JP7281745B2 - 多層プリント配線板の製造方法 - Google Patents
多層プリント配線板の製造方法 Download PDFInfo
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- JP7281745B2 JP7281745B2 JP2019532658A JP2019532658A JP7281745B2 JP 7281745 B2 JP7281745 B2 JP 7281745B2 JP 2019532658 A JP2019532658 A JP 2019532658A JP 2019532658 A JP2019532658 A JP 2019532658A JP 7281745 B2 JP7281745 B2 JP 7281745B2
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- wiring board
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- H—ELECTRICITY
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- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4673—Application methods or materials of intermediate insulating layers not specially adapted to any one of the previous methods of adding a circuit layer
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- B32B37/0007—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding involving treatment or provisions in order to avoid deformation or air inclusion, e.g. to improve surface quality
- B32B37/0015—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding involving treatment or provisions in order to avoid deformation or air inclusion, e.g. to improve surface quality to avoid warp or curl
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- B29C70/865—Incorporated in coherent impregnated reinforcing layers, e.g. by winding completely encapsulated
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- B29C70/882—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts characterised primarily by possessing specific properties, e.g. electrically conductive or locally reinforced partly or totally electrically conductive, e.g. for EMI shielding
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- H05K1/02—Details
- H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
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- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
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- H—ELECTRICITY
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
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- B29C70/28—Shaping operations therefor
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- Production Of Multi-Layered Print Wiring Board (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
Description
第一金属箔と第二金属箔との間に第一プリプレグが介在するようにこれらを積層することで第一積層物を作製し、
前記第一積層物を熱プレスすることで、前記第一プリプレグを熱硬化させて、第一絶縁層を作製し、これにより前記第二金属箔、前記第一絶縁層及び前記第一金属箔がこの順に積層した両面金属張積層板を製造し、
前記両面金属張積層板から前記第一金属箔の一部を除去することで導体配線を作製し、これにより前記第二金属箔、前記第一絶縁層及び前記導体配線がこの順に積層したプリント配線板を製造し、
前記プリント配線板の前記導体配線と第三金属箔との間に第二プリプレグが介在するようにこれらを積層することで第二積層物を作製し、
前記第二積層物を熱プレスすることで、前記第二プリプレグを熱硬化させて、第二絶縁層を作製することを含む。第三金属箔は、予備加熱してから前記第二プリプレグ上に積層される。前記第一絶縁層の線膨張係数は、前記第一金属箔及び前記第二金属箔の各々の線膨張係数より低い。
第一金属箔として銅箔、第二金属箔として銅箔、第三金属箔として銅箔、第一プリプレグ及び第二プリプレグを用意した。
・多官能エポキシ樹脂:日本化薬株式会社製、EPPN-502H。
・フェノール系硬化剤:DIC株式会社製、TD-209060M。
・シリカ:株式会社アドマテックス製、SC-2050MTX。
・タルク:日本タルク株式会社製、D-800。
・水酸化アルミニウム:住友化学株式会社製、CL-303。
多層プリント配線板から、平面視寸法20cm×20cmのサンプルを切り出した。このサンプルの両面の銅箔をエッチングによって全て除去してから、このサンプルを200℃で1時間加熱した。
10 多層プリント配線板
2 金属層
21 第一金属箔
22 第二金属箔
23 第三金属箔
31 第一プリプレグ
32 第二プリプレグ
41 第一絶縁層
42 第二絶縁層
51 導体配線
61 第一積層物
62 第二積層物
7 両面金属張積層板
Claims (9)
- 第一金属箔と第二金属箔との間に第一プリプレグが介在するようにこれらを積層することで第一積層物を作製し、
前記第一積層物を熱プレスすることで、前記第一プリプレグを熱硬化させて、第一絶縁層を作製し、これにより前記第二金属箔、前記第一絶縁層及び前記第一金属箔がこの順に積層し、かつ前記第一絶縁層の線膨張係数は、前記第一金属箔及び前記第二金属箔の各々の線膨張係数より低い、両面金属張積層板を製造し、
前記両面金属張積層板から前記第一金属箔の一部を除去することで導体配線を作製し、これにより前記第二金属箔、前記第一絶縁層及び前記導体配線がこの順に積層し、かつ第一方向に突出するように反ったプリント配線板を製造し、
前記プリント配線板、第二プリプレグ及び第三金属箔のうち、前記第三金属箔のみを予備加熱してから前記第二プリプレグ上に積層されるようにして、前記プリント配線板の前記導体配線と前記第三金属箔との間に前記第二プリプレグが介在するようにこれらを積層することで第二積層物を作製し、
前記第二積層物を予備加熱することなく熱プレスすることで、前記第二プリプレグを熱硬化させて、第二絶縁層を作製することで、前記プリント配線板よりも平坦に近づき又は前記第一方向とは逆方向に突出するような反りが生じている多層プリント配線板を製造する、多層プリント配線板の製造方法。 - 前記第一絶縁層の厚みは、50μm以下である、
請求項1に記載の多層プリント配線板の製造方法。 - 前記第一絶縁層の線膨張係数は、5ppm/K以上17ppm/K以下である、
請求項1又は2に記載の多層プリント配線板の製造方法。 - 前記第三金属箔の厚みは0.002mm以上0.035mm以下である、
請求項1から3のいずれか一項に記載の多層プリント配線板の製造方法。 - 前記第二絶縁層の線膨張係数は、前記第三金属箔の線膨張係数より低い、
請求項1から4のいずれか一項に記載の多層プリント配線板の製造方法。 - 前記第二絶縁層の線膨張係数は、5ppm/K以上17ppm/K以下である、
請求項1から5のいずれか一項に記載の多層プリント配線板の製造方法。 - 前記第一プリプレグは、熱硬化性樹脂組成物と繊維基材とを含み、
前記熱硬化性樹脂組成物は無機充填材を含有し、
前記熱硬化性樹脂組成物中の無機充填材の量と、前記繊維基材の量との合計は、前記熱硬化性樹脂組成物の量と前記繊維基材の量との合計に対して、50質量%以上85質量%以下である、
請求項1から6のいずれか一項に記載の多層プリント配線板の製造方法。 - 前記多層プリント配線板の反り量は、-35mmより大きく2mm以下である、
請求項1から7のいずれか一項に記載の多層プリント配線板の製造方法。 - 前記第三金属箔を予備加熱により60℃以上250℃以下の温度にする、
請求項1から8のいずれか一項に記載の多層プリント配線板の製造方法。
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