TWI722251B - Manufacturing device and manufacturing method of glass substrate - Google Patents
Manufacturing device and manufacturing method of glass substrate Download PDFInfo
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- TWI722251B TWI722251B TW106137517A TW106137517A TWI722251B TW I722251 B TWI722251 B TW I722251B TW 106137517 A TW106137517 A TW 106137517A TW 106137517 A TW106137517 A TW 106137517A TW I722251 B TWI722251 B TW I722251B
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- Prior art keywords
- glass substrate
- opening
- air supply
- gas
- frame
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- 239000011521 glass Substances 0.000 title claims abstract description 111
- 239000000758 substrate Substances 0.000 title claims abstract description 105
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 59
- 238000012545 processing Methods 0.000 claims abstract description 78
- 238000004381 surface treatment Methods 0.000 claims abstract description 74
- 239000005357 flat glass Substances 0.000 claims description 47
- 238000000034 method Methods 0.000 claims description 13
- 239000007789 gas Substances 0.000 description 100
- 238000009434 installation Methods 0.000 description 17
- 238000004891 communication Methods 0.000 description 12
- 238000003780 insertion Methods 0.000 description 9
- 230000037431 insertion Effects 0.000 description 9
- 230000003746 surface roughness Effects 0.000 description 7
- 238000011144 upstream manufacturing Methods 0.000 description 5
- 238000007789 sealing Methods 0.000 description 4
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 3
- 238000002438 flame photometric detection Methods 0.000 description 3
- 229910000040 hydrogen fluoride Inorganic materials 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 239000012159 carrier gas Substances 0.000 description 2
- 230000015556 catabolic process Effects 0.000 description 2
- 238000003280 down draw process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000005192 partition Methods 0.000 description 2
- 238000007788 roughening Methods 0.000 description 2
- 230000004308 accommodation Effects 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 238000007600 charging Methods 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000007786 electrostatic charging Methods 0.000 description 1
- 238000007496 glass forming Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 238000007500 overflow downdraw method Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 238000012552 review Methods 0.000 description 1
- 239000013585 weight reducing agent Substances 0.000 description 1
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Classifications
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C15/00—Surface treatment of glass, not in the form of fibres or filaments, by etching
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
- B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
- B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
- B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
- B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
- B65G49/063—Transporting devices for sheet glass
- B65G49/064—Transporting devices for sheet glass in a horizontal position
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3105—After-treatment
- H01L21/311—Etching the insulating layers by chemical or physical means
- H01L21/31105—Etching inorganic layers
- H01L21/31111—Etching inorganic layers by chemical means
- H01L21/31116—Etching inorganic layers by chemical means by dry-etching
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G2201/00—Indexing codes relating to handling devices, e.g. conveyors, characterised by the type of product or load being conveyed or handled
- B65G2201/02—Articles
- B65G2201/0214—Articles of special size, shape or weigh
- B65G2201/022—Flat
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Geochemistry & Mineralogy (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Inorganic Chemistry (AREA)
- Surface Treatment Of Glass (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Chemical Vapour Deposition (AREA)
- Drying Of Semiconductors (AREA)
Abstract
本發明的玻璃基板(P)的製造裝置(10)具備:將玻璃基板(P)朝預定的方向(X1)搬運的搬運裝置(11),及表面處理裝置(12)。表面處理裝置(12)具備:框體(14);在框體(14)之中一方的主表面(P1)側開口的開口部(17);及可相對於開口部(17)拆卸地安裝,並在一方的主表面(P1)具有供應處理氣體(Ga)用的供氣口(31)之一或複數供氣單元(18)。在此,供氣單元(18)可安裝在開口部(17)之中沿著玻璃基板(P)的搬運方向(X1)的複數位置。The manufacturing apparatus (10) of the glass substrate (P) of this invention is equipped with the conveying apparatus (11) which conveys a glass substrate (P) in a predetermined direction (X1), and a surface treatment apparatus (12). The surface treatment device (12) is provided with: a frame (14); an opening (17) opened on the main surface (P1) side of one of the frames (14); and detachably attachable to the opening (17) , And one of the gas supply ports (31) or a plurality of gas supply units (18) for supplying processing gas (Ga) is provided on one main surface (P1). Here, the air supply unit (18) can be installed at a plurality of positions along the conveyance direction (X1) of the glass substrate (P) in the opening (17).
Description
[0001] 本發明是有關玻璃基板的製造裝置及製造方法,尤其是有關對於成為玻璃基板之板狀玻璃的一方主表面藉處理氣體施以表面處理的裝置及方法。[0001] The present invention relates to a manufacturing apparatus and a manufacturing method of a glass substrate, and in particular to an apparatus and method for applying a surface treatment to one main surface of a plate glass that becomes a glass substrate by a processing gas.
