TWI772520B - 半導體製程用片材及半導體封裝之製造方法 - Google Patents
半導體製程用片材及半導體封裝之製造方法 Download PDFInfo
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- TWI772520B TWI772520B TW107132378A TW107132378A TWI772520B TW I772520 B TWI772520 B TW I772520B TW 107132378 A TW107132378 A TW 107132378A TW 107132378 A TW107132378 A TW 107132378A TW I772520 B TWI772520 B TW I772520B
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Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/93—Batch processes
- H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L24/96—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being encapsulated in a common layer, e.g. neo-wafer or pseudo-wafer, said common layer being separable into individual assemblies after connecting
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/52—Mounting semiconductor bodies in containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
- H01L2224/12105—Bump connectors formed on an encapsulation of the semiconductor or solid-state body, e.g. bumps on chip-scale packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
- H01L2224/20—Structure, shape, material or disposition of high density interconnect preforms
- H01L2224/21—Structure, shape, material or disposition of high density interconnect preforms of an individual HDI interconnect
- H01L2224/214—Connecting portions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/93—Batch processes
- H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L2224/96—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being encapsulated in a common layer, e.g. neo-wafer or pseudo-wafer, said common layer being separable into individual assemblies after connecting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
- H01L2924/1815—Shape
- H01L2924/1816—Exposing the passive side of the semiconductor or solid-state body
- H01L2924/18162—Exposing the passive side of the semiconductor or solid-state body of a chip with build-up interconnect
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Adhesive Tapes (AREA)
- Dicing (AREA)
- Laminated Bodies (AREA)
- Die Bonding (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Control And Other Processes For Unpacking Of Materials (AREA)
Applications Claiming Priority (2)
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JP2017-220856 | 2017-11-16 | ||
JP2017220856A JP7095978B2 (ja) | 2017-11-16 | 2017-11-16 | 半導体プロセスシートおよび半導体パッケージ製造方法 |
Publications (2)
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TW201923995A TW201923995A (zh) | 2019-06-16 |
TWI772520B true TWI772520B (zh) | 2022-08-01 |
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TW107132378A TWI772520B (zh) | 2017-11-16 | 2018-09-14 | 半導體製程用片材及半導體封裝之製造方法 |
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JP (1) | JP7095978B2 (ja) |
KR (1) | KR102600254B1 (ja) |
CN (1) | CN111344845A (ja) |
TW (1) | TWI772520B (ja) |
WO (1) | WO2019097819A1 (ja) |
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US11538787B2 (en) * | 2020-10-30 | 2022-12-27 | Advanced Semiconductor Engineering, Inc. | Method and system for manufacturing a semiconductor package structure |
JP7447035B2 (ja) * | 2021-02-25 | 2024-03-11 | 日東電工株式会社 | 光半導体素子封止用シート |
