TWI760393B - 異向性導電膜、連接構造體及連接構造體之製造方法 - Google Patents

異向性導電膜、連接構造體及連接構造體之製造方法 Download PDF

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TWI760393B
TWI760393B TW106142174A TW106142174A TWI760393B TW I760393 B TWI760393 B TW I760393B TW 106142174 A TW106142174 A TW 106142174A TW 106142174 A TW106142174 A TW 106142174A TW I760393 B TWI760393 B TW I760393B
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Taiwan
Prior art keywords
conductive particles
hardness
resin layer
insulating resin
anisotropic conductive
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TW106142174A
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English (en)
Chinese (zh)
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TW201833944A (zh
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江島康二
平山堅一
尾怜司
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日商迪睿合股份有限公司
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/14—Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/16—Non-insulated conductors or conductive bodies characterised by their form comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
    • H01R11/01—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between the connecting locations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/59—Fixed connections for flexible printed circuits, flat or ribbon cables or like structures
    • H01R12/61—Fixed connections for flexible printed circuits, flat or ribbon cables or like structures connecting to flexible printed circuits, flat or ribbon cables or like structures
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/013—Manufacture or treatment of die-attach connectors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09945—Universal aspects, e.g. universal inner layers or via grid, or anisotropic interposer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0278—Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/251—Organics
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/257—Arrangements for cooling characterised by their materials having a heterogeneous or anisotropic structure, e.g. powder or fibres in a matrix, wire mesh or porous structures
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07231—Techniques
    • H10W72/07232—Compression bonding, e.g. thermocompression bonding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07332—Compression bonding, e.g. thermocompression bonding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/074—Connecting or disconnecting of anisotropic conductive adhesives
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/241—Dispositions, e.g. layouts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/251—Materials
    • H10W72/252—Materials comprising solid metals or solid metalloids, e.g. PbSn, Ag or Cu
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/261—Functions other than electrical connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/321—Structures or relative sizes of die-attach connectors
    • H10W72/322—Multilayered die-attach connectors, e.g. a coating on a top surface of a core
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/321—Structures or relative sizes of die-attach connectors
    • H10W72/325—Die-attach connectors having a filler embedded in a matrix
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/352—Materials of die-attach connectors comprising metals or metalloids, e.g. solders
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/353—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/353—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics
    • H10W72/354—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics comprising polymers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/15—Encapsulations, e.g. protective coatings characterised by their shape or disposition on active surfaces of flip-chip devices, e.g. underfills
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL

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  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Non-Insulated Conductors (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Conductive Materials (AREA)
TW106142174A 2016-12-01 2017-12-01 異向性導電膜、連接構造體及連接構造體之製造方法 TWI760393B (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JPJP2016-233715 2016-12-01
JP2016233715 2016-12-01
JP2017160655A JP7039883B2 (ja) 2016-12-01 2017-08-23 異方性導電フィルム
JPJP2017-160655 2017-08-23

Publications (2)

Publication Number Publication Date
TW201833944A TW201833944A (zh) 2018-09-16
TWI760393B true TWI760393B (zh) 2022-04-11

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TW106142174A TWI760393B (zh) 2016-12-01 2017-12-01 異向性導電膜、連接構造體及連接構造體之製造方法

Country Status (5)

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US (1) US10985128B2 (https=)
JP (1) JP7039883B2 (https=)
KR (1) KR102250339B1 (https=)
CN (1) CN109983629B (https=)
TW (1) TWI760393B (https=)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7330768B2 (ja) * 2018-06-06 2023-08-22 デクセリアルズ株式会社 接続体の製造方法、接続方法
JP2020095922A (ja) * 2018-12-14 2020-06-18 デクセリアルズ株式会社 異方性導電フィルム
CN112562886A (zh) * 2019-09-10 2021-03-26 南昌欧菲生物识别技术有限公司 异方性导电膜及其制备方法、邦定结构和超声波生物识别装置
US20230163489A1 (en) * 2020-03-04 2023-05-25 Showa Denko Materials Co., Ltd. Adhesive film and reel body
WO2025134747A1 (ja) * 2023-12-22 2025-06-26 株式会社レゾナック 回路接続用接着剤フィルム、接続構造体の製造方法、導電材料、及び接続構造体

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004045027A1 (en) * 2002-11-07 2004-05-27 3M Innovative Properties Company Anisotropic conductive adhesive and film
TWI550652B (zh) * 2012-08-01 2016-09-21 迪睿合股份有限公司 An anisotropic conductive film, an anisotropic conductive film, and a connecting structure

