TWI718356B - 排程器、基板處理裝置、以及基板搬運方法 - Google Patents

排程器、基板處理裝置、以及基板搬運方法 Download PDF

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TWI718356B
TWI718356B TW107101114A TW107101114A TWI718356B TW I718356 B TWI718356 B TW I718356B TW 107101114 A TW107101114 A TW 107101114A TW 107101114 A TW107101114 A TW 107101114A TW I718356 B TWI718356 B TW I718356B
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Taiwan
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substrate
processing
section
network diagram
processing apparatus
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TW107101114A
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English (en)
Chinese (zh)
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TW201833998A (zh
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野野部宏司
三谷隆
小泉竜也
大石邦夫
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日商荏原製作所股份有限公司
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67207—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
    • H01L21/6723—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process comprising at least one plating chamber
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Programme-control systems
    • G05B19/02—Programme-control systems electric
    • G05B19/18—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form
    • G05B19/4155—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form characterised by programme execution, i.e. part programme or machine function execution, e.g. selection of a programme
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67276—Production flow monitoring, e.g. for increasing throughput
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Programme-control systems
    • G05B19/02—Programme-control systems electric
    • G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
    • G05B19/41865—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM] characterised by job scheduling, process planning, material flow
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67745—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber characterized by movements or sequence of movements of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/32—Operator till task planning
    • G05B2219/32252—Scheduling production, machining, job shop
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/45—Nc applications
    • G05B2219/45031—Manufacturing semiconductor wafers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
    • Y02P90/02—Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]

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  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Automation & Control Theory (AREA)
  • Human Computer Interaction (AREA)
  • Robotics (AREA)
  • General Engineering & Computer Science (AREA)
  • Quality & Reliability (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • General Factory Administration (AREA)
  • Control Of Conveyors (AREA)
  • Electroplating Methods And Accessories (AREA)
TW107101114A 2017-01-17 2018-01-11 排程器、基板處理裝置、以及基板搬運方法 TWI718356B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017-005729 2017-01-17
JP2017005729A JP6517845B2 (ja) 2017-01-17 2017-01-17 スケジューラ、基板処理装置、及び基板搬送方法

Publications (2)

Publication Number Publication Date
TW201833998A TW201833998A (zh) 2018-09-16
TWI718356B true TWI718356B (zh) 2021-02-11

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US (2) US10824135B2 (enExample)
JP (1) JP6517845B2 (enExample)
KR (1) KR102168365B1 (enExample)
CN (1) CN108335997B (enExample)
TW (1) TWI718356B (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI758578B (zh) * 2018-03-01 2022-03-21 日商荏原製作所股份有限公司 排程器、基板處理裝置、及基板搬送方法
CN109742041B (zh) * 2019-01-07 2020-11-24 成都中电熊猫显示科技有限公司 基板传送的控制方法及设备
US12287624B2 (en) * 2020-07-27 2025-04-29 Applied Materials, Inc. Time constraint management at a manufacturing system
JP7311553B2 (ja) * 2021-03-29 2023-07-19 株式会社Kokusai Electric 基板処理装置、半導体装置の製造方法及びプログラム
JP7324811B2 (ja) * 2021-09-22 2023-08-10 株式会社Kokusai Electric 基板処理装置、半導体装置の製造方法、及びプログラム

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6772029B2 (en) * 2000-01-17 2004-08-03 Ebara Corporation Wafer transfer control apparatus and method for transferring wafer
US20110206034A1 (en) * 2010-02-24 2011-08-25 Fujitsu Limited Route allocation apparatus and method
US9166906B2 (en) * 2008-12-15 2015-10-20 Intergraph Corporation Routing method in asymmetric networks

