TWI716430B - 用於靜電夾頭之具有凸形內表面的環狀邊緣密封 - Google Patents

用於靜電夾頭之具有凸形內表面的環狀邊緣密封 Download PDF

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Publication number
TWI716430B
TWI716430B TW105125098A TW105125098A TWI716430B TW I716430 B TWI716430 B TW I716430B TW 105125098 A TW105125098 A TW 105125098A TW 105125098 A TW105125098 A TW 105125098A TW I716430 B TWI716430 B TW I716430B
Authority
TW
Taiwan
Prior art keywords
corner
electrostatic chuck
top surface
layer
edge seal
Prior art date
Application number
TW105125098A
Other languages
English (en)
Chinese (zh)
Other versions
TW201724339A (zh
Inventor
馬修 麥可 李
Original Assignee
美商蘭姆研究公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 美商蘭姆研究公司 filed Critical 美商蘭姆研究公司
Publication of TW201724339A publication Critical patent/TW201724339A/zh
Application granted granted Critical
Publication of TWI716430B publication Critical patent/TWI716430B/zh

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16J—PISTONS; CYLINDERS; SEALINGS
    • F16J15/00—Sealings
    • F16J15/02—Sealings between relatively-stationary surfaces
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32715—Workpiece holder
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0441—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/72—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using electrostatic chucks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/72—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using electrostatic chucks
    • H10P72/722—Details of electrostatic chucks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7606—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7611—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge profile or support profile

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Drying Of Semiconductors (AREA)
TW105125098A 2015-08-10 2016-08-08 用於靜電夾頭之具有凸形內表面的環狀邊緣密封 TWI716430B (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US201562203118P 2015-08-10 2015-08-10
US62/203,118 2015-08-10
US14/836,202 2015-08-26
US14/836,202 US20170047238A1 (en) 2015-08-10 2015-08-26 Annular edge seal with convex inner surface for electrostatic chuck

Publications (2)

Publication Number Publication Date
TW201724339A TW201724339A (zh) 2017-07-01
TWI716430B true TWI716430B (zh) 2021-01-21

Family

ID=57994425

Family Applications (1)

Application Number Title Priority Date Filing Date
TW105125098A TWI716430B (zh) 2015-08-10 2016-08-08 用於靜電夾頭之具有凸形內表面的環狀邊緣密封

Country Status (6)

Country Link
US (1) US20170047238A1 (https=)
JP (1) JP7018703B2 (https=)
KR (1) KR102689596B1 (https=)
CN (1) CN106449504B (https=)
SG (2) SG10202001170TA (https=)
TW (1) TWI716430B (https=)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11127619B2 (en) 2016-06-07 2021-09-21 Applied Materials, Inc. Workpiece carrier for high power with enhanced edge sealing
CN107195578B (zh) * 2017-07-17 2019-11-29 北京北方华创微电子装备有限公司 静电卡盘
CN109881184B (zh) * 2019-03-29 2022-03-25 拓荆科技股份有限公司 具有静电力抑制的基板承载装置
WO2024059276A1 (en) * 2022-09-16 2024-03-21 Lam Research Corporation Spring-loaded seal cover band for protecting a substrate support
KR20250064814A (ko) * 2023-11-03 2025-05-12 피에스케이 주식회사 기판 지지 유닛 및 기판 처리 장치

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201005869A (en) * 2008-07-30 2010-02-01 Taiwan Semiconductor Mfg Replaceable electrostatic chuck sidewall shield
US20150187614A1 (en) * 2013-12-26 2015-07-02 Lam Research Corporation Edge seal for lower electrode assembly

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW406346B (en) * 1996-08-26 2000-09-21 Applied Materials Inc Method and apparatus for cooling a workpiece using an electrostatic chuck
US6982178B2 (en) 2002-06-10 2006-01-03 E Ink Corporation Components and methods for use in electro-optic displays
JP4458995B2 (ja) 2004-09-10 2010-04-28 京セラ株式会社 ウェハ支持部材
JP2009024712A (ja) 2007-07-17 2009-02-05 Nok Corp 密封装置
US8794638B2 (en) * 2009-02-27 2014-08-05 Halliburton Energy Services, Inc. Sealing array for high temperature applications
CN201973238U (zh) 2010-09-26 2011-09-14 北京北方微电子基地设备工艺研究中心有限责任公司 密封圈及应用该密封圈的等离子体加工设备
JP5920655B2 (ja) * 2011-02-25 2016-05-18 東レ株式会社 樹脂注入成形装置およびそれを用いたｒｔｍ成形方法
US9859142B2 (en) * 2011-10-20 2018-01-02 Lam Research Corporation Edge seal for lower electrode assembly
US9869392B2 (en) * 2011-10-20 2018-01-16 Lam Research Corporation Edge seal for lower electrode assembly
TWI613753B (zh) 2015-02-16 2018-02-01 麥豐密封科技股份有限公司 靜電吸附承盤側壁之改良密封件

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201005869A (en) * 2008-07-30 2010-02-01 Taiwan Semiconductor Mfg Replaceable electrostatic chuck sidewall shield
US20150187614A1 (en) * 2013-12-26 2015-07-02 Lam Research Corporation Edge seal for lower electrode assembly

Also Published As

Publication number Publication date
KR102689596B1 (ko) 2024-07-29
SG10201606452RA (en) 2017-03-30
TW201724339A (zh) 2017-07-01
CN106449504B (zh) 2021-04-06
CN106449504A (zh) 2017-02-22
JP7018703B2 (ja) 2022-02-14
US20170047238A1 (en) 2017-02-16
JP2017041631A (ja) 2017-02-23
KR20170018779A (ko) 2017-02-20
SG10202001170TA (en) 2020-03-30

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