[0002] 如習知,對於近年來的影像顯示裝置是以液晶顯示器(LCD)、電漿顯示器(PDP)、場發射顯示器(FED)、有機EL顯示器(OLED)等代表的平板顯示器(以下,僅稱為FPD。)成為主流。由於針對該等FPD推動輕量化,因此對使用於FPD的玻璃基板也相對地提升薄板化的要求。 [0003] 上述的玻璃基板是例如藉各種下拉法為代表的板狀玻璃的成形方法將成形為帶狀的板狀玻璃(帶狀板玻璃)裁斷成預定的尺寸,並將裁斷後的板狀玻璃的寬方向(稱與帶狀板玻璃的表背面平行,並與長方向正交的方向。以下,相同。)兩端部進一步裁斷後,依需要,對各裁斷面施以研磨加工等所獲得。 [0004] 但是,在製造該種的玻璃基板時,其製造過程的靜電的帶電會成為問題。亦即,絕緣體的玻璃具有非常容易帶電的性質,在玻璃基板的製造步驟中,例如在載放台載放玻璃基板施以預定的加工時,會因玻璃基板與載放台的接觸剝離使得玻璃基板帶電(有將此稱為剝離帶電。)。在導電性的物體接近帶電的玻璃基板時產生放電,根據此放電,會有形成在玻璃基板的表面上的各種元件或構成電子電路的電極線的破損,或導致玻璃基板本身的破損之虞(有將此稱為絕緣破壞或靜電破壞。)。又,帶電後的玻璃基板容易貼附於載放台,將此強制剝離時有導致玻璃基板的破損之虞。此是導致當然顯示不良的原因,因此為盡可能應避免的事實現象。 [0005] 作為避免上述事實現象用的手段,例如可考慮朝玻璃基板的背面(與載放台的載放面接觸側的面)供應預定的處理氣體對背面施以表面處理,藉以使背面粗面化。玻璃基板與載放台的接觸面積越大會有剝離時的帶電量增大的傾向,因此藉著使得與載放台的載放面接觸的玻璃基板的背面粗面化,減少玻璃基板與載放台的接觸面積,可期待獲得剝離時的帶電抑制。並且,玻璃基板的接觸面(背面)越是平滑鑒於如載放面容易貼附於平滑面的點,如上述,藉著使玻璃基板的背面粗面化例如使該背面的表面粗糙度大於載放面的表面粗糙度,可以使玻璃基板貼附載放面困難,藉此可期待剝離時之玻璃基板的破損防止。 [0006] 在此,如上述作為可表面處理的構成,例如在下述專利文獻1中,記載有表面處理裝置,具備:以載放著玻璃基板的狀態朝預定的方向搬運的搬運手段,及朝搬運路徑上的玻璃基板的一方主表面(成為背面側的主表面)供應含氟化氫氣體的處理氣體,並將供應後的處理氣體朝排氣系統排出的噴射器。於此,在噴射器將與氟化氫氣體源連接的第一狹縫設置在玻璃基板的搬運方向預定位置,並將與載體氣體源連接的第二狹縫設置在第一狹縫的上述搬運方向兩側的預定位置。並且,與排氣系統連接的第三狹縫是較第二狹縫更設置在上述搬運方向兩側的預定位置。 [先前技術文獻] [專利文獻] [0007] 專利文獻1:日本特開2014-80331號公報[0002] As is conventionally known, in recent years, image display devices are flat panel displays represented by liquid crystal displays (LCD), plasma displays (PDP), field emission displays (FED), organic EL displays (OLED), etc. (hereinafter, Just called FPD.) Become the mainstream. Due to the promotion of weight reduction for these FPDs, the glass substrates used in FPDs have relatively increased requirements for thinning. [0003] The above-mentioned glass substrate is, for example, a sheet glass (belt-shaped sheet glass) formed into a strip shape is cut into a predetermined size by a sheet glass forming method represented by various down-draw methods, and the cut sheet glass is cut into a predetermined size. The width direction of the glass (referred to as the direction parallel to the front and back of the band-shaped plate glass and perpendicular to the longitudinal direction. Hereinafter, the same.) After the both ends are further cut, each cut surface is subjected to grinding processing as required. obtain. [0004] However, when this kind of glass substrate is manufactured, the electrostatic charging during the manufacturing process becomes a problem. In other words, the glass of the insulator has the property of being very easily charged. In the manufacturing process of the glass substrate, for example, when the glass substrate is placed on the mounting table and subjected to predetermined processing, the glass substrate may peel off due to contact between the glass substrate and the mounting table. The substrate is charged (this is sometimes referred to as peeling charging). When a conductive object approaches a charged glass substrate, a discharge occurs. According to this discharge, various components formed on the surface of the glass substrate or electrode wires constituting an electronic circuit may be damaged, or the glass substrate itself may be damaged ( This is called insulation breakdown or electrostatic breakdown.). In addition, the charged glass substrate is easily attached to the mounting table, and this may cause damage to the glass substrate when it is forcedly peeled off. This is the cause of the display failure of course, so it is a factual phenomenon that should be avoided as much as possible. [0005] As a means for avoiding the above-mentioned facts, for example, it is conceivable to supply a predetermined processing gas to the back surface of the glass substrate (the surface on the side in contact with the mounting surface of the mounting table) to apply surface treatment to the back surface, thereby making the back surface rough Faceted. The larger the contact area between the glass substrate and the mounting table, the greater the tendency for the amount of charge when peeling off. Therefore, by making the back surface of the glass substrate in contact with the mounting surface of the mounting table rough, the glass substrate and the mounting surface are reduced. The contact area of the stage can be expected to suppress electrification during peeling. In addition, the smoother the contact surface (rear surface) of the glass substrate. In view of the point where the mounting surface is easily attached to the smooth surface, as described above, by roughening the back surface of the glass substrate, for example, the surface roughness of the back surface is greater than that of the mounting surface. The surface roughness of the placement surface can make it difficult to attach the glass substrate to the placement surface, so that it can be expected to prevent damage to the glass substrate during peeling. [0006] Here, as a structure that can be surface-treated as described above, for example, Patent Document 1 below describes a surface-treating device that includes: a conveying means for conveying a glass substrate in a predetermined direction with a glass substrate placed thereon, and An ejector that supplies processing gas containing hydrogen fluoride gas on one main surface (the main surface on the back side) of the glass substrate on the conveyance path, and discharges the supplied processing gas to the exhaust system. Here, the first slit connected to the hydrogen fluoride gas source is provided at a predetermined position in the conveying direction of the glass substrate in the ejector, and the second slit connected to the carrier gas source is provided at two positions in the conveying direction of the first slit. Predetermined position on the side. In addition, the third slit connected to the exhaust system is provided at a predetermined position on both sides of the conveying direction than the second slit. [Prior Art Document] [Patent Document] [0007] Patent Document 1: JP 2014-80331 A