JP2022170157A (ja) | 2021-04-28 | 2022-11-10 | 日東電工株式会社 | 熱硬化性樹脂組成物、熱硬化性シート、及び、半導体チップ被覆部材 |
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JP2005028734A (ja) * | 2003-07-11 | 2005-02-03 | Nitto Denko Corp | 積層シート |
TW201441354A (zh) * | 2013-03-27 | 2014-11-01 | Furukawa Electric Co Ltd | 有機電子裝置用元件密封用樹脂組成物、有機電子裝置用元件密封用樹脂薄片、有機電致發光元件、及畫面顯示裝置 |
TW201531549A (zh) * | 2013-10-30 | 2015-08-16 | Lintec Corp | 半導體接合用接著片及半導體裝置的製造方法 |
JP2017092335A (ja) * | 2015-11-13 | 2017-05-25 | 日東電工株式会社 | 半導体パッケージの製造方法 |
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JP3346320B2 (ja) | 1999-02-03 | 2002-11-18 | カシオ計算機株式会社 | 半導体装置及びその製造方法 |
JP2001313350A (ja) * | 2000-04-28 | 2001-11-09 | Sony Corp | チップ状電子部品及びその製造方法、並びにその製造に用いる疑似ウエーハ及びその製造方法 |
JP4155999B2 (ja) * | 2006-06-02 | 2008-09-24 | 株式会社ソニー・コンピュータエンタテインメント | 半導体装置および半導体装置の製造方法 |
US8258624B2 (en) | 2007-08-10 | 2012-09-04 | Intel Mobile Communications GmbH | Method for fabricating a semiconductor and semiconductor package |
JP5224111B2 (ja) | 2008-08-29 | 2013-07-03 | 日立化成株式会社 | 半導体ウェハ加工用接着フィルム |
US20110198762A1 (en) | 2010-02-16 | 2011-08-18 | Deca Technologies Inc. | Panelized packaging with transferred dielectric |
JP2012227441A (ja) | 2011-04-21 | 2012-11-15 | Sumitomo Bakelite Co Ltd | 半導体装置の製造方法および半導体装置 |
JP2013074184A (ja) * | 2011-09-28 | 2013-04-22 | Nitto Denko Corp | 半導体装置の製造方法 |
JP5837381B2 (ja) * | 2011-09-28 | 2015-12-24 | 日東電工株式会社 | 半導体装置の製造方法 |
CN103137501A (zh) * | 2011-11-28 | 2013-06-05 | 日东电工株式会社 | 半导体装置的制造方法 |
JP2013157470A (ja) | 2012-01-30 | 2013-08-15 | Sekisui Chem Co Ltd | 半導体部品の製造方法 |
KR20130103950A (ko) * | 2012-03-12 | 2013-09-25 | 닛토덴코 가부시키가이샤 | 반도체 장치 제조용 내열성 점착 테이프 및 그 테이프를 사용한 반도체 장치의 제조 방법 |
KR20130103947A (ko) * | 2012-03-12 | 2013-09-25 | 닛토덴코 가부시키가이샤 | 반도체 장치 제조용 내열성 점착 테이프 및 그 테이프를 사용한 반도체 장치의 제조 방법 |
JP6167612B2 (ja) | 2013-03-29 | 2017-07-26 | 住友ベークライト株式会社 | 接着シートおよび電子部品 |
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-
2017
- 2017-11-16 JP JP2017220856A patent/JP7095978B2/ja active Active
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2018
- 2018-09-05 CN CN201880074101.XA patent/CN111344845A/zh not_active Withdrawn
- 2018-09-05 WO PCT/JP2018/032933 patent/WO2019097819A1/ja active Application Filing
- 2018-09-05 KR KR1020207016537A patent/KR102600254B1/ko active IP Right Grant
- 2018-09-14 TW TW107132378A patent/TWI772520B/zh active
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JP2005028734A (ja) * | 2003-07-11 | 2005-02-03 | Nitto Denko Corp | 積層シート |
TW201441354A (zh) * | 2013-03-27 | 2014-11-01 | Furukawa Electric Co Ltd | 有機電子裝置用元件密封用樹脂組成物、有機電子裝置用元件密封用樹脂薄片、有機電致發光元件、及畫面顯示裝置 |
TW201531549A (zh) * | 2013-10-30 | 2015-08-16 | Lintec Corp | 半導體接合用接著片及半導體裝置的製造方法 |
JP2017092335A (ja) * | 2015-11-13 | 2017-05-25 | 日東電工株式会社 | 半導体パッケージの製造方法 |
Also Published As
Publication number | Publication date |
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WO2019097819A1 (ja) | 2019-05-23 |
JP7095978B2 (ja) | 2022-07-05 |
TW201923995A (zh) | 2019-06-16 |
JP2019091845A (ja) | 2019-06-13 |
KR102600254B1 (ko) | 2023-11-08 |
KR20200085842A (ko) | 2020-07-15 |
CN111344845A (zh) | 2020-06-26 |
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