made of a photosensitive resin coating layer provided on both sides of the ceramic substrate has the opening width of each corresponding opening portion which is formed on one surface side is the other surface side. It was decided to set the value to be slightly smaller than that formed in the above. By setting in this way, the cross-sectional shape of the through hole (penetrating portion) provided in the ceramic substrate formed in the first blast grinding step and the second blast grinding step is, for example, the final step diagram in FIG. As shown in FIG. 5, the taper shape is formed along one surface side. As a result, the end face shape of the opening formed on one surface side of the tapered through hole (penetrating part) and having a small width is formed in a sharp shape. Therefore, by using the mask having such an opening pattern as a reference, a light emitting material is vapor-deposited on a glass substrate or the like, so that the outline shape of the light emitting portion can be formed in a sharp shape.

[0009]

BEST MODE FOR CARRYING OUT THE INVENTION FIG. 1 shows an embodiment of the present invention.
4 to FIG. 4. The present embodiment relates to a mask used when a predetermined light emitting object 110 is vapor-deposited and formed on a glass substrate 10 of an organic electroluminescence device as shown in FIG. 3 by a predetermined means such as a vacuum vapor deposition method. In particular, it is characterized in that a ceramic material is used as a material for forming the mask. As the ceramic material used in this case, a silicon nitride (SiN) -based material, an alumina-based material, or a glass-containing ceramic material in which a predetermined amount of hard glass components are mixed (commonly referred to as a glass ceramic material), etc. To be

Next, a method for manufacturing such a ceramic mask will be described with reference to FIG. First, in the surface adjustment step shown in FIG. 1A, both surfaces of the ceramic substrate 1 for forming a mask are blasted. In this case, the surface roughness of both surfaces is within the range of Ra = 0.1 to 0.3 μm in the JIS standard display method.
Alternatively, the surface is adjusted so that Rmax is in the range of 1 to 5 μm. As a result, the residual stress that remains inside the ceramic substrate 1 forming the mask when the ceramic substrate 1 is ground to a thickness of 0.1 to 0.3 mm As a result, the flatness of the ceramic substrate 1 is ensured. In addition, fine ruggedness is formed on each surface of the ceramic substrate 1 by the blasting in the surface adjusting step, and both surfaces are formed like ground glass.

Next, the ceramic substrate 1
In the masking pattern forming step shown in FIG. 1B, a photosensitive resin material is first applied to both surface sides to form the photosensitive resin coating layers 2 and 2 '. And here, the screen 3 having a predetermined pattern,
Irradiate with ultraviolet rays through 3 '. As a result, masking patterns 2 and 2 ′ made of a photosensitive resin coating layer are formed on both surface portions of the ceramic substrate 1. Such masking patterns 2, 2 '
Since the contact surface (adhesive surface) thereof comes into contact with the fine uneven surface formed on the surface of the ceramic substrate 1, the degree of adhesion is enhanced and the masking patterns 2, 2 '
Is firmly bonded to the surface of the ceramic substrate 1. Further, during irradiation of ultraviolet rays for forming a masking pattern based on the photoresist method, since fine irregularities are formed on both sides of the ceramic substrate 1, the frosted glass effect formed by the irregularities causes one of the ultraviolet rays to become There is no transmission from one surface side to the other surface side, and the interference phenomenon and the like will not occur when the photosensitive resin coating layers 2, 2'on both surfaces are irradiated with ultraviolet rays. As a result, accurate masking patterns 2, 2'can be formed.

Next, the masking patterns 2 and 2'made of a photosensitive resin material are formed on both surfaces in the above-described manner to obtain the first and second masking patterns shown in FIGS. 1 (C) and 1 (D). In the blast grinding step, a through portion (through hole) 11 having a predetermined opening shape is formed at the ceramic substrate 1. Then, what was blast-ground so as to have a through portion (through hole) 11 having a predetermined shape is left on both surface portions in the photosensitive resin material removing step shown in FIG. The masking patterns 2 and 2'and the coating film 22 that are present are washed away with a predetermined solvent and removed. As a result, the ceramic mask 1 having the through portion (through hole) 11 having a predetermined shape is formed.

By the way, in the above-described series of blast grinding steps, in the present embodiment, a special treatment as shown in FIG. 2 is further performed. First, in FIG. 2A, the blast grinding process is performed from the front surface side of the masking patterns 2 and 2 ′ having the smaller opening width value (d). That is,
The first brass grinding process is performed from the side of the masking pattern 2 having a smaller opening width value. Then, in such a first blast grinding step ((a) in FIG. 2), blast processing is performed so that a recessed portion having a depth of about 20 to 50 μm is formed from the front surface side of the ceramic substrate 1. In such a state, next, as shown in FIG.
In (b), a coating 22 made of a photosensitive resin material is newly provided on the surface of the concave-shaped grinding so as to cover the entire surface. Next, in this state,
As shown in FIG. 2B, while turning the inside out,
As shown in (c) of FIG. 2 below, in the second blast grinding step, the blast grinding process is performed from the surface side having the larger opening width value (D). Then, the blasting is continued so that a tapered through portion (through hole) 11 as shown by a broken line in FIG. 2C is formed.

