TWI766908B - 載置台及電漿處理裝置 - Google Patents

載置台及電漿處理裝置 Download PDF

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Publication number
TWI766908B
TWI766908B TW106142478A TW106142478A TWI766908B TW I766908 B TWI766908 B TW I766908B TW 106142478 A TW106142478 A TW 106142478A TW 106142478 A TW106142478 A TW 106142478A TW I766908 B TWI766908 B TW I766908B
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TW
Taiwan
Prior art keywords
base
focus ring
hole
mounting table
heat transfer
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TW106142478A
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English (en)
Chinese (zh)
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TW201833985A (zh
Inventor
上田雄大
Original Assignee
日商東京威力科創股份有限公司
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Publication of TW201833985A publication Critical patent/TW201833985A/zh
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Publication of TWI766908B publication Critical patent/TWI766908B/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32623—Mechanical discharge control means
    • H01J37/32642—Focus rings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/02—Details
    • H01J37/20—Means for supporting or positioning the object or the material; Means for adjusting diaphragms or lenses associated with the support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32458—Vessel
    • H01J37/32522—Temperature
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32715—Workpiece holder
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32715—Workpiece holder
    • H01J37/32724—Temperature
    • H10P72/00—
    • H10P72/0432—
    • H10P72/70—
    • H10P72/722—
    • H10P72/76—
    • H10P72/7606—
    • H10P72/7612—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/002—Cooling arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/32—Processing objects by plasma generation
    • H01J2237/33—Processing objects by plasma generation characterised by the type of processing
    • H01J2237/334—Etching
    • H01J2237/3343—Problems associated with etching
    • H01J2237/3344—Problems associated with etching isotropy
    • H10P72/0421—

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Plasma & Fusion (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Drying Of Semiconductors (AREA)
  • Plasma Technology (AREA)
  • Treatment Of Fiber Materials (AREA)
TW106142478A 2016-12-08 2017-12-05 載置台及電漿處理裝置 TWI766908B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016-238399 2016-12-08
JP2016238399A JP6812224B2 (ja) 2016-12-08 2016-12-08 基板処理装置及び載置台

Publications (2)

Publication Number Publication Date
TW201833985A TW201833985A (zh) 2018-09-16
TWI766908B true TWI766908B (zh) 2022-06-11

Family

ID=62489671

Family Applications (1)

Application Number Title Priority Date Filing Date
TW106142478A TWI766908B (zh) 2016-12-08 2017-12-05 載置台及電漿處理裝置

Country Status (5)

Country Link
US (1) US20180166259A1 (enExample)
JP (1) JP6812224B2 (enExample)
KR (1) KR102432446B1 (enExample)
CN (1) CN108183058B (enExample)
TW (1) TWI766908B (enExample)

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CN109192696B (zh) * 2018-08-10 2021-06-08 北京北方华创微电子装备有限公司 升降针系统、真空反应腔室以及半导体加工设备
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JP7105666B2 (ja) * 2018-09-26 2022-07-25 東京エレクトロン株式会社 プラズマ処理装置
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US11289310B2 (en) 2018-11-21 2022-03-29 Applied Materials, Inc. Circuits for edge ring control in shaped DC pulsed plasma process device
JP7134104B2 (ja) * 2019-01-09 2022-09-09 東京エレクトロン株式会社 プラズマ処理装置およびプラズマ処理装置の載置台
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JP7465733B2 (ja) * 2019-09-26 2024-04-11 東京エレクトロン株式会社 基板支持器及びプラズマ処理装置
KR102747645B1 (ko) 2019-10-10 2024-12-27 삼성전자주식회사 정전 척 및 상기 정전 척을 포함하는 기판 처리 장치
CN112750675A (zh) * 2019-10-30 2021-05-04 中芯国际集成电路制造(上海)有限公司 等离子体刻蚀装置及其初始化系统和初始化方法
KR102757512B1 (ko) * 2019-11-25 2025-01-20 삼성전자주식회사 리프트 장치 및 이를 포함하는 기판 처리 장치
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JP7441711B2 (ja) * 2020-04-13 2024-03-01 東京エレクトロン株式会社 基板支持台、プラズマ処理システム及びエッジリングの載置方法
KR102615216B1 (ko) * 2020-05-15 2023-12-15 세메스 주식회사 정전 척, 기판 처리 장치 및 기판 처리 방법
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CN114530361B (zh) * 2020-11-23 2024-08-06 中微半导体设备(上海)股份有限公司 下电极组件、等离子体处理装置和更换聚焦环的方法
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Also Published As

Publication number Publication date
CN108183058B (zh) 2020-03-10
KR102432446B1 (ko) 2022-08-16
CN108183058A (zh) 2018-06-19
US20180166259A1 (en) 2018-06-14
TW201833985A (zh) 2018-09-16
JP6812224B2 (ja) 2021-01-13
KR20180065932A (ko) 2018-06-18
JP2018098239A (ja) 2018-06-21

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