TWI728306B - Substrate transfer apparatus and substrate transfer method - Google Patents

Substrate transfer apparatus and substrate transfer method Download PDF

Info

Publication number
TWI728306B
TWI728306B TW108102562A TW108102562A TWI728306B TW I728306 B TWI728306 B TW I728306B TW 108102562 A TW108102562 A TW 108102562A TW 108102562 A TW108102562 A TW 108102562A TW I728306 B TWI728306 B TW I728306B
Authority
TW
Taiwan
Prior art keywords
substrate
holding portion
robot
holding
period
Prior art date
Application number
TW108102562A
Other languages
Chinese (zh)
Other versions
TW201936471A (en
Inventor
深津英司
小河豊
Original Assignee
日商斯庫林集團股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商斯庫林集團股份有限公司 filed Critical 日商斯庫林集團股份有限公司
Publication of TW201936471A publication Critical patent/TW201936471A/en
Application granted granted Critical
Publication of TWI728306B publication Critical patent/TWI728306B/en

Links

Images

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67242Apparatus for monitoring, sorting or marking
    • H01L21/67259Position monitoring, e.g. misposition detection or presence detection
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766Mechanical parts of transfer devices
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67775Docking arrangements

Abstract

本發明提供可確實地偵測已將基板交付至既定位置之情形之基板搬送裝置及基板搬送方法。基板搬送裝置包含有:保持部,其保持基板;往返機構,其使上述保持部相對於既定位置往返移動;光學感測器,其於上述保持部藉由上述往返機構進行移動之路徑上形成感測器區域;及控制部。控制部於基板之交付動作中對搬送異常進行判斷。基板之交付動作包含上述保持部藉由上述往返機構而朝向既定位置移動之往路動作、及上述保持部離開既定位置之返路動作。控制部於基板之交付動作中,對上述保持部或由該保持部所保持之基板通過上述感測器區域之第1通過期間進行檢測,並於該第1通過期間與所預先設定之第1正常期間不同時判斷為搬送異常。 The present invention provides a substrate conveying device and a substrate conveying method that can reliably detect that the substrate has been delivered to a predetermined position. The substrate conveying device includes: a holding portion that holds the substrate; a shuttle mechanism that makes the holding portion reciprocate relative to a predetermined position; and an optical sensor that forms a sensor on the path where the holding portion is moved by the shuttle mechanism Detector area; and control department. The control unit judges the conveyance abnormality during the delivery of the substrate. The substrate delivery operation includes a forward movement in which the holding portion moves to a predetermined position by the reciprocating mechanism, and a return movement in which the holding portion leaves the predetermined position. During the substrate delivery operation, the control section detects the first passage period during which the holding section or the substrate held by the holding section passes through the sensor area, and performs detection between the first passage period and the preset first passage period. During the normal period, it is not judged as a transport abnormality at the same time.

Description

基板搬送裝置及基板搬送方法 Substrate conveying device and substrate conveying method

本申請案主張基於2018年2月28日提出之日本專利申請案2018-035510號之優先權,該申請案之所有內容藉由引用而包含於本說明書中。 This application claims priority based on Japanese Patent Application No. 2018-035510 filed on February 28, 2018, and all the contents of this application are included in this specification by reference.

本發明係關於一種搬送基板之基板搬送裝置及基板搬送方法。 The present invention relates to a substrate conveying device and a substrate conveying method for conveying substrates.

於半導體基板之製程或半導體元件之製程等中,基板藉由搬送機器人等所搬送。於基板之搬送中,要求將基板正確地載置於用以對基板進行處理之處理單元之載置部,以及將經處理之基板正確地收納至收納容器。因此,例如必須利用感測器對每片基板確認基板是否已藉由搬送機器人等正常地被搬送至載置部等。 In the manufacturing process of semiconductor substrates or semiconductor device manufacturing processes, the substrates are transported by a transport robot or the like. In the transportation of the substrate, it is required to accurately place the substrate on the placement part of the processing unit for processing the substrate, and to accurately store the processed substrate in the storage container. Therefore, for example, it is necessary to use a sensor to confirm for each substrate whether or not the substrate has been normally transferred to the placement part by a transfer robot or the like.

例如,專利文獻1所記載之基板搬送裝置,具備有於藉由搬送部搬送基板時保持基板之拾取器(機器手)。該搬送部藉由按壓體固定保持位於拾取器上之基板,並根據按壓體之位置來檢測基板之保持狀態。又,搬送部於將基板交付至載置部等之既定位置時,解除利用按壓體所進行之固定保持。 For example, the substrate transfer device described in Patent Document 1 is provided with a picker (robot) that holds the substrate when the substrate is transferred by the transfer section. The conveying part fixes and holds the substrate on the pickup by the pressing body, and detects the holding state of the substrate according to the position of the pressing body. In addition, when the transfer section delivers the substrate to a predetermined position such as the placement section, it releases the fixing and holding by the pressing body.

[先前技術文獻] [Prior Technical Literature] [專利文獻] [Patent Literature]

[專利文獻1]日本專利特開2012-74485公報 [Patent Document 1] Japanese Patent Laid-Open Publication 2012-74485

於專利文獻1所記載之利用按壓體所進行之基板檢測動作中,在將基板交付至既定位置後而拾取器後退時,並未對基板進行檢測。因此,無法對基板跨上要後退之拾取器上等而在拾取器上殘留有基板之狀態進行檢測。於該情形時,即便沒能將基板交付至既定位置,卻無法對該情形進行檢測。如此,專利文獻1所記載之技術由於無法對基板已藉由搬送部被交付至既定位置之情形進行檢測,因此存在無法對搬送不良進行檢測之情形。 In the substrate inspection operation using the pressing body described in Patent Document 1, when the pickup is moved back after the substrate is delivered to a predetermined position, the substrate is not inspected. Therefore, it is impossible to detect the state in which the substrate is straddled on the pickup that is going to retreat and the substrate remains on the pickup. In this case, even if the substrate cannot be delivered to the predetermined position, the situation cannot be detected. In this way, the technique described in Patent Document 1 cannot detect when the substrate has been delivered to a predetermined position by the transport unit, and therefore there are cases in which the transport failure cannot be detected.

本發明一實施形態鑒於上述情形,而提供可確實地偵測已將基板交付至既定位置之基板搬送裝置及基板搬送方法。 In view of the above situation, an embodiment of the present invention provides a substrate conveying device and a substrate conveying method that can reliably detect that a substrate has been delivered to a predetermined position.

本發明一實施形態提供一種對既定位置交接基板之基板搬送裝置。該基板搬送裝置包含有:保持部,其保持基板;往返機構,其使上述保持部相對於既定位置往返移動;光學感測器,其於上述保持部藉由上述往返機構進行移動之路徑上形成感測器區域;及控制部。上述控制部於基板之交付動作中,對搬送異常進行判斷。基板之交付動作包含上述保持部藉由上述往返機構而朝向既定位置移動之往路動作、及上述保持部藉由上述往返機構而以離開既定位置之方式移動之返路動作。上述控制部於基板之交付動作中,對上述保持部或由該保持部所保持之基板(以下稱為「保持基板」)通過上述感測器區域之第1通過期間(duration)進行檢測,並於 該第1通過期間與所預先設定之第1正常期間不同時,判斷為搬送異常。 An embodiment of the present invention provides a substrate transfer device for transferring substrates to a predetermined position. The substrate conveying device includes: a holding portion that holds a substrate; a shuttle mechanism that reciprocates the holding portion relative to a predetermined position; and an optical sensor formed on a path where the holding portion is moved by the shuttle mechanism The sensor area; and the control section. The above-mentioned control unit judges the conveyance abnormality during the substrate delivery operation. The substrate delivery operation includes a forward movement in which the holding portion moves to a predetermined position by the shuttle mechanism, and a return movement in which the holding portion moves away from the predetermined position by the shuttle mechanism. During the substrate delivery operation, the control unit detects the first passage period (duration) during which the holding part or the substrate held by the holding part (hereinafter referred to as the "holding substrate") passes through the sensor area, and in When the first passing period is different from the first normal period set in advance, it is determined that the conveyance is abnormal.

於本發明一實施形態中,上述既定位置係收納基板之基板收納容器內之位置,且上述光學感測器於上述基板收納容器外形成上述感測器區域。 In one embodiment of the present invention, the predetermined position is a position in the substrate storage container that stores the substrate, and the optical sensor forms the sensor area outside the substrate storage container.

於本發明一實施形態中,上述光學感測器之上述感測器區域係設定於對以偏移至上述基板收納容器外之狀態被載置之基板進行的位置。 In one embodiment of the present invention, the sensor area of the optical sensor is set at a position where the substrate is placed in a state shifted to the outside of the substrate storage container.

於本發明一實施形態中,上述保持部具有:抵接部,其抵接於基板之一端部;可伸縮之位置偏移防止機構,其以將基板之另一端部推向上述抵接部之方式而伸長而固定上述基板;及伸縮檢測部,其對上述位置偏移防止機構之伸縮動作進行檢測。上述位置偏移防止機構於上述往路移動中將基板加以固定,並於上述返路移動中解除基板之固定。上述伸縮檢測部於上述位置偏移防止機構將基板加以固定之狀態下對上述位置偏移防止機構之伸長進行檢測,並於上述位置偏移防止機構解除基板之固定之狀態下對上述位置偏移防止機構之收縮進行檢測。 In one embodiment of the present invention, the holding portion has: an abutting portion that abuts on one end of the substrate; a retractable position shift prevention mechanism that pushes the other end of the substrate toward the abutting portion The substrate is stretched and fixed in a manner; and an expansion/contraction detection unit that detects the expansion/contraction movement of the position shift prevention mechanism. The position shift prevention mechanism fixes the substrate during the forward movement, and releases the fixing of the substrate during the backward movement. The expansion and contraction detection section detects the elongation of the positional deviation prevention mechanism in the state where the positional deviation prevention mechanism is fixing the substrate, and shifts the position when the positional deviation prevention mechanism releases the fixing of the substrate Prevent the shrinkage of the organization for testing.

於本發明一實施形態中,上述保持部係沿著水平方向平坦之板狀構件,且於俯視時,上述板狀構件具有在保持有基板時與基板重疊之部分之至少一部分其中間部分被去除之中空區域,並於上述保持部正常地保持基板時,於俯視時基板與上述板狀構件之上述中空區域完全重疊,且在藉由上述往返機構使上述保持部往返移動時,上述保持部之上述中空區域通過上述路徑。 In one embodiment of the present invention, the holding portion is a plate-shaped member that is flat along the horizontal direction, and when viewed in a plan view, the plate-shaped member has at least a portion of a portion that overlaps the substrate when the substrate is held. When the holding portion normally holds the substrate, the substrate and the hollow area of the plate-shaped member are completely overlapped in a plan view, and when the holding portion is moved back and forth by the reciprocating mechanism, the holding portion The above-mentioned hollow area passes through the above-mentioned path.

於本發明一實施形態中,上述光學感測器係形成沿著 光軸之直線狀之上述感測器區域之穿透型感測器,且上述控制部將藉由上述穿透型感測器所投射之光線被上述保持部或上述保持基板所遮蔽之期間作為上述第1通過期間而加以檢測。 In an embodiment of the present invention, the optical sensor is formed along The transmissive sensor in the linear optical axis of the sensor area, and the control section uses the period during which the light projected by the transmissive sensor is shielded by the holding section or the holding substrate The detection is performed during the first passing period described above.

於本發明一實施形態中,上述光學感測器係藉由光線來形成上述感測器區域之反射型感測器,且上述控制部將藉由上述反射型感測器所投射之光線被上述保持部或上述保持基板所反射而被該反射型感測器所接收之期間作為上述第1通過期間而加以檢測。 In an embodiment of the present invention, the optical sensor is a reflective sensor in which the sensor area is formed by light, and the control unit is used for the light projected by the reflective sensor. The period during which the holding portion or the holding substrate is reflected and received by the reflective sensor is detected as the first passing period.

於本發明一實施形態中,上述控制部於藉由上述保持部來接收位於既定位置之基板之接收動作時,對搬送異常進行判斷。基板之接收動作包含上述保持部藉由上述往返機構而朝向既定位置移動之往路動作、及上述保持部藉由上述往返機構而以離開既定位置之方式移動之返路動作。上述控制部於基板之接收動作中,對上述保持部或上述保持基板通過上述感測器區域之第2通過期間進行檢測,並於該第2通過期間與所預先設定之第2正常期間不同時,判斷為搬送異常。 In an embodiment of the present invention, the control unit judges the conveyance abnormality when the receiving operation of the substrate at a predetermined position is received by the holding unit. The receiving operation of the substrate includes a forward movement in which the holding portion moves to a predetermined position by the shuttle mechanism, and a return movement in which the holding portion moves away from the predetermined position by the shuttle mechanism. In the substrate receiving operation, the control unit detects the second passage period during which the holding portion or the holding substrate passes through the sensor area, and when the second passage period is different from the preset second normal period , It is judged that the conveyance is abnormal.

於本發明一實施形態中,上述第1正常期間與上述第2正常期間係相同長度。 In one embodiment of the present invention, the first normal period and the second normal period have the same length.

於本發明一實施形態中,上述控制部根據藉由上述往返機構所進行之上述保持部之移動速度,來設定第1正常期間或第2正常期間。 In one embodiment of the present invention, the control unit sets the first normal period or the second normal period according to the moving speed of the holding unit by the reciprocating mechanism.

於本發明一實施形態中,上述控制部於上述交付動作時,將上述返路動作中藉由上述往返機構所進行之上述保持部之移動速度設為較上述往路動作中藉由上述往返機構所進行之上述保 持部之移動速度慢。 In one embodiment of the present invention, during the delivery operation, the control unit sets the moving speed of the holding portion by the shuttle mechanism in the return movement to be higher than that of the movement by the shuttle mechanism in the forward movement. The above-mentioned guarantee The moving speed of the holding part is slow.

本發明一實施形態提供一種對既定位置交接基板之基板搬送方法。該基板搬送方法包含有:第1往路步驟,其使保持有基板之保持部朝向既定位置移動;交付步驟,其執行將基板自上述保持部交付至既定位置之動作;第1返路步驟,其於交付步驟後使上述保持部自既定位置後退;第1檢測步驟,其於包含第1往路步驟及第1返路步驟之期間中,對上述第1通過期間係上述保持部或由該保持部所保持之基板(以下稱為「保持基板」)通過光學感測器在上述保持部移動之路徑上所形成之感測器區域的第1通過期間進行檢測;以及第1判斷步驟,其於在第1檢測步驟所檢測出之第1通過期間與所預先設定之第1正常期間不同時,判斷為搬送異常。 An embodiment of the present invention provides a substrate transport method for transferring substrates to a predetermined position. The substrate transport method includes: a first forward step, which moves the holding portion holding the substrate toward a predetermined position; a delivery step, which performs an action of delivering the substrate from the above-mentioned holding portion to the predetermined position; and a first return step, which After the delivery step, the holding portion is retracted from the predetermined position; the first detection step is the holding portion or the holding portion for the first passing period during the period including the first forward step and the first returning step The held substrate (hereinafter referred to as the "holding substrate") is detected by the optical sensor during the first passing period of the sensor area formed on the path of the holding portion moving; and the first judgment step is performed at When the first passing period detected in the first detection step is different from the first normal period set in advance, it is determined that the conveyance is abnormal.

於本發明一實施形態中,上述保持部包含有:抵接部,其抵接於基板之一端部;及可伸縮之位置偏移防止機構,其以將基板之另一端部推向上述抵接部之方式伸長而將上述基板加以固定。而且,於第1往路步驟中,藉由上述位置偏移防止機構將上述基板之另一端部推向上述抵接部而將上述基板加以固定來防止位置偏移,且對上述位置偏移防止機構之伸縮動作進行檢測。於第1返路步驟中,解除藉由上述位置偏移防止機構所進行之固定。 In an embodiment of the present invention, the holding portion includes: an abutment portion that abuts on one end of the substrate; and a retractable position shift prevention mechanism that pushes the other end of the substrate toward the abutment The above-mentioned substrate is fixed by extending the part. Furthermore, in the first advancing step, the positional deviation prevention mechanism pushes the other end of the substrate toward the abutting portion to fix the substrate to prevent positional deviation, and the positional deviation prevention mechanism The telescopic movement is detected. In the first return step, the fixation performed by the above-mentioned positional deviation prevention mechanism is released.

於本發明一實施形態中,上述第1返路動作中藉由上述往返機構所進行之上述保持部之移動速度,較上述第1往路動作中藉由上述往返機構所進行之上述保持部之移動速度慢。 In one embodiment of the present invention, the moving speed of the holding portion by the reciprocating mechanism in the first forward movement is higher than the movement of the holding portion by the reciprocating mechanism in the first forward movement The speed is slow.

於本發明一實施形態中,上述方法進一步包含有:第2往路步驟,其使上述保持部朝向位於既定位置之基板移動;接收步驟,其執行上述保持部接收位於既定位置之基板之接收動作;第 2返路步驟,其於上述接收步驟後使上述保持部自既定位置後退;第2檢測步驟,其於包含第2往路步驟及第2返路步驟之期間中,對上述保持部或上述保持基板通過上述感測器區域之第2通過期間進行檢測;以及第2判斷步驟,其於第2檢測步驟所檢測出之第2通過期間與所預先設定之第2正常期間不同時,判斷為搬送異常。 In an embodiment of the present invention, the above method further includes: a second forwarding step, which moves the holding portion toward the substrate located at a predetermined position; a receiving step, which performs a receiving action for the holding portion to receive the substrate located at the predetermined position; First 2 Returning step, which retreats the holding part from a predetermined position after the receiving step; and the second detection step, which involves applying the holding part or the holding substrate during the period including the second forwarding step and the second returning step Detect through the second pass period of the sensor area; and the second judgment step, which judges that the transport is abnormal when the second pass period detected in the second detection step is different from the preset second normal period .

於本發明一實施形態中,上述第1正常期間與上述第2正常期間係相同長度。 In one embodiment of the present invention, the first normal period and the second normal period have the same length.

根據本發明之實施形態,可確實地偵測藉由搬送部所搬送之基板已被交付至既定位置之情形。 According to the embodiment of the present invention, it is possible to reliably detect that the substrate conveyed by the conveying part has been delivered to a predetermined position.

本發明中上述或進一步之其他目的、特徵及效果,係參照隨附圖式並藉由以下所敍述之實施形態之說明而明確化。 The above or further other objects, features, and effects of the present invention are clarified by referring to the accompanying drawings and the description of the embodiments described below.

1‧‧‧基板處理裝置 1‧‧‧Substrate processing equipment

2‧‧‧分度單元 2‧‧‧Grading unit

3‧‧‧處理部 3‧‧‧Processing Department

4‧‧‧傳遞單元 4‧‧‧Transfer unit

5‧‧‧基板收納容器 5‧‧‧Substrate storage container

5a‧‧‧框體 5a‧‧‧Frame

5b‧‧‧蓋 5b‧‧‧cover

5c‧‧‧基板導引部 5c‧‧‧Substrate guide

6‧‧‧控制部 6‧‧‧Control Department

7‧‧‧間隔壁 7‧‧‧The next wall

7a‧‧‧間隔壁通過孔 7a‧‧‧Partition wall through hole

7b‧‧‧底部 7b‧‧‧Bottom

8、81‧‧‧光學感測器 8, 81‧‧‧Optical sensor

8a、8c、81a‧‧‧投光部 8a, 8c, 81a‧‧‧Projection part

8b、8d、81b‧‧‧受光部 8b, 8d, 81b‧‧‧light receiving part

12‧‧‧處理單元 12‧‧‧Processing unit

20‧‧‧本體 20‧‧‧Ontology

21‧‧‧支撐部 21‧‧‧Support

22‧‧‧爪導引部 22‧‧‧Claw guide

22a‧‧‧平面部 22a‧‧‧Plane

22b‧‧‧側面部 22b‧‧‧Side part

23‧‧‧後導引部 23‧‧‧ Rear Guide Department

24‧‧‧推動器部 24‧‧‧Propeller Department

24a‧‧‧可動部 24a‧‧‧movable part

24b‧‧‧固定部 24b‧‧‧Fixed part

25‧‧‧底座部 25‧‧‧Base

26、26A‧‧‧升降部 26、26A‧‧‧Elevating part

27、27A‧‧‧連結部 27, 27A‧‧‧Connecting part

28、28A‧‧‧伸縮部 28, 28A‧‧‧Retractable part

29‧‧‧推動器檢測部 29‧‧‧Pusher detection department

31:處理單元 31: Processing Unit

32:平台 32: platform

34:裝載埠開閉機構 34: Loading port opening and closing mechanism

34a:閘門構件 34a: Gate component

34b:閘門驅動部 34b: Gate drive unit

35:設置台 35: setting table

35a:上部水平面 35a: upper horizontal plane

35b:上部垂直面 35b: Upper vertical surface

61:儲存部 61: Storage Department

62:判定部 62: Judgment Department

63:驅動控制部 63: Drive Control Department

64:處理控制部 64: Processing Control Department

200:使用者界面 200: User interface

801:側壁 801: Sidewall

802:腔室 802: Chamber

803:旋轉夾盤 803: Rotating Chuck

804:處理液噴嘴 804: Treatment liquid nozzle

805:供給管 805: supply pipe

806:處理液閥 806: Treatment Liquid Valve

807:杯升降機構 807: Cup lifting mechanism

808:處理杯 808: Treatment Cup

811:開口 811: open

812:閘門 812: Gate

813:閘門升降機構 813: Gate Lifting Mechanism

814‧‧‧旋轉馬達 814‧‧‧Rotating Motor

815‧‧‧旋轉軸 815‧‧‧Rotation axis

A‧‧‧排列方向 A‧‧‧Arrangement direction

A1‧‧‧旋轉軸線 A1‧‧‧Rotation axis

B‧‧‧開口 B‧‧‧Open

C、D、E‧‧‧兩點箭頭鏈線 C, D, E‧‧‧Two-point arrow chain

CR‧‧‧中心機器人 CR‧‧‧Central Robot

F‧‧‧兩點鏈線 F‧‧‧Two-point chain line

FW‧‧‧前進位置 FW‧‧‧forward position

G‧‧‧兩點鏈線箭頭 G‧‧‧Two-point chain line arrow

H1、H2‧‧‧機器手 H1, H2‧‧‧Robot

HM‧‧‧起始位置 HM‧‧‧Starting position

IR‧‧‧分度機器人 IR‧‧‧Indexing Robot

L‧‧‧裝載埠開口 L‧‧‧Load port opening

LP‧‧‧裝載埠 LP‧‧‧Load Port

M‧‧‧移動路徑 M‧‧‧Movement path

NHP‧‧‧正常固定保持模式 NHP‧‧‧Normal fixed hold mode

NP1‧‧‧第1正常期間 NP1‧‧‧The first normal period

NP2‧‧‧第2正常期間 NP2‧‧‧The second normal period

NP3‧‧‧第3正常期間 NP3‧‧‧3rd normal period

PP1‧‧‧第1通過期間 PP1‧‧‧The 1st Pass Period

PP2‧‧‧第2通過期間 PP2‧‧‧Second Pass Period

PP3‧‧‧第3通過期間 PP3‧‧‧The third pass period

PP4‧‧‧第4通過期間 PP4‧‧‧The 4th pass period

PP5‧‧‧第5通過期間 PP5‧‧‧Fifth Pass Period

RHP‧‧‧實際固定保持模式 RHP‧‧‧Real fixed hold mode

RLS1、RLS2、RLS3、RLS4‧‧‧光信號 RLS1, RLS2, RLS3, RLS4‧‧‧Optical signal

S1~S8‧‧‧步驟 S1~S8‧‧‧Step

S11~S16‧‧‧步驟 S11~S16‧‧‧Step

SGP‧‧‧信號取得期間 SGP‧‧‧Signal acquisition period

SP1‧‧‧第1監視點 SP1‧‧‧The first monitoring point

SP2‧‧‧第2監視點 SP2‧‧‧The second monitoring point

t1~t6、t5a‧‧‧時間 t1~t6, t5a‧‧‧time

t11~t16、t15a‧‧‧時間 t11~t16, t15a‧‧‧time

W‧‧‧基板 W‧‧‧Substrate

圖1A係表示基板處理裝置之概略構成之俯視圖。 Fig. 1A is a plan view showing a schematic configuration of a substrate processing apparatus.

