TWI747825B - 藉由順序化學汽相沉積製程所進行的低氟含量之鎢的沉積 - Google Patents

藉由順序化學汽相沉積製程所進行的低氟含量之鎢的沉積 Download PDF

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Publication number
TWI747825B
TWI747825B TW105116371A TW105116371A TWI747825B TW I747825 B TWI747825 B TW I747825B TW 105116371 A TW105116371 A TW 105116371A TW 105116371 A TW105116371 A TW 105116371A TW I747825 B TWI747825 B TW I747825B
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Taiwan
Prior art keywords
tungsten
substrate
containing precursor
layer
chamber
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TW105116371A
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English (en)
Chinese (zh)
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TW201715067A (zh
Inventor
亞當 揚德爾
珊傑 戈皮納思
巴曉蘭
拉許納 胡瑪雲
米歇爾 丹納克
勞倫斯 施洛斯
于天驊
思魯提 維克 湯貝爾
凱翰 阿畢迪 艾許地安尼
Original Assignee
美商蘭姆研究公司
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Priority claimed from US14/723,270 external-priority patent/US9613818B2/en
Application filed by 美商蘭姆研究公司 filed Critical 美商蘭姆研究公司
Publication of TW201715067A publication Critical patent/TW201715067A/zh
Application granted granted Critical
Publication of TWI747825B publication Critical patent/TWI747825B/zh

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/40—Formation of materials, e.g. in the shape of layers or pillars of conductive or resistive materials
    • H10P14/42—Formation of materials, e.g. in the shape of layers or pillars of conductive or resistive materials using a gas or vapour
    • H10P14/43—Chemical deposition, e.g. chemical vapour deposition [CVD]
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/06—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of metallic material
    • C23C16/08—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of metallic material from metal halides
    • C23C16/14—Deposition of only one other metal element
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/24—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials using chemical vapour deposition [CVD]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
    • H10P14/63—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by the formation processes
    • H10P14/6326—Deposition processes
    • H10P14/6328—Deposition from the gas or vapour phase
    • H10P14/6334—Deposition from the gas or vapour phase using decomposition or reaction of gaseous or vapour phase compounds, i.e. chemical vapour deposition
    • H10P14/6339—Deposition from the gas or vapour phase using decomposition or reaction of gaseous or vapour phase compounds, i.e. chemical vapour deposition deposition by cyclic CVD, e.g. ALD, ALE or pulsed CVD

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  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemical Vapour Deposition (AREA)
  • Electrodes Of Semiconductors (AREA)
TW105116371A 2015-05-27 2016-05-26 藉由順序化學汽相沉積製程所進行的低氟含量之鎢的沉積 TWI747825B (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US14/723,270 2015-05-27
US14/723,270 US9613818B2 (en) 2015-05-27 2015-05-27 Deposition of low fluorine tungsten by sequential CVD process
US201662328759P 2016-04-28 2016-04-28
US62/328,759 2016-04-28

Publications (2)

Publication Number Publication Date
TW201715067A TW201715067A (zh) 2017-05-01
TWI747825B true TWI747825B (zh) 2021-12-01

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TW105116371A TWI747825B (zh) 2015-05-27 2016-05-26 藉由順序化學汽相沉積製程所進行的低氟含量之鎢的沉積

Country Status (3)

Country Link
JP (1) JP7092456B2 (https=)
KR (1) KR102397797B1 (https=)
TW (1) TWI747825B (https=)

