TWI728306B - 基板搬送裝置及基板搬送方法 - Google Patents

基板搬送裝置及基板搬送方法 Download PDF

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Publication number
TWI728306B
TWI728306B TW108102562A TW108102562A TWI728306B TW I728306 B TWI728306 B TW I728306B TW 108102562 A TW108102562 A TW 108102562A TW 108102562 A TW108102562 A TW 108102562A TW I728306 B TWI728306 B TW I728306B
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TW
Taiwan
Prior art keywords
substrate
holding portion
robot
holding
period
Prior art date
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TW108102562A
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English (en)
Chinese (zh)
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TW201936471A (zh
Inventor
深津英司
小河豊
Original Assignee
日商斯庫林集團股份有限公司
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Publication of TW201936471A publication Critical patent/TW201936471A/zh
Application granted granted Critical
Publication of TWI728306B publication Critical patent/TWI728306B/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67775—Docking arrangements

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
TW108102562A 2018-02-28 2019-01-23 基板搬送裝置及基板搬送方法 TWI728306B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018035510A JP7007948B2 (ja) 2018-02-28 2018-02-28 基板搬送装置および基板搬送方法
JP2018-035510 2018-02-28

Publications (2)

Publication Number Publication Date
TW201936471A TW201936471A (zh) 2019-09-16
TWI728306B true TWI728306B (zh) 2021-05-21

Family

ID=67804892

Family Applications (1)

Application Number Title Priority Date Filing Date
TW108102562A TWI728306B (zh) 2018-02-28 2019-01-23 基板搬送裝置及基板搬送方法

Country Status (5)

Country Link
JP (1) JP7007948B2 (ko)
KR (1) KR102468631B1 (ko)
CN (1) CN111788668A (ko)
TW (1) TWI728306B (ko)
WO (1) WO2019167447A1 (ko)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7443141B2 (ja) * 2020-04-10 2024-03-05 ニデックインスツルメンツ株式会社 産業用ロボットおよび産業用ロボットの制御方法
KR20230048404A (ko) * 2020-09-03 2023-04-11 가와사끼 쥬고교 가부시끼 가이샤 기판 유지 핸드 및 기판 반송 로봇
TWI776412B (zh) * 2021-03-03 2022-09-01 迅得機械股份有限公司 物件容器的移載裝置

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003100852A (ja) * 2001-09-25 2003-04-04 Dainippon Screen Mfg Co Ltd 基板飛び出し検出装置およびそれを用いた基板処理装置
TW200935540A (en) * 2007-09-04 2009-08-16 Tokyo Electron Ltd Substrate positional misalignment detection system
JP2018010992A (ja) * 2016-07-14 2018-01-18 東京エレクトロン株式会社 フォーカスリング交換方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3094056B2 (ja) * 1994-05-24 2000-10-03 東京エレクトロン株式会社 プローブ装置
JPH11145241A (ja) * 1997-11-06 1999-05-28 Toshiba Corp マルチチャンバシステムおよび基板検出方法
JP4276440B2 (ja) 2003-01-06 2009-06-10 東京エレクトロン株式会社 基板検出方法及び装置並びに基板処理装置
JP2008172160A (ja) * 2007-01-15 2008-07-24 Dainippon Screen Mfg Co Ltd 基板処理装置および基板処理方法
JP2010283334A (ja) 2009-05-01 2010-12-16 Hitachi Kokusai Electric Inc 基板処理装置及び半導体装置の製造方法
JP2012074485A (ja) 2010-09-28 2012-04-12 Tokyo Electron Ltd 基板処理装置及び基板搬送方法並びにその方法を実施するためのプログラムを記憶する記憶媒体
KR20120127220A (ko) * 2011-05-12 2012-11-21 도쿄엘렉트론가부시키가이샤 기판 반송 장치, 이것을 구비하는 도포 현상 장치, 및 기판 반송 방법

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003100852A (ja) * 2001-09-25 2003-04-04 Dainippon Screen Mfg Co Ltd 基板飛び出し検出装置およびそれを用いた基板処理装置
TW200935540A (en) * 2007-09-04 2009-08-16 Tokyo Electron Ltd Substrate positional misalignment detection system
JP2018010992A (ja) * 2016-07-14 2018-01-18 東京エレクトロン株式会社 フォーカスリング交換方法

Also Published As

Publication number Publication date
TW201936471A (zh) 2019-09-16
KR20200083623A (ko) 2020-07-08
KR102468631B1 (ko) 2022-11-17
JP7007948B2 (ja) 2022-01-25
WO2019167447A1 (ja) 2019-09-06
JP2019153609A (ja) 2019-09-12
CN111788668A (zh) 2020-10-16

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