TWI753709B - 配線基板 - Google Patents

配線基板 Download PDF

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Publication number
TWI753709B
TWI753709B TW109144613A TW109144613A TWI753709B TW I753709 B TWI753709 B TW I753709B TW 109144613 A TW109144613 A TW 109144613A TW 109144613 A TW109144613 A TW 109144613A TW I753709 B TWI753709 B TW I753709B
Authority
TW
Taiwan
Prior art keywords
layer
conductive layer
molybdenum
tungsten
wiring board
Prior art date
Application number
TW109144613A
Other languages
English (en)
Chinese (zh)
Other versions
TW202133698A (zh
Inventor
山本哲也
緒方孝友
伊藤陽彥
Original Assignee
日商Ｎｇｋ電子器件股份有限公司
日商日本碍子股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商Ｎｇｋ電子器件股份有限公司, 日商日本碍子股份有限公司 filed Critical 日商Ｎｇｋ電子器件股份有限公司
Publication of TW202133698A publication Critical patent/TW202133698A/zh
Application granted granted Critical
Publication of TWI753709B publication Critical patent/TWI753709B/zh

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/01—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics
    • C04B35/10—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on aluminium oxide
    • C04B35/111—Fine ceramics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Ceramic Engineering (AREA)
  • Materials Engineering (AREA)
  • Structural Engineering (AREA)
  • Organic Chemistry (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
TW109144613A 2019-12-26 2020-12-17 配線基板 TWI753709B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019-237389 2019-12-26
JP2019237389 2019-12-26

Publications (2)

Publication Number Publication Date
TW202133698A TW202133698A (zh) 2021-09-01
TWI753709B true TWI753709B (zh) 2022-01-21

Family

ID=76575467

Family Applications (1)

Application Number Title Priority Date Filing Date
TW109144613A TWI753709B (zh) 2019-12-26 2020-12-17 配線基板

Country Status (4)

Country Link
JP (1) JP7001876B2 (ja)
CN (1) CN114026968B (ja)
TW (1) TWI753709B (ja)
WO (1) WO2021131693A1 (ja)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201352084A (zh) * 2012-03-14 2013-12-16 Ngk Spark Plug Co 陶瓷基板及其製造方法
CN110326101A (zh) * 2017-02-21 2019-10-11 京瓷株式会社 布线基板、电子装置及电子模块

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5392465A (en) * 1977-01-24 1978-08-14 Nippon Electric Co Electronic circuit element board
JPS5478084A (en) * 1977-12-05 1979-06-21 Hitachi Ltd Electrode lead wire
JPS6252962A (ja) * 1985-09-02 1987-03-07 Hitachi Ltd 半導体装置
JP3645744B2 (ja) 1999-05-14 2005-05-11 京セラ株式会社 セラミック配線基板
JP4671500B2 (ja) * 2000-12-26 2011-04-20 京セラ株式会社 配線基板の製造方法
JP2003338578A (ja) * 2002-05-21 2003-11-28 Kyocera Corp 半導体素子搭載用基板
JP4897961B2 (ja) * 2006-12-08 2012-03-14 日本特殊陶業株式会社 電子部品検査用配線基板およびその製造方法
JP4885089B2 (ja) * 2007-08-08 2012-02-29 リバーエレテック株式会社 電子部品パッケージ及びその製造方法
JP5392465B2 (ja) 2008-11-25 2014-01-22 住友電気工業株式会社 マグネシウム合金部材
JP5478084B2 (ja) 2009-01-23 2014-04-23 オリンパス株式会社 画像処理システム、画像処理装置および画像処理端末
JP6795441B2 (ja) 2017-03-30 2020-12-02 日本特殊陶業株式会社 セラミック配線基板及びその製造方法
JP6252962B1 (ja) 2017-06-13 2017-12-27 上質空間株式会社 スタンド
JP2019054117A (ja) * 2017-09-15 2019-04-04 日本特殊陶業株式会社 配線基板、及びプレーナトランス

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201352084A (zh) * 2012-03-14 2013-12-16 Ngk Spark Plug Co 陶瓷基板及其製造方法
CN110326101A (zh) * 2017-02-21 2019-10-11 京瓷株式会社 布线基板、电子装置及电子模块

Also Published As

Publication number Publication date
CN114026968B (zh) 2022-08-30
WO2021131693A1 (ja) 2021-07-01
JP7001876B2 (ja) 2022-01-20
CN114026968A (zh) 2022-02-08
JPWO2021131693A1 (ja) 2021-07-01
TW202133698A (zh) 2021-09-01

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