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JP6788545B2 (ja) * 2017-04-26 2020-11-25 東京エレクトロン株式会社 タングステン膜を形成する方法
JP6946463B2 (ja) * 2017-06-05 2021-10-06 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ ワードライン抵抗を低下させる方法
TW201908511A (zh) * 2017-07-13 2019-03-01 美商應用材料股份有限公司 用於沉積鎢成核層的方法及設備
KR102424993B1 (ko) 2017-09-11 2022-07-25 에스케이하이닉스 주식회사 반도체 장치의 제조방법
US10669160B2 (en) * 2018-04-30 2020-06-02 L'Air Liquide, Société Anonyme pour l'Etude et l'Exploitation des Procédés Georges Claude Heterogeneous wet synthesis process for preparation of high purity tungsten pentahalide
KR102806630B1 (ko) * 2018-05-03 2025-05-12 램 리써치 코포레이션 3d nand 구조체들에 텅스텐 및 다른 금속들을 증착하는 방법
KR102513403B1 (ko) * 2018-07-30 2023-03-24 주식회사 원익아이피에스 텅스텐 증착 방법
KR102544654B1 (ko) * 2018-08-17 2023-06-16 샌트랄 글래스 컴퍼니 리미티드 육불화텅스텐의 제조 방법
JP7138518B2 (ja) 2018-08-31 2022-09-16 東京エレクトロン株式会社 成膜方法及び成膜システム
CN111162039A (zh) * 2018-11-08 2020-05-15 长鑫存储技术有限公司 金属导电结构及半导体器件的制备方法
WO2020123987A1 (en) 2018-12-14 2020-06-18 Lam Research Corporation Atomic layer deposition on 3d nand structures
KR20200099112A (ko) 2019-02-13 2020-08-21 세종대학교산학협력단 Ald 공정에서 금속 전구체 환원용 환원제 조성물 및 금속 박막의 형성 방법
WO2020170865A1 (ja) * 2019-02-20 2020-08-27 東京エレクトロン株式会社 半導体装置の製造方法
WO2020210260A1 (en) 2019-04-11 2020-10-15 Lam Research Corporation High step coverage tungsten deposition
WO2020214732A1 (en) * 2019-04-19 2020-10-22 Lam Research Corporation Rapid flush purging during atomic layer deposition
US11447864B2 (en) * 2019-04-19 2022-09-20 Asm Ip Holding B.V. Layer forming method and apparatus
US12237221B2 (en) 2019-05-22 2025-02-25 Lam Research Corporation Nucleation-free tungsten deposition
WO2021030836A1 (en) 2019-08-12 2021-02-18 Lam Research Corporation Tungsten deposition
JP2021038442A (ja) * 2019-09-04 2021-03-11 東京エレクトロン株式会社 基板処理方法及び基板処理装置
CN114946018A (zh) * 2020-06-30 2022-08-26 应用材料公司 在低温下的选择性钨沉积
KR102847592B1 (ko) 2020-11-05 2025-08-18 세종대학교산학협력단 텅스텐 전구체, 이를 이용한 텅스텐 박막 증착 방법 및 증착 장치
KR20230104542A (ko) * 2020-11-20 2023-07-10 램 리써치 코포레이션 텅스텐 저 저항 펄싱된 cvd
US11515200B2 (en) * 2020-12-03 2022-11-29 Applied Materials, Inc. Selective tungsten deposition within trench structures
JP7733133B2 (ja) * 2021-05-07 2025-09-02 インテグリス・インコーポレーテッド モリブデンまたはタングステン材料の堆積方法
CN114420533B (zh) * 2021-12-08 2024-10-18 武汉新芯集成电路股份有限公司 在半导体晶片上制备钨的方法
CN119230478A (zh) * 2023-06-30 2024-12-31 北京北方华创微电子装备有限公司 沉积钨塞的工艺方法及半导体器件

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US20140319614A1 (en) * 2013-04-25 2014-10-30 GlobalFoundries, Inc. Finfet channel stress using tungsten contacts in raised epitaxial source and drain

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JP5864503B2 (ja) * 2013-09-30 2016-02-17 株式会社日立国際電気 半導体装置の製造方法、基板処理装置、プログラム及び記録媒体

Patent Citations (2)

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US20140319614A1 (en) * 2013-04-25 2014-10-30 GlobalFoundries, Inc. Finfet channel stress using tungsten contacts in raised epitaxial source and drain

Also Published As

Publication number Publication date
KR102397797B1 (ko) 2022-05-12
JP2017008412A (ja) 2017-01-12
TW201715067A (zh) 2017-05-01
JP7092456B2 (ja) 2022-06-28
KR20160140448A (ko) 2016-12-07

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