The abrasive used in the first and second blast grinding processes has a relatively large grain size until a through portion (through hole) is formed in the ceramic substrate 1. For example, the value of particle size is 20 to 50 μm
In addition to using a material having a particle diameter within a range of 10 to 18 μm after the through portion (through hole) 11 is formed, for example, a material having a particle diameter of about 10 to 18 μm is used. In this way, by providing the coating film 22 in the middle of the process, and by using different abrasives, it is possible to form the penetrating portion (through hole) 11 having a sharp shape with a clean tapered surface without sagging. become. In particular, in the present embodiment, in the second blast grinding step, for example, as shown in FIG.
After the penetration portion 11 is formed, the penetration portion 11
The abrasive sprayed inside reflects at the coating film 22 formed so as to close one opening side, and the portion left on the side wall of the penetrating portion 11 is ground, finally. In this case, the through portion (through hole) 11 having a smooth tapered surface as shown in FIG. 2D is formed. Therefore, as shown in FIG. 4, the sagging portion 11 ′ that has been a concern in the past
Etc. will not occur. As a result, when the deposition work as shown in FIG. 3 is performed using the ceramic mask 1, the light emitting body 110 made of an organic material is formed on the substrate 10 in a state of having a sharp contour. Will be done.

[0015]

EFFECTS OF THE INVENTION According to the present invention, a mask used for forming a light emitting portion of an organic electroluminescence element or the like by an organic molecule vapor deposition method is based on a ceramic substrate having a predetermined thickness on both sides thereof. Both surfaces are provided with a predetermined surface roughness by applying a blast processing means, and a photosensitive resin material is provided on both surfaces subjected to such surface processing. A masking pattern is formed, and a blasting process having a predetermined opening form is formed on the ceramic substrate by performing a predetermined blasting process on both sides of the ceramic substrate on which masking patterns are formed on both sides. And thereby adopting a structure in which a ceramic mask having a predetermined opening pattern is formed. Was so excellent in heat resistance, and it has become possible to the attached organic substances efficiently obtain deposition mask suitable for reuse can be easily removed by chemical solvents.

Further, in the method for manufacturing such a ceramic mask, a ceramic substrate having a predetermined thickness is used as a base, and both surfaces thereof have a predetermined surface roughness by blasting means. A surface adjusting step of forming and forming a coating layer made of a photosensitive resin material on both surfaces formed so as to have the predetermined surface roughness, and a photoresist at the photosensitive resin coating layer. Masking pattern forming step of providing a masking pattern of a predetermined form by a method, and pitting one surface side of the ceramic substrate by applying a predetermined blast processing means from one surface side provided with the masking pattern. First blast grinding step of forming into a shape, and the photosensitive resin masking pattern on the surface blasted into the concave shape Forming a coating film made of a photosensitive resin material on the upper side of the whole to cover the entire surface, and molding the surface side opposite to the surface side provided with such a coating with a predetermined blasting means. A second blast grinding step of processing and subjecting the ceramic substrate to blasting so that a predetermined penetrating portion is formed on the ceramic substrate part, and a state where the predetermined penetrating portion is formed on the ceramic substrate in this manner. However, since it is composed of a photosensitive resin material removing step of removing the masking pattern and the coating film made of the photosensitive resin material provided on both surface sides with a predetermined solvent, it is resistant to thermal deformation, and The attached organic substances can be easily removed with a chemical solvent, and a mask suitable for reuse can be efficiently manufactured. Particularly, in the present invention, since the surface of the ceramic substrate is finished to have an appropriate roughness in the surface adjusting step, the degree of adhesion of the photosensitive resin material is increased, and the grinding means has a predetermined thickness. It becomes possible to remove the residual stress accumulated in the ceramic substrate molded as described above by subjecting both surfaces to a predetermined blasting process, and removing the distortion, warpage, etc. of the ceramic substrate. I was able to do it. Further, in providing a predetermined penetrating portion (penetrating hole) on the ceramic substrate, a film made of a photosensitive resin material is further provided on the surface side that is first subjected to blast grinding, and this surface side is made of a resin film. When the through hole is formed by blast grinding from the opposite side, the abrasive material reflects at the coating film and grinds the wall surface of the through hole. It is now possible to obtain a through hole having a smooth wall surface with no such problem. As a result, it has become possible to form (manufacture) a mask having an accurate pattern.