[發明概要] [發明所欲解決之課題] [0008] 如以上藉處理氣體施以表面處理的場合,表面處理的結果(處理後的表面品質),當然除了藉搬運手段之玻璃基板的搬運速度之外,也因處理氣體的種類或供應量、供應位置受到大的左右。因此,實際在施以上述表面處理時,對應成為處理對象的玻璃基板的材質、尺寸、製造產線的構成等,有適當設定玻璃基板的搬運速度或處理氣體的種類、供應量及供應位置(在專利文獻1所稱的第一及第二狹縫的位置)等的必要。但是,如專利文獻1記載的表面處理裝置,供應處理氣體的第一狹縫及第二狹縫是固定在預先決定的位置,因此不能對應玻璃基板的種類(材質、厚度、搬運方向尺寸等)變更處理氣體的供應位置。為此在變更成為製造對象的玻璃基板的場合,施以良質的表面處理困難。 [0009] 有鑑於以上的情況,不依據成為玻璃基板的板狀玻璃的種類,可對該板狀玻璃施以良質的表面處理為本發明所欲解決之技術性課題。 [用於解決課題的手段] [0010] 上述課題的解決是藉本發明之玻璃基板的製造裝置來達成。亦即,該製造裝置,具備:搬運裝置,朝預定的方向搬運成為玻璃基板的板狀玻璃,及表面處理裝置,朝搬運裝置正在被搬運的板狀玻璃的一方的主表面供應處理氣體以施加預定的表面處理之玻璃基板的製造裝置,其特徵為:表面處理裝置,具備:框體;開口部,框體之中在一方的主表面側開口;及一或複數的供氣單元,相對於開口部可裝卸地安裝,並具有對一方的主表面供應處理氣體用的供氣口,供氣單元是可安裝在開口部之中沿著板狀玻璃的搬運方向的複數的位置的點。 [0011] 如上述,本發明是將具有對所搬運的板狀玻璃的一方主表面供應處理氣體用之供氣口的構件單元化,可安裝在沿著板狀玻璃的搬運方向的複數的位置。藉由如以上的構成,僅變更供氣單元的安裝位置,即可容易調整供氣口的搬運方向位置。因此,即使產生有必要變更所搬運之板狀玻璃的種類的場合,仍可容易設定最適當的處理條件,藉此可對板狀玻璃施以良質的表面處理。或者,即使同一種類的板狀玻璃,也有可能對應生產狀況或製造產線的其他部份的構成變更搬運速度,但即使是如以上的場合,變更供氣單元的安裝位置,可容易設定包括處理氣體之供應位置的供應條件,可施以良質的表面處理。 [0012] 又,本發明是在表面處理裝置的框體設置開口部,並在此開口部安裝上述構成的供氣單元,因此可將供氣單元的例如包括配管系統的大部份配置在框體的內部空間。藉此不致使表面處理裝置成必要以上大型化地組裝於製造產線。又,框體內部的大部份可成為空洞,即使變更或追加供氣單元的安裝位置的場合也不致有成為與其他構件干涉的問題之虞。 [0013] 又,本發明的玻璃基板的製造裝置,進一步具備排氣單元,相對於開口部可裝卸地安裝,進行處理氣體的排氣,排氣單元是可安裝在開口部之中沿著搬運方向的複數的位置。 [0014] 根據上述構成,僅變更排氣單元的安裝位置,對於處理氣體的排氣口也可容易地調整其搬運方向位置。排氣口的位置是與供氣口的位置同樣,由於是對面對於一方之主表面的空間的處理氣體的流動造成影響的元件,因此如上述調整排氣口的位置,可設定最適當的處理條件。因此,可容易重新設定藉處理氣體之板狀玻璃的處理條件,也可藉此對板狀玻璃施以良質的表面處理。 [0015] 又,本發明的玻璃基板的製造裝置,進一步具備虛擬單元,相對於開口部可裝卸地安裝,並封閉開口部,虛擬單元也可安裝在開口部之中沿著搬運方向的複數的位置。 [0016] 根據上述構成,在框體的開口部安裝一或複數供氣單元,及依需要安裝排氣單元時,可以虛擬單元封閉開口部的其餘的部份。藉此,可容易調整供氣單元的安裝位置。並且,可以虛擬單元完全封閉開口部,因此即使供氣單元等採取任何配置的場合,也不會阻礙處理氣體的流動而可容易施以良質的表面處理。又,由於單元化,可以使供氣單元與尺寸共同化而容易置換供氣單元與虛擬單元的位置。藉此,迅速進行更換。 [0017] 又,本發明的玻璃基板的製造裝置為供氣單元也可具有間隙形成面,該間隙形成面是在該供氣單元安裝於開口部的狀態下,在該供氣單元與一方的主表面之間形成預定間隙。進一步具備排氣單元與虛擬單元的場合,對於該等排氣單元或虛擬單元,也可具有間隙形成面。 [0018] 如以上在安裝於開口部的各單元設置間隙形成面,不論各單元的安裝位置如何,可在與一方主表面之間形成預定的間隙。藉此,可經常調整對處理氣體的流動造成影響的間隙的大小、形狀,因此可更為穩定施以良質的表面處理。 [0019] 又,本發明的玻璃基板的製造裝置是供氣單元具有滾筒,該滾筒是在該供氣單元安裝於開口部的狀態下支撐藉搬運裝置搬運之板狀玻璃的上述一方的主表面。進一步具備排氣單元或虛擬單元的場合,對於該等排氣單元或虛擬單元,也可具有支撐一方的主表面的滾筒。 [0020] 如上述,將支撐板狀玻璃的一方的主表面的滾筒設置在各單元,藉此可將該等滾筒作為搬運裝置的構成元件組裝於表面處理裝置之中。藉此,即使板狀玻璃在搬運方向具有大的尺寸的場合,仍可確實支撐通過表面處理裝置的部份,在與各單元之間形成預定的間隙。因此,藉此也可穩定施以良質的表面處理。 [0021] 又,本發明的玻璃基板的製造裝置為供氣單元也可以嵌合安裝於開口部,藉此將框體的內部空間密閉。進一步具備排氣單元或封閉單元的場合,對於該等排氣單元或虛擬單元,也可以嵌合安裝於開口部,藉此將框體的內部空間密閉。 [0022] 藉由如以上的構成,採取相對於開口部可拆卸地安裝各單元的構成的場合,仍可確實將框體的內部空間密閉。藉此,盡可能避免阻礙間隙之處理氣體流動的事態可穩定施以表面處理。又,如後述,在將框體的內部空間與排氣單元連結構成排氣系統的場合,藉封閉框體的內部空間可確保所需的排氣性能。 [0023] 並且,具備排氣單元的場合,本發明的玻璃基板的製造裝置,也可在排氣單元設有連結一方的主表面與排氣單元之間的空間及框體的內部空間的第一排氣口,框體的內部空間是與處理氣體用的氣體洗滌器連結。 [0024] 如上述採取將框體的內部空間與處理氣體用的氣體洗滌器連結的構成,藉此不論排氣單元的安裝位置如何,可更簡易地構成處理氣體的排氣系統。又,由於所排氣的氣體不僅是處理氣體也包括外氣(通常,空氣),因此即使含有處理氣體但其濃度與供氣時間點比較為低。因此,無須特別考慮抗蝕性可在框體的內部空間構成從排氣單元至氣體洗滌器的排氣系統。 [0025] 又,本發明的玻璃基板的製造裝置也可在框體之中板狀玻璃的搬運方向兩端部設有連結一方的主表面與框體之間的空間及框體的內部空間的第二排氣口,框體的內部空間是與處理氣體用的氣體洗滌器連結。 [0026] 針對供氣口與排氣口的位置關係檢討的結果,在將一或複數的供氣口配置於板狀玻璃的搬運方向中央側時,在採取將兩個排氣口配置在板狀玻璃的搬運方向兩端部的構成的場合,可判定均等之處理氣體的流動是跨板狀玻璃的搬運方向全區域(藉表面處理裝置的搬運方向之處理區域的全區域)形成。因此,在框體之中板狀玻璃的搬運方向兩端部設置連結一方的主表面與框體之間的空間與框體的內部空間的第二排氣口,藉此一邊防止處理氣體流出至裝置外,可在與板狀玻璃之間形成良好的處理氣體的流動。該等的第二排氣口皆是可固定於框體的狀態,因此可對階段更替(各單元的置換)不會造成影響。 [0027] 又,本發明的玻璃基板的製造裝置也可將供氣單元與安裝在框體的連通管的一端側連接,連通管的另外端側是透過可撓軟管與位在框體的外部的處理氣體產生裝置連接。 [0028] 藉由如以上的構成,通常,在將設置於框體的附近的處理氣體產生裝置固定的狀態,可容易且迅速地因應供氣單元的更換位置。藉此,可享受以短時間階段更替的優點。 [0029] 又,上述課題的解決是藉本發明之玻璃基板的製造方法來達成。亦即,該製造方法,具備:搬運步驟,朝預定的方向搬運成為玻璃基板的板狀玻璃,及表面處理步驟,對朝著預定方向搬運之板狀玻璃的一方的主表面施以預定的表面處理的玻璃基板的製造方法,其特徵為:表面處理步驟,係藉著對以表面處理裝置朝預定的方向搬運的板狀玻璃之一方的主表面供應處理氣體來進行,表面處理裝置,具備:框體;開口部,在框體之中一方的主表面側開口;及一或複數的供氣單元,具有相對於開口部可裝卸地安裝,並對一方的主表面供應處理氣體用的供氣口,供氣單元是可安裝在開口部之中沿著板狀玻璃的搬運方向的複數的位置的點。 [0030] 根據本發明的製造方法,也可與上述本發明的製造裝置同樣,僅變更供氣單元的安裝位置,即可容易調整供氣口的搬運方向位置。因此,即使產生有必要變更所搬運之板狀玻璃的種類的場合,仍可容易設定最適當的處理條件,藉此可對板狀玻璃施以良質的表面處理。或者,即使同一種類的板狀玻璃,也有可能對應生產狀況或製造產線的其他部份的構成變更搬運速度,但即使是如以上的場合,仍可容易設定包括處理氣體之供應位置的供應條件,可施以良質的表面處理。 [0031] 又,本發明是在表面處理裝置的框體設置開口部,並在此開口部安裝上述構成的供氣單元,因此可將供氣單元的例如包括配管系統的大部份配置在框體的內部空間。藉此不致使表面處理裝置成必要以上大型化地組裝於製造產線。又,框體內部的大部份可成為空洞,即使變更或追加供氣單元的安裝位置的場合也不致有成為與其他構件干涉的問題之虞。 [發明效果] [0032] 如以上說明,根據本發明,可不需依成為玻璃基板的種類,對於該板狀玻璃施以良質的表面處理。[Summary of the invention] [Problems to be solved by the invention] [0008] As above, when the surface treatment is performed by the processing gas, the result of the surface treatment (surface quality after treatment), of course, except for the conveying speed of the glass substrate by means In addition, it is also greatly affected by the type of processing gas, the supply amount, and the supply location. Therefore, when actually applying the above-mentioned surface treatment, it is necessary to appropriately set the conveying speed of the glass substrate, the type of processing gas, the supply amount, and the supply location according to the material, size, and production line configuration of the glass substrate to be processed ( The positions of the first and second slits referred to in Patent Document 1) and so on. However, as in the surface treatment device described in Patent Document 1, the first slit and the second slit for supplying processing gas are fixed at predetermined positions, so they cannot correspond to the type of glass substrate (material, thickness, dimensions in the conveying direction, etc.) Change the supply location of the process gas. For this reason, when changing the glass substrate to be manufactured, it is difficult to apply a good-quality surface treatment. [0009] In view of the above, regardless of the type of plate glass used as the glass substrate, it is a technical problem to be solved by the present invention that a good surface treatment can be applied to the plate glass. [Means for Solving the Problem] [0010] The solution to the above problem is achieved by the glass substrate manufacturing apparatus of the present invention. That is, the manufacturing apparatus includes a conveying device that conveys the plate glass that becomes a glass substrate in a predetermined direction, and a surface treatment device that supplies processing gas to the main surface of the plate glass being conveyed by the conveying device to apply A device for manufacturing a predetermined surface-treated glass substrate is characterized in that: the surface-treating device includes: a frame; an opening in which one of the main surfaces of the frame opens; and one or more air supply units relative to The opening is detachably mounted and has an air supply port for supplying processing gas to one main surface. The air supply unit is mountable at a plurality of positions along the conveying direction of the plate glass in the opening. [0011] As described above, the present invention unites a member having an air supply port for supplying processing gas to one main surface of the plate glass to be conveyed, and can be installed at plural positions along the conveying direction of the plate glass. . With the above configuration, the conveying direction position of the air supply port can be easily adjusted only by changing the installation position of the air supply unit. Therefore, even if it is necessary to change the type of the plate