TWI741866B - 晶圓載具的貼覆裝置及其操作方法 - Google Patents
晶圓載具的貼覆裝置及其操作方法 Download PDFInfo
- Publication number
- TWI741866B TWI741866B TW109138764A TW109138764A TWI741866B TW I741866 B TWI741866 B TW I741866B TW 109138764 A TW109138764 A TW 109138764A TW 109138764 A TW109138764 A TW 109138764A TW I741866 B TWI741866 B TW I741866B
- Authority
- TW
- Taiwan
- Prior art keywords
- wafer carrier
- chamber
- mechanical polishing
- chemical mechanical
- polishing head
- Prior art date
Links
Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
- B24B37/30—Work carriers for single side lapping of plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
- B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/34—Accessories
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW109138764A TWI741866B (zh) | 2020-11-06 | 2020-11-06 | 晶圓載具的貼覆裝置及其操作方法 |
JP2021178870A JP7261851B2 (ja) | 2020-11-06 | 2021-11-01 | ウェハー載置手段の貼り付け装置及びその操作方法 |
KR1020210150383A KR102637921B1 (ko) | 2020-11-06 | 2021-11-04 | 웨이퍼 템플릿 부착 장치 및 그 조작 방법 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW109138764A TWI741866B (zh) | 2020-11-06 | 2020-11-06 | 晶圓載具的貼覆裝置及其操作方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
TWI741866B true TWI741866B (zh) | 2021-10-01 |
TW202218804A TW202218804A (zh) | 2022-05-16 |
Family
ID=80782469
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW109138764A TWI741866B (zh) | 2020-11-06 | 2020-11-06 | 晶圓載具的貼覆裝置及其操作方法 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP7261851B2 (ja) |
KR (1) | KR102637921B1 (ja) |
TW (1) | TWI741866B (ja) |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW579549B (en) * | 2000-09-05 | 2004-03-11 | Nikon Corp | Polishing device and polishing pad component exchange device and method cross reference to related applications |
TW201108344A (en) * | 2009-08-31 | 2011-03-01 | Hitachi Setsubi Eng Kk | Vacuum adhering method and device |
US9199354B2 (en) * | 2012-10-29 | 2015-12-01 | Wayne O. Duescher | Flexible diaphragm post-type floating and rigid abrading workholder |
TW201922418A (zh) * | 2017-10-16 | 2019-06-16 | 日商Sumco股份有限公司 | 用於單面研磨裝置的晶圓貼附裝置及用於單面研磨裝置的晶圓貼附方法 |
CN210189412U (zh) * | 2019-07-09 | 2020-03-27 | 徐州鑫晶半导体科技有限公司 | 贴附组件与贴附装置 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5155517B2 (ja) * | 2005-04-21 | 2013-03-06 | 株式会社荏原製作所 | ウエハ受渡装置及びポリッシング装置 |
JP5955271B2 (ja) * | 2013-06-04 | 2016-07-20 | 信越半導体株式会社 | 研磨ヘッドの製造方法 |
-
2020
- 2020-11-06 TW TW109138764A patent/TWI741866B/zh active
-
2021
- 2021-11-01 JP JP2021178870A patent/JP7261851B2/ja active Active
- 2021-11-04 KR KR1020210150383A patent/KR102637921B1/ko active IP Right Grant
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW579549B (en) * | 2000-09-05 | 2004-03-11 | Nikon Corp | Polishing device and polishing pad component exchange device and method cross reference to related applications |
TW201108344A (en) * | 2009-08-31 | 2011-03-01 | Hitachi Setsubi Eng Kk | Vacuum adhering method and device |
US9199354B2 (en) * | 2012-10-29 | 2015-12-01 | Wayne O. Duescher | Flexible diaphragm post-type floating and rigid abrading workholder |
TW201922418A (zh) * | 2017-10-16 | 2019-06-16 | 日商Sumco股份有限公司 | 用於單面研磨裝置的晶圓貼附裝置及用於單面研磨裝置的晶圓貼附方法 |
CN210189412U (zh) * | 2019-07-09 | 2020-03-27 | 徐州鑫晶半导体科技有限公司 | 贴附组件与贴附装置 |
Also Published As
Publication number | Publication date |
---|---|
JP2022075584A (ja) | 2022-05-18 |
KR102637921B1 (ko) | 2024-02-16 |
JP7261851B2 (ja) | 2023-04-20 |
TW202218804A (zh) | 2022-05-16 |
KR20220061881A (ko) | 2022-05-13 |
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