CN107717719B - 研磨头、cmp研磨装置、和半导体集成电路装置的制造方法 - Google Patents

研磨头、cmp研磨装置、和半导体集成电路装置的制造方法 Download PDF

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Publication number
CN107717719B
CN107717719B CN201710679978.9A CN201710679978A CN107717719B CN 107717719 B CN107717719 B CN 107717719B CN 201710679978 A CN201710679978 A CN 201710679978A CN 107717719 B CN107717719 B CN 107717719B
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CN
China
Prior art keywords
wafer
spherical shape
polishing
grinding head
airbag
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Expired - Fee Related
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CN201710679978.9A
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English (en)
Chinese (zh)
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CN107717719A (zh
Inventor
山本祐广
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Ablic Inc
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Ablic Inc
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B24B37/32—Retaining rings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/04—Headstocks; Working-spindles; Features relating thereto
    • B24B41/047—Grinding heads for working on plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/006—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the speed
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/10—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving electrical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
    • B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H10P52/40—Chemomechanical polishing [CMP]
    • H10P52/402—Chemomechanical polishing [CMP] of semiconductor materials

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
CN201710679978.9A 2016-08-10 2017-08-10 研磨头、cmp研磨装置、和半导体集成电路装置的制造方法 Expired - Fee Related CN107717719B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016157371A JP6713377B2 (ja) 2016-08-10 2016-08-10 研磨ヘッド、研磨ヘッドを有するｃｍｐ研磨装置およびそれを用いた半導体集積回路装置の製造方法
JP2016-157371 2016-08-10

Publications (2)

Publication Number Publication Date
CN107717719A CN107717719A (zh) 2018-02-23
CN107717719B true CN107717719B (zh) 2021-03-12

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CN201710679978.9A Expired - Fee Related CN107717719B (zh) 2016-08-10 2017-08-10 研磨头、cmp研磨装置、和半导体集成电路装置的制造方法

Country Status (5)

Country Link
US (1) US10300577B2 (https=)
JP (1) JP6713377B2 (https=)
KR (1) KR102366241B1 (https=)
CN (1) CN107717719B (https=)
TW (1) TWI730154B (https=)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7158223B2 (ja) * 2018-09-20 2022-10-21 株式会社荏原製作所 研磨ヘッドおよび研磨装置
CN111168561B (zh) * 2019-12-26 2022-05-13 西安奕斯伟材料科技有限公司 研磨头及晶圆研磨装置
KR102304948B1 (ko) * 2020-01-13 2021-09-24 (주)제이쓰리 반도체 웨이퍼 형상을 제어하는 웨이퍼 가공용 헤드 장치
CN111993268A (zh) * 2020-08-24 2020-11-27 台州市老林装饰有限公司 一种晶圆研磨头装置
CN112677047A (zh) * 2020-12-09 2021-04-20 杭州蒙托机械科技有限公司 一种避免摇晃且能够吹散灰尘的小型抛光头保护装置
CN116117683A (zh) * 2021-11-15 2023-05-16 成都高真科技有限公司 晶圆抓取机构、抛光装置及应用
CN115673908B (zh) * 2023-01-03 2023-03-10 北京特思迪半导体设备有限公司 一种半导体基材抛光设备中晶圆压头及其设计方法

Citations (3)

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JP2005268566A (ja) * 2004-03-19 2005-09-29 Ebara Corp 化学機械研磨装置の基板把持機構のヘッド構造
JP3770956B2 (ja) * 1996-05-20 2006-04-26 松下電器産業株式会社 研磨装置及び研磨方法
JP2007005463A (ja) * 2005-06-22 2007-01-11 Tokyo Seimitsu Co Ltd 研磨装置及び研磨方法

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US5643053A (en) * 1993-12-27 1997-07-01 Applied Materials, Inc. Chemical mechanical polishing apparatus with improved polishing control
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JPH10230455A (ja) * 1997-02-17 1998-09-02 Nec Corp 研磨装置
KR100475845B1 (ko) * 1997-04-04 2005-06-17 도쿄 세이미츄 코퍼레이션 리미티드 연마장치
EP0881039B1 (en) * 1997-05-28 2003-04-16 Tokyo Seimitsu Co.,Ltd. Wafer polishing apparatus with retainer ring
WO1999048645A1 (en) * 1998-03-23 1999-09-30 Speedfam-Ipec Corporation Backing pad for workpiece carrier
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JP2001345297A (ja) * 2000-05-30 2001-12-14 Hitachi Ltd 半導体集積回路装置の製造方法及び研磨装置
KR20010007867A (ko) * 2000-10-12 2001-02-05 김종옥 연삭 숫돌용 자동 밸런스 장치
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JP4718107B2 (ja) * 2003-05-20 2011-07-06 株式会社荏原製作所 基板保持装置及び研磨装置
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JP3770956B2 (ja) * 1996-05-20 2006-04-26 松下電器産業株式会社 研磨装置及び研磨方法
JP2005268566A (ja) * 2004-03-19 2005-09-29 Ebara Corp 化学機械研磨装置の基板把持機構のヘッド構造
JP2007005463A (ja) * 2005-06-22 2007-01-11 Tokyo Seimitsu Co Ltd 研磨装置及び研磨方法

Also Published As

Publication number Publication date
JP6713377B2 (ja) 2020-06-24
TW201805109A (zh) 2018-02-16
TWI730154B (zh) 2021-06-11
KR102366241B1 (ko) 2022-02-22
CN107717719A (zh) 2018-02-23
KR20180018356A (ko) 2018-02-21
US20180043496A1 (en) 2018-02-15
US10300577B2 (en) 2019-05-28
JP2018026453A (ja) 2018-02-15

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Address after: Chiba County, Japan

Applicant after: ABLIC Inc.

Address before: Chiba County, Japan

Applicant before: DynaFine Semiconductor Co.,Ltd.

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CF01 Termination of patent right due to non-payment of annual fee
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Granted publication date: 20210312