TWI775905B - 多層印刷配線板之製造方法 - Google Patents
多層印刷配線板之製造方法 Download PDFInfo
- Publication number
- TWI775905B TWI775905B TW107125546A TW107125546A TWI775905B TW I775905 B TWI775905 B TW I775905B TW 107125546 A TW107125546 A TW 107125546A TW 107125546 A TW107125546 A TW 107125546A TW I775905 B TWI775905 B TW I775905B
- Authority
- TW
- Taiwan
- Prior art keywords
- printed wiring
- wiring board
- metal foil
- multilayer printed
- insulating layer
- Prior art date
Links
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- 150000003512 tertiary amines Chemical class 0.000 description 1
- 230000000930 thermomechanical effect Effects 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- BIKXLKXABVUSMH-UHFFFAOYSA-N trizinc;diborate Chemical compound [Zn+2].[Zn+2].[Zn+2].[O-]B([O-])[O-].[O-]B([O-])[O-] BIKXLKXABVUSMH-UHFFFAOYSA-N 0.000 description 1
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- BNEMLSQAJOPTGK-UHFFFAOYSA-N zinc;dioxido(oxo)tin Chemical compound [Zn+2].[O-][Sn]([O-])=O BNEMLSQAJOPTGK-UHFFFAOYSA-N 0.000 description 1
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Images
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
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- B32B37/0007—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding involving treatment or provisions in order to avoid deformation or air inclusion, e.g. to improve surface quality
- B32B37/0015—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding involving treatment or provisions in order to avoid deformation or air inclusion, e.g. to improve surface quality to avoid warp or curl
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
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- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
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- B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