Further, in the present invention, both surface roughnesses of the ceramic substrate in the above-mentioned surface adjusting step have a Ra value of 0.1 to 0.1 in the surface roughness display method according to the JIS standard.
Within the range of 0.3 μm, or the value of Rmax is 1 to 5 μm
Since the number of fine irregularities is formed on the surface of the ceramic substrate, the degree of adhesion of the photosensitive resin film is increased by the action of the numerous irregularities. Has become even higher. As a result, since the blast grinding process is performed on the basis of such a masking pattern, the shape of the penetrating portion of the mask formed by this blast grinding process has a more clear outline shape. Began to form.

Further, in the present invention, the opening width of each corresponding opening portion of the masking pattern formed of the coating layer made of a photosensitive resin provided on both sides of the ceramic substrate is set to one surface side. Since it is set so that the formed one has a value slightly smaller than that formed on the other surface side, it is formed in the first blast grinding step and the second blast grinding step. The cross-sectional shape of the through hole (penetration part) provided in the ceramic substrate is tapered along one surface side and is formed on one surface side of the tapered through hole (penetration part). The end face shape on the side of the formed opening having a small width has been formed to be a sharp shape. As a result, it has become possible to form the outline shape of the light emitting portion into a sharp shape by depositing the light emitting material on the glass substrate or the like with the mask having such an opening pattern as a reference.

[Brief description of drawings]

FIG. 1 is a schematic diagram showing an overall configuration of a manufacturing process according to the present invention.

FIG. 2 is a process explanatory view showing first and second blast grinding processes in the present invention.

FIG. 3 is a conceptual diagram when performing a vapor deposition operation using the ceramic mask according to the present invention.

FIG. 4 is a cross-sectional view showing a form of a penetrating portion when blasting is performed by a conventional method.

FIG. 5 is a conceptual diagram showing an overall configuration of an organic EL element related to the present invention.

[Explanation of symbols] 1 Ceramic mask (ceramic substrate) 11 Penetration part (penetration hole) 11 'Dull part 2 Photosensitive resin coating layer (masking pattern) 2'Photosensitive resin coating layer (masking pattern) 22 Resin coating 3 screen 3'screen 10 glass substrate 110 luminous body

   ─────────────────────────────────────────────────── ─── Continued front page    F-term (reference) 3K007 AB18 DB03 FA01                 4K029 AA09 BA62 BB02 CA01 DB06                       HA03

Claims (4)

[Claims] 1. A ceramic substrate having a predetermined thickness is used as a base, and both surfaces thereof are subjected to a blasting process so that both surfaces have a predetermined surface roughness. A photosensitive resin material is provided on both surfaces, and a predetermined masking pattern is formed on this surface by a photoresist method, and a predetermined masking pattern is formed on both surfaces of the ceramic substrate. A mask for organic molecule vapor deposition, characterized in that a piercing portion having a predetermined opening form is formed on the ceramic substrate by blasting so that the ceramic substrate has a predetermined opening pattern. 2. A surface adjustment step of forming a ceramic substrate having a predetermined thickness on both sides by blasting means so that the both surfaces have a predetermined surface roughness, and the predetermined step. A coating layer made of a photosensitive resin material is formed on both surfaces formed so as to have a surface roughness of, and a masking pattern having a predetermined shape is formed on the photosensitive resin coating layer by a photoresist method. A masking pattern forming step to be provided, and a first blast grinding step of forming one surface side of the ceramic substrate into a concave shape by applying a predetermined blasting means from one surface side provided with the masking pattern. When,
A film forming step of covering the entire surface by further providing a film made of a photosensitive resin material on the upper side of the photosensitive resin masking pattern on the surface side that has been blasted into the concave shape, and the surface provided with such a film. A second blast grinding step in which the surface opposite to the side is formed by a predetermined blasting means and subjected to blasting so that a predetermined penetrating portion is formed in the portion of the ceramic substrate, Photosensitive resin for removing a masking pattern and a coating made of a photosensitive resin material provided on both surface sides of the ceramic substrate with a predetermined penetrating portion using a predetermined solvent. A method for manufacturing a mask for organic molecule vapor deposition, comprising: a material removing step. 3. The method for manufacturing a mask for organic molecule vapor deposition according to claim 2, wherein both surface roughnesses of the ceramic substrate in the surface adjusting step have a Ra value of 0 in a surface roughness display method according to JIS standard. A method for manufacturing a mask for organic molecule vapor deposition, characterized in that the value of Rmax is set within the range of 1 to 0.3 μm, or the value of Rmax is set within the range of 1 to 5 μm. 4. The method for manufacturing a mask for organic molecule vapor deposition according to claim 2, wherein openings of respective corresponding openings of a masking pattern made of a photosensitive resin coating layer provided on both sides of the ceramic substrate. Manufacture of a mask for organic molecular vapor deposition characterized in that the width formed on one surface side is set to have a slightly smaller value than that formed on the other surface side Method.