圖1B係表示基板處理裝置之概略構成之側視圖。 Fig. 1B is a side view showing the schematic configuration of the substrate processing apparatus.

圖2係表示裝載埠及分度單元之概略構成之側視圖。 Figure 2 is a side view showing the schematic structure of the loading port and the indexing unit.

圖3A係表示機器手之概略構成之俯視圖。 Fig. 3A is a plan view showing the schematic configuration of the robotic hand.

圖3B係表示機器手之概略構成之側視圖。 Fig. 3B is a side view showing the schematic configuration of the robot hand.

圖4係控制系統之方塊圖。 Figure 4 is a block diagram of the control system.

圖5係表示基板之搬送動作之流程圖。 Fig. 5 is a flow chart showing the conveying action of the substrate.

圖6A係表示基板正常地被載置於基板收納容器之情形時之動作例的圖。 FIG. 6A is a diagram showing an example of the operation when the substrate is normally placed in the substrate storage container.

圖6B係表示基板正常地被載置於基板收納容器之情形時之動作例的圖。 FIG. 6B is a diagram showing an example of the operation when the substrate is normally placed in the substrate storage container.

圖6C係表示基板正常地被載置於基板收納容器之情形時之動作例的圖。 FIG. 6C is a diagram showing an example of the operation when the substrate is normally placed in the substrate storage container.

圖6D係表示基板正常地被載置於基板收納容器之情形時之動作例的圖。 FIG. 6D is a diagram showing an example of the operation when the substrate is normally placed in the substrate storage container.

圖6E係表示基板正常地被載置於基板收納容器之情形時之動作例的圖。 FIG. 6E is a diagram showing an example of the operation when the substrate is normally placed in the substrate storage container.

圖7A係表示基板未正常地被載置於基板收納容器之情形時之動作例的圖。 FIG. 7A is a diagram showing an example of the operation when the substrate is not normally placed in the substrate storage container.

圖7B係表示基板未正常地被載置於基板收納容器之情形時之動作例的圖。 FIG. 7B is a diagram showing an example of the operation when the substrate is not normally placed in the substrate storage container.

圖8A係以時間序列來表示基板交付動作中正常之光學感測器之檢測信號及推動器檢測部之檢測信號的時序圖。 FIG. 8A is a time sequence diagram showing the detection signal of the normal optical sensor and the detection signal of the pusher detection part in the substrate delivery operation.

圖8B係以時間序列來表示基板交付動作中正常與異常之光學感測器之檢測信號及推動器檢測部之檢測信號的時序圖。 FIG. 8B is a time sequence diagram showing the detection signal of the normal and abnormal optical sensor and the detection signal of the pusher detection part in the substrate delivery operation.

圖9係表示處理單元之概略構成之側視圖。 Fig. 9 is a side view showing the schematic configuration of the processing unit.

圖10係表示基板處理裝置中基板之搬送動作之流程圖。 Fig. 10 is a flow chart showing the conveying action of the substrate in the substrate processing apparatus.

圖11係以時間序列來表示基板交付動作中正常與異常之光學感測器之檢測信號的時序圖。 FIG. 11 is a time sequence diagram showing the detection signals of the normal and abnormal optical sensors in the substrate delivery operation.

以下,參照隨附圖式,對本發明之第1實施形態詳細地進行說明。 Hereinafter, the first embodiment of the present invention will be described in detail with reference to the accompanying drawings.

圖1A係表示基板處理裝置之概略構成之俯視圖,圖1B係表示基板處理裝置之概略構成之側視圖。 FIG. 1A is a plan view showing the schematic structure of the substrate processing apparatus, and FIG. 1B is a side view showing the schematic structure of the substrate processing apparatus.

基板處理裝置1係利用藥液對基板進行處理之裝置。 例如,基板處理裝置1係用以對基板W之表面(上表面)實施藥液處理之單片型的裝置。基板W係配置有用以實現特定功能之功能部之板狀的構件。更具體而言,基板W係使用於半導體元件(半導體裝置)之製造之基板,且可為圓形狀之矽晶圓。藥液處理例如為洗淨處理、蝕刻處理、抗蝕劑塗佈處理、顯影處理等之半導體製程之主要步驟所使用之處理。 The substrate processing apparatus 1 is an apparatus for processing a substrate using a chemical liquid. For example, the substrate processing apparatus 1 is a monolithic apparatus for applying chemical liquid treatment to the surface (upper surface) of the substrate W. The substrate W is a plate-shaped member configured with functional parts for realizing specific functions. More specifically, the substrate W is a substrate used in the manufacture of semiconductor devices (semiconductor devices), and may be a round silicon wafer. The chemical solution treatment is, for example, a treatment used in the main steps of a semiconductor manufacturing process such as cleaning treatment, etching treatment, resist coating treatment, and development treatment.

如圖1A及圖1B所示,基板處理裝置1包含裝載埠LP、分度單元(indexer unit)2、處理部3、傳遞單元4、及控制部(controller)6。 As shown in FIGS. 1A and 1B, the substrate processing apparatus 1 includes a load port LP, an indexer unit 2, a processing unit 3, a transfer unit 4, and a controller 6.

裝載埠LP係配置於基板處理裝置1之一端,在俯視時,沿著排列方向A隔開間隔地配置有複數個。各裝載埠LP係被構成為將收納基板W之基板收納容器5加以保持,並將基板W導入基板處理裝置1之基板導入部。基板收納容器5係供基板W載置之載置部之一例。基板W自基板收納容器5朝向基板處理裝置1之內部被供給。 The load port LP is arranged at one end of the substrate processing apparatus 1, and in a plan view, a plurality of load ports LP are arranged at intervals along the arrangement direction A. Each load port LP is configured to hold the substrate storage container 5 storing the substrate W, and introduce the substrate W into the substrate introduction portion of the substrate processing apparatus 1. The substrate storage container 5 is an example of a mounting portion where the substrate W is mounted. The substrate W is supplied from the substrate storage container 5 toward the inside of the substrate processing apparatus 1.

分度單元2係與裝載埠LP連結而相對基板收納容器5搬出/搬入基板W之單元。處理部3具有複數個處理單元31,對基板W執行藥液處理。傳遞單元4係於分度單元2與處理部3之間保持基板W之單元。控制部6進行基板處理裝置1之控制。 The indexing unit 2 is a unit that is connected to the load port LP to carry out/carry in the substrate W with respect to the substrate storage container 5. The processing unit 3 has a plurality of processing units 31 and performs chemical liquid processing on the substrate W. The transfer unit 4 is a unit for holding the substrate W between the indexing unit 2 and the processing unit 3. The control unit 6 controls the substrate processing apparatus 1.

於本實施形態中,基板處理裝置1包含有12個處理單元12。更具體而言,基板處理裝置1包含沿著上下方向被積層之3組處理部3,各處理部3由平面地被配置之4個處理單元31所構成。進而,基板處理裝置1包含進行基板之搬送之搬送部。例如,搬送部包含有分度單元2所具備之分度機器人(indexer robot)IR、及處理部3 所具備之中心機器人CR。 In this embodiment, the substrate processing apparatus 1 includes 12 processing units 12. More specifically, the substrate processing apparatus 1 includes three sets of processing units 3 stacked in the vertical direction, and each processing unit 3 is composed of four processing units 31 arranged in a plane. Furthermore, the substrate processing apparatus 1 includes a conveyance section that conveys the substrate. For example, the conveying unit includes an indexer robot (IR) included in the indexing unit 2 and a processing unit 3 The central robot CR possessed.

分度單元2係配置於裝載埠LP與處理部3之間。於分度單元2之內部設置有分度機器人IR。於分度單元2之側面安裝有使用者界面200。使用者界面200具有顯示基板處理裝置1之狀態之顯示部,被構成為可藉由顯示部所具備之觸控面板來操作基板處理裝置1或輸入資訊。對基板處理裝置1之操作及輸入並不限定於利用觸控面板,亦可利用鍵盤或滑鼠來進行。 The indexing unit 2 is arranged between the load port LP and the processing unit 3. An indexing robot IR is installed inside the indexing unit 2. A user interface 200 is installed on the side of the indexing unit 2. The user interface 200 has a display unit that displays the state of the substrate processing apparatus 1 and is configured to operate the substrate processing apparatus 1 or input information through a touch panel provided in the display unit. The operation and input of the substrate processing apparatus 1 are not limited to using a touch panel, and can also be performed using a keyboard or a mouse.

分度機器人IR取出基板被收容於收納容器5之未處理之基板W並朝向傳遞單元(pass unit)4搬送。該未處理之基板W被保持於傳遞單元4。又,分度機器人IR在傳遞單元4保持有已藉由處理單元31被處理之處理完畢之基板W時,將該基板W自傳遞單元4朝向基板收納容器5搬送。 The indexing robot IR takes out the unprocessed substrate W contained in the storage container 5 and transports it toward the pass unit 4. The unprocessed substrate W is held by the transfer unit 4. In addition, when the transfer unit 4 holds the processed substrate W that has been processed by the processing unit 31, the indexing robot IR transfers the substrate W from the transfer unit 4 toward the substrate storage container 5.

分度機器人IR具備有沿著上下以積層狀態所設置之2個機器手H1(參照圖2),該等係保持部之例子。各機器手H1於俯視時係沿著水平方向平坦之板狀構件,且一端與支撐部21(參照圖3)連結。另一端具有在保持有基板W時與基板W重疊之部分之至少一部分其中間部分被去除之中空形狀。各機器手H1可將1片基板W以水平之姿勢加以保持。分度機器人IR使機器手H1沿著水平方向及鉛垂方向移動。此外,分度機器人IR藉由繞鉛垂線軸旋轉(自轉),來變更機器手H1之朝向。 The indexing robot IR is provided with two robots H1 (refer to FIG. 2) arranged in a stacked state along the top and bottom, and these are examples of holding parts. Each robot H1 is a plate-shaped member that is flat in the horizontal direction when viewed from above, and one end is connected to the support part 21 (refer to FIG. 3). The other end has a hollow shape in which at least a part of a portion overlapping with the substrate W when the substrate W is held, the middle part of which is removed. Each robot H1 can hold one substrate W in a horizontal posture. The indexing robot IR moves the robot hand H1 in the horizontal direction and the vertical direction. In addition, the indexing robot IR changes the orientation of the robot H1 by rotating (rotating) around the vertical axis.

分度機器人IR可沿著分度單元2內之移動路徑M(參照圖1)移動。移動路徑M被設計為與複數個裝載埠LP之排列方向平行。分度機器人IR可沿移動路徑M朝與任意之基板收納容器5對向之分度交接位置移動,且可於該分度交接位置,使機器手H1朝向對向之基板收納容器5之內部進入。 The indexing robot IR can move along the moving path M (refer to FIG. 1) in the indexing unit 2. The moving path M is designed to be parallel to the arrangement direction of the plurality of load ports LP. The indexing robot IR can move along the movement path M toward the indexing transfer position opposite to any substrate storage container 5, and at the indexing transfer position, the robot H1 can enter the opposite substrate storage container 5 .

分度機器人IR藉由在分度交接位置使機器手H1沿著水平方向移動,而使該機器手H1相對於基板收納容器5進入及後退。分度機器人IR進行在保持有基板W之狀態下使機器手H1進入基板收納容器5並於將基板W載置至基板收納容器5後後退之搬入動作(交付動作)。又,分度機器人IR進行使機器手H1進入基板收納容器5並於已保持基板收納容器5所收納之基板W後後退之搬出動作(接收動作)。如此,分度機器人1R係對基板收納容器5內之既定位置交接基板W之基板搬送裝置。分度機器人IR對傳遞單元4亦進行同樣之動作。 The indexing robot IR moves the robot H1 in the horizontal direction at the indexing transfer position, so that the robot H1 enters and retreats with respect to the substrate storage container 5. The indexing robot IR performs a loading operation (delivery operation) in which the robot H1 enters the substrate storage container 5 while holding the substrate W, and then retreats after placing the substrate W in the substrate storage container 5. In addition, the indexing robot IR performs an unloading operation (receiving operation) in which the robot H1 enters the substrate storage container 5 and retreats after holding the substrate W stored in the substrate storage container 5. In this way, the indexing robot 1R is a substrate transfer device that transfers the substrate W to a predetermined position in the substrate storage container 5. The indexing robot IR also performs the same action on the transfer unit 4.

中心機器人CR係與分度機器人IR同樣之構造,具備有沿著上下方向以積層狀態所設置之2個機器手H2,且該等係保持部之例子。各機器手H2係俯視時沿著水平方向平坦之板狀構件,且一端與支撐部21(參照圖3)連結。機器手H2之另一端具有在保持有基板W時與基板W重疊之部分之至少一部分其中間部分被去除之中空形狀。各機器手H2可將1片基板W以水平之姿勢加以保持。中心機器人CR使機器手H2沿著水平方向及鉛垂方向移動。此外,中心機器人CR藉由繞鉛垂線軸旋轉(自轉),來變更機器手H2之朝向。 The center robot CR has the same structure as the index robot IR, and includes two robots H2 arranged in a stacked state along the vertical direction, and an example of these system holding parts. Each robot H2 is a plate-shaped member that is flat along the horizontal direction in a plan view, and one end is connected to the support part 21 (refer to FIG. 3). The other end of the robot H2 has a hollow shape in which at least a part of the portion overlapping the substrate W when the substrate W is held is removed. Each robot H2 can hold one substrate W in a horizontal posture. The center robot CR moves the robot hand H2 in the horizontal direction and the vertical direction. In addition, the center robot CR changes the orientation of the robot hand H2 by rotating (rotating) around the vertical axis.

中心機器人CR於俯視時由複數個處理單元31所包圍。中心機器人CR於進行基板搬送時,使機器手H2與任意之處理單元31對向。例如,中心機器人CR在任意之處理單元31與機器手H2相對向之位置,移動(旋轉)至機器手H2可進入處理單元31內部之處理單元交接位置。 The central robot CR is surrounded by a plurality of processing units 31 when viewed from above. The central robot CR makes the robot H2 face any processing unit 31 when carrying out the substrate transfer. For example, the central robot CR moves (rotates) to a position where the robot H2 can enter the processing unit 31 at a position where the processing unit 31 opposes the robot H2.

中心機器人CR於處理單元交接位置,藉由使機器手H2沿著水平方向移動,而使其相對於處理單元31進入及後退。中心機器人CR進行在保持有基板W之狀態下使機器手H2進入處理單元31並在將基板W載置至處理單元31後後退之搬入動作(交付動作)。又,中心機器人CR進行使機器手H1進入處理單元31並在保持有被載置於處理單元31之基板W後後退之搬出動作(接收動作)。如此,中心機器人CR係對處理單元31內之既定位置交接基板W之基板搬送裝置。中心機器人CR對傳遞單元4亦進行同樣之動作。 At the handover position of the processing unit, the central robot CR moves the robot hand H2 in the horizontal direction to enter and retreat relative to the processing unit 31. The center robot CR performs a loading operation (delivery operation) in which the robot H2 enters the processing unit 31 while holding the substrate W, and then retreats after placing the substrate W on the processing unit 31. In addition, the center robot CR performs an unloading operation (receiving operation) in which the robot hand H1 enters the processing unit 31 and retreats after holding the substrate W placed on the processing unit 31. In this way, the central robot CR is a substrate transfer device that transfers the substrate W to a predetermined position in the processing unit 31. The central robot CR also performs the same action on the transfer unit 4.

中心機器人CR將被保持於傳遞單元4之未處理之基板W一次一片地朝向各處理單元31搬送。又,中心機器人CR視需要而在複數個處理單元31之間搬送基板W。中心機器人CR將已藉由處理單元31所處理之基板W自該處理單元31朝向傳遞單元4搬送。 The center robot CR transports the unprocessed substrates W held in the transfer unit 4 toward each processing unit 31 one at a time. In addition, the center robot CR transfers the substrate W between the plurality of processing units 31 as necessary. The central robot CR transports the substrate W processed by the processing unit 31 from the processing unit 31 toward the transfer unit 4.

處理單元31對基板W進行處理。處理單元31所進行之處理例如為洗淨處理。處理單元31所進行之處理,亦可取代洗淨處理,而為其他處理。所謂其他處理,例如為蝕刻處理、塗佈處理、及顯影處理等之藥液處理、或加熱處理及冷卻處理等之熱處理。 The processing unit 31 processes the substrate W. The processing performed by the processing unit 31 is, for example, washing processing. The processing performed by the processing unit 31 can also replace the washing processing and be other processing. The other treatments include, for example, chemical solution treatments such as etching treatment, coating treatment, and development treatment, or heat treatments such as heating treatment and cooling treatment.

圖2係表示裝載埠及分度單元之概略構成之側視圖。於圖2中,藉由對與上述相同之構成標示相同符號來省略詳細之說明。 Figure 2 is a side view showing the schematic structure of the loading port and the indexing unit. In FIG. 2, detailed descriptions are omitted by denoting the same symbols for the same components as described above.

作為基板W之載置部之基板收納容器5,係被構成為可收納複數個基板W之容器。基板收納容器5例如為將基板W以密閉之狀態收納之FOUP(前開式晶圓傳送盒;Front Opening Unified Pod)。基板收納容器5亦可取代FOUP,而為SMIF(標準化機械式介面;Standard Mechanical InterFace)傳送盒、以及OC(開放式晶圓盒;Open Cassette)等。 The substrate storage container 5 as the placement portion of the substrate W is configured as a container that can accommodate a plurality of substrates W. The substrate storage container 5 is, for example, a FOUP (Front Opening Unified Pod) that stores the substrate W in a sealed state. The substrate storage container 5 can also replace FOUP, and be a SMIF (Standard Mechanical InterFace) transfer box, and an OC (Open Cassette), etc.

例如,於將基板收納容器5設置於裝載埠LP時,在基板收納容器5內,成為水平姿勢之複數片基板W相互地隔開間隔而沿著鉛垂方向被積層之狀態。基板收納容器5收納例如25片基板W。但,於圖2中,出於方便而省略基板W之圖示之一部分。 For example, when the substrate storage container 5 is installed in the load port LP, in the substrate storage container 5, a plurality of substrates W in a horizontal posture are separated from each other and stacked in a vertical direction. The substrate storage container 5 contains, for example, 25 substrates W. However, in FIG. 2, a part of the illustration of the substrate W is omitted for convenience.

基板收納容器5具有框體5a、蓋5b、及複數個基板導引部5c。蓋5b可相對於框體5a之前表面進行拆卸,且框體5a之內部藉由蓋5b被安裝於框體5a之前表面所密閉。若將蓋5b拆卸,便於框體5a之前表面形成開口B。 The substrate storage container 5 has a frame 5a, a lid 5b, and a plurality of substrate guide portions 5c. The cover 5b can be detached from the front surface of the frame 5a, and the inside of the frame 5a is sealed by the cover 5b being installed on the front surface of the frame 5a. If the cover 5b is removed, it is convenient to form an opening B on the front surface of the frame 5a.

為了收納25片基板W,設置有25層之基板導引部5c。各層之基板導引部5c自蓋5b側觀察時,成對地且沿著前後方向水平延伸地被設置於基板收納容器5之左右內壁。基板導引部5c藉由支撐基板W之下表面側之端部,來支撐基板W。 In order to accommodate 25 substrates W, a 25-layer substrate guide 5c is provided. The substrate guide portions 5c of each layer are provided on the left and right inner walls of the substrate storage container 5 in pairs and horizontally extending in the front-rear direction when viewed from the side of the cover 5b. The substrate guide 5c supports the substrate W by supporting the end portion on the lower surface side of the substrate W.

裝載埠LP與分度單元2連結,被設置於處理部3之相反側。裝載埠LP具備有設置台35、平台32、及裝載埠開閉機構34。 The load port LP is connected to the indexing unit 2 and is provided on the opposite side of the processing unit 3. The load port LP is provided with a setting stand 35, a platform 32, and a load port opening and closing mechanism 34.

設置台35被配置於間隔壁7之側部,且於下部收納有電動馬達等之驅動機構。該驅動機構與閘門驅動部34b連結,並對其進行驅動。平台32被配置於設置台35之上部水平面35a,以相對於分度單元2接近及離開之方式被設置為可沿著水平方向移動(參照兩點箭頭鏈線C)。基板收納容器5被載置於平台32,藉由平台32朝分度單元2接近移動而與分度單元2連結。於設置台35之上部垂直面35b,設置有與間隔壁通過孔7a連通之裝載埠開口L。 The installation stand 35 is arranged on the side of the partition wall 7, and a drive mechanism such as an electric motor is housed in the lower part. This drive mechanism is connected to and drives the gate drive part 34b. The platform 32 is arranged on the upper horizontal surface 35a of the installation platform 35, and is installed to be movable in the horizontal direction so as to approach and leave the index unit 2 (refer to the two-point arrow chain C). The substrate storage container 5 is placed on the platform 32, and the platform 32 moves closer to the index unit 2 to be connected to the index unit 2. A loading port opening L communicating with the partition wall through hole 7a is provided on the upper vertical surface 35b of the setting platform 35.

裝載埠開閉機構34具備有閘門構件34a及閘門驅動部34b。閘門構件34a藉由嵌入裝載埠開口L而將裝載埠開口L加以關閉。閘門構件34a具有保持蓋5b之機構。平常,閘門構件34a呈嵌入 裝載埠開口L之狀態,而將裝載埠開口L關閉。 The load port opening and closing mechanism 34 includes a gate member 34a and a gate drive unit 34b. The gate member 34a is inserted into the load port opening L to close the load port opening L. The shutter member 34a has a mechanism for holding the cover 5b. Normally, the gate member 34a is embedded The state of the load port opening L, and the load port opening L is closed.

閘門驅動部34b與閘門構件34a連結。閘門驅動部34b使閘門構件34a沿著水平方向及垂直方向移動。 The gate drive portion 34b is connected to the gate member 34a. The gate drive unit 34b moves the gate member 34a in the horizontal direction and the vertical direction.