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- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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- B29C70/68—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts by incorporating or moulding on preformed parts, e.g. inserts or layers, e.g. foam blocks
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- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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- B29C70/00—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts
- B29C70/88—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts characterised primarily by possessing specific properties, e.g. electrically conductive or locally reinforced
- B29C70/882—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts characterised primarily by possessing specific properties, e.g. electrically conductive or locally reinforced partly or totally electrically conductive, e.g. for EMI shielding
- B29C70/885—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts characterised primarily by possessing specific properties, e.g. electrically conductive or locally reinforced partly or totally electrically conductive, e.g. for EMI shielding with incorporated metallic wires, nets, films or plates
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- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
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- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
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- B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
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- C09J11/02—Non-macromolecular additives
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
- C09J5/06—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving heating of the applied adhesive
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/10—Adhesives in the form of films or foils without carriers
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
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- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/35—Heat-activated
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
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Abstract
本發明提供一種多層印刷配線板之製造方法,其在印刷配線板之導體配線上加上絕緣層及金屬箔來製造多層印刷配線板時,即使於印刷配線板產生有該導體配線側之面突出的翹曲,仍可製造可減緩該翹曲的多層印刷配線板。 於第一金屬箔與第二金屬箔之間包夾第一預浸體而將該等積層來製作第一積層物後,將之熱壓使第一預浸體熱硬化來製造雙面覆金屬積層板。從雙面覆金屬積層板去除一部分的第一金屬箔來製作導體配線,藉以製造印刷配線板。將第三金屬箔預加熱後,以在印刷配線板之導體配線與第三金屬箔之間包夾第二預浸體的方式將該等積層並熱壓。第一絕緣層之線膨脹係數分別比第一金屬箔及第二金屬箔之線膨脹係數更低。
Description
本發明涉及一種多層印刷配線板之製造方法,更詳細而言係涉及一種於印刷配線板之導體配線上加上絕緣層及導體層來製造多層印刷配線板的多層印刷配線板之製造方法。
發明背景 近年,隨著電子機器的高功能化及高密度化,電子零件愈來愈傾向小型化、高積體化、高速化及多腳化。隨之而來的,對印刷配線板的高密度化、小徑化、輕量化、薄型化的要求也愈來愈高。
為因應該等要求,一直以來係分別減少構成印刷配線板之絕緣層及導體層的厚度。又,一般多廣用具有四層導體層之多層印刷配線板(四層板)及具有六層導體層之多層印刷配線板(六層板),不過亦有藉由從該等多層印刷配線板減去一層導體層而獲得三層板、五層板等具有奇數導體層的多層印刷配線板,來減低印刷配線板之厚度。
多層印刷配線板多以預浸體與金屬箔作為材料,並以包含熱壓之步驟來製造。屆時卻有會於多層印刷配線板產生因屬預浸體之硬化物的絕緣層與金屬箔之線膨脹係數之差所造成的翹曲之情形,且在製造具有奇數導體層之多層印刷配線板時,此情形相當明顯。
專利文獻1中揭示了一種抑制製造具有奇數導體層之多層印刷配線板時之翹曲的技術。就該方法而言,係在二個金屬箔之間配置預浸體製成積層物後,將之預加熱後進行加熱加壓成形而製得雙面覆金屬積層板後,僅對雙面覆金屬積層板之其中一金屬箔施行配線形成處理製作導體配線,來製造印刷配線板。再於該印刷配線板之導體配線上依序積層預浸體及金屬箔而製出多層積層物,並將之預加熱後進行加熱加壓成形來製作多層印刷配線板。並且視需求對多層印刷配線板之最外層的金屬箔施行配線形成處理,來製作導體配線。
在JP2016-68277A(專利文獻1)中記載之方法中,即使於印刷配線板產生導體配線側之面凹陷的翹曲,從印刷配線板製造多層印刷配線板時仍可減緩翹曲。
發明概要 本發明目的在於提供一種多層印刷配線板之製造方法,其在印刷配線板之導體配線上加上絕緣層及導體層來製造多層印刷配線板時,即使於印刷配線板產生有該導體配線側之面突出的翹曲,仍可製造可減緩該翹曲之多層印刷配線板。
本發明之一態樣之多層印刷配線板之製造方法包含下述步驟: 以在第一金屬箔與第二金屬箔之間包夾第一預浸體的方式將該等積層來製作第一積層物; 將前述第一積層物熱壓使前述第一預浸體熱硬化來製作第一絕緣層,藉此製造依序積層前述第二金屬箔、前述第一絕緣層及前述第一金屬箔而成的雙面覆金屬積層板; 自前述雙面覆金屬積層板去除一部分的前述第一金屬箔來製作導體配線,藉此製造依序積層前述第二金屬箔、前述第一絕緣層及前述導體配線而成的印刷配線板; 以在前述印刷配線板之前述導體配線與第三金屬箔之間包夾第二預浸體的方式將該等積層來製作第二積層物;並 將前述第二積層物熱壓使前述第二預浸體熱硬化來製作第二絕緣層。第三金屬箔係預加熱後再積層至前述第二預浸體上。前述第一絕緣層之線膨脹係數分別比前述第一金屬箔及前述第二金屬箔之線膨脹係數更低。
用以實施發明之形態 本實施形態涉及一種多層印刷配線板之製造方法,更詳細而言係涉及一種於印刷配線板之導體配線上加上絕緣層及導體層來製造多層印刷配線板的多層印刷配線板之製造方法。
首先,說明達至本發明構成之原委。
在JP2016-68277A(專利文獻1)中記載之多層印刷配線板之製造方法中,即使於印刷配線板產生導體配線側之面凹陷的翹曲,從印刷配線板製造多層印刷配線板時仍可減緩翹曲。
但,端視絕緣層之線膨脹係數與金屬箔之線膨脹係數的關係,可能會於印刷配線板產生導體配線側之面突出的翹曲。以專利文獻1中記載之方法卻無法有效抑制這類的翹曲。