glass to be conveyed, the most appropriate processing conditions can be easily set, whereby a high-quality surface treatment can be applied to the plate glass. Or, even for the same type of plate glass, it is possible to change the conveying speed according to the production situation or the composition of other parts of the manufacturing line. However, even in the above cases, changing the installation position of the air supply unit can be easily set including handling The supply conditions of the gas supply position can be treated with good quality surface treatment. [0012] Furthermore, in the present invention, an opening is provided in the frame of the surface treatment device, and the air supply unit constructed as described above is installed in the opening. Therefore, most of the air supply unit including, for example, a piping system can be arranged in the frame. The internal space of the body. This prevents the surface treatment device from becoming larger than necessary and assembled in the manufacturing line. In addition, most of the inside of the frame can be hollow, and even if the installation position of the air supply unit is changed or added, there is no risk of interference with other components. [0013] In addition, the glass substrate manufacturing apparatus of the present invention further includes an exhaust unit, which is detachably attached to the opening to exhaust the processing gas. The exhaust unit can be installed in the opening and transported along. The position of the plural number of directions. [0014] According to the above configuration, only the installation position of the exhaust unit is changed, and the conveying direction position of the exhaust port of the processing gas can be easily adjusted. The position of the exhaust port is the same as the position of the air supply port. Since it is an element that affects the flow of the processing gas in the space on one main surface, the position of the exhaust port can be adjusted as described above to set the most appropriate treatment. condition. Therefore, it is possible to easily reset the processing conditions of the plate glass with the processing gas, and also to apply a good surface treatment to the plate glass. [0015] In addition, the manufacturing apparatus of the glass substrate of the present invention further includes a dummy unit, which is detachably attached to the opening and closes the opening. The dummy unit can also be installed in a plurality of the openings along the conveying direction. position. [0016] According to the above configuration, when one or more air supply units are installed in the opening of the frame body, and when the exhaust unit is installed as needed, the remaining part of the opening can be closed by a virtual unit. Thereby, the installation position of the air supply unit can be easily adjusted. In addition, the virtual unit can completely close the opening. Therefore, even if the gas supply unit is arranged in any configuration, the flow of the processing gas will not be hindered, and a good surface treatment can be easily applied. In addition, due to the unitization, the air supply unit and the size can be made common, and the positions of the air supply unit and the dummy unit can be easily replaced. In this way, it can be replaced quickly. [0017] In addition, in the manufacturing apparatus of the glass substrate of the present invention, the air supply unit may have a gap forming surface. The gap forming surface is between the air supply unit and one of the air supply units when the air supply unit is installed in the opening. A predetermined gap is formed between the main surfaces. When the exhaust unit and the dummy unit are further provided, the exhaust unit or the dummy unit may have a gap forming surface. [0018] As described above, a gap forming surface is provided in each unit installed in the opening, and a predetermined gap can be formed with one main surface regardless of the installation position of each unit. With this, the size and shape of the gap that affects the flow of the processing gas can be constantly adjusted, so that a good surface treatment can be applied more stably. [0019] Furthermore, in the manufacturing apparatus of the glass substrate of the present invention, the air supply unit has a roller, and the roller supports the one main surface of the plate glass conveyed by the conveying device in a state where the air supply unit is installed in the opening. . When an exhaust unit or a virtual unit is further provided, the exhaust unit or the virtual unit may have a roller supporting one main surface. [0020] As described above, a roller supporting one main surface of the plate glass is provided in each unit, whereby the roller can be incorporated in the surface treatment device as a component of the conveying device. Thereby, even if the sheet glass has a large size in the conveying direction, the part passing through the surface treatment device can still be reliably supported, and a predetermined gap is formed between each unit. Therefore, a good surface treatment can be stably applied by this. [0021] In addition, in the manufacturing apparatus of the glass substrate of the present invention, the air supply unit may be fitted and installed in the opening, thereby sealing the internal space of the housing. When an exhaust unit or a closed unit is further provided, the exhaust unit or virtual unit may be fitted and installed in the opening, thereby sealing the internal space of the housing. [0022] With the above configuration, when each unit is detachably attached to the opening, the internal space of the frame can be reliably sealed. Thereby, it is possible to stably apply surface treatment to avoid obstructing the flow of the processing gas in the gap as much as possible. In addition, as will be described later, when the internal space of the housing and the exhaust unit are connected to form an exhaust system, the required exhaust performance can be ensured by closing the internal space of the housing. [0023] In