TWI720321B - 基板處理裝置 - Google Patents

基板處理裝置 Download PDF

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Publication number
TWI720321B
TWI720321B TW107120977A TW107120977A TWI720321B TW I720321 B TWI720321 B TW I720321B TW 107120977 A TW107120977 A TW 107120977A TW 107120977 A TW107120977 A TW 107120977A TW I720321 B TWI720321 B TW I720321B
Authority
TW
Taiwan
Prior art keywords
substrate
gap
processing apparatus
facing
outer peripheral
Prior art date
Application number
TW107120977A
Other languages
English (en)
Chinese (zh)
Other versions
TW201906671A (zh
Inventor
吉田武司
Original Assignee
日商斯庫林集團股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商斯庫林集團股份有限公司 filed Critical 日商斯庫林集團股份有限公司
Publication of TW201906671A publication Critical patent/TW201906671A/zh
Application granted granted Critical
Publication of TWI720321B publication Critical patent/TWI720321B/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Weting (AREA)
TW107120977A 2017-06-30 2018-06-19 基板處理裝置 TWI720321B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017-128692 2017-06-30
JP2017128692A JP6925185B2 (ja) 2017-06-30 2017-06-30 基板処理装置

Publications (2)

Publication Number Publication Date
TW201906671A TW201906671A (zh) 2019-02-16
TWI720321B true TWI720321B (zh) 2021-03-01

Family

ID=64741563

Family Applications (1)

Application Number Title Priority Date Filing Date
TW107120977A TWI720321B (zh) 2017-06-30 2018-06-19 基板處理裝置

Country Status (3)

Country Link
JP (1) JP6925185B2 (fr)
TW (1) TWI720321B (fr)
WO (1) WO2019003815A1 (fr)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7242392B2 (ja) * 2019-04-16 2023-03-20 東京エレクトロン株式会社 基板処理装置
JP7530846B2 (ja) 2021-02-19 2024-08-08 東京エレクトロン株式会社 基板処理装置、基板処理方法及びコンピュータ読み取り可能な記録媒体

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200922701A (en) * 2007-10-17 2009-06-01 Ebara Corp Substrate cleaning apparatus
US20140251539A1 (en) * 2013-03-11 2014-09-11 Tokyo Electron Limited Substrate processing apparatus and substrate processing method
TW201709261A (zh) * 2015-02-03 2017-03-01 Tokyo Electron Ltd 基板液處理裝置及基板液處理方法
TWI582886B (zh) * 2016-01-12 2017-05-11 弘塑科技股份有限公司 單晶圓溼式處理裝置

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101485579B1 (ko) * 2013-10-02 2015-01-22 주식회사 케이씨텍 기판세정장치
JP6329428B2 (ja) * 2014-05-09 2018-05-23 東京エレクトロン株式会社 基板処理装置、基板処理装置の付着物除去方法、及び記憶媒体
JP6347752B2 (ja) * 2015-02-03 2018-06-27 東京エレクトロン株式会社 基板液処理装置及び基板液処理方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200922701A (en) * 2007-10-17 2009-06-01 Ebara Corp Substrate cleaning apparatus
US20140251539A1 (en) * 2013-03-11 2014-09-11 Tokyo Electron Limited Substrate processing apparatus and substrate processing method
TW201709261A (zh) * 2015-02-03 2017-03-01 Tokyo Electron Ltd 基板液處理裝置及基板液處理方法
TWI582886B (zh) * 2016-01-12 2017-05-11 弘塑科技股份有限公司 單晶圓溼式處理裝置

Also Published As

Publication number Publication date
TW201906671A (zh) 2019-02-16
JP2019012768A (ja) 2019-01-24
WO2019003815A1 (fr) 2019-01-03
JP6925185B2 (ja) 2021-08-25

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