又,於印刷配線板上加上絕緣層及導體層來製造多層印刷配線板時,多會在所加導體層上進行表面安裝半導體晶片等電子零件。若在印刷配線板上已發生翹曲的情況下於印刷配線板上安裝電子零件的話,會產生印刷配線板與電子零件之間的距離拉大的部位,而該部位產生連接不良的頻率會變高。該部位之面積會依印刷配線板翹曲的方向而異。當發生已加至多層印刷配線板上之導體層側之面凹陷的翹曲時,多層印刷配線板與電子零件之間的距離只有中央部會變大,因此距離變大之部位的面積較小。相對地,當發生已加至多層印刷配線板上之導體層側之面突出的翹曲時,多層印刷配線板與電子零件之間的距離會在兩端部變大,因此距離變大之部位的面積較大。所以,多層印刷配線板中所加導體層側之面突出的翹曲,會增加多層印刷配線板與電子零件之間發生連接不良的危險性。
本發明人等勤奮研討的結果終達至發明出一種多層印刷配線板之製造方法,其即使在印刷配線板產生該導體配線側之面突出的翹曲,仍可製造可減緩該翹曲之多層印刷配線板。
以下,參照圖1A~圖1E說明本發明實施形態之多層印刷配線板10之製造方法。
在本實施形態中,係製造具備三層導體層之多層印刷配線板10。另,導體層係指印刷配線板1中由導體構成之層,可包含金屬箔及導體配線。
在本實施形態之多層印刷配線板10之製造方法中,如圖1A所示,以在第一金屬箔21與第二金屬箔22之間包夾第一預浸體31的方式將該等積層來製作第一積層物61。在第一積層物61中,第二金屬箔22、第一預浸體31及第一金屬箔21係依序排列在一方向(以下稱為第一方向)上。
將第一積層物61熱壓使第一預浸體31熱硬化來製作第一絕緣層41。藉此製造如圖1B所示依序積層第二金屬箔22、第一絕緣層41及第一金屬箔21而成的雙面覆金屬積層板7。第二金屬箔22、第一絕緣層41及第一金屬箔21係依序排列於第一方向上。
第一絕緣層41之線膨脹係數分別比第一金屬箔21及第二金屬箔22之線膨脹係數更低。
從雙面覆金屬積層板7去除一部分的第一金屬箔21,藉以製作導體配線51。藉此製造如圖1C所示依序積層第二金屬箔22、第一絕緣層41及導體配線51而成的印刷配線板1。第二金屬箔22、第一絕緣層41及導體配線51係依序排列於第一方向上。
如圖1D所示,以在印刷配線板1之導體配線51與第三金屬箔23之間包夾第二預浸體32的方式將該等積層來製作第二積層物62。第三金屬箔23係預加熱後再積層至第二預浸體32上。在第二積層物62中,第二金屬箔22、第一絕緣層41、導體配線51、第二預浸體32及第三金屬箔23係依序排列在第一方向上。
將第二積層物62熱壓使第二預浸體32熱硬化來製作第二絕緣層42。藉此如圖1E所示製作多層印刷配線板10。
在本實施形態中,如圖1C所示即使於印刷配線板1產生其導體配線51側之面突出的翹曲、亦即朝第一方向突出之翹曲,仍可減緩該翹曲。吾等推測,該翹曲之減緩係因以下機制而生成。惟,本實施形態不受下述機制之說明限制。
在本實施形態中,第一絕緣層41之線膨脹係數分別比第一金屬箔21及第二金屬箔22之線膨脹係數更低。所以,若利用熱壓來製造雙面覆金屬積層板7,第一金屬箔21及第二金屬箔22比第一絕緣層41更容易大幅膨脹。接著,於熱壓後將之冷卻後,已大幅膨脹之第一金屬箔21及第二金屬箔22將會比第一絕緣層41更大幅地收縮。此時,第一絕緣層41因受第一金屬箔21及第二金屬箔22拘束,故會和第一金屬箔21及第二金屬箔22一起以大於原本的收縮度收縮。所以,在冷卻後之雙面覆金屬積層板7的第一絕緣層41內,會產生得以往與第一方向正交之方向伸長的應力。即,在第一絕緣層41內會產生得以往第一絕緣層41之面方向伸長的應力。惟,第一絕緣層41受第一金屬箔21及第二金屬箔22拘束,因此在該時間點不易於雙面覆金屬積層板7產生翹曲。
若從該雙面覆金屬積層板7去除一部分的第一金屬箔21來製作導體配線51,第一絕緣層41受導體配線51之拘束會比受第一金屬箔21之拘束更少。所以,第一絕緣層41內之應力會有部分被釋放。即,第一絕緣層41內之形成有導體配線51之側的應力會有部分被釋放,使得第一絕緣層41在第一絕緣層41之導體配線51側得以伸長。但,第一絕緣層41中之第二金屬箔22側的部分係受第二金屬箔22拘束。所以,第一絕緣層41之第二金屬箔22側之得以伸長的應力不容易被釋放。因此,第一絕緣層41之導體配線51側會比第二金屬箔22側更大幅伸長,致使第一絕緣層41翹曲成朝第一方向突出。其結果,致使印刷配線板1整體也會翹曲成朝第一方向突出。
假設,未使第三金屬箔23預加熱便將第二預浸體32及第三金屬箔23疊合至該印刷配線板1上而製作第二積層物62後,將之熱壓以製造多層印刷配線板10。此時,冷卻多層印刷配線板10時,會在由第二預浸體32製成的第二絕緣層42產生得以伸長之應力,因此印刷配線板1中會殘留翹曲。即,多層印刷配線板10會翹曲成朝第一方向突出。
