SG10202001170TA - Annular edge seal with convex inner surface for electrostatic chuck - Google Patents
Annular edge seal with convex inner surface for electrostatic chuckInfo
- Publication number
- SG10202001170TA SG10202001170TA SG10202001170TA SG10202001170TA SG10202001170TA SG 10202001170T A SG10202001170T A SG 10202001170TA SG 10202001170T A SG10202001170T A SG 10202001170TA SG 10202001170T A SG10202001170T A SG 10202001170TA SG 10202001170T A SG10202001170T A SG 10202001170TA
- Authority
- SG
- Singapore
- Prior art keywords
- electrostatic chuck
- edge seal
- annular edge
- convex inner
- convex
- Prior art date
Links
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16J—PISTONS; CYLINDERS; SEALINGS
- F16J15/00—Sealings
- F16J15/02—Sealings between relatively-stationary surfaces
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32715—Workpiece holder
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/04—Apparatus for manufacture or treatment
- H10P72/0441—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/72—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using electrostatic chucks
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/72—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using electrostatic chucks
- H10P72/722—Details of electrostatic chucks
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
- H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
- H10P72/7606—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
- H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
- H10P72/7611—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge profile or support profile
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Mechanical Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Drying Of Semiconductors (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201562203118P | 2015-08-10 | 2015-08-10 | |
| US14/836,202 US20170047238A1 (en) | 2015-08-10 | 2015-08-26 | Annular edge seal with convex inner surface for electrostatic chuck |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SG10202001170TA true SG10202001170TA (en) | 2020-03-30 |
Family
ID=57994425
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG10202001170TA SG10202001170TA (en) | 2015-08-10 | 2016-08-04 | Annular edge seal with convex inner surface for electrostatic chuck |
| SG10201606452RA SG10201606452RA (en) | 2015-08-10 | 2016-08-04 | Annular edge seal with convex inner surface for electrostatic chuck |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG10201606452RA SG10201606452RA (en) | 2015-08-10 | 2016-08-04 | Annular edge seal with convex inner surface for electrostatic chuck |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20170047238A1 (https=) |
| JP (1) | JP7018703B2 (https=) |
| KR (1) | KR102689596B1 (https=) |
| CN (1) | CN106449504B (https=) |
| SG (2) | SG10202001170TA (https=) |
| TW (1) | TWI716430B (https=) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11127619B2 (en) | 2016-06-07 | 2021-09-21 | Applied Materials, Inc. | Workpiece carrier for high power with enhanced edge sealing |
| CN107195578B (zh) * | 2017-07-17 | 2019-11-29 | 北京北方华创微电子装备有限公司 | 静电卡盘 |
| CN109881184B (zh) * | 2019-03-29 | 2022-03-25 | 拓荆科技股份有限公司 | 具有静电力抑制的基板承载装置 |
| WO2024059276A1 (en) * | 2022-09-16 | 2024-03-21 | Lam Research Corporation | Spring-loaded seal cover band for protecting a substrate support |
| KR20250064814A (ko) * | 2023-11-03 | 2025-05-12 | 피에스케이 주식회사 | 기판 지지 유닛 및 기판 처리 장치 |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW406346B (en) * | 1996-08-26 | 2000-09-21 | Applied Materials Inc | Method and apparatus for cooling a workpiece using an electrostatic chuck |
| US6982178B2 (en) | 2002-06-10 | 2006-01-03 | E Ink Corporation | Components and methods for use in electro-optic displays |
| JP4458995B2 (ja) | 2004-09-10 | 2010-04-28 | 京セラ株式会社 | ウェハ支持部材 |
| JP2009024712A (ja) | 2007-07-17 | 2009-02-05 | Nok Corp | 密封装置 |
| US9543181B2 (en) * | 2008-07-30 | 2017-01-10 | Taiwan Semiconductor Manufacturing Company, Ltd. | Replaceable electrostatic chuck sidewall shield |
| US8794638B2 (en) * | 2009-02-27 | 2014-08-05 | Halliburton Energy Services, Inc. | Sealing array for high temperature applications |
| CN201973238U (zh) | 2010-09-26 | 2011-09-14 | 北京北方微电子基地设备工艺研究中心有限责任公司 | 密封圈及应用该密封圈的等离子体加工设备 |
| JP5920655B2 (ja) * | 2011-02-25 | 2016-05-18 | 東レ株式会社 | 樹脂注入成形装置およびそれを用いたｒｔｍ成形方法 |
| US9859142B2 (en) * | 2011-10-20 | 2018-01-02 | Lam Research Corporation | Edge seal for lower electrode assembly |
| US9869392B2 (en) * | 2011-10-20 | 2018-01-16 | Lam Research Corporation | Edge seal for lower electrode assembly |
| US10090211B2 (en) * | 2013-12-26 | 2018-10-02 | Lam Research Corporation | Edge seal for lower electrode assembly |
| TWI613753B (zh) | 2015-02-16 | 2018-02-01 | 麥豐密封科技股份有限公司 | 靜電吸附承盤側壁之改良密封件 |
-
2015
- 2015-08-26 US US14/836,202 patent/US20170047238A1/en not_active Abandoned
-
2016
- 2016-08-03 JP JP2016152437A patent/JP7018703B2/ja active Active
- 2016-08-04 SG SG10202001170TA patent/SG10202001170TA/en unknown
- 2016-08-04 SG SG10201606452RA patent/SG10201606452RA/en unknown
- 2016-08-05 KR KR1020160099788A patent/KR102689596B1/ko active Active
- 2016-08-08 TW TW105125098A patent/TWI716430B/zh active
- 2016-08-10 CN CN201610652728.1A patent/CN106449504B/zh active Active
Also Published As
| Publication number | Publication date |
|---|---|
| KR102689596B1 (ko) | 2024-07-29 |
| SG10201606452RA (en) | 2017-03-30 |
| TW201724339A (zh) | 2017-07-01 |
| TWI716430B (zh) | 2021-01-21 |
| CN106449504B (zh) | 2021-04-06 |
| CN106449504A (zh) | 2017-02-22 |
| JP7018703B2 (ja) | 2022-02-14 |
| US20170047238A1 (en) | 2017-02-16 |
| JP2017041631A (ja) | 2017-02-23 |
| KR20170018779A (ko) | 2017-02-20 |
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