TWI722251B - 玻璃基板的製造裝置及製造方法 - Google Patents

玻璃基板的製造裝置及製造方法 Download PDF

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Publication number
TWI722251B
TWI722251B TW106137517A TW106137517A TWI722251B TW I722251 B TWI722251 B TW I722251B TW 106137517 A TW106137517 A TW 106137517A TW 106137517 A TW106137517 A TW 106137517A TW I722251 B TWI722251 B TW I722251B
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TW
Taiwan
Prior art keywords
glass substrate
opening
air supply
gas
frame
Prior art date
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TW106137517A
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English (en)
Chinese (zh)
Other versions
TW201829339A (zh
Inventor
山本好晴
中弘樹
大野和宏
Original Assignee
日商日本電氣硝子股份有限公司
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Application filed by 日商日本電氣硝子股份有限公司 filed Critical 日商日本電氣硝子股份有限公司
Publication of TW201829339A publication Critical patent/TW201829339A/zh
Application granted granted Critical
Publication of TWI722251B publication Critical patent/TWI722251B/zh

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    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C15/00—Surface treatment of glass, not in the form of fibres or filaments, by etching
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/063—Transporting devices for sheet glass
    • B65G49/064—Transporting devices for sheet glass in a horizontal position
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3105—After-treatment
    • H01L21/311—Etching the insulating layers by chemical or physical means
    • H01L21/31105—Etching inorganic layers
    • H01L21/31111—Etching inorganic layers by chemical means
    • H01L21/31116—Etching inorganic layers by chemical means by dry-etching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2201/00—Indexing codes relating to handling devices, e.g. conveyors, characterised by the type of product or load being conveyed or handled
    • B65G2201/02—Articles
    • B65G2201/0214—Articles of special size, shape or weigh
    • B65G2201/022—Flat

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Surface Treatment Of Glass (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Chemical Vapour Deposition (AREA)
  • Drying Of Semiconductors (AREA)
TW106137517A 2016-11-16 2017-10-31 玻璃基板的製造裝置及製造方法 TWI722251B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016223248A JP6665760B2 (ja) 2016-11-16 2016-11-16 ガラス基板の製造装置及び製造方法
JP2016-223248 2016-11-16

Publications (2)

Publication Number Publication Date
TW201829339A TW201829339A (zh) 2018-08-16
TWI722251B true TWI722251B (zh) 2021-03-21

Family

ID=62146441

Family Applications (1)

Application Number Title Priority Date Filing Date
TW106137517A TWI722251B (zh) 2016-11-16 2017-10-31 玻璃基板的製造裝置及製造方法

Country Status (5)

Country Link
JP (1) JP6665760B2 (ko)
KR (1) KR102312556B1 (ko)
CN (1) CN109963820B (ko)
TW (1) TWI722251B (ko)
WO (1) WO2018092506A1 (ko)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114173814A (zh) 2019-07-11 2022-03-11 古德T细胞有限公司 用于预防、改善或治疗免疫检查点抑制剂耐药癌症的组合物

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013157418A (ja) * 2012-01-30 2013-08-15 Sumitomo Precision Prod Co Ltd エッチング装置
TW201335083A (zh) * 2011-12-28 2013-09-01 Nippon Electric Glass Co 玻璃板加工裝置及其加工方法
WO2015045405A1 (ja) * 2013-09-30 2015-04-02 日本板硝子株式会社 ガラス板の製造方法
CN106029587A (zh) * 2013-12-31 2016-10-12 金浩权 利用化学钢化的钢化玻璃制作装置及制作方法

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4045592B2 (ja) * 2002-08-22 2008-02-13 三菱マテリアル株式会社 プラズマエッチング用シリコン電極板
JP4381160B2 (ja) * 2003-07-16 2009-12-09 積水化学工業株式会社 表面処理装置
JP4312001B2 (ja) * 2003-07-28 2009-08-12 リアライズ・アドバンストテクノロジ株式会社 基板支持装置および基板取り外し方法
JP4398262B2 (ja) * 2004-01-08 2010-01-13 大日本スクリーン製造株式会社 基板処理装置
WO2007077765A1 (ja) * 2005-12-28 2007-07-12 Sharp Kabushiki Kaisha ステージ装置及びプラズマ処理装置
JP5235293B2 (ja) * 2006-10-02 2013-07-10 東京エレクトロン株式会社 処理ガス供給機構および処理ガス供給方法ならびにガス処理装置
JP5444599B2 (ja) * 2007-09-28 2014-03-19 東京エレクトロン株式会社 ガス供給装置及び成膜装置
WO2011010584A1 (ja) * 2009-07-23 2011-01-27 シャープ株式会社 ウエットエッチング装置およびウエットエッチング方法
JP2014080331A (ja) 2012-10-17 2014-05-08 Asahi Glass Co Ltd 反射防止性ガラスの製造方法
JP6048817B2 (ja) * 2012-12-27 2016-12-21 日本電気硝子株式会社 板状ガラスの表面処理装置及び表面処理方法
WO2014123089A1 (ja) * 2013-02-07 2014-08-14 旭硝子株式会社 ガラス製造方法
JP2016064926A (ja) * 2013-02-07 2016-04-28 旭硝子株式会社 ガラス製造方法
TR201900193T4 (tr) * 2014-01-31 2019-02-21 Nippon Sheet Glass Co Ltd Cam levha üretim yöntemi ve cam levha kullanımları.
KR102135740B1 (ko) * 2014-02-27 2020-07-20 주식회사 원익아이피에스 기판 처리 장치 및 기판 처리 방법
CN106233433B (zh) * 2014-04-16 2019-03-05 Ａｇｃ株式会社 蚀刻装置、蚀刻方法、基板的制造方法及基板

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201335083A (zh) * 2011-12-28 2013-09-01 Nippon Electric Glass Co 玻璃板加工裝置及其加工方法
JP2013157418A (ja) * 2012-01-30 2013-08-15 Sumitomo Precision Prod Co Ltd エッチング装置
WO2015045405A1 (ja) * 2013-09-30 2015-04-02 日本板硝子株式会社 ガラス板の製造方法
CN106029587A (zh) * 2013-12-31 2016-10-12 金浩权 利用化学钢化的钢化玻璃制作装置及制作方法

Also Published As

Publication number Publication date
KR102312556B1 (ko) 2021-10-14
TW201829339A (zh) 2018-08-16
CN109963820A (zh) 2019-07-02
WO2018092506A1 (ja) 2018-05-24
CN109963820B (zh) 2021-12-31
KR20190084098A (ko) 2019-07-15
JP2018080079A (ja) 2018-05-24
JP6665760B2 (ja) 2020-03-13

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