但在本實施形態中,第三金屬箔23係預加熱後再積層至第二預浸體32上。即,由於係在第三金屬箔23預加熱後來製作第二積層物62,因此製作第二積層物62時,第三金屬箔23係呈現已伸長之狀態。此時即使將該第二積層物62熱壓,第三金屬箔23也不容易再進一步伸長,故可防止第二預浸體32及第二絕緣層42因熱而伸長。將藉由熱壓所得多層印刷配線板10冷卻時,第三金屬箔23及第二絕緣層42會收縮,而且此時第三金屬層之收縮量較大,因此會在第二絕緣層42產生得以伸長之應力。但,利用熱壓製作第二絕緣層42時,因第二絕緣層42之伸長受阻,故冷卻後第二絕緣層42內產生之應力會變得比第一絕緣層41內產生之應力更小。如此一來,藉由第三金屬層收縮及第二絕緣層42內產生之應力小於在第一絕緣層41產生之應力,會使多層印刷配線板10出現朝與第一方向之反向突出之翹曲的傾向。因此,製造印刷配線板1時產生的翹曲傾向會被製造多層印刷配線板10時產生的翹曲傾向抵銷,使多層印刷配線板10近於平坦或是產生朝與第一方向為反向突出的翹曲。
藉此,在本實施形態中得以減緩多層印刷配線板10朝第一方向突出的翹曲。此處所謂的翹曲減緩意指多層印刷配線板10相較於印刷配線板1更趨近於平坦,或是產生朝與第一方向為反向突出的翹曲。
此外,該翹曲減緩可在不導致多層印刷配線板10之厚度增大的情況下達成。另,不導致厚度增大意指減緩本實施形態中之多層印刷配線板10翹曲的手段不以增大多層印刷配線板10之厚度為必要,而非指本實施形態中之多層印刷配線板10的厚度尺寸比習知多層印刷配線板10的厚度尺寸更小。
另,本說明中之線膨脹係數為與上述第一方向正交之方向的線膨脹係數。第一金屬箔21、第二金屬箔22、第三金屬箔23、第一絕緣層41及第二絕緣層42的線膨脹係數各係利用熱機械分析法(TMA法)在測定溫度範圍30~350℃、升溫速度10℃/min及拉伸荷重200mN之條件下進行測定。
接著進一步詳細說明本實施形態之製造方法。
在本實施形態中,準備金屬箔及預浸體作為多層印刷配線板10之材料。金屬箔包含第一金屬箔21、第二金屬箔22及第三金屬箔23,預浸體包含第一預浸體31及第二預浸體32。
第一金屬箔21、第二金屬箔22及第三金屬箔23之線膨脹係數各宜為14ppm/K以上且18ppm/K以下。
第一金屬箔21、第二金屬箔22及第三金屬箔23之厚度譬如各宜為0.002mm以上且0.035mm以下。尤其,第三金屬箔23之厚度若為0.002mm以上且0.035mm以下,可在不導致多層印刷配線板10之厚度增大的情況下更減緩多層印刷配線板10之翹曲。
第一金屬箔21、第二金屬箔22及第三金屬箔23各宜為銅箔,譬如為電解銅箔或軋延銅箔。第一金屬箔21、第二金屬箔22及第三金屬箔23各亦可不為銅箔,譬如亦可為鋁箔或不鏽鋼箔。
第一預浸體31宜含熱硬化性樹脂組成物(以下稱為「組成物(X)」)與纖維基材。在本實施形態中,第一預浸體31及第二預浸體32各具備纖維基材及已浸潤至纖維基材中之組成物(X)的乾燥物或半硬化物。第一預浸體31及第二預浸體32各係譬如將組成物(X)浸潤至纖維基材後,將組成物(X)加熱使其乾燥或半硬化來製造。
纖維基材中之纖維譬如為玻璃纖維等之無機質纖維,或為芳醯胺纖維、PBO(聚對伸苯基苯并二唑)纖維、PBI(聚苯并咪唑)纖維、PTFE(聚四氟乙烯)纖維、PBZT(聚對伸苯基苯并雙噻唑)纖維、全芳香族聚酯纖維等之有機纖維。纖維基材可為織布亦可為不織布。
熱硬化性樹脂宜含有環氧樹脂。環氧樹脂含有譬如選自於由多官能環氧樹脂、雙酚型環氧樹脂、酚醛型環氧樹脂及聯苯型環氧樹脂所構成群組中之至少一種成分。
組成物(X)亦可含有能與熱硬化性樹脂反應之硬化劑。熱硬化性樹脂含有環氧樹脂時,硬化劑可含有譬如選自於由一級胺、二級胺等二胺系硬化劑、酚系硬化劑、酸酐系硬化劑、二氰二胺及聚伸苯醚(PPE)所構成群組中之至少一種成分。
硬化劑的量可因應熱硬化性樹脂與硬化劑之種類,以組成物(X)具有良好的硬化特性的方式適當調整。譬如,當組成物(X)含有環氧樹脂與具有羥基之硬化劑時,環氧樹脂與硬化劑之當量比宜為0.8:1.2~1.2:0.8之範圍內。
組成物(X)亦可含有硬化促進劑。硬化促進劑可含有譬如選自於由咪唑類及其衍生物、有機磷系化合物、辛酸鋅等金屬皂類、二級胺類、三級胺類及四級銨鹽所構成群組中之至少一種成分。
