CN104882395A - 基板处理装置及基板处理方法 - Google Patents
基板处理装置及基板处理方法 Download PDFInfo
- Publication number
- CN104882395A CN104882395A CN201510087749.9A CN201510087749A CN104882395A CN 104882395 A CN104882395 A CN 104882395A CN 201510087749 A CN201510087749 A CN 201510087749A CN 104882395 A CN104882395 A CN 104882395A
- Authority
- CN
- China
- Prior art keywords
- substrate
- treatment
- chamber
- base plate
- processing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 325
- 238000003672 processing method Methods 0.000 title claims abstract description 17
- 238000000034 method Methods 0.000 claims abstract description 89
- 239000007789 gas Substances 0.000 claims abstract description 58
- 239000007921 spray Substances 0.000 claims abstract description 6
- 238000009832 plasma treatment Methods 0.000 claims description 6
- 230000008676 import Effects 0.000 claims description 2
- 230000015572 biosynthetic process Effects 0.000 description 8
- 230000008020 evaporation Effects 0.000 description 6
- 238000001704 evaporation Methods 0.000 description 6
- 230000007423 decrease Effects 0.000 description 4
- 238000005530 etching Methods 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 238000010926 purge Methods 0.000 description 2
- 230000000630 rising effect Effects 0.000 description 2
- 238000005507 spraying Methods 0.000 description 2
- 238000001994 activation Methods 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 230000002688 persistence Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000011268 retreatment Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 230000002123 temporal effect Effects 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32798—Further details of plasma apparatus not provided for in groups H01J37/3244 - H01J37/32788; special provisions for cleaning or maintenance of the apparatus
- H01J37/32899—Multiple chambers, e.g. cluster tools
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/3244—Gas supply means
- H01J37/32449—Gas control, e.g. control of the gas flow
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32715—Workpiece holder
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32733—Means for moving the material to be treated
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67196—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the transfer chamber
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67745—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber characterized by movements or sequence of movements of transfer devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67748—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a single workpiece
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67754—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a batch of workpieces
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68771—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by supporting more than one semiconductor substrate
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Plasma & Fusion (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Robotics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Drying Of Semiconductors (AREA)
Abstract
Description
Claims (14)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020140023493A KR102135740B1 (ko) | 2014-02-27 | 2014-02-27 | 기판 처리 장치 및 기판 처리 방법 |
KR10-2014-0023493 | 2014-02-27 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN104882395A true CN104882395A (zh) | 2015-09-02 |
CN104882395B CN104882395B (zh) | 2018-06-12 |
Family
ID=53882889
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201510087749.9A Active CN104882395B (zh) | 2014-02-27 | 2015-02-26 | 基板处理装置及基板处理方法 |
Country Status (5)
Country | Link |
---|---|
US (1) | US20150243490A1 (zh) |
JP (1) | JP6062975B2 (zh) |
KR (1) | KR102135740B1 (zh) |
CN (1) | CN104882395B (zh) |
TW (1) | TWI587425B (zh) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107924862A (zh) * | 2015-09-03 | 2018-04-17 | 川崎重工业株式会社 | 基板移载装置 |
CN109963820A (zh) * | 2016-11-16 | 2019-07-02 | 日本电气硝子株式会社 | 玻璃基板的制造装置及制造方法 |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9388494B2 (en) | 2012-06-25 | 2016-07-12 | Novellus Systems, Inc. | Suppression of parasitic deposition in a substrate processing system by suppressing precursor flow and plasma outside of substrate region |
US9617638B2 (en) | 2014-07-30 | 2017-04-11 | Lam Research Corporation | Methods and apparatuses for showerhead backside parasitic plasma suppression in a secondary purge enabled ALD system |
JP6447393B2 (ja) * | 2015-07-06 | 2019-01-09 | 東京エレクトロン株式会社 | 成膜処理装置、成膜処理方法及び記憶媒体 |
US9508547B1 (en) * | 2015-08-17 | 2016-11-29 | Lam Research Corporation | Composition-matched curtain gas mixtures for edge uniformity modulation in large-volume ALD reactors |
KR20180082509A (ko) | 2015-12-07 | 2018-07-18 | 어플라이드 머티어리얼스, 인코포레이티드 | 병합형 커버 링 |
US9738977B1 (en) | 2016-06-17 | 2017-08-22 | Lam Research Corporation | Showerhead curtain gas method and system for film profile modulation |