Family Cites Families (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4646764A (en) * 1985-12-16 1987-03-03 R. J. Reynolds Tobacco Company Process for providing roll reconstituted tobacco material
JP3644884B2 (ja) * 1999-10-25 2005-05-11 古河電気工業株式会社 遮光シャッター付きアダプタおよび遮光シャッター付き光モジュールレセプタクル
EP1628363B1 (en) * 2003-06-25 2009-12-16 Hitachi Chemical Company, Ltd. Circuit member connecting structure and method of producing the same
FR2866329B1 (fr) * 2004-02-12 2006-06-02 Saint Gobain Vetrotex Fils de verre conducteurs de l'electricite et structures comprenant de tels fils.
CN101142715B (zh) * 2005-03-15 2012-08-22 株式会社半导体能源研究所 半导体器件以及具有该半导体器件的电子器件
JP4962706B2 (ja) * 2006-09-29 2012-06-27 日本化学工業株式会社 導電性粒子およびその製造方法
JP5217640B2 (ja) * 2008-05-30 2013-06-19 富士通株式会社 プリント配線板の製造方法およびプリント基板ユニットの製造方法
US20100139747A1 (en) * 2008-08-28 2010-06-10 The Penn State Research Foundation Single-crystal nanowires and liquid junction solar cells
KR101056435B1 (ko) * 2009-10-05 2011-08-11 삼성모바일디스플레이주식회사 이방성 도전 필름 및 이를 포함하는 표시 장치
JP5833809B2 (ja) * 2010-02-01 2015-12-16 デクセリアルズ株式会社 異方性導電フィルム、接合体及び接続方法
JP2012164454A (ja) 2011-02-04 2012-08-30 Sony Chemical & Information Device Corp 導電性粒子及びこれを用いた異方性導電材料
KR101375298B1 (ko) 2011-12-20 2014-03-19 제일모직주식회사 전도성 미립자 및 이를 포함하는 이방 전도성 필름
JP6209313B2 (ja) 2012-02-20 2017-10-04 デクセリアルズ株式会社 異方性導電フィルム、接続構造体、接続構造体の製造方法及び接続方法
JP2013182823A (ja) 2012-03-02 2013-09-12 Dexerials Corp 接続体の製造方法、及び異方性導電接着剤
KR101716945B1 (ko) * 2012-08-24 2017-03-15 데쿠세리아루즈 가부시키가이샤 이방성 도전 필름 및 그의 제조 방법
JP5972844B2 (ja) * 2012-09-18 2016-08-17 デクセリアルズ株式会社 異方性導電フィルム、異方性導電フィルムの製造方法、接続体の製造方法、及び接続方法
KR101594484B1 (ko) * 2012-11-20 2016-02-16 제일모직주식회사 이방성 도전 필름 및 반도체 장치
KR101551758B1 (ko) * 2012-12-11 2015-09-09 제일모직주식회사 이방 도전성 필름용 조성물 및 이방 도전성 필름
KR101554617B1 (ko) * 2013-01-25 2015-09-21 제일모직주식회사 이방성 도전 필름 및 반도체 장치
KR20140109102A (ko) * 2013-03-05 2014-09-15 삼성디스플레이 주식회사 이방성도전필름 및 이를 갖는 표시장치
KR101628440B1 (ko) * 2013-10-31 2016-06-08 제일모직주식회사 이방성 도전 필름 및 이를 이용한 반도체 장치
US20170110806A1 (en) * 2014-03-20 2017-04-20 Dexerials Corporation Anisotropic conductive film and production method of the same
KR102430609B1 (ko) 2014-03-31 2022-08-08 데쿠세리아루즈 가부시키가이샤 이방성 도전 필름 및 그 제조 방법
JP6523794B2 (ja) * 2014-06-06 2019-06-05 積水化学工業株式会社 導電材料及び接続構造体
JP2016089153A (ja) 2014-10-29 2016-05-23 デクセリアルズ株式会社 導電材料
KR102332272B1 (ko) * 2014-11-18 2021-12-01 삼성디스플레이 주식회사 이방성 도전 필름 및 이를 갖는 표시장치
WO2017154978A1 (ja) * 2016-03-09 2017-09-14 東洋紡株式会社 伸縮性導体シート及び伸縮性導体シート形成用ペースト
CN109690543B (zh) * 2016-09-26 2021-04-09 华为技术有限公司 安全认证方法、集成电路及系统
JP6187665B1 (ja) 2016-10-18 2017-08-30 デクセリアルズ株式会社 異方性導電フィルム

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004045027A1 (en) * 2002-11-07 2004-05-27 3M Innovative Properties Company Anisotropic conductive adhesive and film
TWI550652B (zh) * 2012-08-01 2016-09-21 迪睿合股份有限公司 An anisotropic conductive film, an anisotropic conductive film, and a connecting structure

Also Published As

Publication number Publication date
KR20190065438A (ko) 2019-06-11
CN109983629A (zh) 2019-07-05
US20190304943A1 (en) 2019-10-03
US10985128B2 (en) 2021-04-20
CN109983629B (zh) 2020-12-08
KR102250339B1 (ko) 2021-05-10
JP7039883B2 (ja) 2022-03-23
JP2018092895A (ja) 2018-06-14
TW201833944A (zh) 2018-09-16

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