addition, when an exhaust unit is provided, the glass substrate manufacturing apparatus of the present invention may be provided with a first connecting space between the main surface of one side and the exhaust unit and the internal space of the frame in the exhaust unit. An exhaust port, the internal space of the frame is connected with a gas scrubber for processing gas. [0024] As described above, the internal space of the housing and the gas scrubber for the processing gas are connected, whereby the exhaust system for the processing gas can be more easily constructed regardless of the installation position of the exhaust unit. In addition, since the gas to be exhausted includes not only the processing gas but also external air (usually, air), even if the processing gas is contained, its concentration is lower than the time of supply. Therefore, without special consideration of corrosion resistance, an exhaust system from the exhaust unit to the gas scrubber can be constructed in the internal space of the frame. [0025] In addition, the glass substrate manufacturing apparatus of the present invention may be provided at both ends of the frame in the conveyance direction of the plate glass with a space connecting one of the main surfaces and the frame and the internal space of the frame. The second exhaust port and the internal space of the housing are connected to a gas scrubber for processing gas. [0026] As a result of the review of the positional relationship between the air supply port and the exhaust port, when one or more air supply ports are arranged on the central side in the conveying direction of the plate glass, the two exhaust ports are arranged on the plate. In the case of the structure at both ends of the conveying direction of the shaped glass, it can be judged that the uniform flow of the processing gas is formed across the entire area of the conveying direction of the plate glass (the entire area of the processing area in the conveying direction of the surface treatment device). Therefore, two exhaust ports connecting the space between one main surface and the frame and the internal space of the frame are provided at both ends in the conveyance direction of the plate glass in the frame, thereby preventing the processing gas from flowing out to Outside the device, a good flow of processing gas can be formed between the plate glass and the glass. These second exhaust ports can all be fixed to the frame, so the stage change (replacement of each unit) will not be affected. [0027] In addition, the glass substrate manufacturing apparatus of the present invention may also connect the air supply unit to one end of the communication pipe mounted on the frame, and the other end of the communication pipe is connected to the frame through the flexible hose. The external process gas generator is connected. [0028] With the above configuration, normally, in a state where the processing gas generating device installed near the housing is fixed, it is possible to easily and quickly respond to the replacement position of the gas supply unit. In this way, you can enjoy the advantages of replacing in a short period of time. [0029] Moreover, the solution of the above-mentioned problem is achieved by the method of manufacturing the glass substrate of the present invention. That is, the manufacturing method includes: a conveying step of conveying a plate glass that becomes a glass substrate in a predetermined direction, and a surface treatment step of applying a predetermined surface to one main surface of the plate glass conveyed in a predetermined direction The method for manufacturing a treated glass substrate is characterized in that the surface treatment step is performed by supplying a treatment gas to the main surface of one of the plate glass conveyed in a predetermined direction by the surface treatment device. The surface treatment device includes: The frame; the opening, which opens on the main surface side of one of the frames; and one or more air supply units, which are detachably mounted with respect to the opening, and supply air for supplying processing gas to one of the main surfaces The air supply unit is a point that can be installed at a plurality of positions along the conveying direction of the plate glass in the opening. [0030] According to the manufacturing method of the present invention, it is also possible to easily adjust the conveying direction position of the air supply port by only changing the installation position of the air supply unit as in the above-mentioned manufacturing apparatus of the present invention. Therefore, even if it is necessary to change the type of the plate glass to be conveyed, the most appropriate processing conditions can be easily set, whereby a high-quality surface treatment can be applied to the plate glass. Or, even for the same type of plate glass, it is possible to change the conveying speed according to the production situation or the composition of other parts of the manufacturing line, but even in the above cases, it is still easy to set the supply conditions including the supply position of the processing gas. , Can be applied with good quality surface treatment. [0031] Furthermore, in the present invention, an opening is provided in the frame of the surface treatment device, and the air supply unit constructed as described above is installed in the opening. Therefore, most of the air supply unit including, for example, a piping system can be arranged in the frame. The internal space of the body. This prevents the surface treatment device from becoming larger than necessary and assembled in the manufacturing line. In addition, most of the inside of the frame can be hollow, and even if the installation position of the air supply unit is changed or added, there is no risk of interference with other components. [Effects of the Invention] [0032] As explained above, according to the present invention, it is not necessary to apply a good surface treatment to the plate glass without depending on the type of the glass substrate.