閘門構件34a具有保持蓋5b之機構。閘門驅動部34b在閘門構件34a保持有蓋5b之狀態下將閘門構件34a自裝載埠LP朝向分度單元2側(參照兩點鏈線箭頭D)移動,藉此使蓋5b自基板收納容器5脫離。此外,藉由閘門構件34a朝垂直下方向(參照兩點鏈線箭頭E)移動,基板收納容器5與分度單元2連通,而成為分度機器人IR之機器手H1可朝向基板收納容器5內部進入之狀態。閘門驅動部34b藉由被收納於設置台35之下部之驅動機構所驅動。驅動機構在典型上雖由電動馬達及滾珠螺桿所構成,但並不限定於此,亦可為使用汽缸之驅動機構。在將基板收納容器5封口時,進行與上述動作相反的動作,而以蓋5b來關閉開口B,並以閘門構件34a來關閉裝載埠開口L。 The shutter member 34a has a mechanism for holding the cover 5b. The gate driving section 34b moves the gate member 34a from the load port LP toward the indexing unit 2 side (refer to the two-dot chain arrow D) with the gate member 34a holding the cover 5b, thereby disengaging the cover 5b from the substrate storage container 5. . In addition, by moving the gate member 34a in the vertical downward direction (refer to the two-dot chain arrow E), the substrate storage container 5 communicates with the indexing unit 2, and the robot H1, which becomes the indexing robot IR, can face the inside of the substrate storage container 5. The state of entry. The gate driving portion 34b is driven by a driving mechanism housed in the lower part of the installation table 35. Although the drive mechanism is typically composed of an electric motor and a ball screw, it is not limited to this, and it may be a drive mechanism using a cylinder. When the substrate storage container 5 is sealed, an operation opposite to the above-mentioned operation is performed, the opening B is closed with the lid 5b, and the load port opening L is closed with the shutter member 34a.

光學感測器8係以光學方式來檢測物體之有無的感測器。例如,光學感測器8亦可為穿透型感測器。又,光學感測器8在機器手H1移動之路徑上形成感測器區域。具有穿透型感測器之形態之光學感測器8,具有投光部8a及受光部8b。投光部8a與受光部8b係以在裝載埠開口L之上下位置相互地對向之方式使光軸對齊而被設置。光學感測器8在投光部8a與受光部8b之間沿著光軸形成直線狀之感測器區域。具有穿透型感測器之形態的光學感測器8,對投光狀態與遮光狀態進行檢測。所謂投光狀態係指自投光部8a所投射之光未被遮蔽而由受光部8b所接收之狀態。所謂遮光狀態係指自投光部8a所投射之光由通過感測器區域之物體所遮蔽而不會由受光 部8b所接收之狀態。例如,在分度機器人IR朝基板收納容器5搬送基板W時,機器手H1本體或由機器手H1所保持之基板W會遮蔽投光部8a與受光部8b之間之光路(感測器區域)。據此,光學感測器8之檢測狀態藉由機器手H1本體或基板W是否存在於感測器區域,而在投光狀態與遮光狀態之間進行切換。例如,光學感測器8對判定部62(參照圖4)輸出將投光狀態設為導通(ON),並將遮光狀態設為斷開(OFF)之導通/斷開信號。 The optical sensor 8 is a sensor that optically detects the presence or absence of an object. For example, the optical sensor 8 may also be a transmissive sensor. In addition, the optical sensor 8 forms a sensor area on the moving path of the robot H1. The optical sensor 8 in the form of a transmissive sensor has a light projecting part 8a and a light receiving part 8b. The light projecting portion 8a and the light receiving portion 8b are arranged so that the upper and lower positions of the load port opening L are opposed to each other with the optical axis aligned. The optical sensor 8 forms a linear sensor area along the optical axis between the light projecting portion 8a and the light receiving portion 8b. The optical sensor 8 in the form of a transmissive sensor detects the light-emitting state and the light-shielding state. The so-called light-emitting state refers to a state where the light projected from the light-emitting portion 8a is not shielded but is received by the light-receiving portion 8b. The so-called light-shielding state means that the light projected from the light-emitting portion 8a is shielded by objects passing through the sensor area and will not be light-receiving The status received by part 8b. For example, when the indexing robot IR transfers the substrate W to the substrate storage container 5, the main body of the robot H1 or the substrate W held by the robot H1 shields the optical path (sensor area) between the light projecting part 8a and the light receiving part 8b. ). Accordingly, the detection state of the optical sensor 8 is switched between the light-emitting state and the light-shielded state by whether the body of the robot H1 or the substrate W exists in the sensor area. For example, the optical sensor 8 outputs an on/off signal to the determination unit 62 (see FIG. 4) to set the light emission state to be on (ON) and the light shielding state to be off (OFF).

光學感測器8亦可具有反射型感測器之形態。具有反射型感測器之形態之光學感測器8,具有投光部8c及受光部8d,且該等被設置於裝載埠開口L之下位置或上位置(於圖2表示設置於下位置之例子)。具有反射型感測器之形態之光學感測器8,係配置為投光部8c之光軸與受光部8d之光軸在感測器區域交叉。感測器區域於裝載埠開口L,被設定於機器手H1或由其所保持之基板W之通過路徑上。換言之,感測器區域係藉由自投光部8c所投射,並被位在上述通過路徑之物體所反射而由上述受光部8d所接收之光線來定義。具有反射型感測器之形態之光學感測器8對投光狀態與反射狀態進行檢測。所謂投光狀態係指自投光部8c所投射之光不會由受光部8d所接收之狀態。所謂反射狀態係指自投光部8c所投射之光由通過感測器區域之物體所反射,且反射之光由受光部8d所接收之狀態。例如,在分度機器人IR朝基板收納容器5搬送基板W時,機器手H1本體或由機器手H1所保持之基板W,反射自投光部8c所投射之光,且反射之光由受光部8d所接收。據此,光學感測器8藉由機器手H1或基板W是否存在於感測器區域,而在投光狀態與反射狀態之間進行切換。例如,光學感測器8對判定部62(參照圖4)輸出投光狀 態設為導通,並將反射狀態設為斷開之導通/斷開信號。 The optical sensor 8 may also have the form of a reflective sensor. The optical sensor 8 in the form of a reflective sensor has a light-projecting portion 8c and a light-receiving portion 8d, and these are arranged at the lower or upper position of the load port opening L (shown in FIG. 2 at the lower position Example). The optical sensor 8 in the form of a reflective sensor is arranged such that the optical axis of the light projecting portion 8c and the optical axis of the light receiving portion 8d intersect in the sensor area. The sensor area at the load port opening L is set on the path of the robot H1 or the substrate W held by it. In other words, the sensor area is defined by the light projected from the light projecting portion 8c, reflected by the object located in the passing path, and received by the light receiving portion 8d. The optical sensor 8 in the form of a reflective sensor detects the light projection state and the reflection state. The so-called light-emitting state refers to a state where the light projected from the light-emitting portion 8c is not received by the light-receiving portion 8d. The so-called reflection state refers to a state where the light projected from the light projecting portion 8c is reflected by an object passing through the sensor area, and the reflected light is received by the light receiving portion 8d. For example, when the indexing robot IR transfers the substrate W to the substrate storage container 5, the main body of the robot H1 or the substrate W held by the robot H1 reflects the light projected from the light projecting portion 8c, and the reflected light is transmitted by the light receiving portion 8d received. Accordingly, the optical sensor 8 is switched between the light projection state and the reflection state according to whether the robot H1 or the substrate W exists in the sensor area. For example, the optical sensor 8 outputs a projected light shape to the determination unit 62 (refer to FIG. 4) The state is set to on, and the reflection state is set to off, the on/off signal.

藉由使用光學感測器3,可不遮住通過空間之通過物之通過路徑而根據導通/斷開信號,正確地檢測出通過空間之通過物。 By using the optical sensor 3, the passage of objects passing through the space can be correctly detected based on the on/off signal without blocking the passage of objects passing through the space.

分度單元2由間隔壁7所覆蓋。藉此,分度單元2之內部自外部環境氣體被隔離,而被維持而清潔之環境。於與裝載埠LP連結之間隔壁7,設置有用以供基板W通過之間隔壁通過孔7a。於分度單元2之底部7b,配置有分度機器人IR。 The index unit 2 is covered by the partition wall 7. Thereby, the inside of the indexing unit 2 is isolated from the external ambient air, and a clean environment is maintained. The partition wall 7 connected to the load port LP is provided with a partition wall passage hole 7a for the substrate W to pass through. At the bottom 7b of the indexing unit 2, an indexing robot IR is arranged.

分度機器人IR具有2個機器手H1、底座部25、升降部26、連結部27、及一對伸縮部28。底座部25被固定於分度單元之底部7b而形成分度機器人IR之基台。 The index robot IR has two robots H1, a base part 25, an elevating part 26, a connecting part 27, and a pair of telescopic parts 28. The base part 25 is fixed to the bottom 7b of the indexing unit to form the base of the indexing robot IR.

升降部26自底座部25朝鉛垂上方延伸,並於內部具有升降機構。升降機構典型上雖由馬達、編碼器、及滾珠螺桿所構成,但亦可由汽缸所構成。升降部26可變更機器手H1於垂直方向上之停止位置。具體而言,升降部26可將機器手H1之高度位置,調整為拾取位置(下位置)與放置位置(上位置)。所謂拾取位置係將基板W自基板收納容器5搬出時機器手H1之爪導引部22(參照圖3B)之最上部較搬出對象之基板W之下表面低的高度位置。所謂放置位置係將基板W朝向基板收納容器5搬入時機器手H1之下表面較基板導引部5c之上表面高之高度位置。關於機器手H1之構成之細部將於後述之。 The lifting part 26 extends vertically upward from the base part 25 and has a lifting mechanism inside. Although the lifting mechanism is typically composed of a motor, an encoder, and a ball screw, it can also be composed of a cylinder. The lifting part 26 can change the stop position of the robot H1 in the vertical direction. Specifically, the lifting part 26 can adjust the height position of the robot H1 to a picking position (lower position) and a placing position (upper position). The pick-up position is a position where the uppermost part of the claw guide 22 (see FIG. 3B) of the robot H1 when the substrate W is carried out from the substrate storage container 5 is lower than the lower surface of the substrate W to be carried out. The placement position is a height position where the lower surface of the robot H1 is higher than the upper surface of the substrate guide portion 5c when the substrate W is carried in toward the substrate storage container 5. The details of the composition of the robot H1 will be described later.

連結部27將升降部26與伸縮部28加以連結,而將升降部26之升降動作傳遞至伸縮部28。連結部27將2個伸縮部28連結於其上部。各伸縮部28將支撐機器手H1之支撐部21連結於其上部。2個伸縮部28及各自對應之2個支撐部21分別連結於2個機器手H1,而 可使2個機器手H1個別地進退動作。 The connecting part 27 connects the lifting part 26 and the telescopic part 28, and transmits the lifting motion of the lifting part 26 to the telescopic part 28. The connecting part 27 connects the two telescopic parts 28 to the upper part. Each telescopic part 28 connects the support part 21 which supports the robot H1 to the upper part. The two telescopic parts 28 and the corresponding two supporting parts 21 are respectively connected to the two robot hands H1, and Two robots H1 can advance and retreat individually.

伸縮部28具有複數個關節,藉由關節部之旋轉驅動而進行伸縮動作。伸縮部28可藉由伸縮動作來變更機器手H1之水平方向之位置。例如,關於上側之機器手H1,將沿著水平方向使伸縮部28之關節收縮之位置(實線)設為起始位置HM(後退位置),並將沿著水平方向使關節伸展之位置(兩點鏈線F)設為前進位置FW(進入位置)。起始位置HM係機器手H1於水平方向上之基準位置。伸縮部28可藉由複數個關節之伸縮而使設置空間變小。關於下側之機器手H1亦同。如此,伸縮部28構成使機器手H1往返移動之之往返機構。 The telescopic part 28 has a plurality of joints, and performs telescopic action by rotating and driving the joint parts. The telescopic part 28 can change the position of the robot H1 in the horizontal direction by telescopic action. For example, regarding the upper robot hand H1, the position (solid line) at which the joint of the telescopic part 28 is contracted in the horizontal direction is set as the starting position HM (reverse position), and the position where the joint is extended in the horizontal direction ( The two-point chain line F) is set to the forward position FW (entry position). The starting position HM is the reference position of the robot H1 in the horizontal direction. The expansion and contraction part 28 can reduce the installation space by expansion and contraction of a plurality of joints. The same goes for the lower robot H1. In this way, the telescopic portion 28 constitutes a reciprocating mechanism for reciprocating the robot hand H1.

分度單元2藉由分度機器人IR,自基板收納容器5取得未處理之基板W,並交付至傳遞單元4。藉由處理單元31所處理之基板W,係放置於傳遞單元4。該處理完畢之基板W可藉由分度機器人IR朝向基板收納容器5搬送並加以收納。 The indexing unit 2 obtains the unprocessed substrate W from the substrate storage container 5 by the indexing robot IR, and delivers it to the transfer unit 4. The substrate W processed by the processing unit 31 is placed in the transfer unit 4. The processed substrate W can be transported toward the substrate storage container 5 and stored by the indexing robot IR.

圖3A係表示機器手之概略構成之俯視圖,圖3B係表示機器手之概略構成之側視圖。藉由對上述之構成標示相同符號而省略詳細之說明。 Fig. 3A is a plan view showing the schematic configuration of the robotic hand, and Fig. 3B is a side view showing the schematic configuration of the robotic hand. The detailed description is omitted by assigning the same symbols to the above-mentioned components.

如圖3A所示,機器手H1具有本體20、支撐部21、爪導引部22、後導引部23、及推動器部24。 As shown in FIG. 3A, the robot hand H1 has a main body 20, a supporting part 21, a claw guide part 22, a rear guide part 23, and a pusher part 24.

本體20於俯視(自上表面觀察)時係沿著水平方向平坦之板狀構件,且一端與支撐部21連結。另一端具有於保持有基板W時與基板W重疊之部分之至少一部分其中間部分被去除之中空形狀。本體20可以水平之姿勢來保持基板W。例如,中空形狀係V字型形狀。本體20例如以陶瓷或鋁等輕量且具有強度之材料所形成。 The main body 20 is a plate-shaped member that is flat along the horizontal direction in a plan view (viewed from the upper surface), and one end is connected to the supporting portion 21. The other end has a hollow shape in which at least a part of a portion overlapping with the substrate W when the substrate W is held is removed. The main body 20 can hold the substrate W in a horizontal position. For example, the hollow shape is a V-shaped shape. The main body 20 is formed of, for example, a lightweight and strong material such as ceramic or aluminum.

在機器手H1通過光學感測器8之感測器區域時,藉由 機器手H1具有中空形狀,可利用光學感測器8容易地檢測出基板W是否存在於機器手H1上。具體而言,在機器手H1保持有基板W時,基板W與機器手H1之中空區域重疊。藉由利用光學感測器8來檢測該基板W所重疊之部分,可容易地檢測出基板W被保持於機器手H1上之情形。如後述般,即便基板W以跨上機器手H1上之狀態存在於該機器手H1上時,基板W也與機器手H1之中空區域重疊。藉由利用光學感測器8來檢測出該基板W所重疊之部分,可容易地檢測出基板W位於機器手H1上之情形。 When the robot H1 passes through the sensor area of the optical sensor 8, by The robot H1 has a hollow shape, and the optical sensor 8 can easily detect whether the substrate W is present on the robot H1. Specifically, when the substrate W is held by the robot H1, the substrate W overlaps the hollow area of the robot H1. By using the optical sensor 8 to detect the overlapped portion of the substrate W, it can be easily detected that the substrate W is held on the robot hand H1. As will be described later, even if the substrate W exists on the robot H1 in a state of straddling the robot H1, the substrate W overlaps the hollow area of the robot H1. By using the optical sensor 8 to detect the overlapped portion of the substrate W, it can be easily detected that the substrate W is located on the robot hand H1.

爪導引部22分別被設置於本體20之V字型形狀之各前端,於側視時呈L字型形狀。爪導引部22具有以平面部22a自下方支撐基板W,並以側面部22b支撐基板W之周端部的構造。 The pawl guide 22 is respectively provided at each front end of the V-shaped shape of the main body 20, and has an L-shaped shape when viewed from the side. The claw guide 22 has a structure in which the substrate W is supported from below by a flat surface portion 22a, and the peripheral end of the substrate W is supported by a side surface portion 22b.

後導引部23係設置於較本體20之表面之爪導引部22更支撐部21側,以可支撐基板W之方式自爪導引部22隔開固定之距離被配置。後導引部23於本實施形態中為大致圓柱形,具備具有自圓柱之中段越朝向上方越細之斜率之傾斜部分,以被構成為藉由該傾斜部分來支撐基板W之周端部。 The rear guide portion 23 is disposed on the support portion 21 side of the claw guide portion 22 on the surface of the main body 20, and is arranged at a fixed distance from the claw guide portion 22 in such a way that the substrate W can be supported. The rear guide portion 23 is substantially cylindrical in this embodiment, and has an inclined portion with a slope that becomes thinner from the middle section of the cylinder toward the upper side, so as to be configured to support the peripheral end of the substrate W by the inclined portion.

基板W由2個爪導引部22與2個後導引部23之4個點所支撐。藉此,相較於被直接支撐於本體20之整個面之情形,與基板W之背面及端部之接觸面積較小,且據此可減少基板W之背面之損傷或污染之產生。 The substrate W is supported by four points of two claw guides 22 and two rear guides 23. As a result, compared with the case where it is directly supported on the entire surface of the main body 20, the contact area with the back surface and the end of the substrate W is smaller, and accordingly, the damage or contamination of the back surface of the substrate W can be reduced.

如圖3B所示,藉由爪導引部22及後導引部23所保持之基板W之上表面,較爪導引部22及後導引部23之最上部低。因此,基板W不容易自機器手H1脫離。 As shown in FIG. 3B, the upper surface of the substrate W held by the claw guide 22 and the rear guide 23 is lower than the uppermost part of the claw guide 22 and the rear guide 23. Therefore, the substrate W is not easily detached from the robot H1.

推動器部24具有可動部24a、及固定部24b。可動部24a 與固定部24b連結,固定部24b被固定於支撐部21。 The pusher part 24 has a movable part 24a and a fixed part 24b. Movable part 24a It is connected to the fixing portion 24 b, and the fixing portion 24 b is fixed to the support portion 21.

可動部24a係可朝沿著本體20之水平延伸之方向(圖3A之兩點鏈線箭頭G)進行伸縮動作之伸縮部。可動部24a藉由例如彈簧、汽缸、馬達等所驅動而進行伸縮。於基板W被載置於機器手H1時,基板W由爪導引部22及後導引部23所支撐。於該狀態下,藉由可動部24a朝基板W側伸長,可將基板W夾入並加以固定保持。例如,藉由可動部24a朝基板W側伸長,壓住基板W之端部,基板W之端部被壓抵於爪導引部22之側面部22b,而利用可動部24a與爪導引部22將基板W夾入並加以固定保持。相反地,藉由可動部24a收縮,而自基板W之端部離開從而解除固定保持。 The movable portion 24a is an expansion and contraction portion that can perform expansion and contraction in a direction along the horizontal extension of the main body 20 (two-dot chain line arrow G in FIG. 3A). The movable portion 24a is driven to expand and contract by, for example, a spring, a cylinder, a motor, or the like. When the substrate W is placed on the robot H1, the substrate W is supported by the claw guide 22 and the rear guide 23. In this state, by extending the movable portion 24a toward the substrate W side, the substrate W can be sandwiched and fixedly held. For example, by extending the movable part 24a toward the substrate W and pressing the end of the substrate W, the end of the substrate W is pressed against the side surface 22b of the claw guide 22, and the movable part 24a and the claw guide 22 sandwiches the substrate W and fixes it. Conversely, as the movable portion 24a contracts and moves away from the end of the substrate W, the fixed holding is released.

在分度機器人IR或中心機器人CR搬送基板W時,若以高速進行直進動作或旋轉動作,便會因振動或慣性力而存在使基板W掉落之可能性。然而,藉由在機器手H1上將基板W加以固定保持,推動器部24作為防止基板W之位置偏移之位置偏移防止機構而發揮作用。因此,即便於分度機器人IR或中心機器人CR以高速進行直進動作或旋轉動作之情形時,亦可防止基板W之位置偏移。由於藉由將基板W加以固定保持,可消除使基板W掉落之可能性,因此分度機器人IR或中心機器人CR可進行與機器手H1未保持有基板W之狀態相同之高速移動。 When the indexing robot IR or the center robot CR transports the substrate W, if the linear motion or rotation motion is performed at a high speed, the substrate W may fall due to vibration or inertial force. However, by fixing and holding the substrate W on the robot H1, the pusher portion 24 functions as a positional deviation prevention mechanism for preventing the positional deviation of the substrate W. Therefore, even when the index robot IR or the center robot CR performs linear motion or rotation motion at high speed, the positional deviation of the substrate W can be prevented. Since the substrate W is fixed and held, the possibility of dropping the substrate W can be eliminated. Therefore, the indexing robot IR or the center robot CR can move at the same high speed as the robot H1 without holding the substrate W.

推動器部24具有推動器檢測部29(伸縮檢測部)。推動器檢測部29對可動部24a之伸長量進行推測。若可動部24a伸長固定之伸長量以上,可動部24a便可將基板W加以固定保持。例如,推動器檢測部29於可動部24a成為固定之伸長量以上時檢測為伸長狀態,而於未滿固定之伸長量時檢測為收縮狀態。推動器檢測部29例 如對判定部62輸出將伸長狀態設為導通信號並將收縮狀態設為斷開信號之導通/斷開信號。若自推動器檢測部29所輸出之信號為導通,判定部62便判定為基板W之固定保持狀態,若為斷開,基板W便判定為解除固定狀態。固定之伸長量係根據設計資料或過去之實績等所決定,並被保存於儲存部61。例如,亦可取代藉由推動器檢測部29來檢測伸長量,而根據藉由相機攝影所得到之拍攝圖像來檢測伸長量。 The pusher part 24 has a pusher detection part 29 (a telescopic detection part). The pusher detection part 29 estimates the extension amount of the movable part 24a. If the movable portion 24a is extended by more than the fixed extension amount, the movable portion 24a can fix and hold the substrate W. For example, the pusher detection portion 29 detects the extended state when the movable portion 24a becomes more than the fixed extension amount, and detects the contracted state when the fixed extension amount is less than full. 29 cases of pusher detection department For example, an on/off signal that sets the extended state as an on signal and the contracted state as an off signal is output to the determination section 62. If the signal output from the pusher detection unit 29 is ON, the determination unit 62 determines that the substrate W is in a fixed holding state, and if it is disconnected, the substrate W is determined to be an unlocked state. The fixed amount of elongation is determined based on design data or past performance, and is stored in the storage unit 61. For example, instead of detecting the elongation amount by the pusher detection unit 29, the elongation amount may be detected based on a captured image obtained by camera photography.

圖4係控制系統之方塊圖。如圖4所示,控制部6對基板處理裝置1之各構成部進行控制。控制部6具有判定部62、儲存部61、驅動控制部63、及處理控制部64。 Figure 4 is a block diagram of the control system. As shown in FIG. 4, the control part 6 controls each component part of the substrate processing apparatus 1. As shown in FIG. The control unit 6 has a determination unit 62, a storage unit 61, a drive control unit 63, and a processing control unit 64.

