TWI730154B - 研磨頭、具有研磨頭的cmp研磨裝置以及使用該cmp研磨裝置的半導體積體電路裝置的製造方法 - Google Patents

研磨頭、具有研磨頭的cmp研磨裝置以及使用該cmp研磨裝置的半導體積體電路裝置的製造方法 Download PDF

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Publication number
TWI730154B
TWI730154B TW106126866A TW106126866A TWI730154B TW I730154 B TWI730154 B TW I730154B TW 106126866 A TW106126866 A TW 106126866A TW 106126866 A TW106126866 A TW 106126866A TW I730154 B TWI730154 B TW I730154B
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TW
Taiwan
Prior art keywords
polishing
wafer
airbag
polishing head
spherical shape
Prior art date
Application number
TW106126866A
Other languages
English (en)
Chinese (zh)
Other versions
TW201805109A (zh
Inventor
山本祐広
Original Assignee
日商艾普凌科有限公司
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Publication of TW201805109A publication Critical patent/TW201805109A/zh
Application granted granted Critical
Publication of TWI730154B publication Critical patent/TWI730154B/zh

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B24B37/32—Retaining rings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/04—Headstocks; Working-spindles; Features relating thereto
    • B24B41/047—Grinding heads for working on plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/006—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the speed
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/10—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving electrical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
    • B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H10P52/40—Chemomechanical polishing [CMP]
    • H10P52/402—Chemomechanical polishing [CMP] of semiconductor materials

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
TW106126866A 2016-08-10 2017-08-09 研磨頭、具有研磨頭的cmp研磨裝置以及使用該cmp研磨裝置的半導體積體電路裝置的製造方法 TWI730154B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016157371A JP6713377B2 (ja) 2016-08-10 2016-08-10 研磨ヘッド、研磨ヘッドを有するｃｍｐ研磨装置およびそれを用いた半導体集積回路装置の製造方法
JP2016-157371 2016-08-10

Publications (2)

Publication Number Publication Date
TW201805109A TW201805109A (zh) 2018-02-16
TWI730154B true TWI730154B (zh) 2021-06-11

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Family Applications (1)

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TW106126866A TWI730154B (zh) 2016-08-10 2017-08-09 研磨頭、具有研磨頭的cmp研磨裝置以及使用該cmp研磨裝置的半導體積體電路裝置的製造方法

Country Status (5)

Country Link
US (1) US10300577B2 (https=)
JP (1) JP6713377B2 (https=)
KR (1) KR102366241B1 (https=)
CN (1) CN107717719B (https=)
TW (1) TWI730154B (https=)

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JP7158223B2 (ja) * 2018-09-20 2022-10-21 株式会社荏原製作所 研磨ヘッドおよび研磨装置
CN111168561B (zh) * 2019-12-26 2022-05-13 西安奕斯伟材料科技有限公司 研磨头及晶圆研磨装置
KR102304948B1 (ko) * 2020-01-13 2021-09-24 (주)제이쓰리 반도체 웨이퍼 형상을 제어하는 웨이퍼 가공용 헤드 장치
CN111993268A (zh) * 2020-08-24 2020-11-27 台州市老林装饰有限公司 一种晶圆研磨头装置
CN112677047A (zh) * 2020-12-09 2021-04-20 杭州蒙托机械科技有限公司 一种避免摇晃且能够吹散灰尘的小型抛光头保护装置
CN116117683A (zh) * 2021-11-15 2023-05-16 成都高真科技有限公司 晶圆抓取机构、抛光装置及应用
CN115673908B (zh) * 2023-01-03 2023-03-10 北京特思迪半导体设备有限公司 一种半导体基材抛光设备中晶圆压头及其设计方法

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TW430588B (en) * 1998-03-23 2001-04-21 Speedfam Ipec Corp Backing pad for workpiece carrier
TW474848B (en) * 1999-08-13 2002-02-01 Speedfam Ipec Corp Workpiece carrier with segmented and floating retaining elements
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JP2016010836A (ja) * 2014-06-30 2016-01-21 株式会社東芝 研磨装置、研磨方法、及び研磨パッド

Also Published As

Publication number Publication date
JP6713377B2 (ja) 2020-06-24
TW201805109A (zh) 2018-02-16
KR102366241B1 (ko) 2022-02-22
CN107717719A (zh) 2018-02-23
KR20180018356A (ko) 2018-02-21
CN107717719B (zh) 2021-03-12
US20180043496A1 (en) 2018-02-15
US10300577B2 (en) 2019-05-28
JP2018026453A (ja) 2018-02-15

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