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5442306A (en) 1977-09-09 1979-04-04 Osaka Shinku Kiki Seisakusho Strong flange joint device in vacuum melting furnace
JPH1031504A (ja) * 1996-07-15 1998-02-03 Oji Paper Co Ltd 最適生産スケジュールの自動作成方法および最適生産スケジュール作成装置
JP3684056B2 (ja) * 1996-11-15 2005-08-17 株式会社日立国際電気 半導体製造装置の基板搬送制御方法
US6418356B1 (en) * 1998-12-31 2002-07-09 Silicon Valley Group, Inc. Method and apparatus for resolving conflicts in a substrate processing system
JP2003086563A (ja) 2001-09-11 2003-03-20 Dainippon Screen Mfg Co Ltd 基板処理装置のスケジュール作成方法及びそのプログラム
US7099277B2 (en) * 2002-02-20 2006-08-29 Mitsubishi Electric Research Laboratories, Inc. Dynamic optimal path selection in multiple communications networks
JP3928962B2 (ja) * 2003-08-21 2007-06-13 株式会社日立製作所 通信型車両ナビゲーションシステムのサーバ装置及び車載端末装置
EP1701232B1 (en) * 2003-12-24 2016-03-02 Nippon Steel & Sumitomo Metal Corporation Manufacturing/distribution schedule creation device and method, manufacturing/distribution process control device and method, computer program, and computer-readable recording medium
US8483861B2 (en) * 2009-08-31 2013-07-09 Applied Materials, Inc. Scheduling modeling system for adaptive, automated data collection and performance analysis of manufacturing system for optimal scheduling
US8655472B2 (en) 2010-01-12 2014-02-18 Ebara Corporation Scheduler, substrate processing apparatus, and method of transferring substrates in substrate processing apparatus
JP5620680B2 (ja) * 2010-01-12 2014-11-05 株式会社荏原製作所 スケジューラ、基板処理装置、及び基板処理装置の運転方法
JP5415356B2 (ja) * 2010-05-19 2014-02-12 株式会社荏原製作所 基板処理装置の基板搬送方法、スケジューラ、及び基板処理装置の運転制御装置
JP5939210B2 (ja) * 2013-06-20 2016-06-22 Ｊｆｅスチール株式会社 スケジューリング方法及びスケジューリング装置
JP2015060566A (ja) * 2013-09-20 2015-03-30 株式会社東芝 作業計画スケジューリング装置およびその方法
JP6501601B2 (ja) 2014-05-20 2019-04-17 東京エレクトロン株式会社 基板処理装置、基板処理方法及び基板処理プログラム
EP3298555A1 (en) * 2015-05-19 2018-03-28 Fleetmatics Ireland Limited System and method for accelerating route search
KR102240155B1 (ko) * 2017-03-29 2021-04-14 가부시키가이샤 코쿠사이 엘렉트릭 기판 이재 유닛, 기판 처리 장치 및 반도체 장치의 제조 방법
JP6789384B2 (ja) * 2017-04-06 2020-11-25 東京エレクトロン株式会社 基板処理装置および基板搬送方法
TWI758578B (zh) * 2018-03-01 2022-03-21 日商荏原製作所股份有限公司 排程器、基板處理裝置、及基板搬送方法
JP7247743B2 (ja) * 2019-05-20 2023-03-29 東京エレクトロン株式会社 基板処理装置及び基板処理方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6772029B2 (en) * 2000-01-17 2004-08-03 Ebara Corporation Wafer transfer control apparatus and method for transferring wafer
US9166906B2 (en) * 2008-12-15 2015-10-20 Intergraph Corporation Routing method in asymmetric networks
US20110206034A1 (en) * 2010-02-24 2011-08-25 Fujitsu Limited Route allocation apparatus and method

Also Published As

Publication number Publication date
US10824135B2 (en) 2020-11-03
US20180203434A1 (en) 2018-07-19
TW201833998A (zh) 2018-09-16
JP2018117000A (ja) 2018-07-26
CN108335997A (zh) 2018-07-27
KR102168365B1 (ko) 2020-10-22
JP6517845B2 (ja) 2019-05-22
CN108335997B (zh) 2023-05-09
US20210011462A1 (en) 2021-01-14
KR20180084616A (ko) 2018-07-25
US11099546B2 (en) 2021-08-24

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