儲存部61儲存有用以控制基板處理裝置1之各構成部所必需的資訊。例如,儲存部61作為正常期間而儲存有在分度機器人IR將由機器手H1所保持之基板W交付至基板收納容器5之基板交付動作中基板W被正常地交付時自光學感測器8所輸出之斷開信號之持續時間。基板交付動作由分度機器人IR將保持有基板W之機器手H1自起始位置HM朝向前進位置FW移動之往路移動、將機器手H1自放置位置朝向拾取位置而朝垂直下方移動並將由機器手H1所保持之基板W載置於基板導引部5c之載置移動、及將機器手H1自前進位置FW朝向起始位置HM移動之返路移動所構成。正常期間係根據設計資料、評價資料、及過去之實績等所決定之基板W被正常地搬送之期間,可根據機器手H1之移動距離或移動速度任意地變更。又,正常期間亦可考慮因動作偏差所導致微小之時間偏差,而使其於正側及/或負側具有一定之裕度。 The storage unit 61 stores information necessary to control each component of the substrate processing apparatus 1. For example, as a normal period, the storage unit 61 stores the substrate W from the optical sensor 8 when the substrate W is normally delivered during the substrate delivery operation in which the indexing robot IR delivers the substrate W held by the robot H1 to the substrate storage container 5 The duration of the output disconnect signal. In the substrate delivery operation, the indexing robot IR moves the robot H1 holding the substrate W from the starting position HM to the forward position FW, and moves the robot H1 from the placement position to the picking position and moves vertically downward and will be moved by the robot H1. The substrate W held by H1 is placed on the substrate guide portion 5c for placement movement, and the robot H1 is composed of a return movement that moves the robot H1 from the advance position FW to the start position HM. The normal period is the period during which the substrate W is normally transported, which is determined based on the design data, evaluation data, and past performance, and can be arbitrarily changed according to the moving distance or moving speed of the robot H1. In addition, during the normal period, the slight time deviation caused by the operation deviation can also be considered, so that it has a certain margin on the positive side and/or the negative side.

例如,儲存部61作為正常時序信號而儲存有在基板交 付動作中於往路移動開始時(起始位置HM)自推動器檢測部29所輸出之導通信號。此外,儲存部61作為正常時序信號而儲存有在基板交付動作中於往路移動結束時(前進位置FW)自推動器檢測部29所輸出之斷開信號。該等正常時序信號係根據設計資料、評價資料、及過去之實績等所決定。又,正常時序信號亦可考慮因動作偏差所導致微小之時間偏差,而使其於正側及/或負側具有一定之裕度。 For example, the storage unit 61 stores the signals on the substrate as a normal timing signal. The on-signal output from the pusher detection unit 29 at the start of the forward movement (starting position HM) during the auxiliary operation. In addition, the storage unit 61 stores the disconnection signal output from the pusher detection unit 29 at the end of the forward movement (forward position FW) during the substrate delivery operation as a normal timing signal. These normal timing signals are determined based on design data, evaluation data, and past performance. In addition, the normal timing signal can also consider the slight time deviation caused by the action deviation, so that it has a certain margin on the positive side and/or the negative side.

例如,儲存部61而儲存有在基板交付動作中基板W被正常地固定保持及解除固定時自推動器檢測部29依照時間序列所輸出之導通/斷開信號模式。具體而言,正常固定保持模式NHP表示在分度機器人IR使機器手H1以固定保持有基板W之狀態自起始位置HM朝向前進位置FW往路移動至解除機器手H1之固定為止的期間中,自推動器檢測部29所輸出之時間序列之導通/斷開信號之切換。正常固定保持模式NHP係根據設計資料、評價資料、及過去之實績等所決定。正常固定保持模式NHP亦可考慮因動作偏差所導致微小之時間偏差而使其於正側及/或負側具有一定之裕度。 For example, the storage unit 61 stores the on/off signal patterns output by the pusher detection unit 29 in a time series when the substrate W is normally fixed and held during the substrate delivery operation. Specifically, the normal fixed holding mode NHP means that the indexing robot IR moves the robot H1 to the forward position FW from the starting position HM to the forward position FW in a state where the indexing robot IR holds the substrate W until the robot H1 is released. Switching of the on/off signal of the time series output from the pusher detection unit 29. The normal fixed maintenance mode NHP is determined based on design data, evaluation data, and past performance. The normal fixed hold mode NHP can also consider the slight time deviation caused by the action deviation, so that it has a certain margin on the positive side and/or the negative side.

又,儲存部61儲存有表示一連串之裝置動作之各種配方。例如,儲存部61儲存有異常時配方。異常時配方係於在基板之交付動作中判定部62根據光學感測器8所檢測出之導通/斷開信號而判定為異常之情形時,對基板處理裝置1之各構成部執行控制動作時所使用。作為異常時配方,儲存部61例如儲存有將分度機器人IR及閘門驅動部34b即時停止,而且使處理單元31於處理後停止,並使中心機器人CR於基板搬送後停止,且發出表示異常之警報之一連串之裝置動作。基於來自推動器檢測部29之導通/斷開信號之異常時配方亦同。異常時配方、即異常發生時之裝置動作,可任意地變更。 In addition, the storage unit 61 stores various recipes representing a series of device operations. For example, the storage unit 61 stores an abnormality recipe. The recipe at the time of abnormality is when the judgment section 62 judges that it is abnormal based on the on/off signal detected by the optical sensor 8 during the delivery operation of the substrate, and when the control operation is performed on each component of the substrate processing apparatus 1 Used. As a recipe at the time of an abnormality, the storage unit 61 stores, for example, that the indexing robot IR and the gate drive unit 34b are stopped immediately, and the processing unit 31 is stopped after processing, and the center robot CR is stopped after the substrate is transported, and sends out an abnormality indication. The alarm is a series of device actions. The recipe is also the same when the abnormality is based on the on/off signal from the pusher detection unit 29. The recipe when an abnormality occurs, that is, the device action when an abnormality occurs, can be changed arbitrarily.

利用光學感測器8所檢測出之導通/斷開之信號,被輸入至判定部62。判定部62對於基板W之搬送動作,將伴隨著機器手H1之移動而自光學感測器8所輸出之斷開之信號之持續時間設為通過期間。判定部62將自光學感測器8所輸入之信號從導通變為斷開之時序設為測量開始點,並於其後,將自斷開變為導通之時序設為測量結束點。判定部62於自測量開始點即便經過所預先決定之既定期間光學感測器8之信號仍未自斷開變為導通之情形時,將經過該既定期間之時間點設為測量結束點。判定部62將通過期間與儲存部61所儲存之正常期間加以比較。判定部62於通過期間與正常期間一致時判定基板W之搬送動作為正常,而於不同時判定基板W之搬送動作為不正常(搬送異常)。在判定為搬送異常時,控制部6對控制基板處理裝置1之各構成部進行控制,而執行異常時配方。 The ON/OFF signal detected by the optical sensor 8 is input to the determination unit 62. Regarding the transfer operation of the substrate W, the judging unit 62 sets the duration of the disconnection signal output from the optical sensor 8 accompanying the movement of the robot H1 as the passing period. The judging unit 62 sets the timing when the signal input from the optical sensor 8 changes from on to off as the measurement start point, and thereafter sets the timing from off to on as the measurement end point. When the signal of the optical sensor 8 has not been turned off to on even after a predetermined period has passed since the measurement start point, the determination unit 62 sets the time point when the predetermined period has elapsed as the measurement end point. The determination unit 62 compares the passing period with the normal period stored in the storage unit 61. The judging section 62 judges that the conveying operation of the substrate W is normal when the passing period coincides with the normal period, but judges that the conveying operation of the substrate W is abnormal (abnormal conveying) at the same time. When it is determined that the conveyance is abnormal, the control unit 6 controls each component of the control substrate processing apparatus 1 to execute the abnormality recipe.

於儲存部61儲存有複數個正常期間時,可根據機器手H1之移動速度來選擇特定之正常期間。控制部6根據將機器手H1之移動速度與正常期間建立對應關係之對應表,而自動地選擇特定之正常期間。特定之正常期間亦可藉由來自輸入部(未圖示)之輸入,而由使用者所選擇性地指定。 When a plurality of normal periods are stored in the storage unit 61, a specific normal period can be selected according to the moving speed of the robot H1. The control unit 6 automatically selects a specific normal period according to a correspondence table that establishes a correspondence between the moving speed of the robot H1 and the normal period. The specific normal period can also be selectively designated by the user through input from the input unit (not shown).

利用推動器檢測部29所檢測出之導通/斷開之信號,被輸入至判定部62。判定部62將在可動部24a,成為固定之伸長量以上時自推動器檢測部29所輸出之導通之信號,解釋為檢測出基板W之固定保持狀態。又,判定部62將在可動部24a未滿固定之伸長量時自推動器檢測部29所輸出之斷開信號,解釋為檢測出基板W之解除固定狀態。 The ON/OFF signal detected by the pusher detection unit 29 is input to the determination unit 62. The determination section 62 interprets the conduction signal output from the pusher detection section 29 when the movable section 24a becomes equal to or greater than the fixed extension amount, as detecting the fixed holding state of the substrate W. In addition, the determination section 62 interprets the disconnection signal output from the pusher detection section 29 when the movable section 24a is less than the fixed extension amount, as detecting that the substrate W has been released from the fixed state.

判定部62將以特定時序自推動器檢測部29所輸出之 導通/斷開信號與在儲存部61所儲存之特定時序下正常之導通/斷開信號之資訊加以比較。判定部62於以特定時序自推動器檢測部29所輸出之導通/斷開信號與在儲存部61所儲存之特定時序下正常之導通/斷開信號之資訊一致時,判定基板W之固定保持狀態及/或解除固定狀態為正常,而於不同時判定基板W之固定保持狀態及/或解除固定狀態為不正常(異常)。於判定為異常時,控制部6對基板處理裝置1之各構成部進行控制,而執行異常時配方。 The judging part 62 will output the output from the pusher detection part 29 at a specific timing. The ON/OFF signal is compared with the information of the normal ON/OFF signal at a specific time sequence stored in the storage unit 61. The judging section 62 judges that the on/off signal output from the pusher detection section 29 at a specific timing is consistent with the information of the normal on/off signal at the specific timing stored in the storage section 61 to determine whether the substrate W is fixed and maintained The state and/or the unfixed state are normal, but the fixed holding state and/or the unfixed state of the substrate W are not determined to be abnormal (abnormal) at the same time. When it is determined to be abnormal, the control unit 6 controls each component of the substrate processing apparatus 1 to execute the abnormal time recipe.

又,判定部62亦可將自推動器檢測部29所輸出之時間序列之導通/斷開信號之切換(實際固定保持模式RHP)與儲存部61所儲存正常之時間序列之導通/斷開信號之切換(正常固定保持模式NHP)加以比較。判定部62於實際固定保持模式RHP與正常固定保持模式NHP一致時,判定基板W之固定保持狀態及/或解除固定狀態為正常,而於不同時判定基板W之固定保持狀態及/或解除固定狀態為不正常(異常)。於判定為異常時,控制部6對基板處理裝置1之各構成部進行控制,而執行異常時配方。 In addition, the judging unit 62 can also switch the time-series on/off signal output from the pusher detection unit 29 (the actual fixed hold mode RHP) and the normal time-series on/off signal stored in the storage unit 61 The switching (normal fixed hold mode NHP) is compared. When the actual fixed holding mode RHP is consistent with the normal fixed holding mode NHP, the judging section 62 judges that the fixed holding state and/or release of the fixed state of the substrate W is normal, but does not judge the fixed holding state and/or release of the substrate W at the same time The status is abnormal (abnormal). When it is determined to be abnormal, the control unit 6 controls each component of the substrate processing apparatus 1 to execute the abnormal time recipe.

驅動控制部63對分度機器人IR、中心機器人CR、及閘門驅動部34b之驅動進行控制。驅動控制部63於判定部62判定為異常時,根據異常時配方,使分度機器人IR及閘門驅動部34b即時停止,並使中心機器人CR於基板搬送後停止。 The drive control unit 63 controls the drive of the index robot IR, the center robot CR, and the gate drive unit 34b. When the determination unit 62 determines that it is abnormal, the drive control unit 63 immediately stops the indexing robot IR and the gate driving unit 34b according to the abnormality recipe, and stops the center robot CR after the substrate is transported.

處理控制部64對處理單元31之處理進行控制。具體之處理依照儲存部61中所儲存之處理配方。處理控制部64於判定部62判定為異常時,根據異常時配方,繼續進行處理單元31之處理,並於處理結束後,使處理單元31之動作停止。 The processing control unit 64 controls the processing of the processing unit 31. The specific processing is in accordance with the processing recipe stored in the storage unit 61. The processing control unit 64 continues the processing of the processing unit 31 according to the recipe at the time of the abnormality when the determination unit 62 determines that it is abnormal, and stops the operation of the processing unit 31 after the processing ends.

控制部6係由中央運算處理裝置(CPU)、ROM(唯讀記 憶體;Read-only Memory)、RAM(隨機存取記憶體;Random-Access Memory)、及固定磁碟或SSD(固態磁碟;Solid State Drive)等之儲存媒體、驅動電路以及通信電路等所構成。通信電路包含用以進行RS-232C(美國工業聯盟推薦標準232C)或乙太網路(註冊商標)等之通信之電路、及用以進行數位或類比之信號輸入輸出之電路。通信電路除了進行控制部6與光學感測器8、推動器檢測部29、各種驅動部及處理單元31之間之通信或輸入輸出信號之傳遞外,亦進行與裝載埠LP或外部控制機器等周邊機器之通信或輸入輸出信號之傳遞。 The control unit 6 is composed of a central processing unit (CPU), ROM (read-only memory) Memory; Read-only Memory), RAM (Random-Access Memory), and storage media, drive circuits and communication circuits such as fixed disks or SSDs (Solid State Drive) constitute. The communication circuit includes a circuit for communication such as RS-232C (Recommended Standard 232C by the American Industry Association) or Ethernet (registered trademark), and a circuit for digital or analog signal input and output. The communication circuit not only communicates between the control unit 6 and the optical sensor 8, the pusher detection unit 29, various drive units, and the processing unit 31, or transfers input and output signals, but also communicates with the load port LP or external control equipment, etc. Communication of peripheral equipment or transmission of input and output signals.

圖5係表示基板之搬送動作(交接動作)之流程圖。圖6A至圖6E係表示基板被正常地載置於基板收納容器之情形時之動作例的圖。圖8A係依照時間序列來表示基板交付動作中光學感測器8之檢測信號與推動器檢測部29之檢測信號的時序圖。藉由對與上述相同之構成標示相同符號來省略詳細之說明。於圖8A中,將在基板交付動作為正常之情形時自光學感測器8所輸出之時間序列之導通/斷開信號設為光信號RLS1。 Fig. 5 is a flowchart showing the transfer operation (transfer operation) of the substrate. 6A to 6E are diagrams showing examples of operations when the substrate is normally placed in the substrate storage container. FIG. 8A is a timing diagram showing the detection signal of the optical sensor 8 and the detection signal of the pusher detection portion 29 in the substrate delivery operation according to the time sequence. The detailed description is omitted by assigning the same symbols to the same components as the above. In FIG. 8A, the time-series on/off signal output from the optical sensor 8 when the substrate delivery operation is normal is set as the optical signal RLS1.

<步驟S1>基板收納容器被載置 <Step S1> The substrate storage container is placed

基板收納容器5被載置於平台32。蓋5b將開口B加以閉塞。平台32使平台32上之基板收納容器5朝分度單元2移動接近,而使蓋5b接觸於閘門構件34a。 The substrate storage container 5 is placed on the platform 32. The cover 5b closes the opening B. The platform 32 moves the substrate storage container 5 on the platform 32 toward the indexing unit 2 and makes the cover 5b contact the gate member 34a.

裝載埠開閉機構34使閘門構件34a保持蓋5b,並使閘門驅動部34b自基板收納容器5朝向分度單元2移動。藉由該動作,使蓋5b自基板收納容器5脫離。此外,裝載埠開閉機構34藉由使閘門驅動部34b朝向垂直下方向移動,使將基板收納容器5與分度單元 2連通,而成為分度機器人IR之機器手H1可進入基板收納容器5內部之狀態。 The load port opening and closing mechanism 34 causes the shutter member 34 a to hold the cover 5 b and moves the shutter driving portion 34 b from the substrate storage container 5 toward the indexing unit 2. With this operation, the lid 5b is detached from the substrate storage container 5. In addition, the load port opening and closing mechanism 34 moves the gate drive portion 34b in the vertical downward direction, so that the substrate storage container 5 and the indexing unit 2 is connected, and the robot hand H1 of the indexing robot IR can enter the state of the substrate storage container 5.

<步驟S2>自基板收納容器取出基板 <Step S2> Take out the substrate from the substrate storage container

分度機器人IR進行基板W之接收動作。基板接收動作係由往路移動(第2往路步驟)、取得移動、及返路移動(第2返路步驟)所構成。於分度交接位置待機中之分度機器人IR,將機器手H1之垂直位置朝向拾取位置移動。然後,分度機器人IR為了使機器手H1朝向基板收納容器5內之保持有基板W之基板導引部5c之下部進入,而使機器手H1進行自起始位置HM朝向前進位置FW移動之往路移動。 The indexing robot IR performs the receiving operation of the substrate W. The board receiving operation is composed of the forward movement (the second forward step), the acquisition movement, and the backward movement (the second backward step). The indexing robot IR, which is waiting at the indexing transfer position, moves the vertical position of the robot H1 toward the picking position. Then, the indexing robot IR moves the robot H1 toward the lower part of the substrate guide 5c holding the substrate W in the substrate storage container 5, and moves the robot H1 from the starting position HM to the forward position FW. mobile.

在機器手H1到達前進位置FW後,分度機器人IR進行使機器手H1自拾取位置朝向放置位置上升之取得移動。藉由取得移動,被載置於基板導引部5c之基板W由機器手H1所抬起,而由爪導引部22及後導引部23所支撐。於該狀態下,可動部24a朝基板W側伸長,而將基板W壓抵於爪導引部22。基板W成為由可動部24a與爪導引部22所夾入之狀態,而被固定保持。推動器檢測部29於可動部24a成為固定之伸長量以上時檢測出導通信號,並將所檢測出之導通信號輸出至判定部62。 After the robot H1 reaches the forward position FW, the indexing robot IR performs an acquisition movement to raise the robot H1 from the picking position to the placing position. By obtaining the movement, the substrate W placed on the substrate guiding portion 5c is lifted by the robot hand H1 and supported by the claw guiding portion 22 and the rear guiding portion 23. In this state, the movable portion 24 a extends toward the substrate W side, and presses the substrate W against the claw guide portion 22. The substrate W is in a state of being sandwiched between the movable portion 24a and the claw guide portion 22, and is fixedly held. The pusher detection section 29 detects the conduction signal when the movable section 24 a becomes equal to or greater than the fixed extension amount, and outputs the detected conduction signal to the determination section 62.

分度機器人IR為了在機器手H1固定保持有基板W之狀態下使機器手H1自基板收納容器5內後退,而進行使機器手H1自前進位置FW朝向起始位置HM移動之返路移動。 The indexing robot IR moves the robot H1 back from the forward position FW to the starting position HM in order to move the robot H1 back from the substrate storage container 5 while the robot H1 is holding the substrate W fixedly.

<步驟S3>對基板進行處理 <Step S3> Process the substrate

分度機器人IR於固定保持有基板W之狀態下,使機器手H1進入 傳遞單元4,並將基板W載置於傳遞單元4。於載置後,分度機器人IR使機器手H1朝向傳遞單元4之外部後退。被載置於傳遞單元4之基板W,藉由中心機器人CR朝向處理單元31被搬送。中心機器人CR亦與分度機器人IR相同地,以固定保持有基板W之狀態進行搬送。 The indexing robot IR makes the robot H1 enter while holding the substrate W The transfer unit 4 and the substrate W are placed on the transfer unit 4. After the placement, the indexing robot IR moves the robot hand H1 back toward the outside of the transfer unit 4. The substrate W placed on the transfer unit 4 is transported toward the processing unit 31 by the center robot CR. The center robot CR is also transported in a state where the substrate W is fixed and held in the same way as the indexing robot IR.

對被搬送至處理單元31基板W執行藥液處理。藥液處理例如為洗淨處理,對基板W供給藥液,而將基板W加以洗淨。亦可取代洗淨處理而進行蝕刻處理、塗佈處理、或顯影處理等。此外,亦可為與藥液處理不同之處理,例如亦可為加熱處理或冷卻處理等之熱處理。藉由處理單元31所處理之基板W,藉由中心機器人CR而自處理單元31被取出,並被載置於傳遞單元4。 The chemical solution processing is performed on the substrate W that is transported to the processing unit 31. The chemical liquid treatment is, for example, a cleaning process. The chemical liquid is supplied to the substrate W and the substrate W is cleaned. Instead of washing treatment, etching treatment, coating treatment, or development treatment may be performed. In addition, it may be a treatment different from the chemical solution treatment, for example, a heat treatment such as a heating treatment or a cooling treatment. The substrate W processed by the processing unit 31 is taken out from the processing unit 31 by the central robot CR and placed on the transfer unit 4.

<步驟S4>將基板交付至基板收納容器 <Step S4> Deliver the substrate to the substrate storage container

分度機器人IR進行基板W之交付動作。基板交付動作係由往路移動(第1往路步驟)、載置移動、及返路移動(第1返路步驟)所構成。被載置於傳遞單元4之基板W,被固定保持於機器手H1。分度機器人IR於機器手H1固定保持有基板W之狀態下,移動至作為基板W之收納對象之基板收納容器5之分度交接位置。於移動後,如圖6A所示,機器手H1朝向與開口B對向之朝向旋轉,並將垂直位置移動至放置位置(時間t1)。於時間t1,光學感測器8由於為投光狀態,因此輸出導通信號,而可動部24a由於為伸長狀態,因此推動器檢測部29輸出導通信號。 The indexing robot IR performs the delivery action of the substrate W. The board delivery operation is composed of forward movement (first forward step), placement movement, and return movement (first backward step). The substrate W placed on the transfer unit 4 is fixedly held by the robot H1. The indexing robot IR moves to the indexing transfer position of the substrate storage container 5 as the storage object of the substrate W in the state where the robot H1 holds the substrate W fixedly. After the movement, as shown in FIG. 6A, the robot H1 rotates toward the direction opposite to the opening B, and moves the vertical position to the placement position (time t1). At time t1, since the optical sensor 8 is in the light-emitting state, it outputs a conduction signal, and because the movable portion 24a is in the extended state, the pusher detection portion 29 outputs a conduction signal.