組成物(X)宜含有無機充填材。無機充填材可含有譬如選自於由球狀二氧化矽、硫酸鋇、氧化矽粉、碎二氧化矽、燒成滑石、鈦酸鋇、氧化鈦、黏土、氧化鋁、雲母、軟水鋁石、硼酸鋅及錫酸鋅、以及前述以外之各種金屬氧化物及金屬水合物所構成群組中之至少一種成分。相對於組成物(X)之固體成分總量,無機充填材比率譬如為20質量%以上且80質量%以下。
相對於組成物(X)的量與纖維基材的量之合計,組成物(X)中之無機充填材的量與纖維基材的量之合計宜為50質量%以上且85質量%以下。此時,可使以含有該組成物(X)之預浸體熱硬化做成的絕緣層之線膨脹係數不會變得太高,同時可使絕緣層與金屬箔之剝離強度不會過度降低。相對於組成物(X)的量與纖維基材量之合計,組成物(X)中之無機充填材的量與纖維基材的量之合計宜為55質量%以上且80質量%以下。
組成物(X)更可含有光穩定劑、黏度調整劑、阻燃劑等適宜的添加劑。
組成物(X)亦可含有溶劑。溶劑可含有譬如選自於由丙酮、甲基乙基酮、環己酮等酮系溶劑、甲苯、二甲苯等芳香族系溶劑以及二甲基甲醯胺等含氮溶劑所構成群組中之至少一種成分。
使第二預浸體32熱硬化做成的第二絕緣層42之線膨脹係數宜比第三金屬箔23之線膨脹係數更低。此時,可更減緩朝多層印刷配線板10之第一方向突出的翹曲。並可抑制多層印刷配線板10朝與第一方向相反方向過度翹曲。
第一絕緣層41之線膨脹係數宜為5ppm/K以上且17ppm/K以下。此時,尤其能減緩多層印刷配線板10之翹曲。並可抑制第一金屬箔21及第二金屬箔22之剝離強度過度降低。
第一絕緣層41之線膨脹係數分別與第一金屬箔21及第二金屬箔22之線膨脹係數之差宜為12ppm/K以下,且11ppm/K以下較佳。此時,可更減緩多層印刷配線板10之翹曲。
第二絕緣層42之線膨脹係數宜為5ppm/K以上且17ppm/K以下。此時,尤其能減緩多層印刷配線板10之翹曲。並可抑制第三金屬箔23之剝離強度過度降低。
第二絕緣層42之線膨脹係數與第三金屬箔23之線膨脹係數之差宜為12ppm/K以下,且11ppm/K以下較佳。此時,可更減緩多層印刷配線板10之翹曲。
第一絕緣層41及第二絕緣層42之厚度各宜為50μm以下。藉由第一絕緣層41及第二絕緣層42之厚度各為50μm以下,可在不導致多層印刷配線板10之厚度增大的情況下更減緩多層印刷配線板10之翹曲。
第一絕緣層41之厚度與第二絕緣層42之厚度可互異亦可相同,且以第一絕緣層41之厚度與第二絕緣層42之厚度相同為宜。藉由第一絕緣層41之厚度與第二絕緣層42之厚度相同,尤其可減緩多層印刷配線板10之翹曲。
這樣低的線膨脹係數譬如可藉由增大組成物(X)中之無機充填材、或使用線膨脹係數低之玻璃布作為纖維基材來達成。
多層印刷配線板10之翹曲量宜大於-35mm且為2mm以下。多層印刷配線板10之翹曲量若在該範圍內,可更減緩多層印刷配線板10之翹曲,從而可製得少有與電子零件等連接不良的多層印刷配線板10。多層印刷配線板10之翹曲量較宜大於-25mm且為0mm以下。此時,尤其能減緩多層印刷配線板10之翹曲。另,多層印刷配線板10之翹曲量可以與後述實施例相同之方法測定,翹曲量為正值時表示有產生朝第一方向突出之翹曲,翹曲量為負值時則表示有產生朝與第一方向為反向突出之翹曲。
再來說明從上述材料製造多層印刷配線板10之方法。
首先,製造印刷配線板1。為此,首先如圖1A所示,以在第一金屬箔21與第二金屬箔22之間包夾第一預浸體31的方式將該等積層來製作第一積層物61。第一預浸體31可為一片亦可為多片。即,在第一積層物61中,第二金屬箔22、一片或多片第一預浸體31及第一金屬箔21係依序排列在第一方向上。
製作第一積層物61時,第一金屬箔21、第二金屬箔22及第一預浸體31宜為常溫,即5~35℃之範圍內之溫度。
接著熱壓第一積層物61。藉此使第一預浸體31熱硬化來製作第一絕緣層41。藉此製造如圖1B所示第二金屬箔22、第一絕緣層41及第一金屬箔21依序排列在第一方向上積層而成的雙面覆金屬積層板7。
熱壓方法可舉如利用多段真空壓機、雙帶式壓機、線軋輥之壓製或利用真空層合機之壓製等。熱壓時之最高加熱溫度依樹脂組成物之組成而定,譬如為160℃以上且340℃以下。又,熱壓時之加壓壓力譬如為0.5MPa以上且5MPa以下,加熱時間則譬如為1分鐘以上且240分鐘以下。
熱壓後將雙面覆金屬積層板7冷卻。宜將雙面覆金屬積層板7冷卻至常溫、即5~35℃之範圍內之溫度。此時,如上述於第一絕緣層41會產生得以往與第一方向正交之方向伸長的應力。
接著,僅對雙面覆金屬積層板7中之二個金屬箔中的第一金屬箔21施行配線形成處理來製作導體配線51。即,藉由去除一部分的第一金屬箔21來製作導體配線51。為此,譬如可採用光刻法。藉此製造如圖1C所示第二金屬箔22、第一絕緣層41及導體配線51依序排列在第一方向上積層而成的印刷配線板1。而於該印刷配線板1,如上述,第一絕緣層41內之應力會有部分被釋放而產生朝第一方向突出之翹曲。