US10522387B2 (en) * | 2016-12-15 | 2019-12-31 | Taiwan Semiconductor Manufacturing Company, Ltd. | Semiconductor device and multi-wafer deposition apparatus |
KR101928008B1 (ko) | 2017-04-24 | 2018-12-11 | 세메스 주식회사 | 기판 처리 장치 및 기판 처리 방법 |
JP2022076547A (ja) * | 2020-11-10 | 2022-05-20 | 東京エレクトロン株式会社 | 基板処理システム、基板処理方法、および制御プログラム |
KR102394121B1 (ko) * | 2021-10-08 | 2022-05-04 | (주) 티로보틱스 | 기판 이송 로봇을 챔버 내에서 주행하기 위한 주행 로봇 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20010007630A1 (en) * | 2000-01-12 | 2001-07-12 | Yoshihiro Katsumata | Substrate transfer system and substrate processing apparatus |
CN1909182A (zh) * | 2005-08-05 | 2007-02-07 | 中微半导体设备(上海)有限公司 | 半导体工艺处理系统及其处理方法 |
CN101075551A (zh) * | 2006-05-17 | 2007-11-21 | 台湾积体电路制造股份有限公司 | 制程设备组 |
KR100839191B1 (ko) * | 2007-03-28 | 2008-06-17 | 세메스 주식회사 | 기판 처리 장치 및 방법 |
TW201330138A (zh) * | 2011-09-26 | 2013-07-16 | Hitachi Int Electric Inc | 半導體裝置之製造方法及基板處理裝置 |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
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DE4009603A1 (de) * | 1989-03-30 | 1990-10-04 | Leybold Ag | Vorrichtung zum ein- und ausschleusen eines werkstuecks in eine vakuumkammer |
US5795399A (en) * | 1994-06-30 | 1998-08-18 | Kabushiki Kaisha Toshiba | Semiconductor device manufacturing apparatus, method for removing reaction product, and method of suppressing deposition of reaction product |
US6315512B1 (en) * | 1997-11-28 | 2001-11-13 | Mattson Technology, Inc. | Systems and methods for robotic transfer of workpieces between a storage area and a processing chamber |
US6143082A (en) * | 1998-10-08 | 2000-11-07 | Novellus Systems, Inc. | Isolation of incompatible processes in a multi-station processing chamber |
EP1259544B1 (en) * | 2000-02-11 | 2011-08-24 | Biogen Idec MA Inc. | Heterologous polypeptide of the tnf family |
US6506252B2 (en) * | 2001-02-07 | 2003-01-14 | Emcore Corporation | Susceptorless reactor for growing epitaxial layers on wafers by chemical vapor deposition |
JP4683453B2 (ja) * | 2001-04-27 | 2011-05-18 | 芝浦メカトロニクス株式会社 | 真空処理装置 |
US6592675B2 (en) * | 2001-08-09 | 2003-07-15 | Moore Epitaxial, Inc. | Rotating susceptor |
US20030230385A1 (en) * | 2002-06-13 | 2003-12-18 | Applied Materials, Inc. | Electro-magnetic configuration for uniformity enhancement in a dual chamber plasma processing system |
US6821563B2 (en) * | 2002-10-02 | 2004-11-23 | Applied Materials, Inc. | Gas distribution system for cyclical layer deposition |
JP4595727B2 (ja) * | 2005-07-22 | 2010-12-08 | ソニー株式会社 | 外力推定システム及び外力推定方法、並びにコンピュータ・プログラム |
US8060252B2 (en) * | 2007-11-30 | 2011-11-15 | Novellus Systems, Inc. | High throughput method of in transit wafer position correction in system using multiple robots |
US20110049779A1 (en) * | 2009-08-28 | 2011-03-03 | Applied Materials, Inc. | Substrate carrier design for improved photoluminescence uniformity |
IT1396514B1 (it) * | 2009-11-27 | 2012-12-14 | Nuovo Pignone Spa | Metodo di controllo di turbina basato su rapporto tra temperatura di scarico e pressione di turbina |
US9076829B2 (en) * | 2011-08-08 | 2015-07-07 | Applied Materials, Inc. | Robot systems, apparatus, and methods adapted to transport substrates in electronic device manufacturing |
US20130196078A1 (en) | 2012-01-31 | 2013-08-01 | Joseph Yudovsky | Multi-Chamber Substrate Processing System |
-
2014
- 2014-02-27 KR KR1020140023493A patent/KR102135740B1/ko active IP Right Grant
-
2015
- 2015-02-17 TW TW104105490A patent/TWI587425B/zh active
- 2015-02-17 JP JP2015028395A patent/JP6062975B2/ja active Active
- 2015-02-26 US US14/633,123 patent/US20150243490A1/en not_active Abandoned
- 2015-02-26 CN CN201510087749.9A patent/CN104882395B/zh active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20010007630A1 (en) * | 2000-01-12 | 2001-07-12 | Yoshihiro Katsumata | Substrate transfer system and substrate processing apparatus |
CN1909182A (zh) * | 2005-08-05 | 2007-02-07 | 中微半导体设备(上海)有限公司 | 半导体工艺处理系统及其处理方法 |
CN101075551A (zh) * | 2006-05-17 | 2007-11-21 | 台湾积体电路制造股份有限公司 | 制程设备组 |
KR100839191B1 (ko) * | 2007-03-28 | 2008-06-17 | 세메스 주식회사 | 기판 처리 장치 및 방법 |
TW201330138A (zh) * | 2011-09-26 | 2013-07-16 | Hitachi Int Electric Inc | 半導體裝置之製造方法及基板處理裝置 |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107924862A (zh) * | 2015-09-03 | 2018-04-17 | 川崎重工业株式会社 | 基板移载装置 |
CN107924862B (zh) * | 2015-09-03 | 2021-09-21 | 川崎重工业株式会社 | 基板移载装置 |
CN109963820A (zh) * | 2016-11-16 | 2019-07-02 | 日本电气硝子株式会社 | 玻璃基板的制造装置及制造方法 |
CN109963820B (zh) * | 2016-11-16 | 2021-12-31 | 日本电气硝子株式会社 | 玻璃基板的制造装置及制造方法 |
Also Published As
Publication number | Publication date |
---|---|
KR20150101786A (ko) | 2015-09-04 |
US20150243490A1 (en) | 2015-08-27 |
CN104882395B (zh) | 2018-06-12 |
TWI587425B (zh) | 2017-06-11 |
TW201535571A (zh) | 2015-09-16 |
JP6062975B2 (ja) | 2017-01-18 |
JP2015162677A (ja) | 2015-09-07 |
KR102135740B1 (ko) | 2020-07-20 |
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