<步驟S5>比較推動器檢測部信號是否一致 <Step S5> Compare whether the signals of the pusher detection part are consistent

其次,如圖6B所示,分度機器人IR為了在固定保持有基板W之 狀態下使機器手H1朝向基板收納容器5內部進入,而開始自起始位置HM朝向前進位置FW移動之往路移動(時間t2)。判定部62以往路移動開始作為第1監視點SP1,將自推動器檢測部29所輸出之信號與在儲存部61所儲存之第1監視點SP1之正常時序信號加以比較。由於在第1監視點SP1,基板W必須被固定保持,因此在儲存部61所儲存之第1監視點SP1之正常時序信號為導通信號。判定部62於比較之結果為兩信號一致時使處理持續進行,而於不同時(步驟S5之NO)執行異常時配方。第1監視點SP1並不一定要在往路移動即將開始前,亦可為在往路移動開始之固定期間前。又,判定部62亦可為了取得自推動器檢測部29所輸出之信號之時間序列模式,而開始進行導通/斷開信號之取得(信號取得期間SGP)。 Next, as shown in FIG. 6B, the indexing robot IR is to hold the substrate W in a fixed position. In the state, the robot H1 is entered toward the inside of the substrate storage container 5, and the forward movement from the starting position HM to the forward position FW is started (time t2). The judging unit 62 serves as the first monitoring point SP1 at the beginning of the road movement, and compares the signal output from the pusher detection unit 29 with the normal timing signal of the first monitoring point SP1 stored in the storage unit 61. Since the substrate W must be fixedly held at the first monitoring point SP1, the normal timing signal of the first monitoring point SP1 stored in the storage portion 61 is the ON signal. The judging unit 62 continues the processing when the result of the comparison is that the two signals are consistent, and executes the abnormal time recipe at different times (NO in step S5). The first monitoring point SP1 does not have to be immediately before the start of the onward movement, and may be before the fixed period when the onward movement starts. In addition, in order to obtain the time-series pattern of the signal output from the pusher detection unit 29, the determination unit 62 may start the acquisition of the on/off signal (signal acquisition period SGP).

於開始進行往路移動後,若機器手H1到達裝載埠開口L,所固定保持之基板W遮斷光學感測器8之光軸,自光學感測器8朝向判定部62所輸出之信號,便自導通信號切換為斷開信號(時間t3)。判定部62將自光學感測器8所輸入之導通信號朝向斷開信號之切換作為通過期間之起點,開始進行斷開信號之持續時間之測量。 After starting the forward movement, if the robot H1 reaches the loading port opening L, the fixed and held substrate W interrupts the optical axis of the optical sensor 8, and the signal output from the optical sensor 8 toward the determination unit 62 is The self-on signal is switched to the off signal (time t3). The judging part 62 regards the switching of the on signal input from the optical sensor 8 to the off signal as the starting point of the passing period, and starts measuring the duration of the off signal.

其次,如圖6C所示,機器手H1到達前進位置FW。於到達前進位置FW後,控制部6藉由使可動部24a收縮而解除朝向基板W之壓抵。藉由解除朝向基板W之壓抵,可將基板W載置於基板導引部5c。可動部24a由於成為收縮狀態,因此自推動器檢測部29朝向判定部62所輸出之信號,自導通信號切換為斷開信號(時間t4)。判定部62以往路移動結束作為第2監視點SP2,將自推動器檢測部29所輸出之信號與在儲存部61所儲存之第2監視點SP2之正常時序信號加以比較。由於在第2監視點SP2基板W必須被解除固定,因 此在儲存部61所儲存之第2監視點SP2之正常時序信號為斷開信號。判定部62在比較之結果為兩信號一致時(步驟S5之YES),使處理持續進行,而於不同時(S5之NO),執行異常時配方。第2監視點SP2並不一定要在往路移動剛結束後,亦可在往路移動結束後並經過固定期間後。 Next, as shown in Fig. 6C, the robot hand H1 reaches the forward position FW. After reaching the forward position FW, the control part 6 releases the pressing against the substrate W by shrinking the movable part 24a. By releasing the pressing force toward the substrate W, the substrate W can be placed on the substrate guide portion 5c. Since the movable portion 24a is in the contracted state, the signal output from the pusher detection portion 29 toward the determination portion 62 is switched from the on signal to the off signal (time t4). The judging unit 62 serves as the second monitoring point SP2 as the end of the path movement, and compares the signal output from the pusher detection unit 29 with the normal timing signal of the second monitoring point SP2 stored in the storage unit 61. Since the board W must be unfixed at the second monitoring point SP2, The normal sequence signal of the second monitoring point SP2 stored in the storage unit 61 is an off signal. When the result of the comparison is that the two signals are the same (YES in step S5), the judging unit 62 continues the processing, but when they are not the same (NO in S5), executes the abnormal time recipe. The second monitoring point SP2 does not have to be immediately after the onward movement is completed, and may be after the onward movement is completed and after a fixed period has elapsed.

又,判定部62於取得自推動器檢測部29所輸出之信號之時間序列模式(實際固定保持模式RHP)時,結束導通/斷開信號之取得。判定部62將所取得之實際固定保持模式RHP與儲存部61所儲存之正常固定保持模式NHP加以比較。判定部62於比較之結果為兩模式一致時(步驟S5之YES),使處理持續進行,而於不同時(步驟S5之NO),執行異常時配方。 In addition, when the determination unit 62 obtains the time-series pattern of the signal output from the pusher detection unit 29 (the actual fixed hold mode RHP), it ends the acquisition of the on/off signal. The determination unit 62 compares the acquired actual fixed holding pattern RHP with the normal fixed holding pattern NHP stored in the storage unit 61. When the result of the comparison is that the two modes are consistent (YES in step S5), the judging unit 62 continues the processing, and when they are different (NO in step S5), executes the abnormal recipe.

在判定部62根據自推動器檢測部29所輸出之信號而判定為正常時(步驟S5之YES),分度機器人IR維持在前進位置FW,進行使機器手H1之垂直位置自放置位置下降移動至拾取位置的載置移動。藉由載置移動,被保持於爪導引部22及後導引部23之內側之基板W,被載置於基板導引部5c。 When the determination unit 62 determines that it is normal based on the signal output from the pusher detection unit 29 (YES in step S5), the indexing robot IR is maintained at the forward position FW, and the vertical position of the robot H1 is moved downward from the placement position. Placement movement to the pickup position. By the placement movement, the substrate W held inside the claw guide portion 22 and the rear guide portion 23 is placed on the substrate guide portion 5c.

<步驟S6>使機器手H1後退 <Step S6> Retreat the robot H1

其次,如圖6D所示,分度機器人IR為了使機器手H1自基板收納容器5內後退,而進行使機器手H1自前進位置FW朝向起始位置HM移動之返路移動。若基板W被正常地載置於基板導引部5c,機器手H1上便不存在基板W。因此,若在通過光學感測器8之光軸中機器手H1之中空區域(構件不存在部分即V字型部分之間的區域)到達光軸,光學感測器8便自遮光狀態變化為投光狀態。據此,自光 學感測器8所輸出之信號便自導通信號變化為斷開信號(時間t5)。判定部62於自光學感測器8所輸出之信號從斷開信號變化為導通信號之時間點,結束自光學感測器8所輸出之斷開信號之持續時間的測量。在通過機器手H1之中空區域後,光學感測器8之輸出從斷開信號切換為導通信號。若機器手H1到達起始位置HM,返路移動便結束(圖6E,時間t6)。於基板W被正常地交付動作之情形時,自光學感測器8所輸出之信號從導通信號變化為斷開信號之時間t3至從斷開信號變化為導通信號之時間t5為止的期間,成為第1通過期間PP1。 Next, as shown in FIG. 6D, in order to retreat the robot H1 from the substrate storage container 5, the indexing robot IR performs a return movement of moving the robot H1 from the forward position FW to the starting position HM. If the substrate W is normally placed on the substrate guide portion 5c, there is no substrate W on the robot H1. Therefore, if the hollow area of the robot H1 (the area between the non-existent parts, that is, the area between the V-shaped parts) of the robot H1 reaches the optical axis while passing through the optical axis of the optical sensor 8, the optical sensor 8 changes from the light-shielded state to Projection state. Accordingly, since the light The signal output by the learning sensor 8 changes from the on signal to the off signal (time t5). The determination unit 62 ends the measurement of the duration of the disconnection signal output from the optical sensor 8 at the time point when the signal output from the optical sensor 8 changes from the disconnection signal to the conduction signal. After passing through the hollow area of the robot H1, the output of the optical sensor 8 is switched from an off signal to an on signal. If the robot H1 reaches the starting position HM, the return movement ends (Figure 6E, time t6). When the substrate W is normally delivered for operation, the period from the time t3 when the signal output by the optical sensor 8 changes from the on signal to the off signal to the time t5 when the signal from the off signal changes to the on signal , Becomes the first pass period PP1.

分度機器人IR於使機器手H1自基板收納容器5內後退之返路移動時,可設為較往路移動時之搬送速度慢之速度。藉由於返路移動時降低速度,可提升返路移動時之光學感測器8之檢測精度。 When the indexing robot IR moves the robot H1 backward from the substrate storage container 5, it can be set to a speed slower than the conveying speed when moving forward. By reducing the speed when moving back, the detection accuracy of the optical sensor 8 when moving back can be improved.

<步驟S7>比較光學感測器信號是否一致 <Step S7> Compare whether the optical sensor signals are consistent

判定部62將基板W之交付動作時所測量之第1通過期間PP1與儲存部61所儲存之第1正常期間NP1加以比較。例如,第1正常期間NP1為自光學感測器8所輸出之斷開信號從時間t3至t5之期間。判定部62在將第1通過期間PP1與所預先設定且被儲存於儲存部61之第1正常期間NP1加以比較之結果為一致時,判定為正常(S7之YES),並持續進行處理,而於不同時判定為異常(S7之NO),並執行異常時配方。於將第1通過期間PP1與第1正常期間NP1加以比較之情形時,亦可相對於第1正常期間NP1使其具有±10%左右之裕度來進行判定。 The determination unit 62 compares the first passing period PP1 measured during the delivery operation of the substrate W with the first normal period NP1 stored in the storage unit 61. For example, the first normal period NP1 is the period from time t3 to t5 from the off signal output from the optical sensor 8. When the judgment unit 62 compares the first passing period PP1 with the first normal period NP1 set in advance and stored in the storage unit 61 and the result is consistent, it judges that it is normal (YES in S7), and continues processing, and At different times, it is judged as abnormal (NO of S7), and the formula when abnormal is executed. When comparing the first passing period PP1 with the first normal period NP1, it is also possible to make a determination with a margin of about ±10% with respect to the first normal period NP1.

例如,所儲存之第1正常期間NP1為2.8秒以下。根據設計值及實驗,2.5秒附近為適當之值,假設存在異常時為3.0秒以上,則2.5秒加上約10%之裕度,而將第1正常期間NP1設為2.8秒以下。如前所述,由於第1正常期間NP1可根據移動距離或移動速度任意地變更,因此並不限定於該等數值。此外,第1正常期間NP1亦可如2.2秒以上且2.8秒以下般具有上下限之範圍。如此,藉由使其具有裕度,可防止將不成問題之微小之動作偏差等作為錯誤而檢測出之情形。若第1通過期間PP1藉由判定部62而被判定為正常,便結束利用分度機器人IR所進行之一連串的基板交付動作。 For example, the stored first normal period NP1 is 2.8 seconds or less. According to design values and experiments, around 2.5 seconds is an appropriate value. If there is an abnormality, it is 3.0 seconds or more, then 2.5 seconds plus a margin of about 10%, and the first normal period NP1 is set to 2.8 seconds or less. As described above, since the first normal period NP1 can be arbitrarily changed according to the movement distance or the movement speed, it is not limited to these values. In addition, the first normal period NP1 may have a range of upper and lower limits such as 2.2 seconds or more and 2.8 seconds or less. In this way, by providing a margin, it is possible to prevent a situation in which small non-problematic deviations of operation are detected as errors. If the first passing period PP1 is judged to be normal by the judging unit 62, a series of substrate delivery operations performed by the indexing robot IR is ended.

此處,對基板W藉由機器手H1而未被正常地載置於基板導引部5c之情形,換言之,對基板W未被正常地交付至作為既定位置之基板導引部5c之情形進行說明。例如,基板W存在有因經過製程而翹曲成凹型之情形。在基板W被載置於基板導引部5c後,由於基板W之翹曲,而存在有即便機器手H1已下降至拾取位置,基板W之下表面之一部分仍然與機器手H1之側面部22b之上端為同等之高度或較機器手H1之側面部22b之上端低之可能性。 Here, the case where the substrate W is not normally placed on the substrate guide part 5c by the robot H1, in other words, the case where the substrate W is not normally delivered to the substrate guide part 5c as a predetermined position is performed Description. For example, the substrate W may be warped into a concave shape due to the process. After the substrate W is placed on the substrate guide portion 5c, due to the warpage of the substrate W, even if the robot H1 has been lowered to the pickup position, a part of the lower surface of the substrate W is still with the side surface 22b of the robot H1. The upper end may be the same height or lower than the upper end of the side part 22b of the robot H1.

圖7A至圖7B係對基板未被正常地載置於基板收納容器之情形時之動作進行說明的圖。圖8B係以時間序列來表示基板交付動作中正常與異常之光學感測器之檢測信號與推動器檢測部之檢測信號的時序圖。由於至機器手H1進入前進位置並下降至拾取位置為止與圖6A至圖6C相同,因此省略說明。與圖8A相同之部分亦省略說明。於圖8B中,將基板交付動作中產生異常時自光學感測器8所輸出之時間序列之導通/斷開信號設為光信號RLS2。 7A to 7B are diagrams for explaining the operation when the substrate is not normally placed in the substrate storage container. FIG. 8B is a time sequence diagram showing the detection signal of the normal and abnormal optical sensor and the detection signal of the pusher detection part in the substrate delivery operation. Since the robot H1 enters the forward position and descends to the pick-up position is the same as in FIGS. 6A to 6C, the description is omitted. The description of the same parts as those in FIG. 8A is also omitted. In FIG. 8B, the time-series on/off signal output from the optical sensor 8 when an abnormality occurs during the substrate delivery operation is set as the optical signal RLS2.

如圖7A所示,於分度機器人IR為了將基板W載置於基 板導引部5c而進行載置移動後,機器手H1自前進位置FW朝向起始位置HM進行返路移動時,存在有機器手H1之側面部22b之上端會勾到基板W之端部或下表面等之情形。於勾到之狀態下,基板W未由爪導引部22及後導引部23所支撐,基板W之一部分跨到側面部22b上,而以不穩定之狀態被載置於機器手H1上。於載置移動後,由於使可動部24a收縮之狀態為正常,因此判定部62判定自推動器檢測部29所輸出之斷開信號為正常之狀態(圖6C,時間t4)。因此,即便於基板W以不穩定之狀態被載置於機器手H1上之情形時,亦無法藉由推動器檢測部29來檢測出該異常。 As shown in FIG. 7A, in order to place the substrate W on the substrate by the indexing robot IR After the board guide 5c is placed and moved, when the robot H1 moves back from the forward position FW to the starting position HM, the upper end of the side surface 22b where the robot H1 exists will hook the end of the substrate W or The situation of the bottom surface and so on. In the hooked state, the substrate W is not supported by the claw guide 22 and the rear guide 23, and a part of the substrate W straddles the side surface 22b and is placed on the robot H1 in an unstable state . After the placement movement, since the state of retracting the movable portion 24a is normal, the judging section 62 judges that the disconnection signal output from the pusher detecting section 29 is the normal state (FIG. 6C, time t4). Therefore, even when the substrate W is placed on the robot H1 in an unstable state, the abnormality cannot be detected by the pusher detection unit 29.

另一方面,即便在通過光學感測器8之光軸中機器手H1之中空區域(作為構件不存在部分之V字型部分之間的區域)到達光軸(時間t5),由於在機器手H1上存在有基板W,因此光學感測器8不會從遮光狀態變化為投光狀態,其輸出信號被維持為斷開信號。如圖7A所示,機器手H1繼續進行返路移動,並於基板W通過光軸之狀態下光學感測器8之輸出變化為導通信號(時間t5a)。判定部62於自光學感測器8所輸出之信號從斷開信號變化為導通信號之時間點,結束光學感測器8之斷開信號之持續時間的測量。若機器手H1到達起始位置HM,返路移動便結束(圖7B,時間t6)。於基板W未被正常地搬送之情形時,自光學感測器8所輸出之信號從導通信號變化為斷開信號之時間t3,至從斷開信號變化為導通信號之時間t5a為止的期間,成為第2通過期間PP2。 On the other hand, even if the hollow area of the robot H1 (the area between the V-shaped parts as the non-existent part of the component) reaches the optical axis (time t5) in the optical axis passing through the optical sensor 8, because the robot H1 There is a substrate W on H1, so the optical sensor 8 does not change from a light-shielding state to a light-emitting state, and its output signal is maintained as an off signal. As shown in FIG. 7A, the robot H1 continues to move back, and the output of the optical sensor 8 changes to a conduction signal (time t5a) when the substrate W passes through the optical axis. The determination section 62 ends the measurement of the duration of the disconnection signal of the optical sensor 8 at the time point when the signal output from the optical sensor 8 changes from the disconnection signal to the conduction signal. If the robot H1 reaches the starting position HM, the return movement ends (Figure 7B, time t6). When the substrate W is not transported normally, the signal output from the optical sensor 8 changes from the on signal to the off signal at time t3 to the time t5a when the off signal changes to the on signal The period becomes the second pass period PP2.

判定部62針對基板W之交付動作,將所測量之第2通過期間PP2與儲存部61所儲存之第1正常期間NP1加以比較。判定部62將第2通過期間PP2與儲存部61所儲存之第1正常期間NP1加以比較之結果,如圖8B所示般由於第2通過期間PP2與儲存部61所儲存之第1正常期間NP1不同,因此執行異常時配方。 The determination unit 62 compares the measured second pass period PP2 with the first normal period NP1 stored in the storage unit 61 for the delivery operation of the substrate W. The determination unit 62 compares the second pass period PP2 with the first normal period NP1 stored in the storage unit 61. As shown in FIG. 8B, the second pass period PP2 and the first normal period NP1 stored in the storage unit 61 are compared. Different, so the recipe is executed abnormally.

<步驟S8>異常時配方之執行 <Step S8> Execution of recipe when abnormal

判定部62於判定為異常時,使基板處理裝置1之各構成部執行儲存部61所儲存之異常時配方。例如,異常時配方規定包含分度機器人IR及閘門驅動部34b即時停止、處理單元31之處理後停止、中心機器人CR之基板搬送後停止、及警報之產生之一連串的動作。警報係基板處理裝置1之主畫面之警告顯示、聲音的產生、透過通信線路朝向主電腦之彈出訊息之顯示指令輸出等。藉由產生警報,可通知裝置使用者基板處理裝置1為異常之情形。於異常時配方之執行完成之情形時,判定部62亦設為一連串之搬送動作結束。 When the determination unit 62 determines that it is abnormal, it causes each component of the substrate processing apparatus 1 to execute the abnormal time recipe stored in the storage unit 61. For example, the recipe at abnormal time includes a series of actions including the immediate stop of the indexing robot IR and the gate drive unit 34b, the post-processing stop of the processing unit 31, the stop after the substrate transfer of the center robot CR, and the generation of an alarm. The alarm is the warning display of the main screen of the substrate processing apparatus 1, the generation of sound, the display command output of the pop-up message to the main computer through the communication line, and so on. By generating an alarm, the device user can be notified that the substrate processing device 1 is abnormal. When the execution of the recipe is completed in an abnormal situation, the judging unit 62 also sets the series of conveying operations to end.

根據上述之本發明第1實施形態之基板搬送裝置,針對機器手H1將基板W載置於基板收納容器5之基板導引部5c時之一連串之基板W之交付動作,可使用光學感測器8之檢測信號,來判定處於正常狀態或處於異常狀態。更具體而言,可根據光學感測器8檢測出機器手H1本體或基板W時生成之斷開信號之持續時間,來測量通過期間。藉由對該通過期間與儲存部61所儲存之正常期間是否一致進行比較,可判定基板W之交付動作為正常或異常。 According to the substrate transfer device of the first embodiment of the present invention described above, an optical sensor can be used for a series of substrate W delivery operations when the robot H1 places the substrate W on the substrate guide portion 5c of the substrate storage container 5 8 detection signals to determine whether it is in a normal state or in an abnormal state. More specifically, the passing period can be measured based on the duration of the disconnect signal generated when the optical sensor 8 detects the body of the robot H1 or the substrate W. By comparing whether the passing period is consistent with the normal period stored in the storage unit 61, it can be determined whether the delivery operation of the substrate W is normal or abnormal.

其次,對以下狀態進行說明:基板W未如圖6E所示般被正確地載置於基板收納容器5之基板導引部5c,例如基板W位於較圖6E所圖示之狀態更右側,基板W以會自基板收納容器5突出之方式偏移地被載置。光學感測器8之感測器區域係設定於可以偏移至基板收納容器5外之狀態被載置之基板W進行檢測的位置。因 此,可藉由光學感測器8來檢測出基板W以偏移之狀態被載置之情形。於該情形時亦全作為其他異常狀態而被檢測出。 Next, the following state will be described: the substrate W is not correctly placed on the substrate guide portion 5c of the substrate storage container 5 as shown in FIG. 6E. For example, the substrate W is positioned on the right side of the state shown in FIG. 6E. W is placed so as to be offset so as to protrude from the substrate storage container 5. The sensor area of the optical sensor 8 is set at a position capable of detecting the substrate W placed in a state shifted to the outside of the substrate storage container 5 for detection. because Therefore, the optical sensor 8 can detect that the substrate W is placed in a shifted state. In this case, all are detected as other abnormal conditions.

對於機器手H1接收被載置於基板收納容器5之基板導引部5c之基板W時之一連串基板W之接收動作,亦可根據光學感測器8之輸出,來判定為正常狀態或異常狀態。具體而言,根據光學感測器8檢測出機器手H1或基板W而生成之斷開信號之持續時間,來測量第2通過期間。亦可藉由對該第2通過期間與儲存部61所儲存之第2正常期間是否一致進行比較,來判定基板W之接收動作為正常或異常狀態。 For the receiving operation of a series of substrates W when the robot H1 receives the substrate W placed in the substrate guide portion 5c of the substrate storage container 5, it can also be determined as a normal state or an abnormal state based on the output of the optical sensor 8 . Specifically, the second passing period is measured based on the duration of the off signal generated by the optical sensor 8 detecting the robot H1 or the substrate W. It is also possible to determine whether the receiving operation of the substrate W is in a normal or abnormal state by comparing whether the second passing period is consistent with the second normal period stored in the storage unit 61.

更具體而言,於第2往路步驟中,測量未保持有基板W之機器手H1本體通過光學感測器8之感測器區域後,至第2返路步驟中由機器手H1本體與機器手H1所保持之基板W通過感測器區域為止的第2通過期間。藉由判定部62來判定該第2通過期間與所預先設定且被儲存於儲存部61之第2正常期間是否不同。判定部62於該等並無不同之情形時判斷為正常,而於不同之情形時判斷為搬送異常。 More specifically, in the second forward step, after measuring that the body of the robot H1 that does not hold the substrate W passes through the sensor area of the optical sensor 8, to the second backward step, the robot H1 body and the machine The second passing period until the substrate W held by the hand H1 passes through the sensor area. The determining unit 62 determines whether the second passing period is different from the second normal period set in advance and stored in the storage unit 61. The judging unit 62 judges that it is normal when there are no different situations, and judges that the conveying is abnormal in different situations.