[0034] 以下,參閱第1圖~第8圖說明本發明的第一實施形態。並且,本實施形態中,作為板狀玻璃是以對從成形後的帶狀板玻璃切出預定尺寸的玻璃基板的背面施以表面處理的場合為例說明。 [0035] 第1圖表示本發明第一實施形態之玻璃基板的製造裝置10的一實施形態。該製造裝置10具備:將玻璃基板P朝預定的方向X1搬運的搬運裝置11;對搬運裝置11所搬運之玻璃基板P的一方的主表面P1(在第1圖稱下面)施以預定的表面處理的表面處理裝置12;及收容搬運裝置11及表面處理裝置12的處理槽13。 [0036] 在此之中,表面處理裝置12是作為對玻璃基板P的一方的主表面P1供應處理氣體Ga並施以預定的表面處理之用,主要具備:框體14;在與框體14之間形成玻璃基板P之插穿路15的頭部16;形成在框體14之中與插穿路15面對側(本實施形態為上側)的開口部17;及安裝於開口部17的供氣單元18。本實施形態中,表面處理裝置12,進一步具備與供氣單元18一起安裝於開口部17的排氣單元19及虛擬單元20a、20b。以下,說明各構成元件的詳細。 [0037] 框體14是如第1圖及第2圖表示形成箱型,在框體14的上側(與玻璃基板P的面對側),跨玻璃基板P的搬運方向X1的大致全區域設置開口部17。在此,開口部17具有:供氣單元18與排氣單元19,及虛擬單元20a、20b抵接的底部21;位在底部21的寬方向(稱為與玻璃基板P的搬運方向X1正交的方向。以下,在本說明書中相同。)兩側的側壁部22;及設置在底部21,將框體14的內部空間23與框體14的外部空間24(在此為框體14的外部空間,稱處理槽13的內部空間),尤其與插穿路15側的空間連結的連通孔25。本實施形態是如第3圖表示,在連通孔25的周圍配設有O環等的密封構件26,在底部21上載放著供氣單元18與排氣單元19,及虛擬單元20a、20b的狀態下,封閉連通孔25,並使框體14的內部空間23相對於外部空間24成密封的狀態(參閱第4圖)。 [0038] 並且,框體14的在玻璃基板P的搬運方向X1兩端部安裝有排氣口形成構件27,在框體14與排氣口形成構件27之間,形成有朝寬方向延伸的狹縫狀的排氣口28(參閱第2圖)。此排氣口28是透過設置在框體14的搬運方向X1兩端部的連通孔29(參閱第1圖)與內部空間23連結,可藉後述的氣體洗滌器30(參閱第1圖)排氣。 [0039] 接著,進行供氣單元18、排氣單元19及虛擬單元20a、20b的說明。 [0040] 供氣單元18、排氣單元19及虛擬單元20a、20b是分別相對於框體14的開口部17可拆卸地安裝。本實施形態是在沿著開口部17之搬運方向X1的預定位置分別設有兩個供氣單元18與一個排氣單元19及五個虛擬單元20a、20b(參閱第1圖)。詳細說明時,在開口部17之中從搬運方向X1的最上游側依虛擬單元20b、供氣單元18、虛擬單元20a、虛擬單元20a、虛擬單元20a、供氣單元18、排氣單元19、虛擬單元20a的順序配設。在此,如第2圖表示,各單元18~20a的搬運方向尺寸C1~C3是(除最上游側的虛擬單元20b)相同,且寬方向尺寸W1~W3也相同。此時,除排氣口形成構件27之框體14的搬運方向尺寸L(參閱第3圖)是成為與安裝在開口部17的供氣單元18、排氣單元19及虛擬單元20a、20b的搬運方向尺寸C1~C3的總合(參閱第2圖)相等。又,各單元18~20a、20b是彼此以在搬運方向X1抵接的狀態安裝於開口部17(參閱第1圖)。藉此,供氣單元18與排氣單元19及虛擬單元20a可相對於沿著開口部17的搬運方向X1的複數位置任意地安裝(圖示例中除最上游側的七個位置)。 [0041] 又,位在開口部17的寬方向兩側的側壁部22的內側面22a、22a間的距離T(參閱第3圖)是同樣分別與安裝在開口部17的供氣單元18與排氣單元19及虛擬單元20a、20b的寬方向尺寸W1~W3(參閱第2圖)相等。藉此,各單元18~20a、20b是形成以鑲嵌合安裝於開口部17的狀態(參閱第2圖及第4圖)。藉以上的安裝樣態,使框體14的內部空間23相對於外部空間24成為密閉的狀態。 [0042] 在此之中,供氣單元18是如第1圖及第5圖表示,具有:朝著玻璃基板P的插穿路15開口,並朝向玻璃基板P的一方的主表面P1供應處理氣體Ga用的供氣口31,及將以處理氣體產生裝置32(參閱第1圖)產生的處理氣體Ga導入供氣口31的導入部33。在此,供氣口31是例如第2圖表示,成為朝寬方向延伸的狹縫形狀,導入部33具有預定形態的導入路34,可將處理氣體Ga跨成為該狹縫形狀的供氣口31的寬方向全區域均等地導入。導入部33的一部份是通過框體14的連通孔25位於內部空間23。 [0043] 第6圖是表示處理氣體Ga之導入路34的一形態。該圖表示的導入路34是從處理氣體產生裝置32側朝向供氣口31側成為多段分支的形態,藉此可跨供氣口31的寬方向(在第6圖稱左右方向)全區域盡可能均等地導入處理氣體Ga。本實施形態中,設有兩條導入路34,在與各導入路34的供氣口31的相反側的端部34a連接著連通管35(第5圖中,以兩點虛線表示)的一端。並且,此時,也可以如第5圖表示,在端部34a的內周圍設置O環等的密封構件36。連通管35是如第1圖表示,在形成於和框體14的開口部17相反側的部份的複數管安裝部37(參閱第3圖)之中,僅安裝於位在供氣單元18的下方的管安裝部37。連通管35的另外端是透過可撓軟管38連接處理氣體產生裝置32。在未安裝有連通管35的管安裝部37安裝有蓋子39。藉此,不論供氣單元18的安裝位置為何,皆可將供氣單元18連接於設置固定後的狀態的處理氣體產生裝置32。 [0044] 排氣單元19是如第7圖表示,具有進行朝玻璃基板P的一方主表面P1供應後之處理氣體Ga的排氣用的排氣口40。此排氣口40是將框體14的外部空間24,尤其是玻璃基板P的一方的主表面P1與排氣單元19之間的空間連結於框體14的內部空間23,本實施形態是形成朝寬方向延伸的狹縫形狀(參閱第2圖)。 [0045] 又,框體14的內部空間23是例如透過設置在框體14的下部的連通孔41與氣體洗滌器30連結(參閱第1圖)。藉此,將朝玻璃基板P的一方的主表面P1供應後的處理氣體Ga,透過排氣單元19的排氣口40及框體14的內部空間23導入氣體洗滌器30內。 [0046] 又,本實施形態中,除排氣單元19的排氣口40之外,並在框體14的搬運方向兩端設有排氣口28,此排氣口28是與框體14的內部空間23連結(參閱第1圖)。藉此,在插穿路15的搬運方向兩端透過排氣口28及框體14的內部空間23將處理氣體Ga或外氣導入氣體洗滌器30。 [0047] 虛擬單元20a、20b是安裝以埋沒安裝於開口部17的供氣單元18與排氣單元19的間隙,並封閉開口部17為目的。因此,虛擬單元20a、20b不具有用於對玻璃基板P之一方主表面P1側的空間進行供排氣的功能。 [0048] 並且,本實施形態中,供氣單元18與排氣單元19,及虛擬單元20a、20b皆是安裝於開口部17的狀態,在與玻璃基板P的一方的主表面P1之間具有形成預定間隙42的間隙形成面43a~43c(參閱第8圖)。此時,供氣單元18的間隙形成面43a是採使得供氣口31的附近部份較其周圍的部份更朝插穿路15側突出的形態。此時,一方的主表面P1與間隙形成面43a的間隙42在供氣口31的附近部份成為最小。 [0049] 又,本實施形態中,供氣單元18與排氣單元19,及虛擬單元20a、20b皆是安裝於開口部17的狀態,具有支撐藉搬運裝置11所搬運之玻璃基板P的一方主表面P1的支撐滾輪44a~44c。