CN109963820B - 玻璃基板的制造装置及制造方法 - Google Patents

玻璃基板的制造装置及制造方法 Download PDF

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Publication number
CN109963820B
CN109963820B CN201780070959.4A CN201780070959A CN109963820B CN 109963820 B CN109963820 B CN 109963820B CN 201780070959 A CN201780070959 A CN 201780070959A CN 109963820 B CN109963820 B CN 109963820B
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China
Prior art keywords
glass substrate
surface treatment
main surface
opening portion
gas
Prior art date
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CN201780070959.4A
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English (en)
Chinese (zh)
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CN109963820A (zh
Inventor
山本好晴
中塚弘树
大野和宏
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Electric Glass Co Ltd
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Nippon Electric Glass Co Ltd
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Publication of CN109963820A publication Critical patent/CN109963820A/zh
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Publication of CN109963820B publication Critical patent/CN109963820B/zh
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    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C15/00—Surface treatment of glass, not in the form of fibres or filaments, by etching
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/063—Transporting devices for sheet glass
    • B65G49/064—Transporting devices for sheet glass in a horizontal position
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3105—After-treatment
    • H01L21/311—Etching the insulating layers by chemical or physical means
    • H01L21/31105—Etching inorganic layers
    • H01L21/31111—Etching inorganic layers by chemical means
    • H01L21/31116—Etching inorganic layers by chemical means by dry-etching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2201/00—Indexing codes relating to handling devices, e.g. conveyors, characterised by the type of product or load being conveyed or handled
    • B65G2201/02—Articles
    • B65G2201/0214—Articles of special size, shape or weigh
    • B65G2201/022—Flat

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Surface Treatment Of Glass (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Chemical Vapour Deposition (AREA)
  • Drying Of Semiconductors (AREA)
CN201780070959.4A 2016-11-16 2017-10-20 玻璃基板的制造装置及制造方法 Active CN109963820B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2016-223248 2016-11-16
JP2016223248A JP6665760B2 (ja) 2016-11-16 2016-11-16 ガラス基板の製造装置及び製造方法
PCT/JP2017/037958 WO2018092506A1 (ja) 2016-11-16 2017-10-20 ガラス基板の製造装置及び製造方法

Publications (2)

Publication Number Publication Date
CN109963820A CN109963820A (zh) 2019-07-02
CN109963820B true CN109963820B (zh) 2021-12-31

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CN201780070959.4A Active CN109963820B (zh) 2016-11-16 2017-10-20 玻璃基板的制造装置及制造方法

Country Status (5)

Country Link
JP (1) JP6665760B2 (ko)
KR (1) KR102312556B1 (ko)
CN (1) CN109963820B (ko)
TW (1) TWI722251B (ko)
WO (1) WO2018092506A1 (ko)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3998284A4 (en) 2019-07-11 2023-08-02 Good T Cells, Inc. COMPOSITION FOR PREVENTING, IMPROVING OR TREATMENT OF IMMUNECHECKPOINT INHIBITOR RESISTANT CANCER

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1577762A (zh) * 2003-07-28 2005-02-09 禧沛股份有限公司 基板支持装置及基板取出方法
CN1638033A (zh) * 2004-01-08 2005-07-13 大日本网目版制造株式会社 基板处理装置
CN101159228A (zh) * 2006-10-02 2008-04-09 东京毅力科创株式会社 处理气体供给机构、供给方法及气体处理装置
US20100212832A1 (en) * 2005-12-28 2010-08-26 Sharp Kabushiki Kaisha Stage device and plasma treatment apparatus
CN102473627A (zh) * 2009-07-23 2012-05-23 夏普株式会社 湿蚀刻装置和湿蚀刻方法
JP2013157418A (ja) * 2012-01-30 2013-08-15 Sumitomo Precision Prod Co Ltd エッチング装置
WO2014123089A1 (ja) * 2013-02-07 2014-08-14 旭硝子株式会社 ガラス製造方法
CN104882395A (zh) * 2014-02-27 2015-09-02 圆益Ips股份有限公司 基板处理装置及基板处理方法
WO2015159927A1 (ja) * 2014-04-16 2015-10-22 旭硝子株式会社 エッチング装置、エッチング方法、基板の製造方法、および基板

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4045592B2 (ja) * 2002-08-22 2008-02-13 三菱マテリアル株式会社 プラズマエッチング用シリコン電極板
JP4381160B2 (ja) * 2003-07-16 2009-12-09 積水化学工業株式会社 表面処理装置
JP5444599B2 (ja) * 2007-09-28 2014-03-19 東京エレクトロン株式会社 ガス供給装置及び成膜装置
JP5874393B2 (ja) * 2011-12-28 2016-03-02 日本電気硝子株式会社 ガラス板加工装置およびその加工方法
JP2014080331A (ja) 2012-10-17 2014-05-08 Asahi Glass Co Ltd 反射防止性ガラスの製造方法
JP6048817B2 (ja) * 2012-12-27 2016-12-21 日本電気硝子株式会社 板状ガラスの表面処理装置及び表面処理方法
JP2016064926A (ja) * 2013-02-07 2016-04-28 旭硝子株式会社 ガラス製造方法
JP6360064B2 (ja) * 2013-09-30 2018-07-18 日本板硝子株式会社 ガラス板の製造方法
KR101413626B1 (ko) * 2013-12-31 2014-08-06 김호권 화학강화를 이용한 강화유리 제조장치 및 제조방법
EP3100986B1 (en) * 2014-01-31 2018-12-05 Nippon Sheet Glass Company, Limited Process for producing glass plate and uses of glass plate

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1577762A (zh) * 2003-07-28 2005-02-09 禧沛股份有限公司 基板支持装置及基板取出方法
CN1638033A (zh) * 2004-01-08 2005-07-13 大日本网目版制造株式会社 基板处理装置
US20100212832A1 (en) * 2005-12-28 2010-08-26 Sharp Kabushiki Kaisha Stage device and plasma treatment apparatus
CN101159228A (zh) * 2006-10-02 2008-04-09 东京毅力科创株式会社 处理气体供给机构、供给方法及气体处理装置
CN102473627A (zh) * 2009-07-23 2012-05-23 夏普株式会社 湿蚀刻装置和湿蚀刻方法
JP2013157418A (ja) * 2012-01-30 2013-08-15 Sumitomo Precision Prod Co Ltd エッチング装置
WO2014123089A1 (ja) * 2013-02-07 2014-08-14 旭硝子株式会社 ガラス製造方法
CN104882395A (zh) * 2014-02-27 2015-09-02 圆益Ips股份有限公司 基板处理装置及基板处理方法
WO2015159927A1 (ja) * 2014-04-16 2015-10-22 旭硝子株式会社 エッチング装置、エッチング方法、基板の製造方法、および基板

Also Published As

Publication number Publication date
WO2018092506A1 (ja) 2018-05-24
KR20190084098A (ko) 2019-07-15
TWI722251B (zh) 2021-03-21
CN109963820A (zh) 2019-07-02
JP6665760B2 (ja) 2020-03-13
JP2018080079A (ja) 2018-05-24
KR102312556B1 (ko) 2021-10-14
TW201829339A (zh) 2018-08-16

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