CN111344845A - 半导体工艺片及半导体封装体制造方法 - Google Patents

半导体工艺片及半导体封装体制造方法 Download PDF

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Publication number
CN111344845A
CN111344845A CN201880074101.XA CN201880074101A CN111344845A CN 111344845 A CN111344845 A CN 111344845A CN 201880074101 A CN201880074101 A CN 201880074101A CN 111344845 A CN111344845 A CN 111344845A
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CN
China
Prior art keywords
semiconductor
adhesive
chip
layer
sealing material
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
CN201880074101.XA
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English (en)
Chinese (zh)
Inventor
志贺豪士
佐藤慧
高本尚英
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Nitto Denko Corp
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Nitto Denko Corp
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Filing date
Publication date
Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp
Publication of CN111344845A publication Critical patent/CN111344845A/zh
Withdrawn legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/52—Mounting semiconductor bodies in containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/93—Batch processes
    • H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L24/96—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being encapsulated in a common layer, e.g. neo-wafer or pseudo-wafer, said common layer being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L2224/12105—Bump connectors formed on an encapsulation of the semiconductor or solid-state body, e.g. bumps on chip-scale packages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
    • H01L2224/20—Structure, shape, material or disposition of high density interconnect preforms
    • H01L2224/21—Structure, shape, material or disposition of high density interconnect preforms of an individual HDI interconnect
    • H01L2224/214—Connecting portions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/93—Batch processes
    • H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L2224/96—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being encapsulated in a common layer, e.g. neo-wafer or pseudo-wafer, said common layer being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H01L2924/1815—Shape
    • H01L2924/1816—Exposing the passive side of the semiconductor or solid-state body
    • H01L2924/18162—Exposing the passive side of the semiconductor or solid-state body of a chip with build-up interconnect

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Adhesive Tapes (AREA)
  • Dicing (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Laminated Bodies (AREA)
  • Die Bonding (AREA)
  • Control And Other Processes For Unpacking Of Materials (AREA)
CN201880074101.XA 2017-11-16 2018-09-05 半导体工艺片及半导体封装体制造方法 Withdrawn CN111344845A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2017-220856 2017-11-16
JP2017220856A JP7095978B2 (ja) 2017-11-16 2017-11-16 半導体プロセスシートおよび半導体パッケージ製造方法
PCT/JP2018/032933 WO2019097819A1 (ja) 2017-11-16 2018-09-05 半導体プロセスシートおよび半導体パッケージ製造方法

Publications (1)

Publication Number Publication Date
CN111344845A true CN111344845A (zh) 2020-06-26

Family

ID=66538976

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201880074101.XA Withdrawn CN111344845A (zh) 2017-11-16 2018-09-05 半导体工艺片及半导体封装体制造方法

Country Status (5)

Country Link
JP (1) JP7095978B2 (ja)
KR (1) KR102600254B1 (ja)
CN (1) CN111344845A (ja)
TW (1) TWI772520B (ja)
WO (1) WO2019097819A1 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114958226A (zh) * 2021-02-25 2022-08-30 日东电工株式会社 光半导体元件密封用片

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11538787B2 (en) * 2020-10-30 2022-12-27 Advanced Semiconductor Engineering, Inc. Method and system for manufacturing a semiconductor package structure
JP2022170157A (ja) 2021-04-28 2022-11-10 日東電工株式会社 熱硬化性樹脂組成物、熱硬化性シート、及び、半導体チップ被覆部材

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1264173A (zh) * 1999-02-03 2000-08-23 卡西欧计算机株式会社 半导体装置及制做方法
JP2005028734A (ja) * 2003-07-11 2005-02-03 Nitto Denko Corp 積層シート
CN101083235A (zh) * 2006-06-02 2007-12-05 索尼株式会社 半导体装置及半导体装置的制造方法
CN103137501A (zh) * 2011-11-28 2013-06-05 日东电工株式会社 半导体装置的制造方法
JP2013157470A (ja) * 2012-01-30 2013-08-15 Sekisui Chem Co Ltd 半導体部品の製造方法
CN104733400A (zh) * 2013-12-24 2015-06-24 日东电工株式会社 切割/芯片接合薄膜、半导体装置的制造方法以及半导体装置
US20160035667A1 (en) * 2014-07-30 2016-02-04 Taiwan Semiconductor Manufacturing Company, Ltd. Methods of Packaging Semiconductor Devices and Packaged Semiconductor Devices
CN107017173A (zh) * 2015-11-13 2017-08-04 日东电工株式会社 半导体封装体的制造方法