若基板W產生翹曲,即便在基板W被載置於基板導引部5c後,機器手H1下降至拾取位置,仍存在基板W之下表面之一部分與機器手H1之側面部22b之上端同等之高度或較機器手H1之側面部22b之上端低之可能性。於該情形時,在機器手H1自前進位置FW朝向起始位置HM進行返路移動時,機器手H1之側面部22b之上端會勾到基板W之端部或下表面等。此時,基板W不會由爪導引部22及後導引部23所保持,基板W之一部分會跨上側面部22b之上端,而以不穩定之狀態被載置於機器手H1上。如此,於基板W以不 穩定之狀態被載置於機器手H1上之情形時,存在有無法根據來自推動器檢測部29之導通/斷開信號來檢測出異常之可能性。即便於如此之狀況,由於根據來自光學感測器8之導通/斷開信號,仍可藉由判定部62來進行異常判定,因此仍可將異常進行檢測。 If the substrate W is warped, even after the substrate W is placed on the substrate guide 5c, and the robot H1 is lowered to the pickup position, there is still a part of the lower surface of the substrate W that is equal to the upper end of the side surface 22b of the robot H1 The height may be lower than the upper end of the side part 22b of the robot H1. In this case, when the robot H1 moves back from the forward position FW to the starting position HM, the upper end of the side surface 22b of the robot H1 will hook onto the end or the lower surface of the substrate W. At this time, the substrate W will not be held by the claw guide portion 22 and the rear guide portion 23, and a part of the substrate W will straddle the upper end of the upper side portion 22b and be placed on the robot H1 in an unstable state. In this way, the substrate W is not When the stable state is placed on the robot H1, there is a possibility that an abnormality cannot be detected based on the on/off signal from the pusher detection unit 29. Even in such a situation, the abnormality determination can still be performed by the determination section 62 based on the on/off signal from the optical sensor 8, so that the abnormality can still be detected.

此外,判定部62對於基板處理裝置1之各構成部,使其等執行異常時配方。藉由異常時配方的執行,來停止搬送動作。於執行異常時配方時發出警報,基板處理裝置1之使用者可立即得知基板處理裝置1為異常狀態。其結果,可儘早停止基板W之搬送,而減少對後續步驟之影響。 In addition, the judging unit 62 causes the components of the substrate processing apparatus 1 to execute an abnormal recipe. By executing the recipe in the event of an exception, the conveying action is stopped. When an alarm is issued when the recipe is executed abnormally, the user of the substrate processing apparatus 1 can immediately know that the substrate processing apparatus 1 is in an abnormal state. As a result, the transfer of the substrate W can be stopped as soon as possible, and the influence on subsequent steps can be reduced.

本發明並不限定於上述實施形態,可以如下之方式變形而加以實施。以下,參照隨附圖式,對本發明第2實施形態詳細地進行說明。 The present invention is not limited to the above-mentioned embodiment, and can be modified and implemented as follows. Hereinafter, the second embodiment of the present invention will be described in detail with reference to the accompanying drawings.

圖9係表示處理單元之概略構成之側視圖。藉由對與上述相同之構成標示相同符號,來省略詳細之說明。處理單元31係用以對基板W實施洗淨處理或蝕刻處理等之液體處理之單片型處理部。 Fig. 9 is a side view showing the schematic configuration of the processing unit. The detailed description is omitted by denoting the same symbols for the same components as the above. The processing unit 31 is a single-piece processing section for performing liquid processing such as cleaning processing or etching processing on the substrate W.

處理單元31具有於內部區隔由側壁801所包圍之密閉空間的腔室802。於腔室802內具備有保持基板W並使其旋轉之旋轉夾盤803、處理液噴嘴804、沖洗液噴嘴(未圖示)、有機溶劑噴嘴(未圖示)、及收容旋轉夾盤803之筒狀之處理杯808。處理液噴嘴804對由旋轉夾盤803所保持之基板W之表面(上表面),供給由處理液供給部所供給之處理液。沖洗液噴嘴對由旋轉夾盤803所保持之基板W之表面(上表面),供給由沖洗液供給部所供給之沖洗液。有機溶劑噴嘴對由旋轉夾盤803所保持之基板W之表面(上表面),供給由有機 溶劑供給部所供給之有機溶劑。 The processing unit 31 has a chamber 802 inside which is partitioned by a closed space surrounded by a side wall 801. The chamber 802 is provided with a rotating chuck 803 that holds and rotates the substrate W, a processing liquid nozzle 804, a rinse liquid nozzle (not shown), an organic solvent nozzle (not shown), and a rotating chuck 803 that accommodates it. Cylindrical processing cup 808. The processing liquid nozzle 804 supplies the processing liquid supplied from the processing liquid supply unit to the surface (upper surface) of the substrate W held by the spin chuck 803. The rinse liquid nozzle supplies the rinse liquid supplied from the rinse liquid supply part to the surface (upper surface) of the substrate W held by the spin chuck 803. The organic solvent nozzle supplies organic solvent to the surface (upper surface) of the substrate W held by the spin chuck 803 The organic solvent supplied by the solvent supply part.

於腔室802之側壁801,以可將基板W相對於腔室802內搬入搬出之方式形成開口811。被配置於腔室802之外側之中心機器人CR(參照圖1),通過開口811使機器手H2(參照圖1)對腔室802內進行存取。藉此,中心機器人CR可將未處理之基板W載置於旋轉夾盤803上、或自旋轉夾盤803上取出處理完畢之基板W。於側壁801之外側設置有用以將開口811沿著上下方向加以開閉之閘門812。於閘門812結合有閘門升降機構813。閘門升降機構813使閘門812於開位置與閉位置(未圖示)之間上下運動。閘門升降機構813係藉由處理控制部64所控制。 An opening 811 is formed in the side wall 801 of the cavity 802 in such a way that the substrate W can be carried in and out of the cavity 802. The center robot CR (refer to FIG. 1) arranged on the outer side of the chamber 802 allows the robot H2 (refer to FIG. 1) to access the inside of the chamber 802 through the opening 811. Thereby, the central robot CR can place the unprocessed substrate W on the rotating chuck 803 or take out the processed substrate W from the rotating chuck 803. A gate 812 for opening and closing the opening 811 in the vertical direction is provided on the outer side of the side wall 801. A gate lifting mechanism 813 is combined with the gate 812. The gate lifting mechanism 813 moves the gate 812 up and down between an open position and a closed position (not shown). The gate lifting mechanism 813 is controlled by the processing control unit 64.

於本實施形態中,旋轉夾盤803係沿著水平方向吸附基板W並將基板W保持為水平之吸附式夾盤。具體而言,旋轉夾盤803係連結於與旋轉馬達814之驅動軸一體化之旋轉軸815。基板W之保持方式亦可為沿著水平方向夾持基板W並將基板W保持為水平之夾持式。亦即,亦可取代吸附式夾盤而將機械夾盤作為旋轉夾盤803來使用。 In this embodiment, the rotating chuck 803 is a suction chuck that sucks the substrate W in the horizontal direction and keeps the substrate W horizontal. Specifically, the rotating chuck 803 is connected to a rotating shaft 815 integrated with the drive shaft of the rotating motor 814. The holding method of the substrate W may also be a holding type in which the substrate W is held in a horizontal direction and the substrate W is held horizontally. That is, instead of the suction chuck, a mechanical chuck may be used as the rotating chuck 803.

於基板W藉由旋轉夾盤803吸附而被保持時,若旋轉馬達814被驅動,旋轉軸815便藉由該驅動力而繞既定之旋轉軸線(鉛垂軸線)A1旋轉。藉此,與旋轉夾盤803地,基板W被以保持大致水平之姿勢的狀態繞旋轉軸線A1旋轉。 When the substrate W is held by suction by the rotating chuck 803, if the rotating motor 814 is driven, the rotating shaft 815 rotates around the predetermined rotating axis (vertical axis) A1 by the driving force. Thereby, as with the rotating chuck 803, the substrate W is rotated around the rotation axis A1 while maintaining a substantially horizontal posture.

處理液噴嘴804藉由供給管805而與處理液供給部連結。處理液閥806被配設於供給管805之中途,且藉由控制部6之信號所開閉控制。藉由打開處理液閥806,處理液噴嘴804與處理液供給部成為連通狀態,處理液自處理液噴嘴804被吐出。藉由關閉處 理液閥806,可使處理液自處理液噴嘴804之吐出停止。 The processing liquid nozzle 804 is connected to the processing liquid supply part by a supply pipe 805. The treatment liquid valve 806 is arranged in the middle of the supply pipe 805 and is controlled to open and close by a signal from the control unit 6. When the processing liquid valve 806 is opened, the processing liquid nozzle 804 and the processing liquid supply part are in a communication state, and the processing liquid is discharged from the processing liquid nozzle 804. By closing The liquid treatment valve 806 can stop the discharge of the treatment liquid from the treatment liquid nozzle 804.

處理杯808係結合於用以使處理杯808於退避位置(實線)與處理位置(兩點鏈線)之間上下運動之杯升降機構807。杯升降機構807係由處理控制部64所控制,藉此來控制處理杯808之上下位置。處理控制部64為了於旋轉夾盤803上接收基板W,而於基板W之搬入時使處理杯808下降至退避位置。處理控制部64於基板W之處理時,使處理杯808上升至處理位置。藉由將處理杯808配置於處理位置,可利用處理杯808接住被供給至基板W且因旋轉而被甩飛之處理液,從而可抑制處理單元31內之處理液之飛散。處理控制部64於基板處理後,解除利用旋轉夾盤803之基板W之吸附,並使處理杯808下降至退避位置。旋轉夾盤803上之基板W係藉由中心機器人CR之機器手H2所保持,所保持之基板W朝向腔室802外被搬出。 The processing cup 808 is combined with a cup lifting mechanism 807 for moving the processing cup 808 up and down between the retreat position (solid line) and the processing position (two-dot chain line). The cup lifting mechanism 807 is controlled by the processing control unit 64 to control the upper and lower positions of the processing cup 808. In order to receive the substrate W on the spin chuck 803, the processing control unit 64 lowers the processing cup 808 to the retracted position when the substrate W is carried in. The processing control unit 64 raises the processing cup 808 to the processing position during the processing of the substrate W. By arranging the processing cup 808 at the processing position, the processing cup 808 can be used to receive the processing liquid supplied to the substrate W and being flung away due to the rotation, so that the scattering of the processing liquid in the processing unit 31 can be suppressed. After the substrate is processed, the processing control unit 64 releases the suction of the substrate W by the spin chuck 803, and lowers the processing cup 808 to the retracted position. The substrate W on the rotating chuck 803 is held by the robot hand H2 of the central robot CR, and the held substrate W is carried out toward the outside of the chamber 802.

處理液亦可包含氫氟酸、硫酸、乙酸、硝酸、鹽酸、氨水、雙氧水、有機酸(例如檸檬酸、草酸等)、有機鹼(例如TMAH(四甲基氫氧化銨;Tetra Methyl Ammonium Hydroxide)等)、界面活性劑、或防腐蝕劑。 The treatment liquid may also contain hydrofluoric acid, sulfuric acid, acetic acid, nitric acid, hydrochloric acid, ammonia, hydrogen peroxide, organic acids (such as citric acid, oxalic acid, etc.), organic bases (such as TMAH (tetramethyl ammonium hydroxide; Tetra Methyl Ammonium Hydroxide) Etc.), surfactants, or corrosion inhibitors.

處理液噴嘴804例如為以連續流之狀態吐出處理液之直線形噴嘴。處理液噴嘴804以將吐出口朝向大致下方之狀態,被安裝於處理液噴嘴臂(未圖示)。處理液噴嘴臂係沿著水平方向延伸之擺動臂,且處理液噴嘴804被安裝於其擺動端部。擺動臂之基端部係結合於未圖示之臂旋動機構。臂旋動機構使處理液噴嘴臂繞沿著鉛垂方向之既定之旋轉軸線(未圖示)擺動。藉由處理液噴嘴臂之擺動,處理液噴嘴804沿著於俯視時通過基板W之上表面中央部之圓弧狀的軌跡水平地移動。藉此,可進行於吐出處理液之狀態下處 理液噴嘴804在基板W上水平地移動之處理。 The processing liquid nozzle 804 is, for example, a linear nozzle that discharges the processing liquid in a continuous flow state. The processing liquid nozzle 804 is attached to the processing liquid nozzle arm (not shown) with the discharge port facing substantially downward. The treatment liquid nozzle arm is a swing arm extending in the horizontal direction, and the treatment liquid nozzle 804 is installed at the swing end thereof. The base end of the swing arm is connected to an arm rotation mechanism not shown. The arm rotation mechanism swings the treatment liquid nozzle arm around a predetermined rotation axis (not shown) along the vertical direction. Due to the swing of the processing liquid nozzle arm, the processing liquid nozzle 804 moves horizontally along an arc-shaped trajectory that passes through the center of the upper surface of the substrate W in a plan view. With this, it can be processed in the state of spitting out the treatment liquid The liquid treatment nozzle 804 moves horizontally on the substrate W for processing.

中心機器人CR將自基板收納容器5被搬送至傳遞單元4之基板W、朝向各處理單元31一次一片地進行搬送。關於中心機器人CR,對於與分度機器人IR相同之構造,省略說明。中心機器人CR具有升降部26A、連結部27A、及一對伸縮部28A。該等分別與分度機器人IR之升降部26、連結部27及伸縮部28具有相同之構造。 The center robot CR transports the substrate W transferred from the substrate storage container 5 to the transfer unit 4 toward each processing unit 31 one at a time. Regarding the center robot CR, the description is omitted for the same structure as the indexing robot IR. The center robot CR has an elevating part 26A, a connecting part 27A, and a pair of telescopic parts 28A. These have the same structures as the lifting part 26, the connecting part 27, and the telescopic part 28 of the indexing robot IR, respectively.

升降部26A可調整機器手H2之垂直方向之位置。具體而言,升降部26A可將機器手H2之高度位置調整為拾取位置(下位置)與放置位置(上位置)。所謂拾取位置,係將基板W自處理單元31搬出時機器手H2之爪導引部22(參照圖3B)之最上部較搬出對象之基板W之下表面低的高度位置。所謂放置位置,係將基板W搬入處理單元31時機器手H2之下表面較旋轉夾盤803之上表面高的高度位置。 The lifting part 26A can adjust the vertical position of the robot H2. Specifically, the lifting part 26A can adjust the height position of the robot H2 to a picking position (lower position) and a placing position (upper position). The pick-up position is a position where the uppermost part of the claw guide 22 (see FIG. 3B) of the robot H2 when the substrate W is unloaded from the processing unit 31 is lower than the lower surface of the substrate W to be unloaded. The placement position is a position where the lower surface of the robot H2 is higher than the upper surface of the rotary chuck 803 when the substrate W is carried into the processing unit 31.

作為往返機構之伸縮部28A具有複數個關節,並藉由關節部之旋轉驅動進行伸縮動作。伸縮部28A可藉由伸縮動作來調整機器手H2之水平方向之位置。具體而言,伸縮部28A可將機器手H2之水平位置調整為起始位置HM(實線)與前進位置FW(兩點鏈線)。所謂起始位置HM(實線),係使伸縮部28A之關節收縮之狀態之水平位置。所謂前進位置FW(兩點鏈線),係使關節伸展而可於基板收納容器5內載置基板W之水平位置。起始位置HM係機器手H2於水平方向上之基準位置。 The telescopic part 28A, which is a reciprocating mechanism, has a plurality of joints, and the telescopic motion is performed by the rotation drive of the joint part. The telescopic part 28A can adjust the position of the robot H2 in the horizontal direction by telescopic action. Specifically, the telescopic part 28A can adjust the horizontal position of the robot H2 to the starting position HM (solid line) and the forward position FW (two-point chain line). The initial position HM (solid line) is a horizontal position in a state where the joints of the telescopic part 28A are contracted. The forward position FW (two-point chain line) is a horizontal position where the joint can be extended and the substrate W can be placed in the substrate storage container 5. The starting position HM is the reference position of the robot H2 in the horizontal direction.

於腔室802之開口811設置有檢測通過開口811之物體之有無的檢測部(感測器),且於本實施形態中係使用光學感測器81。光學感測器81係穿透型感測器,且具有投光部81a與受光部81b。投光部81a與受光部81b係設置為於開口811之上下位置相互地對向之方式使光軸對齊,而對在投光部81a與受光部81b之間通過光軸之物體進行檢測。具體而言,在機器手H2或其所保持之基板W通過投光部81a與受光部81b之間時,會遮蔽光軸(遮光)。光學感測器81藉由對投光狀態與遮光狀態進行檢測,來檢測出機器手H2或基板W之有無。於本實施形態中,將遮光之狀態設為導通並將投光狀態設為斷開之導通/斷開信號,自光學感測器81,被輸出至判定部62。光學感測器81亦可具有反射型感測器之形態。反射型感測器的細節,由於與前述之光學感測器8之情形時相同,因此省略說明。 The opening 811 of the cavity 802 is provided with a detection part (sensor) for detecting the presence or absence of an object passing through the opening 811, and an optical sensor 81 is used in this embodiment. The optical sensor 81 is a transmissive sensor, and has a light projecting part 81a and a light receiving part 81b. The light projecting portion 81a and the light receiving portion 81b are arranged to align the optical axis so that the upper and lower positions of the opening 811 are opposed to each other, and an object passing the optical axis between the light projecting portion 81a and the light receiving portion 81b is detected. Specifically, when the robot H2 or the substrate W held by it passes between the light projecting portion 81a and the light receiving portion 81b, the optical axis is shielded (light shielding). The optical sensor 81 detects the presence or absence of the robot H2 or the substrate W by detecting the light projection state and the light shielding state. In this embodiment, the on/off signal that sets the light-shielding state to on and the light-emitting state to off is output from the optical sensor 81 to the determination unit 62. The optical sensor 81 may also have the form of a reflective sensor. The details of the reflective sensor are the same as in the case of the aforementioned optical sensor 8, so the description is omitted.

圖10係表示基板處理裝置中基板之搬送動作之流程圖。圖11係依照時間序列來表示在基板交付動作中正常與異常之光學感測器之檢測信號的時序圖。於圖11中,光信號RLS3表示在基板交付動作為正常時自光學感測器8所輸出之時間序列之導通/斷開信號之例子。又,光信號RLS4表示在基板交付動作存在有異常時自光學感測器8所輸出之時間序列之導通/斷開信號之例子。對於機器手H2之推動器檢測部29(參照圖3A、3B)之說明由於與上述相同,因此予以省略。 Fig. 10 is a flow chart showing the conveying action of the substrate in the substrate processing apparatus. FIG. 11 is a timing diagram showing the detection signals of the normal and abnormal optical sensors in the substrate delivery operation according to the time sequence. In FIG. 11, the optical signal RLS3 represents an example of a time-series on/off signal output from the optical sensor 8 when the substrate delivery operation is normal. In addition, the optical signal RLS4 represents an example of a time-series on/off signal output from the optical sensor 8 when there is an abnormality in the substrate delivery operation. The description of the pusher detection portion 29 of the robot H2 (refer to FIGS. 3A and 3B) is the same as the above, and therefore is omitted.

<步驟S11>取得基板 <Step S11> Obtain a board

中心機器人CR進行基板之接收動作。中心機器人CR之基板之接收動作,由於與分度機器人IR之基板之接收動作相同,因此省略詳細之說明。中心機器人CR取得藉由分度機器人IR而被載置於傳遞單元4之基板W,並搬送至處理單元31。中心機器人CR與分度機器 人IR相同地,以固定保持有基板W之狀態進行搬送。 The central robot CR performs the receiving action of the substrate. Since the receiving action of the substrate of the center robot CR is the same as the receiving action of the substrate of the indexing robot IR, the detailed description is omitted. The center robot CR obtains the substrate W placed on the transfer unit 4 by the indexing robot IR, and transports it to the processing unit 31. Central robot CR and indexing machine The human IR is similarly transported in a state where the substrate W is fixed and held.

<步驟S12>搬入、載置基板 <Step S12> Loading and placing the substrate

中心機器人CR進行基板之交付動作。中心機器人CR之基板之交付動作,由於與分度機器人IR之基板之交付動作相同,因此省略詳細之說明。中心機器人CR在將基板W固定保持於機器手H2之狀態下,旋轉至對基板W進行處理之對象處理單元31之處理單元交接位置。與中心機器人CR之旋轉動作同步地,閘門812藉由閘門升降機構813而自閉位置下降至開位置,機器手H2與開口811相對向。於旋轉後,使垂直位置移動至放置位置(時間t11)。於時間t11,由於光學感測器8為投光狀態,因此輸出導通信號。 The central robot CR performs the delivery of the substrate. Since the substrate delivery action of the center robot CR is the same as the substrate delivery action of the indexing robot IR, the detailed description is omitted. The center robot CR rotates to the processing unit transfer position of the target processing unit 31 that processes the substrate W while holding the substrate W in the robot H2. In synchronization with the rotation of the central robot CR, the gate 812 is lowered from the closed position to the open position by the gate lifting mechanism 813, and the robot H2 faces the opening 811. After rotating, move the vertical position to the placement position (time t11). At time t11, since the optical sensor 8 is in the light emitting state, it outputs a turn-on signal.

其次,中心機器人CR為了於固定保持有基板W之狀態下使機器手H2朝向處理單元31內部進入,而使機器手H2開始進行自起始位置HM朝向前進位置FW移動之往路移動(時間t12)。於開始進行往路移動後,若機器手H2到達開口811,被固定保持之基板W遮蔽光學感測器81之光軸,自光學感測器81朝向判定部62所輸出之信號,便會從導通信號切換為斷開信號(時間t13)。判定部62以從自光學感測器81所輸入之導通信號切換為斷開信號作為通過期間之起點,而開始進行斷開信號之持續時間之測量。 Next, in order for the center robot CR to move the robot H2 toward the inside of the processing unit 31 while holding the substrate W in a fixed state, the robot H2 starts to move forward from the starting position HM to the forward position FW (time t12) . After starting to move forward, if the robot H2 reaches the opening 811, the fixed substrate W shields the optical axis of the optical sensor 81, and the signal output from the optical sensor 81 toward the determination unit 62 will be guided The on signal is switched to the off signal (time t13). The judging section 62 starts to measure the duration of the off signal by switching from the on signal input from the optical sensor 81 to the off signal as the starting point of the passing period.

其次,機器手H2到達前進位置FW。於到達前進位置FW後,控制部6藉由使推動器部24之可動部24a收縮,來解除朝向基板W之壓抵(時間t14)。藉由解除朝向基板W之壓抵,可將基板W載置於旋轉夾盤803。中心機器人CR維持在前進位置FW,執行使機器手H2之垂直位置自放置位置下降移動至拾取位置之載置移動。藉 由載置移動,被保持於爪導引部22及後導引部23之內側之基板W,被載置於旋轉夾盤803。 Next, the robot H2 reaches the forward position FW. After reaching the forward position FW, the control section 6 retracts the movable section 24a of the pusher section 24 to release the pressing force toward the substrate W (time t14). By releasing the pressing against the substrate W, the substrate W can be placed on the rotating chuck 803. The center robot CR is maintained at the forward position FW, and executes the placement movement that moves the vertical position of the robot H2 from the placement position to the pickup position. borrow The substrate W held inside the claw guide portion 22 and the rear guide portion 23 by the placement movement is placed on the spin chuck 803.

