TWI756625B - 基板處理裝置及其搬送控制方法 - Google Patents

基板處理裝置及其搬送控制方法 Download PDF

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Publication number
TWI756625B
TWI756625B TW109103629A TW109103629A TWI756625B TW I756625 B TWI756625 B TW I756625B TW 109103629 A TW109103629 A TW 109103629A TW 109103629 A TW109103629 A TW 109103629A TW I756625 B TWI756625 B TW I756625B
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Taiwan
Prior art keywords
substrate
processing
liquid
processing unit
liquid film
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TW109103629A
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English (en)
Chinese (zh)
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TW202040637A (zh
Inventor
河原啓之
橋本光治
菊本憲幸
墨周武
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日商斯庫林集團股份有限公司
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67745—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber characterized by movements or sequence of movements of transfer devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J11/00—Manipulators not otherwise provided for
    • B25J11/0095—Manipulators transporting wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J19/00—Accessories fitted to manipulators, e.g. for monitoring, for viewing; Safety devices combined with or specially adapted for use in connection with manipulators
    • B25J19/02—Sensing devices
    • B25J19/021—Optical sensing devices
    • B25J19/023—Optical sensing devices including video camera means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Programme-controlled manipulators
    • B25J9/16—Programme controls
    • B25J9/1679—Programme controls characterised by the tasks executed
    • B25J9/1692—Calibration of manipulator
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Mechanical Engineering (AREA)
  • Multimedia (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Weting (AREA)
TW109103629A 2019-03-26 2020-02-06 基板處理裝置及其搬送控制方法 TWI756625B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019-058734 2019-03-26
JP2019058734A JP7261052B2 (ja) 2019-03-26 2019-03-26 基板処理装置およびその搬送制御方法

Publications (2)

Publication Number Publication Date
TW202040637A TW202040637A (zh) 2020-11-01
TWI756625B true TWI756625B (zh) 2022-03-01

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TW109103629A TWI756625B (zh) 2019-03-26 2020-02-06 基板處理裝置及其搬送控制方法

Country Status (5)

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JP (1) JP7261052B2 (ja)
KR (2) KR20240027875A (ja)
CN (1) CN113557591A (ja)
TW (1) TWI756625B (ja)
WO (1) WO2020195175A1 (ja)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102571748B1 (ko) * 2021-05-04 2023-08-25 세메스 주식회사 기판 처리 장치 및 방법
KR102553643B1 (ko) * 2021-05-17 2023-07-13 세메스 주식회사 기판 처리 장치 및 기판 반송로봇
KR102640371B1 (ko) * 2021-09-03 2024-02-27 엘에스이 주식회사 기판 이송 장치

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20120064727A1 (en) * 2010-09-15 2012-03-15 Samsung Electronics Co., Ltd. Substrate treatment equipment and method of treating substrate using the same
TW201250776A (en) * 2011-04-06 2012-12-16 Tokyo Electron Ltd Substrate processing apparatus, substrate processing method, and computer-readable recording medium having program for executing the substrate processing method recorded therein
TW201324659A (zh) * 2011-11-21 2013-06-16 Tokyo Electron Ltd 基板處理裝置、基板處理方法、及記憶有基板處理程式之電腦可讀取記憶媒體
TW201522952A (zh) * 2013-11-07 2015-06-16 Tokyo Electron Ltd 基板之缺陷結構分析裝置、基板處理系統、基板之缺陷結構分析方法、程式及電腦記錄媒體
TW201601845A (zh) * 2014-06-25 2016-01-16 斯克林集團公司 基板處理裝置、治具、及教導方法
US20170345680A1 (en) * 2016-05-27 2017-11-30 Semes Co., Ltd. Transfer unit, and apparatus and method for treating substrate
TW201801168A (zh) * 2016-03-30 2018-01-01 東京威力科創股份有限公司 基板處理裝置、基板處理裝置之控制方法及基板處理系統
TW201825888A (zh) * 2016-09-02 2018-07-16 斯庫林集團股份有限公司 基板檢查裝置、基板處理裝置、基板檢查方法以及基板處理方法
TW201834103A (zh) * 2017-02-28 2018-09-16 日商斯庫林集團股份有限公司 基板處理裝置以及基板處理方法
WO2018216476A1 (ja) * 2017-05-24 2018-11-29 東京エレクトロン株式会社 基板処理装置および基板処理方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4514700B2 (ja) * 2005-12-13 2010-07-28 大日本スクリーン製造株式会社 基板処理装置および基板処理方法
JP5088335B2 (ja) 2009-02-04 2012-12-05 東京エレクトロン株式会社 基板搬送装置及び基板処理システム
JP6914062B2 (ja) * 2017-03-03 2021-08-04 東京エレクトロン株式会社 基板処理装置および基板処理方法
JP6953286B2 (ja) * 2017-11-09 2021-10-27 東京エレクトロン株式会社 基板処理装置、基板処理方法及び記憶媒体
JP2020017618A (ja) * 2018-07-25 2020-01-30 東京エレクトロン株式会社 基板処理装置および基板処理方法

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20120064727A1 (en) * 2010-09-15 2012-03-15 Samsung Electronics Co., Ltd. Substrate treatment equipment and method of treating substrate using the same
TW201250776A (en) * 2011-04-06 2012-12-16 Tokyo Electron Ltd Substrate processing apparatus, substrate processing method, and computer-readable recording medium having program for executing the substrate processing method recorded therein
TW201324659A (zh) * 2011-11-21 2013-06-16 Tokyo Electron Ltd 基板處理裝置、基板處理方法、及記憶有基板處理程式之電腦可讀取記憶媒體
TW201522952A (zh) * 2013-11-07 2015-06-16 Tokyo Electron Ltd 基板之缺陷結構分析裝置、基板處理系統、基板之缺陷結構分析方法、程式及電腦記錄媒體
TW201601845A (zh) * 2014-06-25 2016-01-16 斯克林集團公司 基板處理裝置、治具、及教導方法
TW201801168A (zh) * 2016-03-30 2018-01-01 東京威力科創股份有限公司 基板處理裝置、基板處理裝置之控制方法及基板處理系統
US20170345680A1 (en) * 2016-05-27 2017-11-30 Semes Co., Ltd. Transfer unit, and apparatus and method for treating substrate
TW201825888A (zh) * 2016-09-02 2018-07-16 斯庫林集團股份有限公司 基板檢查裝置、基板處理裝置、基板檢查方法以及基板處理方法
TW201834103A (zh) * 2017-02-28 2018-09-16 日商斯庫林集團股份有限公司 基板處理裝置以及基板處理方法
WO2018216476A1 (ja) * 2017-05-24 2018-11-29 東京エレクトロン株式会社 基板処理装置および基板処理方法

Also Published As

Publication number Publication date
CN113557591A (zh) 2021-10-26
WO2020195175A1 (ja) 2020-10-01
JP2020161609A (ja) 2020-10-01
KR102658643B1 (ko) 2024-04-18
JP7261052B2 (ja) 2023-04-19
KR20240027875A (ko) 2024-03-04
TW202040637A (zh) 2020-11-01
KR20210126693A (ko) 2021-10-20

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