接著從印刷配線板1製造多層印刷配線板10。為此,將第三金屬箔23預加熱後,如圖1D所示以在印刷配線板1之導體配線51與第三金屬箔23之間包夾第二預浸體32的方式將該等積層來製作第二積層物62。 第二預浸體32可為一片亦可為多片。即,在第二積層物62中,第二金屬箔22、第一絕緣層41、導體配線51、一片或多片第二預浸體32及第三金屬箔23係依序排列在第一方向上。
第三金屬箔23之預加熱譬如可使用烘箱進行,惟不受此限。宜藉由預加熱使第三金屬箔23為60℃以上且250℃以下之溫度。即,宜在第三金屬箔23之溫度為60℃以上且250℃以下之狀態下來製作第二積層物62。該溫度若為60℃以上,即可藉由製造多層印刷配線板10時產生之翹曲傾向來充分抵銷製造印刷配線板1時產生之翹曲傾向,而可有效地減緩多層印刷配線板10之翹曲。又,該溫度若為250℃以下,製造多層印刷配線板10時產生之翹曲傾向就不會變得太大。藉由預加熱使第三金屬箔23之溫度為70℃以上且230℃以下較佳。此時,尤其能減緩多層印刷配線板10之翹曲。
製作第二積層物62時,印刷配線板1及第二預浸體32宜為常溫。
接著熱壓第二積層物62。理想上係於製作第二積層物62後立刻將之熱壓。藉此使第二預浸體32熱硬化來製作第二絕緣層42。藉此可製造多層印刷配線板10。如圖1E所示,在多層印刷配線板10中,第二金屬箔22、第一絕緣層41、導體配線51、第二絕緣層42及第三金屬箔23係依序排列在第一方向上而積層。
熱壓方法可舉如利用多段真空壓機、雙帶式壓機、線軋輥之壓製或利用真空層合機之壓製等。熱壓時之最高加熱溫度依樹脂組成物之組成而定,譬如為160℃以上且340℃以下。又,熱壓時之加壓壓力譬如為0.5MPa以上且5MPa以下,加熱時間則譬如為1分鐘以上且240分鐘以下。
熱壓後將多層印刷配線板10冷卻。宜將多層印刷配線板10冷卻至常溫。
藉此可製造具備三層導體層之多層印刷配線板10。三層導體層包含一個導體配線51與二個金屬箔(第二金屬箔22及第三金屬箔23)。在該多層印刷配線板10如上述翹曲已獲減緩。
亦可對多層印刷配線板10中之第二金屬箔22及第三金屬箔23中任一者或二者施行配線形成處理,來製作導體配線。即,可藉由去除一部分的第二金屬箔22來製作導體配線,亦可藉由去除一部分的第三金屬箔23來製作導體配線。此時,可製造具備包含二個導體配線及一個金屬箔之三層導體層的多層印刷配線板10,或是具備包含三個導體配線之三層導體層的多層印刷配線板10。
利用公知方法將該具備三層導體層之多層印刷配線板10進一步多層化,還可製造譬如具備五層導體層之多層印刷配線板、具備七層導體層之多層印刷配線板等具備五層以上奇數層導體層的多層印刷配線板。另,亦可將多層印刷配線板10多層化來製造具備偶數層導體層的多層印刷配線板。具備三層導體層之多層印刷配線板10之翹曲已獲減緩,因此亦可減緩將之進一步多層化所得的多層印刷配線板之翹曲。 實施例
以下提出本發明具體的實施形態。另,本發明不限於僅以下實施例。 1.製造多層印刷配線板
準備作為第一金屬箔之銅箔、作為第二金屬箔之銅箔、作為第三金屬箔之銅箔、第一預浸體及第二預浸體。
第一金屬箔、第二金屬箔及第三金屬箔之厚度及線膨脹係數如下述表所示。
第一預浸體係以下列程序製作。將表中「第一預浸體用組成」一欄中所示成分混合,調製出熱硬化性樹脂組成物。將該熱硬化性樹脂組成物浸潤至纖維基材之旭化成股份有限公司製品名「1017布」(厚15μm)後,在140℃下將熱硬化性樹脂組成物加熱2分鐘而製出第一預浸體。相對於第一預浸體總量,熱硬化性樹脂組成物之乾燥物或半硬化物的百分比(樹脂含量)為70質量%。
第二預浸體係以下述製程製作。將表中「第二預浸體用組成」一欄中所示成分混合,調製出熱硬化性樹脂組成物。將該熱硬化性樹脂組成物浸潤至纖維基材之旭化成股份有限公司製品名「1017布」(厚15μm)後,在140℃下將熱硬化性樹脂組成物加熱2分鐘而製出第二預浸體。相對於第二預浸體總量,熱硬化性樹脂組成物之乾燥物或半硬化物的百分比(樹脂含量)為70質量%。
另,表中所示成分詳細如下。
多官能環氧樹脂:日本化藥股份有限公司製EPPN-502H。
酚系硬化劑:DIC股份有限公司製TD-209060M。
二氧化矽:股份有公司Admatechs製SC-2050MTX。
滑石:Nippon Talc Co.,Ltd.製D-800。
氫氧化鋁:住友化學股份有限公司製CL-303。