藉此,使得玻璃基板P一邊被以搬運裝置11的支撐滾輪45(參閱第1圖)及設置在各單元18~20a、20b的支撐滾輪44a~44c支撐一邊朝預定的方向X1搬運。 [0050] 並且,本實施形態中,供氣單元18與排氣單元19,及虛擬單元20a、20b皆具有加熱器46a~46c(參閱第8圖)。藉此,在安裝於開口部17的狀態,可調整在與玻璃基板P的一方主表面P1之間的間隙42流動的處理氣體Ga的溫度。 [0051] 對成為表面處理的對象的玻璃基板P,例如使用以溢流下拉法為代表的下拉法,或浮動法等的習知的手段將成形為帶狀的板狀玻璃(帶狀板玻璃)裁斷成預定的長方向尺寸之後,依需要施以兩邊或四邊的研磨加工。又,對於玻璃基板P的尺寸雖不加以限制,但例如沿著搬運方向X1的方向的尺寸是以大於表面處理裝置12的搬運方向尺寸(實質為框體14的搬運方向尺寸L)為佳。 [0052] 根據成為以上構成的表面處理裝置12,例如製作出如以下的處理氣體Ga的流動,可對一方的主表面P1施以預定的表面處理。亦即,如第8圖表示,在以搬運裝置11將玻璃基板P導入表面處理裝置12的內部(插穿路15)的狀態下,藉處理氣體產生裝置32產生預定的處理氣體Ga,例如將氟化氫氣與氮氣等的載體氣體混合所成的處理氣體Ga。並且,將此處理氣體Ga透過可撓軟管38、連通管35及導入路34,從供氣口31供應至與一方主表面P1的間隙42。又,藉氣體洗滌器30將導入的力作用於框體14的內部空間23,通過與內部空間23連結的各排氣口28、40(參閱第8圖)進行供應間隙42後之處理氣體Ga的排氣。藉此,以處理氣體Ga充滿間隙42,並在間隙42內形成處理氣體Ga之預定的流動。又,藉配置在間隙42的搬運方向X1兩端的排氣口28(參閱第1圖),可盡可能地防止處理氣體Ga向間隙42的兩側,即表面處理裝置12的外側漏出。當然,雖省略圖示,但也可在處理槽13設置某種的排氣手段,對處理槽13的內部空間施以預定的排氣處理。 [0053] 如上述,一邊繼續處理氣體Ga的供應,一邊將玻璃基板P導入插穿路15,使玻璃基板P通過插穿路15結束後,完成處理氣體Ga對一方之主表面P1的表面處理。並且,藉此處理獲得一方主表面P1的粗面化,並維持另一方之主表面P2(在第8圖稱上面)的表面性及表面精度。其中一例,以表面粗糙度Ra的變化說明上述粗面化時,在上述表面處理的前後,設定藉處理氣體Ga對一方之主表面P1的表面處理條件,使一方的主表面P1的表面粗糙度Ra[nm]在0.1nm以上且1.8nm以下的範圍提升(在此為增加),更佳為在0.1nm以上且0.8nm以下的範圍提升。在上述範圍,提升一方的主表面P1的表面粗糙度Ra,於表面處理以後的製造步驟中,可避免實質上成為玻璃基板P的問題程度之帶電產生的事態。並且,在此所謂表面粗糙度Ra[nm]是以準用JIS R 1683:2007的方法測量所獲得的值。 [0054] 如上述,本發明第一實施形態相關的製造裝置10是將具有對搬運裝置11所搬運的玻璃基板P的一方主表面P1供應處理氣體Ga用之供氣口31的構件單元化,可安裝在沿著玻璃基板P的搬運方向X1的複數位置。藉由如以上的構成,僅變更供氣單元18的安裝位置,即可容易調整供氣口31的搬運方向X1的位置。因此,即使產生有必要變更所搬運之玻璃基板P的種類的場合,仍可容易設定最適當的處理條件,藉此可對玻璃基板P施以良質的表面處理。或者,即使同一種類的玻璃基板P,也有可能對應生產狀況或製造產線的其他部份的構成變更搬運裝置11的搬運速度,但即使是如以上的場合,仍可容易設定包括處理氣體Ga之供應位置的供應條件,可施以良質的表面處理。 [0055] 並且,本實施形態是在其框體14設置開口部17,並在此開口部17安裝上述構成的供氣單元18,因此可將包括供氣單元的導入路34的大部份配置在框體14的內部空間23。藉此不致使表面處理裝置12成必要以上大型化地組裝於製造產線。又,框體14內部的大部份可成為空洞,即使變更或追加供氣單元18的安裝位置的場合也不致有成為與其他構件干涉的問題之虞。 [0056] 又,本實施形態是將排氣口28、40與框體14的內部空間23連結,並將此內部空間23與氣體洗滌器30連結。如上述,構成以框體14的內部空間23作為排氣系統的一部份,藉此僅變更排氣單元19的安裝位置,即可容易將排氣口40與氣體洗滌器30連結。並且,以內部空間23作為排氣系統的一部份,藉此即使變更供氣單元18的安裝位置的場合也不致有使供氣系統與排氣系統干涉之虞。因此,僅變更供氣單元18與連通管35的安裝位置,即可容易變更供氣口31的位置。 [0057] 以上,雖已說明本發明第一實施形態之玻璃基板P的製造裝置10及製造方法,但該等製造裝置10及製造方法,當然在本發明的範圍內可採取任意的形態。 [0058] 例如,第一實施形態雖例示將兩個供氣單元18與一個排氣單元19及五個虛擬單元20a、20b安裝於開口部17的場合,但當然不僅是供氣單元18的位置數量也可變更。第9圖是表示其一例(本發明的第二實施形態)之玻璃基板P的製造裝置50的剖面圖。如第9圖表示,該製造裝置50是與第一實施形態相同,除具備搬運裝置11、表面處理裝置51及處理槽13,另一方面表面處理裝置51的構成是與第一實施形態相關的表面處理裝置12不同。具體而言,該表面處理裝置51是將三個供氣單元18與五個虛擬單元20a、20b安裝在框體14的開口部17所構成。以和第一實施形態的比較說明,形成將從上游側(在第1圖及第9圖稱左側)第四個的虛擬單元20a置換成供氣單元18,並從上游側第七個的排氣單元19置換成虛擬單元20a的形態。 [0059] 如上述,藉著增加供氣單元18的數量,可減小每一個供氣單元18(供氣口31)所負擔之一方主表面P1的處理面積。因此,例如在供氣口31、31間,盡可能不產生處理氣體Ga停止而使其濃度降低的區域,可對一方的主表面P1施以均等且足夠質量的表面處理。又,如本實施形態,只要採取在框體14的搬運方向X1的兩端配設一對排氣口28的形態,如第9圖表示,即使採排氣單元19的數量為0的構成,仍可盡可能防止處理氣體Ga朝向表面處理裝置51外漏出,尤其不具問題。 [0060] 又,以上的說明是作為開口部17,例示與一個搬運方向X1連續的空間存在於底部21上的場合,當然也可採取此以外的構成。例如上述實施形態,在供氣單元18與排氣單元19及虛擬單元20a的搬運方向尺寸C1~C3與寬方向尺寸W1~W3皆為相等的場合,也可設置使得朝寬方向延伸的間隔壁(圖示省略)連結一對的側壁部22、22,將各單元18~20a選擇性配置在該等間隔壁與側壁部22、22所區劃的複數的單元收容部(圖示省略)。 [0061] 又,上述實施形態中,各排氣口28、40雖是形成透過框體14的內部空間23與氣體洗滌器30連結的構成,但也可以是此以外的構成。例如也可以預定的配管連接設置在框體14的側部的連通孔29與設置在框體14的底部的連通孔41,藉此連結排氣口28與氣體洗滌器30。此時框體14的內部也可以不是空洞,只要可避免與各單元18~20a的干涉,則可以採任意的構造。 [0062] 並且,以上的說明中,雖已說明對於從帶狀板玻璃切出玻璃基板P之一方的主表面P1施以預定的表面處理的場合,當然本發明也可運用於帶狀板玻璃之其中任一方的主表面。亦即,圖示雖然省略,但也可在成形為帶狀於寬方向裁斷之後,對僅在捲繞其長方向一端或兩端的玻璃膜表背一方的面施以表面處理的場合也可適當施以上述構成相關的表面處理。[0034] Hereinafter, the first embodiment of the present invention will be described with reference to FIGS. 1 to 8. In addition, in the present embodiment, as the sheet glass, a case where a surface treatment is applied to the back surface of a glass substrate cut out of a predetermined size from the strip-shaped sheet glass after forming is taken as an example. [0035] Fig. 1 shows an embodiment of the glass
