JPS5478084A - Electrode lead wire - Google Patents

Electrode lead wire

Info

Publication number
JPS5478084A
JPS5478084A JP14504177A JP14504177A JPS5478084A JP S5478084 A JPS5478084 A JP S5478084A JP 14504177 A JP14504177 A JP 14504177A JP 14504177 A JP14504177 A JP 14504177A JP S5478084 A JPS5478084 A JP S5478084A
Authority
JP
Japan
Prior art keywords
lead wire
coating
electrode
base body
electrode base
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP14504177A
Other languages
Japanese (ja)
Inventor
Akira Matsunaga
Toshiyuki Hidaka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP14504177A priority Critical patent/JPS5478084A/en
Publication of JPS5478084A publication Critical patent/JPS5478084A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

PURPOSE:To make the electrode base body of a glass mold type semiconductor device stable against damp with coherence with a lead wire fitted to it by composing the electrode base body of Mo covered with a W coating. CONSTITUTION:Onto the surface of electrode base body 1 made of a Mo material previously formed into a cylinder of fixed size, W coating 2 is adhered through vapor-phase or liquid-phase plating, thereby obtaining electrode body A. Next, lead wire 3 of a Cu material is fitted to one flank of body A through electric welding. Then, the surface without lead wire 3 of electrode body A is brazed to both sides of rectification unit body B obtaining by stacking a plural number of semiconductor plates 4 via brazing material 5, and then sealed by glass sealing material 6. As a result, since the thermal expansivity of W approximates to that of Mo, the stress to glsss material 6 is small, coherence between lead wire 3 and W coating 2 is excellent, and damp resistance improves.
JP14504177A 1977-12-05 1977-12-05 Electrode lead wire Pending JPS5478084A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14504177A JPS5478084A (en) 1977-12-05 1977-12-05 Electrode lead wire

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14504177A JPS5478084A (en) 1977-12-05 1977-12-05 Electrode lead wire

Publications (1)

Publication Number Publication Date
JPS5478084A true JPS5478084A (en) 1979-06-21

Family

ID=15376016

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14504177A Pending JPS5478084A (en) 1977-12-05 1977-12-05 Electrode lead wire

Country Status (1)

Country Link
JP (1) JPS5478084A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021131693A1 (en) * 2019-12-26 2021-07-01 Ｎｇｋエレクトロデバイス株式会社 Wiring board

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021131693A1 (en) * 2019-12-26 2021-07-01 Ｎｇｋエレクトロデバイス株式会社 Wiring board

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