TWI741866B - 晶圓載具的貼覆裝置及其操作方法 - Google Patents

晶圓載具的貼覆裝置及其操作方法 Download PDF

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Publication number
TWI741866B
TWI741866B TW109138764A TW109138764A TWI741866B TW I741866 B TWI741866 B TW I741866B TW 109138764 A TW109138764 A TW 109138764A TW 109138764 A TW109138764 A TW 109138764A TW I741866 B TWI741866 B TW I741866B
Authority
TW
Taiwan
Prior art keywords
wafer carrier
chamber
mechanical polishing
chemical mechanical
polishing head
Prior art date
Application number
TW109138764A
Other languages
English (en)
Chinese (zh)
Other versions
TW202218804A (zh
Inventor
林仁傑
周韋辰
許致遠
許仁和
張金鈺
邱煥仁
吳翰宗
Original Assignee
環球晶圓股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 環球晶圓股份有限公司 filed Critical 環球晶圓股份有限公司
Priority to TW109138764A priority Critical patent/TWI741866B/zh
Application granted granted Critical
Publication of TWI741866B publication Critical patent/TWI741866B/zh
Priority to JP2021178870A priority patent/JP7261851B2/ja
Priority to KR1020210150383A priority patent/KR102637921B1/ko
Publication of TW202218804A publication Critical patent/TW202218804A/zh

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
TW109138764A 2020-11-06 2020-11-06 晶圓載具的貼覆裝置及其操作方法 TWI741866B (zh)

Priority Applications (3)

Application Number Priority Date Filing Date Title
TW109138764A TWI741866B (zh) 2020-11-06 2020-11-06 晶圓載具的貼覆裝置及其操作方法
JP2021178870A JP7261851B2 (ja) 2020-11-06 2021-11-01 ウェハー載置手段の貼り付け装置及びその操作方法
KR1020210150383A KR102637921B1 (ko) 2020-11-06 2021-11-04 웨이퍼 템플릿 부착 장치 및 그 조작 방법

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW109138764A TWI741866B (zh) 2020-11-06 2020-11-06 晶圓載具的貼覆裝置及其操作方法

Publications (2)

Publication Number Publication Date
TWI741866B true TWI741866B (zh) 2021-10-01
TW202218804A TW202218804A (zh) 2022-05-16

Family

ID=80782469

Family Applications (1)

Application Number Title Priority Date Filing Date
TW109138764A TWI741866B (zh) 2020-11-06 2020-11-06 晶圓載具的貼覆裝置及其操作方法

Country Status (3)

Country Link
JP (1) JP7261851B2 (ja)
KR (1) KR102637921B1 (ja)
TW (1) TWI741866B (ja)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW579549B (en) * 2000-09-05 2004-03-11 Nikon Corp Polishing device and polishing pad component exchange device and method cross reference to related applications
TW201108344A (en) * 2009-08-31 2011-03-01 Hitachi Setsubi Eng Kk Vacuum adhering method and device
US9199354B2 (en) * 2012-10-29 2015-12-01 Wayne O. Duescher Flexible diaphragm post-type floating and rigid abrading workholder
TW201922418A (zh) * 2017-10-16 2019-06-16 日商Ｓｕｍｃｏ股份有限公司 用於單面研磨裝置的晶圓貼附裝置及用於單面研磨裝置的晶圓貼附方法
CN210189412U (zh) * 2019-07-09 2020-03-27 徐州鑫晶半导体科技有限公司 贴附组件与贴附装置

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5155517B2 (ja) * 2005-04-21 2013-03-06 株式会社荏原製作所 ウエハ受渡装置及びポリッシング装置
JP5955271B2 (ja) * 2013-06-04 2016-07-20 信越半導体株式会社 研磨ヘッドの製造方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW579549B (en) * 2000-09-05 2004-03-11 Nikon Corp Polishing device and polishing pad component exchange device and method cross reference to related applications
TW201108344A (en) * 2009-08-31 2011-03-01 Hitachi Setsubi Eng Kk Vacuum adhering method and device
US9199354B2 (en) * 2012-10-29 2015-12-01 Wayne O. Duescher Flexible diaphragm post-type floating and rigid abrading workholder
TW201922418A (zh) * 2017-10-16 2019-06-16 日商Ｓｕｍｃｏ股份有限公司 用於單面研磨裝置的晶圓貼附裝置及用於單面研磨裝置的晶圓貼附方法
CN210189412U (zh) * 2019-07-09 2020-03-27 徐州鑫晶半导体科技有限公司 贴附组件与贴附装置

Also Published As

Publication number Publication date
JP2022075584A (ja) 2022-05-18
KR102637921B1 (ko) 2024-02-16
JP7261851B2 (ja) 2023-04-20
TW202218804A (zh) 2022-05-16
KR20220061881A (ko) 2022-05-13

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