[0063]10‧‧‧玻璃基板的製造裝置11‧‧‧搬運裝置12‧‧‧表面處理裝置13‧‧‧處理槽14‧‧‧框體15‧‧‧插穿路16‧‧‧頭部17‧‧‧開口部18‧‧‧供氣單元19‧‧‧排氣單元20a‧‧‧虛擬單元25‧‧‧連通孔27‧‧‧排氣口形成構件29‧‧‧連通孔30‧‧‧氣體洗滌器32‧‧‧處理氣體產生裝置33‧‧‧導入部35‧‧‧連通管37‧‧‧管安裝部38‧‧‧可撓軟管39‧‧‧蓋子44a‧‧‧支撐滾輪Ga‧‧‧處理氣體P1‧‧‧主表面[0063]10‧‧‧Glass
[0033] 第1圖為本發明第一實施形態之玻璃基板的製造裝置的剖面圖。 第2圖為第1圖表示之表面處理裝置的主要部上視圖。 第3圖為卸下第1圖表示的表面處理裝置之各單元的狀態的主要部上視圖。 第4圖為第2圖表示之表面處理裝置的主要部A-A剖面圖。 第5圖是從箭頭B的方向觀看第2圖表示之供氣單元的剖面圖。 第6圖為第5圖表示之供氣單元的C-C剖面圖。 第7圖是從箭頭D的方向觀看第2圖表示之供氣單元的剖面圖。 第8圖是用於說明使用第1圖表示的表面處理裝置的表面處理之一例的主要部放大圖。 第9圖為本發明第二實施形態之玻璃基板的製造裝置的剖面圖。[0033] "Figure 1" is a cross-sectional view of a glass substrate manufacturing apparatus according to a first embodiment of the present invention. Figure 2 is a top view of the main parts of the surface treatment device shown in Figure 1. Figure 3 is a top view of the main parts of the surface treatment device shown in Figure 1 with the units of the surface treatment device removed. Figure 4 is a cross-sectional view of the main parts of the surface treatment device shown in Figure 2 A-A. Figure 5 is a cross-sectional view of the air supply unit shown in Figure 2 viewed from the direction of arrow B. Figure 6 is a C-C cross-sectional view of the air supply unit shown in Figure 5. Figure 7 is a cross-sectional view of the air supply unit shown in Figure 2 viewed from the direction of arrow D. Fig. 8 is an enlarged view of a main part for explaining an example of surface treatment using the surface treatment device shown in Fig. 1. Figure 9 is a cross-sectional view of a glass substrate manufacturing apparatus according to a second embodiment of the present invention.
10‧‧‧玻璃基板的製造裝置 10‧‧‧Glass substrate manufacturing equipment
11‧‧‧搬運裝置 11‧‧‧Transportation device
12‧‧‧表面處理裝置 12‧‧‧Surface treatment device
13‧‧‧處理槽 13‧‧‧Treatment tank
14‧‧‧框體 14‧‧‧Frame
15‧‧‧插穿路 15‧‧‧Penetrating the Road
16‧‧‧頭部 16‧‧‧Head
17‧‧‧開口部 17‧‧‧Opening
18‧‧‧供氣單元 18‧‧‧Air supply unit
19‧‧‧排氣單元 19‧‧‧Exhaust unit
20a‧‧‧虛擬單元 20a‧‧‧Virtual Unit
20b‧‧‧虛擬單元 20b‧‧‧Virtual Unit
21‧‧‧底部 21‧‧‧Bottom
23‧‧‧內部空間 23‧‧‧Internal space
24‧‧‧外部空間 24‧‧‧Exterior space
25‧‧‧連通孔 25‧‧‧Connecting hole
27‧‧‧排氣口形成構件 27‧‧‧Exhaust port forming member
28‧‧‧排氣口 28‧‧‧Exhaust port
29‧‧‧連通孔 29‧‧‧Connecting hole
30‧‧‧氣體洗滌器 30‧‧‧Gas scrubber
31‧‧‧供氣口 31‧‧‧Air supply port
32‧‧‧處理氣體產生裝置 32‧‧‧Processing gas generator
33‧‧‧導入部 33‧‧‧Introduction Department
34‧‧‧導入路 34‧‧‧Introduction
35‧‧‧連通管 35‧‧‧Connecting pipe
37‧‧‧管安裝部 37‧‧‧Tube Installation Department
38‧‧‧可撓軟管 38‧‧‧Flexible hose
39‧‧‧蓋子 39‧‧‧Lid
40‧‧‧排氣口 40‧‧‧Exhaust port
41‧‧‧連通孔 41‧‧‧Connecting hole
44a‧‧‧支撐滾輪 44a‧‧‧Support roller
44b‧‧‧支撐滾輪 44b‧‧‧Support roller
44c‧‧‧支撐滾輪 44c‧‧‧Support roller
45‧‧‧支撐滾輪 45‧‧‧Support roller
Ga‧‧‧處理氣體 Ga‧‧‧Processing gas
P‧‧‧玻璃基板 P‧‧‧Glass substrate
P1‧‧‧一方主表面 P1‧‧‧One side main surface
P2‧‧‧另一方主表面 P2‧‧‧The other main surface
X1‧‧‧搬運方向 X1‧‧‧Conveying direction
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