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001313350A (ja) * 2000-04-28 2001-11-09 Sony Corp チップ状電子部品及びその製造方法、並びにその製造に用いる疑似ウエーハ及びその製造方法
US8258624B2 (en) 2007-08-10 2012-09-04 Intel Mobile Communications GmbH Method for fabricating a semiconductor and semiconductor package
JP5224111B2 (ja) 2008-08-29 2013-07-03 日立化成株式会社 半導体ウェハ加工用接着フィルム
US20110198762A1 (en) 2010-02-16 2011-08-18 Deca Technologies Inc. Panelized packaging with transferred dielectric
JP2012227441A (ja) 2011-04-21 2012-11-15 Sumitomo Bakelite Co Ltd 半導体装置の製造方法および半導体装置
JP5837381B2 (ja) * 2011-09-28 2015-12-24 日東電工株式会社 半導体装置の製造方法
JP2013074184A (ja) * 2011-09-28 2013-04-22 Nitto Denko Corp 半導体装置の製造方法
KR20130103950A (ko) * 2012-03-12 2013-09-25 닛토덴코 가부시키가이샤 반도체 장치 제조용 내열성 점착 테이프 및 그 테이프를 사용한 반도체 장치의 제조 방법
KR20130103947A (ko) * 2012-03-12 2013-09-25 닛토덴코 가부시키가이샤 반도체 장치 제조용 내열성 점착 테이프 및 그 테이프를 사용한 반도체 장치의 제조 방법
JPWO2014156324A1 (ja) * 2013-03-27 2017-02-16 古河電気工業株式会社 有機電子デバイス用素子封止用樹脂組成物、有機電子デバイス用素子封止用樹脂シート、有機エレクトロルミネッセンス素子、及び画像表示装置
JP6167612B2 (ja) 2013-03-29 2017-07-26 住友ベークライト株式会社 接着シートおよび電子部品
JPWO2015064574A1 (ja) * 2013-10-30 2017-03-09 リンテック株式会社 半導体接合用接着シートおよび半導体装置の製造方法
JP2015126124A (ja) 2013-12-26 2015-07-06 日東電工株式会社 半導体パッケージの製造方法
JP6530213B2 (ja) * 2014-07-22 2019-06-12 日東電工株式会社 シート状樹脂組成物、裏面研削用テープ一体型シート状樹脂組成物、及び、半導体装置の製造方法
US9281286B1 (en) 2014-08-27 2016-03-08 Freescale Semiconductor Inc. Microelectronic packages having texturized solder pads and methods for the fabrication thereof
JP2017088782A (ja) 2015-11-13 2017-05-25 日東電工株式会社 積層体および合同体・組み合わせの回収方法・半導体装置の製造方法

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1264173A (zh) * 1999-02-03 2000-08-23 卡西欧计算机株式会社 半导体装置及制做方法
JP2005028734A (ja) * 2003-07-11 2005-02-03 Nitto Denko Corp 積層シート
CN1577821A (zh) * 2003-07-11 2005-02-09 日东电工株式会社 层压片
CN101083235A (zh) * 2006-06-02 2007-12-05 索尼株式会社 半导体装置及半导体装置的制造方法
CN103137501A (zh) * 2011-11-28 2013-06-05 日东电工株式会社 半导体装置的制造方法
JP2013157470A (ja) * 2012-01-30 2013-08-15 Sekisui Chem Co Ltd 半導体部品の製造方法
CN104733400A (zh) * 2013-12-24 2015-06-24 日东电工株式会社 切割/芯片接合薄膜、半导体装置的制造方法以及半导体装置
US20160035667A1 (en) * 2014-07-30 2016-02-04 Taiwan Semiconductor Manufacturing Company, Ltd. Methods of Packaging Semiconductor Devices and Packaged Semiconductor Devices
CN107017173A (zh) * 2015-11-13 2017-08-04 日东电工株式会社 半导体封装体的制造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114958226A (zh) * 2021-02-25 2022-08-30 日东电工株式会社 光半导体元件密封用片

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Publication number Publication date
KR20200085842A (ko) 2020-07-15
TW201923995A (zh) 2019-06-16
KR102600254B1 (ko) 2023-11-08
WO2019097819A1 (ja) 2019-05-23
JP7095978B2 (ja) 2022-07-05
TWI772520B (zh) 2022-08-01
JP2019091845A (ja) 2019-06-13

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