<步驟S13>使機器手H2後退 <Step S13> Retreat the robot H2

其次,中心機器人CR為了使機器手H2自處理單元31內後退,而進行使機器手H2自前進位置FW朝向起始位置HM移動之返路移動。若基板W被正常地載置於旋轉夾盤803,機器手H2上便不存在基板W。因此,若在通過光學感測器81之光軸中機器手H2之中空區域(作為構件不存在部分之V字型部分之間的區域)到達光軸,光學感測器8便自遮光狀態變化為投光狀態。據此自光學感測器81所輸出之信號,從導通信號變化為斷開信號(時間t15)。判定部62於自光學感測器81所輸出之信號從斷開信號變化為導通信號之時間點,結束自光學感測器81所輸出之斷開信號之持續時間的測量。在中空區域通過光學感測器81之光軸後,亦維持斷開信號之狀態,若機器手H2到達起始位置HM,返路移動便完成(時間t16)。於基板被正常地搬送之情形時,自光學感測器81所輸出之信號從導通信號變化為斷開信號之時間t13,至從斷開信號變化為導通信號之時間t15為止的期間,成為第3通過期間PP3。 Next, in order to make the robot H2 retreat from the processing unit 31, the center robot CR performs a return movement which moves the robot H2 from the forward position FW to the start position HM. If the substrate W is normally placed on the spin chuck 803, there is no substrate W on the robot H2. Therefore, if the hollow area of the robot H2 (the area between the V-shaped parts as the non-existent part of the component) reaches the optical axis while passing through the optical axis of the optical sensor 81, the optical sensor 8 changes from the light-shielded state It is in the light-emitting state. Accordingly, the signal output from the optical sensor 81 changes from the on signal to the off signal (time t15). The determining part 62 ends the measurement of the duration of the disconnection signal output from the optical sensor 81 at the time point when the signal output from the optical sensor 81 changes from the disconnection signal to the conduction signal. After the hollow area passes through the optical axis of the optical sensor 81, the signal state is maintained. If the robot H2 reaches the starting position HM, the return movement is completed (time t16). When the substrate is transported normally, the signal output from the optical sensor 81 changes from the on signal to the off signal at time t13 to the time t15 when the off signal changes to the on signal, It becomes the third pass period PP3.

中心機器人CR於使機器手H2自處理單元31內後退之返路移動時,可設為較往路移動時之平常搬送速度慢之速度,而藉由於往路移動時降低速度,可提升往路移動時之光學感測器81之檢測精度。 When the central robot CR moves the robot H2 backwards from the processing unit 31, it can be set to a speed slower than the normal conveying speed when moving forward, and by reducing the speed when moving forward, it can improve the speed when moving forward. The detection accuracy of the optical sensor 81.

<步驟S14>比較光學感測器信號是否一致 <Step S14> Compare whether the optical sensor signals are consistent

判定部62將基板W之交付動作時所測量之第3通過期間PP3與儲存部61儲存之第2正常期間NP2加以比較。判定部62於將第3通過期間PP3與儲存部61所儲存之第2正常期間NP2加以比較之結果為一致時判定為正常(S14之YES),並持續進行處理,而於不同時判定為異常(S14之NO),並執行異常時配方。於將第3通過期間PP3與第2正常期間NP2加以比較之情形時,亦可相對於第2正常期間NP2,使其具有±10%左右之裕度來進行判定。 The determination unit 62 compares the third pass period PP3 measured during the delivery operation of the substrate W with the second normal period NP2 stored in the storage unit 61. The judging unit 62 judges that it is normal (YES in S14) when the result of comparing the third pass period PP3 with the second normal period NP2 stored in the storage unit 61 is the same, and continues processing, but judged as abnormal at the same time (NO of S14), and execute the recipe when abnormal. In the case of comparing the third pass period PP3 with the second normal period NP2, it is also possible to make a determination with a margin of about ±10% with respect to the second normal period NP2.

例如,所儲存之第2正常期間NP2為2.8秒以下。根據設計值及實驗,2.5秒附近為適當之值,假設存在異常時為3.0秒以上,則2.5秒加上約10%之裕度,而將第2正常期間NP2設為2.8秒以下。如前所述,由於第2正常期間NP2可根據移動距離或移動速度任意地變更,因此並不限定於該等數值,而亦可具有上下限之範圍。如此,藉由使其具有裕度,可防止將不成問題之微小之動作偏差等作為錯誤而推測出之情形。若第3通過期間PP3藉由判定部62而被判定為正常,便結束利用中心機器人CR所進行之一連串的基板交付動作。 For example, the stored second normal period NP2 is 2.8 seconds or less. According to design values and experiments, 2.5 seconds is an appropriate value. If there is an abnormality, it is 3.0 seconds or more, 2.5 seconds plus a margin of about 10%, and the second normal period NP2 is set to 2.8 seconds or less. As described above, since the second normal period NP2 can be arbitrarily changed according to the moving distance or the moving speed, it is not limited to these values, and may have a range of upper and lower limits. In this way, by providing a margin, it is possible to prevent a situation in which small operation deviations that are not a problem can be guessed as errors. If the third pass period PP3 is judged to be normal by the judging unit 62, a series of board delivery operations performed by the center robot CR is ended.

<步驟S15>對基板進行處理 <Step S15> Process the substrate

對被搬送至處理單元31之基板W執行各種處理。例如,執行利用藥液所進行之洗淨處理、蝕刻處理、抗蝕劑塗佈處理、或顯影處理。 Various processes are performed on the substrate W transported to the processing unit 31. For example, a cleaning process, an etching process, a resist coating process, or a development process by a chemical solution is performed.

此處,假設基板W藉由機器手H2而未被正常地載置於旋轉夾盤803之情形。例如,基板W存在有因經過製造製程而翹曲為凹型之情形。在基板W被載置於旋轉夾盤803後,由於基板W之翹曲,即便機器手H2下降至下降拾取位置,仍存在基板W之下表面之 一部分與機器手H2之側面部22b之上端同等或較機器手H2之側面部22b之上端低之可能性。 Here, it is assumed that the substrate W is not normally placed on the spin chuck 803 by the robot H2. For example, the substrate W may warp into a concave shape due to the manufacturing process. After the substrate W is placed on the spin chuck 803, due to the warpage of the substrate W, even if the robot H2 is lowered to the lowered pickup position, there is still a gap on the lower surface of the substrate W There is a possibility that a part is equal to or lower than the upper end of the side surface 22b of the robot H2.

在機器手H2進行載置移動而將基板W載置於旋轉夾盤803後,於機器手H2自前進位置FW朝向起始位置HM進行返路移動時,存在有機器手H2之側面部22b之上端會勾到基板W之端部或下表面等之情形。於勾到之狀態下,基板W未由爪導引部22及後導引部23所支撐,基板W之一部分跨上側面部22b上,而以不穩定之狀態被載置於機器手H2上。於載置移動後,由於使可動部24a收縮之狀態為正常,因此判定部62判定自推動器檢測部29所輸出之斷開信號為正常之狀態。因此,即便於基板W以不穩定之狀態被載置於機器手H2上之情形時,亦無法藉由推動器檢測部29來檢測出該異常。 After the robot H2 moves and places the substrate W on the spin chuck 803, when the robot H2 moves back from the forward position FW to the starting position HM, there is a side surface 22b of the robot H2 The upper end will hook onto the end or lower surface of the substrate W. In the hooked state, the substrate W is not supported by the claw guide 22 and the rear guide 23, and a part of the substrate W straddles the upper side 22b and is placed on the robot H2 in an unstable state . After the placement movement, since the state of retracting the movable portion 24a is normal, the determination section 62 determines that the disconnection signal output from the pusher detection section 29 is a normal state. Therefore, even when the substrate W is placed on the robot H2 in an unstable state, the abnormality cannot be detected by the pusher detection unit 29.

另一方面,即便在通過光學感測器81之光軸中機器手H2之中空區域(作為構件不存在部分之V字型部分之間的區域)到達光軸(時間t15),由於在機器手H2上存在有基板W,因此光學感測器81不會從遮光狀態變化為投光狀態,其輸出信號被維持為斷開信號。機器手H2繼續進行返路移動,並於基板W通過光軸之時間點變化為導通信號(時間t15a)。判定部62於自光學感測器81所輸出之信號從斷開信號變化為導通信號之時間點,結束光學感測器81之斷開信號之持續時間的測量。若機器手H2到達起始位置HM,返路移動便結束(時間t16)。於基板W未被正常地搬送之情形時,自光學感測器81所輸出之信號從導通信號變化為斷開信號之時間t13,至從斷開信號變化為導通信號之時間t15a為止的期間,成為第4通過期間PP4。 On the other hand, even if the hollow area of the robot H2 (the area between the V-shaped parts as the non-existent part of the component) reaches the optical axis (time t15) in the optical axis passing through the optical sensor 81, the There is a substrate W on H2, so the optical sensor 81 does not change from a light-shielding state to a light-emitting state, and its output signal is maintained as an off signal. The robot H2 continues to move back, and changes to a conduction signal at the point in time when the substrate W passes through the optical axis (time t15a). The determination section 62 ends the measurement of the duration of the disconnection signal of the optical sensor 81 at the time point when the signal output from the optical sensor 81 changes from the disconnection signal to the conduction signal. If the robot H2 reaches the starting position HM, the return movement ends (time t16). When the substrate W is not normally transported, the signal output from the optical sensor 81 changes from the on signal to the off signal at time t13 to the time t15a when the off signal changes to the on signal The period becomes the fourth pass period PP4.

判定部62針對基板W之交付動作,將所測量之第4通過期間PP4與儲存部61所儲存之第2正常期間NP2加以比較。判定部62將第4通過期間PP4與儲存部61所儲存之第2正常期間NP2加以比較之結果,如圖11所示般由於第4通過期間PP4與儲存部61所儲存之第2正常期間NP2不同,因此執行異常時配方。 The determination unit 62 compares the measured fourth pass period PP4 with the second normal period NP2 stored in the storage unit 61 for the delivery operation of the substrate W. The determination unit 62 compares the fourth pass period PP4 with the second normal period NP2 stored in the storage unit 61. As shown in FIG. 11, the fourth pass period PP4 and the second normal period NP2 stored in the storage unit 61 are compared. Different, so the recipe is executed abnormally.

<步驟S16>異常時配方之執行 <Step S16> Execution of recipe when abnormal

判定部62於判定為異常時,使基板處理裝置1之各構成部執行儲存部61所儲存之異常時配方。例如,異常時配方規定包含分度機器人IR之基板搬送後停止、被判定為異常之對象處理單元31之即時停止、異常處理單元以外之處理單元31之處理完成後停止、中心機器人CR之即時停止、及警報之產生之一連串的動作。警報係基板處理裝置1之主畫面之警告顯示、聲音的產生、透過通信線路朝向主電腦之彈出訊息之顯示指令輸出等。藉由產生警報,可通知裝置使用者基板處理裝置1為異常之情形。於異常時配方之執行完成之情形時,判定部62亦設為一連串之搬送動作結束。 When the determination unit 62 determines that it is abnormal, it causes each component of the substrate processing apparatus 1 to execute the abnormal time recipe stored in the storage unit 61. For example, the recipe at the time of abnormality includes the stop of the substrate transfer of the indexing robot IR, the immediate stop of the target processing unit 31 that is judged to be abnormal, the stop after the processing of the processing unit 31 other than the abnormal processing unit, and the immediate stop of the central robot CR , And a series of actions that generate an alarm. The alarm is the warning display of the main screen of the substrate processing apparatus 1, the generation of sound, the display command output of the pop-up message to the main computer through the communication line, and so on. By generating an alarm, the device user can be notified that the substrate processing device 1 is abnormal. When the execution of the recipe is completed in an abnormal situation, the judging unit 62 also sets the series of conveying operations to end.

根據上述之本發明第2實施形態之基板搬送裝置,藉由判定部62,針對機器手H2將基板W載置於處理單元31之旋轉夾盤803時之一連串之基板W之交付動作,可使用光學感測器81之檢測信號,來判定處於正常狀態或處於異常狀態。更具體而言,可根據光學感測器81所檢測出之機器手H2或基板W之檢測時間之斷開信號之持續時間,來測量通過期間。藉由對該通過期間與儲存部61所儲存之正常期間是否一致進行比較,可判定基板W之交付動作為正常或異常。 According to the substrate transfer device of the second embodiment of the present invention described above, the determination unit 62 can be used for a series of substrate W delivery operations when the robot H2 places the substrate W on the spin chuck 803 of the processing unit 31 The detection signal of the optical sensor 81 is used to determine whether it is in a normal state or in an abnormal state. More specifically, the passing period can be measured based on the duration of the off signal of the detection time of the robot hand H2 or the substrate W detected by the optical sensor 81. By comparing whether the passing period is consistent with the normal period stored in the storage unit 61, it can be determined whether the delivery operation of the substrate W is normal or abnormal.

若基板W產生翹曲,則即便機器手H2下降至拾取位置,仍存在基板W之下表面之一部分與機器手H2之側面部22b之上端同等之高度或較機器手H2之側面部22b之上端低之可能性。於該情形時,在機器手H2自前進位置FW朝向起始位置HM進行返路移動時,機器手H2之側面部22b之上端會勾到基板W之端部或下表面等。此時,基板W不會由爪導引部22及後導引部23所保持,基板W之一部分會跨上側面部22b,而以不穩定之狀態被載置於機器手H2上。如此,於基板W以不穩定之狀態被載置於機器手H2上之情形時,存在有無法根據來自推動器檢測部29之導通/斷開信號來檢測出異常之可能性。即便於如此之狀況,由於根據來自光學感測器81之導通/斷開信號,仍可藉由判定部62來進行異常判定,因此仍可對異常進行檢測。 If the substrate W is warped, even if the robot H2 is lowered to the pickup position, there is still a part of the lower surface of the substrate W that is the same height as the upper end of the side surface 22b of the robot H2 or higher than the upper end of the side surface 22b of the robot H2 Low possibility. In this case, when the robot H2 moves back from the forward position FW to the starting position HM, the upper end of the side portion 22b of the robot H2 will hook onto the end or the lower surface of the substrate W. At this time, the substrate W is not held by the claw guide 22 and the rear guide 23, and a part of the substrate W straddles the side surface 22b and is placed on the robot H2 in an unstable state. In this way, when the substrate W is placed on the robot H2 in an unstable state, there is a possibility that an abnormality cannot be detected based on the on/off signal from the pusher detector 29. Even in such a situation, the abnormality determination can still be performed by the determination section 62 based on the on/off signal from the optical sensor 81, so that the abnormality can still be detected.

此外,判定部62對於基板處理裝置1之各構成部,使其等執行異常時配方。藉由異常時配方的執行,來停止搬送動作,其後之基板W之搬送便停止。此外,警報被發出,基板處理裝置1之使用者便可立即得知基板處理裝置1為異常狀態。其結果,可儘早地停止基板W之搬送,來減少對後續步驟之影響。 In addition, the judging unit 62 causes the components of the substrate processing apparatus 1 to execute an abnormal recipe. The execution of the recipe at the time of the abnormality stops the conveying action, and then the conveying of the substrate W is stopped. In addition, when an alarm is issued, the user of the substrate processing apparatus 1 can immediately know that the substrate processing apparatus 1 is in an abnormal state. As a result, the transfer of the substrate W can be stopped as soon as possible to reduce the influence on subsequent steps.

本發明並不限定於上述實施形態,可如下所述般變形而加以實施。以下,對本發明第3實施形態詳細地進行說明。 The present invention is not limited to the above-mentioned embodiment, and can be modified and implemented as described below. Hereinafter, the third embodiment of the present invention will be described in detail.

存在有被載置於基板收納容器5之基板W成為自正常位置朝分度單元2側偏移之狀態、即基板W自基板收納容器5突出之狀態的情況。於該情形時,光學感測器8可檢測出基板W之突出。例如,於穿透型感測器之情形時,光軸會由突出之基板W所遮蔽而成為遮光狀態。又,於反射型感測器之情形時,所投射之光會由突 出之狀態之基板W所反射而成為反射狀態。無論何種形態之感測器均輸出斷開信號,且由於突出之基板W靜止,因此持續輸出斷開信號。 The substrate W placed in the substrate storage container 5 may be in a state shifted from the normal position toward the index unit 2 side, that is, the substrate W may protrude from the substrate storage container 5. In this case, the optical sensor 8 can detect the protrusion of the substrate W. For example, in the case of a transmissive sensor, the optical axis is shielded by the protruding substrate W and becomes a light-shielding state. Also, in the case of a reflective sensor, the projected light will be The substrate W in the out-of-state state is reflected and becomes a reflective state. The sensor of any type outputs a disconnection signal, and since the protruding substrate W is stationary, it continues to output the disconnection signal.

於該情形時,即便自測量開始點經過所預先決定之既定期間,光學感測器8之輸出也不會從斷開變化為導通。因此,判定部62將經過該既定期間之時間點設為測量結束點,並將該既定期間設為第5通過期間PP5。既定期間較佳係設定為基板W之交付動作有異常時所設想之斷開信號持續時間以上,例如設定為3秒以上。 In this case, the output of the optical sensor 8 will not change from off to on even if a predetermined period has passed since the measurement start point. Therefore, the determination unit 62 sets the time point when the predetermined period has elapsed as the measurement end point, and sets the predetermined period as the fifth passage period PP5. The predetermined period is preferably set to be longer than the duration of the off signal assumed when there is an abnormality in the delivery operation of the substrate W, for example, set to be 3 seconds or longer.

判定部62將測量光學感測器8所檢測出之斷開信號之持續時間所得到的第5通過期間PP5與儲存部61所儲存之第3正常期間NP3加以比較。例如,第3正常期間NP3係使用者所決定之任意期間。判定部62於將第5通過期間PP5與儲存部61所儲存之第3正常期間NP3加以比較之結果為一致時判定為正常,而於不同時判定為異常。判定部62於判定為異常之情形時,執行任意之異常時配方。亦可將第1正常期間NP1與第3正常期間設為相同期間(相同長度)。藉由設為相同期間,使用者便無需管理複數個設定,而且,可減少基板處理裝置1之資料處理負荷與通信負荷。 The determining unit 62 compares the fifth passing period PP5 obtained by measuring the duration of the off signal detected by the optical sensor 8 with the third normal period NP3 stored in the storage unit 61. For example, the third normal period NP3 is an arbitrary period determined by the user. The determination unit 62 determines that it is normal when the result of comparing the fifth pass period PP5 with the third normal period NP3 stored in the storage unit 61 is the same, but determines that it is abnormal at the same time. The judging unit 62 executes any abnormal recipe when it is judged to be an abnormal situation. The first normal period NP1 and the third normal period may be the same period (same length). By setting the same period, the user does not need to manage multiple settings, and the data processing load and communication load of the substrate processing apparatus 1 can be reduced.

本發明並不限定於上述實施形態,而且,可下述之例示般變形而加以實施。 The present invention is not limited to the above-mentioned embodiment, and can be modified and implemented as illustrated below.

(1)於前述之實施形態中,機器手H1(H2)之中空形狀雖為包含V字型之形狀,但亦可為包含Y字型或U字型之形狀。藉由將中空形狀設為可變更,可增加機器手形狀之設計自由度。又,亦可於機器手H1(H2)安裝反射構件。藉由安裝反射構件,可提高反射型感測器之檢測感度。反射構件之安裝位置只要為可藉由受光部8d 來接收自反射感測器之投光部8c所投射且由該反射構件所反射之光線的位置即可,可為機器手H1(H2)之正背面的任一面。 (1) In the foregoing embodiment, although the hollow shape of the robot hand H1 (H2) is a shape including a V shape, it may also be a shape including a Y shape or a U shape. By setting the hollow shape to be changeable, the design freedom of the robot hand shape can be increased. In addition, a reflective member may be attached to the robot H1 (H2). By installing reflective components, the detection sensitivity of the reflective sensor can be improved. As long as the installation position of the reflecting member is accessible by the light receiving part 8d The position to receive the light beam projected from the light projection part 8c of the reflective sensor and reflected by the reflective member is sufficient, and it can be any side of the front and back of the robot H1 (H2).

(2)於前述之實施形態中,光學感測器8、81為1個。然而,亦可設置複數個光學感測器。可藉由設置複數個光學感測器,來提升檢測精度。 (2) In the foregoing embodiment, the number of optical sensors 8, 81 is one. However, multiple optical sensors can also be provided. The detection accuracy can be improved by installing multiple optical sensors.

(3)於前述之實施形態中,光學感測器8於裝載埠開口L之上下位置被對向設置。然而,只要自基板收納容器5後退時機器手H1與所保持之基板W在移動之路徑上,便不限定於與裝載埠開口L對向之配置,亦可採用與被設置於分度單元2之間隔壁7之間隔壁通過孔7a等對向之配置。藉此,可增加設計之自由度。 (3) In the foregoing embodiment, the optical sensor 8 is arranged opposite to the upper and lower positions of the load port opening L. However, as long as the robot H1 and the held substrate W are on the moving path when retreating from the substrate storage container 5, it is not limited to the arrangement opposite to the loading port opening L, and can also be used and installed in the indexing unit 2. The partition wall 7 of the partition wall passes through the hole 7a and is arranged so as to face each other. In this way, the degree of freedom of design can be increased.

(4)於前述之實施形態中,光學感測器81係設置於處理單元31之開口811內側之上下位置。然而,只要自處理單元31後退時在機器手H2與所保持之基板W移動之路徑上,便不限定於被設置在處理單元31之開口811內側,而亦可被設置於開口811外側。藉此,可增加設計之自由度。 (4) In the foregoing embodiment, the optical sensor 81 is disposed at the upper and lower positions inside the opening 811 of the processing unit 31. However, as long as the moving path of the robot H2 and the substrate W held by the processing unit 31 moves back from the processing unit 31, it is not limited to being provided inside the opening 811 of the processing unit 31, and may be provided outside the opening 811. In this way, the degree of freedom of design can be increased.

(5)亦可於分度機器人IR自基板收納容器5接收基板W之接收動作之動作期間設置正常期間。關於中心機器人CR亦同。 (5) The normal period can also be set during the operation period of the receiving operation of the indexing robot IR receiving the substrate W from the substrate storage container 5. The same applies to the central robot CR.

(6)分度機器人IR亦可以自基板收納容器5接收基板W之動作期間與對基板收納容器5交付基板W之動作期間成為相同期間(相同長度)之方式所設計及/或控制。藉由設為相同動作期間,便無須在取得基板W之動作期間與交付基板W之動作期間分別設置個別之正常期間,可使正常期間共通化。藉由使正常期間共通化,可相較於個別地設置正常期間之情形時,減少基板處理裝置1之資料處理負荷與通信負荷。關於中心機器人CR亦同。 (6) The indexing robot IR may also be designed and/or controlled so that the operation period of receiving the substrate W from the substrate storage container 5 and the operation period of delivering the substrate W to the substrate storage container 5 have the same period (same length). By setting the same operation period, there is no need to set separate normal periods between the operation period of obtaining the substrate W and the operation period of delivering the substrate W, and the normal periods can be made common. By making the normal period common, it is possible to reduce the data processing load and communication load of the substrate processing apparatus 1 compared to when the normal period is individually set. The same applies to the central robot CR.

(7)亦可將第1正常期間NP1與第2正常期間NP2設為相同期間(相同長度)。此外,亦可將第1正常期間NP1、第2正常期間NP2、及第3正常期間NP3設為相同期間(相同長度)。藉由設為相同期間,使用者便無需管理複數個設定而可減輕管理之工時。此外,可減少基板處理裝置1之資料處理負荷與通信負荷。 (7) The first normal period NP1 and the second normal period NP2 may be the same period (same length). In addition, the first normal period NP1, the second normal period NP2, and the third normal period NP3 may be the same period (same length). By setting the same period, the user does not need to manage multiple settings and can reduce management man-hours. In addition, the data processing load and communication load of the substrate processing apparatus 1 can be reduced.