以在第一金屬箔與第二金屬箔之間包夾1片第一預浸體的方式,將該等積層來製作第一積層物。以表中「熱壓條件(第一次)」一欄中所載條件將該第一積層物熱壓,使第一預浸體熱硬化而製作出第一絕緣層後,冷卻至25℃。藉此製造雙面覆金屬積層板。
該雙面覆金屬積層板中之第一絕緣層之厚度及線膨脹係數如表中所示。
對該雙面覆銅積層板中之第一金屬箔施行蝕刻處理,去除一部分的第一金屬箔後製作出導體配線。藉此製造印刷配線板。
以烘箱將第三金屬箔預加熱至表中「預加熱溫度」一欄所載溫度後,立刻以在25℃之印刷配線板之導體配線與第三金屬箔之間包夾1片25℃之第二預浸體的方式,將該等積層而製作出第二積層物。另,「預加熱溫度」一欄以符號「-」表示時,係未將第三金屬箔預加熱,即以在25℃之印刷配線板之導體配線與25℃之第三金屬箔之間包夾1片25℃之第二預浸體的方式將該等積層而製出第二積層物。製作第二積層物後,立刻將第二積層物熱壓使第二預浸體熱硬化製作出第二絕緣層後再冷卻至常溫。藉此製造出多層印刷配線板。 2.評估
從多層印刷配線板裁切出俯視尺寸20cm×20cm之試樣。利用蝕刻將該試樣之兩面銅箔全部去除後,將該試樣在200℃下加熱1小時。
接著,將試樣配置在平坦的載台上,並在該狀態下測定試樣從載台凸起量之最大值。並以該測定值作為翹曲量。翹曲量係當試樣上出現朝第一方向突出之翹曲時以正值規定,出現朝與第一方向反向突出之翹曲時則以負值規定。其結果列於表1~4。
1‧‧‧印刷配線板10‧‧‧多層印刷配線板2‧‧‧金屬層21‧‧‧第一金屬箔22‧‧‧第二金屬箔23‧‧‧第三金屬箔31‧‧‧第一預浸體32‧‧‧第二預浸體41‧‧‧第一絕緣層42‧‧‧第二絕緣層51‧‧‧導體配線61‧‧‧第一積層物62‧‧‧第二積層物7‧‧‧雙面覆金屬積層板
圖1中,圖1A係顯示本發明一實施形態之多層印刷配線板之製造方法例的概略截面圖。圖1B係顯示本發明一實施形態之多層印刷配線板之製造方法例的概略截面圖。圖1C係顯示本發明一實施形態之多層印刷配線板之製造方法例的概略截面圖。圖1D係顯示本發明一實施形態之多層印刷配線板之製造方法例的概略截面圖。圖1E係顯示本發明一實施形態之多層印刷配線板之製造方法例的概略截面圖。
1‧‧‧印刷配線板
10‧‧‧多層印刷配線板
21‧‧‧第一金屬箔
22‧‧‧第二金屬箔
23‧‧‧第三金屬箔
31‧‧‧第一預浸體
32‧‧‧第二預浸體
41‧‧‧第一絕緣層
42‧‧‧第二絕緣層
51‧‧‧導體配線
61‧‧‧第一積層物
62‧‧‧第二積層物
7‧‧‧雙面覆金屬積層板
Claims (8)
- 一種多層印刷配線板之製造方法,係以在第一金屬箔與第二金屬箔之間包夾第一預浸體的方式將該等積層來製作第一積層物;將前述第一積層物熱壓使前述第一預浸體熱硬化來製作第一絕緣層,藉此製造依序積層前述第二金屬箔、前述第一絕緣層及前述第一金屬箔而成的雙面覆金屬積層板,其中前述第一絕緣層之線膨脹係數為5ppm/K以上且17ppm/K以下;自前述雙面覆金屬積層板去除一部分的前述第一金屬箔來製作導體配線,藉此製造依序積層前述第二金屬箔、前述第一絕緣層及前述導體配線而成的印刷配線板;以在前述印刷配線板之前述導體配線與第三金屬箔之間包夾第二預浸體的方式將該等積層來製作第二積層物;並將前述第二積層物熱壓使前述第二預浸體熱硬化來製作第二絕緣層;其中,前述第三金屬箔係預加熱後再積層至前述第二預浸體上;且,前述第一絕緣層之線膨脹係數分別比前述第一金屬箔及前述第二金屬箔之線膨脹係數更低。
- 如請求項1之多層印刷配線板之製造方法,其中前述第一絕緣層之厚度為50μm以下。
- 如請求項1或2之多層印刷配線板之製 造方法,其中前述第三金屬箔之厚度為0.002mm以上且0.035mm以下。
- 如請求項1或2之多層印刷配線板之製造方法,其中前述第二絕緣層之線膨脹係數比前述第三金屬箔之線膨脹係數更低。
- 如請求項1或2之多層印刷配線板之製造方法,其中前述第二絕緣層之線膨脹係數為5ppm/K以上且17ppm/K以下。
- 如請求項1或2之多層印刷配線板之製造方法,其中前述第一預浸體包含熱硬化性樹脂組成物與纖維基材;前述熱硬化性樹脂組成物含有無機充填材;且相對於前述熱硬化性樹脂組成物的量與前述纖維基材的量之合計,前述熱硬化性樹脂組成物中之無機充填材的量與前述纖維基材的量之合計為50質量%以上且85質量%以下。
- 如請求項1或2之多層印刷配線板之製造方法,其中前述多層印刷配線板之翹曲量大於-35mm且為2mm以下。
- 如請求項1或2之多層印刷配線板之製造方法,其係藉由預加熱使前述第三金屬箔為60℃以上且250℃以下之溫度。
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