CN210189412U - 贴附组件与贴附装置 - Google Patents
贴附组件与贴附装置 Download PDFInfo
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- CN210189412U CN210189412U CN201921066176.1U CN201921066176U CN210189412U CN 210189412 U CN210189412 U CN 210189412U CN 201921066176 U CN201921066176 U CN 201921066176U CN 210189412 U CN210189412 U CN 210189412U
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- 238000000034 method Methods 0.000 claims abstract description 23
- 238000001179 sorption measurement Methods 0.000 claims abstract description 23
- 239000007788 liquid Substances 0.000 claims description 28
- 238000005498 polishing Methods 0.000 claims description 26
- 238000004891 communication Methods 0.000 claims description 4
- 235000012431 wafers Nutrition 0.000 description 40
- 238000007517 polishing process Methods 0.000 description 10
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 10
- 239000010410 layer Substances 0.000 description 4
- 238000010521 absorption reaction Methods 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 230000000712 assembly Effects 0.000 description 2
- 238000000429 assembly Methods 0.000 description 2
- 239000004744 fabric Substances 0.000 description 2
- 239000012528 membrane Substances 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 239000002985 plastic film Substances 0.000 description 2
- 229920006255 plastic film Polymers 0.000 description 2
- 229920002799 BoPET Polymers 0.000 description 1
- 230000003044 adaptive effect Effects 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000012634 fragment Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- -1 region Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
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- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
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Priority Applications (1)
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CN201921066176.1U CN210189412U (zh) | 2019-07-09 | 2019-07-09 | 贴附组件与贴附装置 |
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CN201921066176.1U CN210189412U (zh) | 2019-07-09 | 2019-07-09 | 贴附组件与贴附装置 |
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CN210189412U true CN210189412U (zh) | 2020-03-27 |
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CN201921066176.1U Active CN210189412U (zh) | 2019-07-09 | 2019-07-09 | 贴附组件与贴附装置 |
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI741866B (zh) * | 2020-11-06 | 2021-10-01 | 環球晶圓股份有限公司 | 晶圓載具的貼覆裝置及其操作方法 |
CN114147610A (zh) * | 2022-01-18 | 2022-03-08 | 徐州晶睿半导体装备科技有限公司 | 半自动真空抛光头贴片机 |
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2019
- 2019-07-09 CN CN201921066176.1U patent/CN210189412U/zh active Active
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI741866B (zh) * | 2020-11-06 | 2021-10-01 | 環球晶圓股份有限公司 | 晶圓載具的貼覆裝置及其操作方法 |
CN114147610A (zh) * | 2022-01-18 | 2022-03-08 | 徐州晶睿半导体装备科技有限公司 | 半自动真空抛光头贴片机 |
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GR01 | Patent grant | ||
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Effective date of registration: 20230627 Address after: 221000 No.1 Xinxin Road, Xuzhou Economic and Technological Development Zone, Jiangsu Province Patentee after: Zhonghuan Leading (Xuzhou) Semiconductor Materials Co.,Ltd. Address before: 221000 No.1 Xinxin Road, Xuzhou Economic and Technological Development Zone, Jiangsu Province Patentee before: XUZHOU XINJING SEMICONDUCTOR TECHNOLOGY Co.,Ltd. Effective date of registration: 20230627 Address after: 221000 No.1 Xinxin Road, Xuzhou Economic and Technological Development Zone, Jiangsu Province Patentee after: Zhonghuan Leading (Xuzhou) Semiconductor Materials Co.,Ltd. Patentee after: Zhonghuan leading semiconductor materials Co.,Ltd. Address before: 221000 No.1 Xinxin Road, Xuzhou Economic and Technological Development Zone, Jiangsu Province Patentee before: Zhonghuan Leading (Xuzhou) Semiconductor Materials Co.,Ltd. |
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TR01 | Transfer of patent right | ||
CP03 | Change of name, title or address |
Address after: 221000 No.1 Xinxin Road, Xuzhou Economic and Technological Development Zone, Jiangsu Province Patentee after: Zhonghuan Leading (Xuzhou) Semiconductor Materials Co.,Ltd. Country or region after: China Patentee after: Zhonghuan Leading Semiconductor Technology Co.,Ltd. Address before: 221000 No.1 Xinxin Road, Xuzhou Economic and Technological Development Zone, Jiangsu Province Patentee before: Zhonghuan Leading (Xuzhou) Semiconductor Materials Co.,Ltd. Country or region before: China Patentee before: Zhonghuan leading semiconductor materials Co.,Ltd. |