(8)於前述之實施形態中,已對因基板W之翹曲而產生異常狀態之情形進行說明。然而,亦存在有因其他原因而產生異常狀態之可能性。例如,於因分度機器人IR之動作不良而產生基板W之保持異常之情形時,亦可檢測出該保持異常。 (8) In the foregoing embodiment, the case where the abnormal state occurs due to the warpage of the substrate W has been described. However, there is also the possibility of abnormal conditions due to other reasons. For example, when an abnormality in the holding of the substrate W occurs due to a malfunction of the indexing robot IR, the holding abnormality can also be detected.

(9)於前述之實施形態中,雖已例示關於裝載埠LP與處理單元31之實施形態,但並不限定於該等,亦可將本發明應用於傳遞單元4等載置基板之單元。 (9) In the foregoing embodiments, although the loading port LP and the processing unit 31 have been exemplified, they are not limited to these, and the present invention can also be applied to the transfer unit 4 and other substrate-mounted units.

雖已對本發明之實施形態進行詳細之說明,但該等僅為用以明確化本發明之技術內容的具體例,本發明不應被限定解釋為該等具體例。本發明之範圍係藉由申請專利範圍所表示,意在包含申請專利範圍及與其均等之意涵以及範圍內之所有變更。 Although the embodiments of the present invention have been described in detail, these are only specific examples for clarifying the technical content of the present invention, and the present invention should not be limited to these specific examples. The scope of the present invention is indicated by the scope of the patent application, and is intended to include the scope of the patent application and its equivalent meaning and all changes within the scope.

2‧‧‧分度單元 2‧‧‧Grading unit

3‧‧‧處理部 3‧‧‧Processing Department

4‧‧‧傳遞單元 4‧‧‧Transfer unit

5‧‧‧基板收納容器 5‧‧‧Substrate storage container

5a‧‧‧框體 5a‧‧‧Frame

5b‧‧‧蓋 5b‧‧‧cover

5c‧‧‧基板導引部 5c‧‧‧Substrate guide

7‧‧‧間隔壁 7‧‧‧The next wall

7a‧‧‧間隔壁通過孔 7a‧‧‧Partition wall through hole

7b‧‧‧底部 7b‧‧‧Bottom

8‧‧‧光學感測器 8‧‧‧Optical Sensor

8a‧‧‧投光部 8a‧‧‧Light Projection Department

8b‧‧‧受光部 8b‧‧‧Light receiving part

8c‧‧‧投光部 8c‧‧‧Light Projection Department

8d‧‧‧受光部 8d‧‧‧light receiving part

21‧‧‧支撐部 21‧‧‧Support

25‧‧‧底座部 25‧‧‧Base

26‧‧‧升降部 26‧‧‧Elevator

27‧‧‧連結部 27‧‧‧Connecting part

28‧‧‧伸縮部 28‧‧‧Retractable part

32‧‧‧平台 32‧‧‧Platform

34‧‧‧裝載埠開閉機構 34‧‧‧Load port opening and closing mechanism

34a‧‧‧閘門構件 34a‧‧‧Gate component

34b‧‧‧閘門驅動部 34b‧‧‧Gate drive

35‧‧‧設置台 35‧‧‧Settable

35a‧‧‧上部水平面 35a‧‧‧Upper horizontal plane

35b‧‧‧上部垂直面 35b‧‧‧Upper vertical surface

B‧‧‧開口 B‧‧‧Open

C‧‧‧兩點箭頭鏈線 C‧‧‧Two-point arrow chain

D‧‧‧兩點箭頭鏈線 D‧‧‧Two-point arrow chain

E‧‧‧兩點箭頭鏈線 E‧‧‧Two-point arrow chain

FW‧‧‧前進位置 FW‧‧‧forward position

H1‧‧‧機器手 H1‧‧‧Robot

HM‧‧‧起始位置 HM‧‧‧Starting position

IR‧‧‧分度機器人 IR‧‧‧Indexing Robot

L‧‧‧裝載埠開口 L‧‧‧Load port opening

W‧‧‧基板 W‧‧‧Substrate

Claims (14)

一種基板搬送裝置,係對既定位置交接基板者;其具備有:保持部,其保持基板;往返機構,其使上述保持部相對於上述既定位置進行往返移動;光學感測器,其於上述保持部藉由上述往返機構進行移動之路徑上形成感測器區域;以及控制部,其於基板之交付動作中,對上述保持部或由該保持部所保持之基板(以下稱為「保持基板」)通過上述感測器區域之第1通過期間進行檢測,並於該第1通過期間與所預先設定之第1正常期間不同時判斷為搬送異常,其中,上述基板之交付動作包含上述保持部藉由上述往返機構而朝向上述既定位置之往路動作、及上述保持部離開上述既定位置之返路動作;而上述保持部具有:抵接部,其抵接於基板之一端部;可伸縮之位置偏移防止機構,其以將基板之另一端部推向上述抵接部之方式伸長而固定上述基板;及伸縮檢測部,其對上述位置偏移防止機構之伸縮動作進行檢測;上述位置偏移防止機構於上述往路移動中將基板加以固定,並於上述返路移動中解除基板之固定,且上述伸縮檢測部於上述位置偏移防止機構將基板加以固定之狀態下對上述位置偏移防止機構之伸長進行檢測,並於上述位置偏移防止機構解除基板之固定之狀態下對上述位置偏移防止機構之收縮進行檢測。 A substrate conveying device that transfers a substrate to a predetermined position; it is provided with: a holding portion that holds the substrate; a reciprocating mechanism that allows the holding portion to reciprocate relative to the predetermined position; and an optical sensor that holds the substrate The sensor area is formed on the path moved by the above-mentioned shuttle mechanism; and the control unit, which, during the substrate delivery operation, provides for the above-mentioned holding part or the substrate held by the holding part (hereinafter referred to as “holding substrate”). ) The detection is carried out through the first passing period of the sensor area, and when the first passing period is different from the first normal period set in advance, it is judged as a conveyance abnormality, wherein the delivery operation of the substrate includes the holding portion The forward movement of the reciprocating mechanism toward the predetermined position, and the return movement of the holding portion away from the predetermined position; and the holding portion has: an abutment portion that abuts on one end of the substrate; and a retractable position deviation A movement prevention mechanism which stretches and fixes the substrate by pushing the other end of the substrate toward the abutment portion; and a telescopic detection part which detects the expansion and contraction action of the position shift prevention mechanism; the position shift prevention The mechanism fixes the substrate during the forward movement, and releases the fixing of the substrate during the return movement, and the expansion and contraction detection section controls the position shift prevention mechanism in a state where the substrate is fixed by the position shift prevention mechanism. The elongation is detected, and the shrinkage of the position deviation prevention mechanism is detected in a state where the position deviation prevention mechanism releases the fixing of the substrate. 如請求項1之基板搬送裝置,其中,上述既定位置係收納基板之基板收納容器內之位置,且上述光學感測器於上述基板收納容器 外形成上述感測器區域。 The substrate conveying device of claim 1, wherein the predetermined position is a position in the substrate storage container that stores the substrate, and the optical sensor is in the substrate storage container The above-mentioned sensor area is formed outside. 如請求項2之基板搬送裝置,其中,上述光學感測器之上述感測器區域係設定於對以偏移至上述基板收納容器外之狀態被載置之基板進行檢測的位置。 The substrate conveying device of claim 2, wherein the sensor area of the optical sensor is set at a position for detecting a substrate placed in a state shifted outside the substrate storage container. 如請求項1之基板搬送裝置,其中,上述保持部係沿著水平方向平坦之板狀構件,且於俯視時,上述板狀構件具有在保持有基板時與基板重疊之部分之至少一部分其中間部分被去除之中空區域,並於上述保持部正常地保持基板時,於俯視時基板與上述板狀構件之上述中空區域完全重疊,且在藉由上述往返機構使上述保持部往返移動時,上述保持部之上述中空區域通過上述路徑。 The substrate conveying device according to claim 1, wherein the holding portion is a plate-shaped member that is flat in a horizontal direction, and when viewed in a plan view, the plate-shaped member has at least a part of the middle of a portion overlapping the substrate when the substrate is held Part of the hollow area is removed, and when the holding portion normally holds the substrate, the substrate completely overlaps the hollow area of the plate-shaped member in a plan view, and when the holding portion is moved back and forth by the reciprocating mechanism, the The above-mentioned hollow area of the holding part passes through the above-mentioned path. 如請求項1之基板搬送裝置,其中,上述光學感測器係形成沿著光軸之直線狀之上述感測器區域之穿透型感測器,且上述控制部將藉由上述穿透型感測器所投射之光線被上述保持部或上述保持基板所遮蔽之期間作為上述第1通過期間而加以檢測。 The substrate conveying device of claim 1, wherein the optical sensor is a transmissive sensor that forms the sensor area in a linear shape along the optical axis, and the control unit is configured by the transmissive sensor The period during which the light beam projected by the sensor is shielded by the holding portion or the holding substrate is detected as the first passing period. 如請求項1之基板搬送裝置,其中,上述光學感測器係藉由光線來形成上述感測器區域之反射型感測器,且上述控制部將藉由上述反射型感測器所投射之光線被上述保持部或上述保持基板所反射而被該反射型感測器所接收之期間作為上述第1通過期間而加以檢測。 The substrate conveying device of claim 1, wherein the optical sensor is a reflective sensor forming the sensor area by light, and the control unit is projected by the reflective sensor The period during which light is reflected by the holding portion or the holding substrate and received by the reflective sensor is detected as the first passing period. 如請求項1至6中任一項之基板搬送裝置,其中,上述控制部於藉由上述保持部來接收位於上述既定位置之基板之基板之接收動作時,對搬送異常進行判斷, 上述基板之接收動作包含上述保持部藉由上述往返機構而朝向上述既定位置移動之往路動作、及上述保持部藉由上述往返機構而離開上述既定位置之返路動作,且上述控制部於上述基板之接收動作中,對上述保持部或上述保持基板通過上述感測器區域之第2通過期間進行檢測,並於該第2通過期間與所預先設定之第2正常期間不同時,判斷為搬送異常。 The substrate conveying device according to any one of claims 1 to 6, wherein the control section judges the conveyance abnormality when receiving the substrate of the substrate at the predetermined position by the holding section, The receiving operation of the substrate includes a forward motion in which the holding portion moves toward the predetermined position by the shuttle mechanism, and a return motion in which the holding portion leaves the predetermined position by the shuttle mechanism, and the control portion is on the substrate In the receiving operation, the second passage period during which the holding portion or the holding substrate passes through the sensor area is detected, and when the second passage period is different from the preset second normal period, it is judged that the conveyance is abnormal . 如請求項7之基板搬送裝置,其中,上述第1正常期間與上述第2正常期間係相同長度。 The substrate transfer device of claim 7, wherein the first normal period and the second normal period have the same length. 如請求項1之基板搬送裝置,其中,上述控制部根據藉由上述往返機構所進行之上述保持部之移動速度,來設定上述第1正常期間。 The substrate transfer device of claim 1, wherein the control section sets the first normal period based on the moving speed of the holding section by the shuttle mechanism. 一種基板搬送裝置,係對既定位置交接基板者;其具備有:保持部,其保持基板;往返機構,其使上述保持部相對於上述既定位置進行往返移動;光學感測器,其於上述保持部藉由上述往返機構進行移動之路徑上形成感測器區域;以及控制部,其於基板之交付動作中,對上述保持部或由該保持部所保持之基板(以下稱為「保持基板」)通過上述感測器區域之第1通過期間進行檢測,並於該第1通過期間與所預先設定之第1正常期間不同時判斷為搬送異常,其中,上述基板之交付動作包含上述保持部藉由上述往返機構而朝向上述既定位置之往路動作、及上述保持部離開上述既定位置之返路動作;而上述控制部於上述交付動作時,將上述返路動作中藉由上述往返機構所進行之上述保持部之移動速度設為較上述往路動作中藉 由上述往返機構所進行之上述保持部之移動速度慢。 A substrate conveying device that transfers a substrate to a predetermined position; it is provided with: a holding portion that holds the substrate; a reciprocating mechanism that allows the holding portion to reciprocate relative to the predetermined position; and an optical sensor that holds the substrate The sensor area is formed on the path moved by the above-mentioned shuttle mechanism; and the control unit, which, during the substrate delivery operation, provides for the above-mentioned holding part or the substrate held by the holding part (hereinafter referred to as “holding substrate”). ) The detection is carried out through the first passing period of the sensor area, and when the first passing period is different from the first normal period set in advance, it is judged as a conveyance abnormality, wherein the delivery operation of the substrate includes the holding portion The forward movement of the reciprocating mechanism toward the predetermined position and the return movement of the holding portion away from the predetermined position; and the control unit will perform the return movement by the reciprocating mechanism during the delivery operation. The moving speed of the above holding part is set to be lower than that of the above The moving speed of the holding portion by the reciprocating mechanism is slow. 一種基板搬送方法,係對既定位置交接基板者;其包含有:第1往路步驟,其使保持有基板之保持部朝向上述既定位置移動;交付步驟,其執行將基板自上述保持部交付至上述既定位置之動作;第1返路步驟,其於上述交付步驟後使上述保持部自上述既定位置後退;第1檢測步驟,其於包含上述第1往路步驟及上述第1返路步驟之期間中,對上述保持部或由該保持部所保持之基板(以下稱為「保持基板」)通過光學感測器在上述保持部移動之路徑上所形成之感測器區域的第1通過期間進行檢測;以及第1判斷步驟,其於在上述第1檢測步驟所檢測出之上述第1通過期間與所預先設定之第1正常期間不同時,判斷為搬送異常;而上述保持部包含有:抵接部,其抵接於基板之一端部;及可伸縮之位置偏移防止機構,其以將基板之另一端部推向上述抵接部之方式進行伸縮而將上述基板加以固定;於上述第1往路步驟中,藉由上述位置偏移防止機構將上述基板之另一端部推向上述抵接部而將上述基板加以固定來防止位置偏移,且對上述位置偏移防止機構之伸縮動作進行檢測,於上述第1返路步驟中,解除藉由上述位置偏移防止機構所進行之固定。 A method for transferring a substrate to a predetermined position; it includes: a first forwarding step, which moves a holding portion holding a substrate toward the predetermined position; a delivery step, which executes the delivery of the substrate from the holding portion to the above-mentioned predetermined position. Action at a predetermined position; a first return step, which retreats the holding portion from the predetermined position after the delivery step; a first detection step, which is in the period including the first forward step and the first return step , To detect the first passing period of the sensor area formed by the holding part or the substrate held by the holding part (hereinafter referred to as the "holding substrate") through the optical sensor on the path of the holding part moving And a first determining step, which determines that the conveying is abnormal when the first passing period detected in the first detecting step is different from the first normal period set in advance; and the holding portion includes: abutting Part, which abuts against one end of the substrate; and a retractable positional deviation preventing mechanism, which expands and contracts by pushing the other end of the substrate toward the abutting part to fix the substrate; in the first In the advancing step, the position shift prevention mechanism pushes the other end of the substrate toward the abutting portion to fix the substrate to prevent position shift, and detects the expansion and contraction movement of the position shift prevention mechanism In the above-mentioned first return step, the fixation performed by the above-mentioned positional deviation prevention mechanism is released. 一種基板搬送方法,係對既定位置交接基板者;其包含有:第1往路步驟,其使保持有基板之保持部朝向上述既定位置移動;交付步驟,其執行將基板自上述保持部交付至上述既定位置之動 作;第1返路步驟,其於上述交付步驟後使上述保持部自上述既定位置後退;第1檢測步驟,其於包含上述第1往路步驟及上述第1返路步驟之期間中,對上述保持部或由該保持部所保持之基板(以下稱為「保持基板」)通過光學感測器在上述保持部移動之路徑上所形成之感測器區域的第1通過期間進行檢測;以及第1判斷步驟,其於在上述第1檢測步驟所檢測出之上述第1通過期間與所預先設定之第1正常期間不同時,判斷為搬送異常;而上述第1返路動作中藉由上述往返機構所進行之上述保持部之移動速度,較上述第1往路動作中藉由上述往返機構所進行之上述保持部之移動速度慢。 A method for transferring a substrate to a predetermined position; it includes: a first forwarding step, which moves a holding portion holding a substrate toward the predetermined position; a delivery step, which executes the delivery of the substrate from the holding portion to the above-mentioned predetermined position. Movement of a given position The first return step, which retreats the holding portion from the predetermined position after the delivery step; the first detection step, which includes the first forward step and the first return step, to the The holding portion or the substrate held by the holding portion (hereinafter referred to as the "holding substrate") is detected by the optical sensor during the first passing period of the sensor area formed on the path of the holding portion moving; and 1 judging step, which judges that the conveying is abnormal when the first passing period detected in the first detecting step is different from the first normal period set in advance; and the reciprocating The moving speed of the holding portion performed by the mechanism is slower than the moving speed of the holding portion performed by the reciprocating mechanism in the first forward movement. 如請求項11或12之基板搬送方法,其中,其進一步包含有:第2往路步驟,其使上述保持部朝向位於上述既定位置之基板移動;接收步驟,其執行上述保持部接收位於上述既定位置之基板之接收動作;第2返路步驟,其於上述接收步驟後使上述保持部自上述既定位置後退;第2檢測步驟,其於包含上述第2往路步驟及上述第2返路步驟之期間中,對上述保持部或上述保持基板通過上述感測器區域之第2通過期間進行檢測;以及第2判斷步驟,其於上述第2檢測步驟所檢測出之上述第2通過期間與所預先設定之第2正常期間不同時,判斷為搬送異常。 The substrate transport method of claim 11 or 12, which further includes: a second forwarding step of moving the holding portion toward the substrate located at the predetermined position; a receiving step of performing the holding portion receiving the predetermined position The receiving action of the substrate; the second returning step, which retreats the holding portion from the predetermined position after the receiving step; the second detecting step, which is during the period including the second forwarding step and the second returning step , Detecting the second passage period during which the holding portion or the holding substrate passes through the sensor area; and a second determination step in which the second passage period detected in the second detection step and the preset If the second normal period is different, it will be judged as a transport abnormality. 如請求項13之基板搬送方法,其中,上述第1正常期間與上述第2正常期間係相同長度。 The substrate transport method of claim 13, wherein the first normal period and the second normal period have the same length.
TW108102562A 2018-02-28 2019-01-23 Substrate transfer apparatus and substrate transfer method TWI728306B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018-035510 2018-02-28
JP2018035510A JP7007948B2 (en) 2018-02-28 2018-02-28 Board transfer device and board transfer method

Publications (2)

Publication Number Publication Date
TW201936471A TW201936471A (en) 2019-09-16
TWI728306B true TWI728306B (en) 2021-05-21

Family

ID=67804892

Family Applications (1)

Application Number Title Priority Date Filing Date
TW108102562A TWI728306B (en) 2018-02-28 2019-01-23 Substrate transfer apparatus and substrate transfer method

Country Status (5)

Country Link
JP (1) JP7007948B2 (en)
KR (1) KR102468631B1 (en)
CN (1) CN111788668A (en)
TW (1) TWI728306B (en)
WO (1) WO2019167447A1 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7443141B2 (en) * 2020-04-10 2024-03-05 ニデックインスツルメンツ株式会社 Industrial robots and industrial robot control methods
US20240025052A1 (en) * 2020-09-03 2024-01-25 Kawasaki Jukogyo Kabushiki Kaisha Substrate holding hand and substrate conveying robot
TWI776412B (en) * 2021-03-03 2022-09-01 迅得機械股份有限公司 Transferring device for accommodating object

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003100852A (en) * 2001-09-25 2003-04-04 Dainippon Screen Mfg Co Ltd Substrate slip-out detector and substrate processing apparatus using the same
TW200935540A (en) * 2007-09-04 2009-08-16 Tokyo Electron Ltd Substrate positional misalignment detection system
JP2018010992A (en) * 2016-07-14 2018-01-18 東京エレクトロン株式会社 Focus ring replacement method

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3094056B2 (en) * 1994-05-24 2000-10-03 東京エレクトロン株式会社 Probe device
JPH11145241A (en) * 1997-11-06 1999-05-28 Toshiba Corp Multi-chamber system and wafer detection
JP4276440B2 (en) * 2003-01-06 2009-06-10 東京エレクトロン株式会社 Substrate detection method and apparatus, and substrate processing apparatus
JP2008172160A (en) * 2007-01-15 2008-07-24 Dainippon Screen Mfg Co Ltd Device and method for processing substrate
JP2010283334A (en) * 2009-05-01 2010-12-16 Hitachi Kokusai Electric Inc Substrate processing apparatus, and semiconductor device manufacturing method
JP2012074485A (en) * 2010-09-28 2012-04-12 Tokyo Electron Ltd Substrate processing device, substrate transfer method, and recording medium storing program for implementing the same method
KR20120127220A (en) * 2011-05-12 2012-11-21 도쿄엘렉트론가부시키가이샤 Substrate transfer device, coating developing apparatus provided substrate transfer device, and substrate transfer method

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003100852A (en) * 2001-09-25 2003-04-04 Dainippon Screen Mfg Co Ltd Substrate slip-out detector and substrate processing apparatus using the same
TW200935540A (en) * 2007-09-04 2009-08-16 Tokyo Electron Ltd Substrate positional misalignment detection system
JP2018010992A (en) * 2016-07-14 2018-01-18 東京エレクトロン株式会社 Focus ring replacement method

Also Published As

Publication number Publication date
KR20200083623A (en) 2020-07-08
JP2019153609A (en) 2019-09-12
JP7007948B2 (en) 2022-01-25
CN111788668A (en) 2020-10-16
KR102468631B1 (en) 2022-11-17
WO2019167447A1 (en) 2019-09-06
TW201936471A (en) 2019-09-16

Similar Documents

Publication Publication Date Title
TWI728306B (en) Substrate transfer apparatus and substrate transfer method
US6973370B2 (en) Substrate processing apparatus and method for adjusting a substrate transfer position
JP6040883B2 (en) Substrate transport apparatus, substrate transport method, and storage medium
TWI677933B (en) Door switch
US20090245981A1 (en) Closed container, lid opening and closing system for closed container, wafer transfer system, and lid closing method for closed container
TWI758933B (en) Substrate holder, conveying system for conveying substrates in electronic component manufacturing apparatus, and electronic component manufacturing apparatus
JP6415220B2 (en) Substrate processing apparatus and substrate processing method
US9696262B2 (en) Substrate processing apparatus, method of operating substrate processing apparatus, and storage medium
KR20130086914A (en) Robot hand and robot
KR20160055010A (en) wafer transfer robot and control method thereof
US8251636B2 (en) Lid closing method for closed container and lid opening/closing system for closed container
TWI425590B (en) Substrate treating apparatus, and a substrate transporting method therefor
US7470098B2 (en) Detecting apparatus and detecting method
TWI801456B (en) Teaching method of transfer device and substrate processing system
TWI792004B (en) Substrate carrier apparatus and substrate carrying method
JP7126856B2 (en) Substrate gripping device, substrate transfer device, and substrate transfer method
JP2003218018A (en) Processing device
JP5874629B2 (en) Substrate transport method, substrate transport apparatus, and storage medium
KR102570567B1 (en) Semiconductor Fabricating Apparatus Having camera unit
KR20240034990A (en) Substrate cleaning apparatus
JP2010287663A (en) Substrate carrier