SG10201600659UA - Barrier seal for electrostatic chuck - Google Patents
Barrier seal for electrostatic chuckInfo
- Publication number
- SG10201600659UA SG10201600659UA SG10201600659UA SG10201600659UA SG10201600659UA SG 10201600659U A SG10201600659U A SG 10201600659UA SG 10201600659U A SG10201600659U A SG 10201600659UA SG 10201600659U A SG10201600659U A SG 10201600659UA SG 10201600659U A SG10201600659U A SG 10201600659UA
- Authority
- SG
- Singapore
- Prior art keywords
- electrostatic chuck
- barrier seal
- barrier
- seal
- chuck
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
- H01L21/6833—Details of electrostatic chucks
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16J—PISTONS; CYLINDERS; SEALINGS
- F16J15/00—Sealings
- F16J15/02—Sealings between relatively-stationary surfaces
- F16J15/06—Sealings between relatively-stationary surfaces with solid packing compressed between sealing surfaces
- F16J15/10—Sealings between relatively-stationary surfaces with solid packing compressed between sealing surfaces with non-metallic packing
- F16J15/104—Sealings between relatively-stationary surfaces with solid packing compressed between sealing surfaces with non-metallic packing characterised by structure
- F16J15/106—Sealings between relatively-stationary surfaces with solid packing compressed between sealing surfaces with non-metallic packing characterised by structure homogeneous
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/02—Details
- H01J37/20—Means for supporting or positioning the objects or the material; Means for adjusting diaphragms or lenses associated with the support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32458—Vessel
- H01J37/32513—Sealing means, e.g. sealing between different parts of the vessel
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32697—Electrostatic control
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32715—Workpiece holder
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32798—Further details of plasma apparatus not provided for in groups H01J37/3244 - H01J37/32788; special provisions for cleaning or maintenance of the apparatus
- H01J37/3288—Maintenance
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/20—Positioning, supporting, modifying or maintaining the physical state of objects being observed or treated
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Plasma & Fusion (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Mechanical Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Drying Of Semiconductors (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW104105259A TWI613753B (en) | 2015-02-16 | 2015-02-16 | Improved seal for electrostatically adsorbing the side wall of the retainer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SG10201600659UA true SG10201600659UA (en) | 2016-09-29 |
Family
ID=56551818
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG10201600659UA SG10201600659UA (en) | 2015-02-16 | 2016-01-27 | Barrier seal for electrostatic chuck |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US10529611B2 (en) |
| JP (1) | JP6195636B2 (en) |
| KR (1) | KR101854973B1 (en) |
| CN (1) | CN105895570B (en) |
| DE (2) | DE102016101751A1 (en) |
| FR (1) | FR3032768B1 (en) |
| SG (1) | SG10201600659UA (en) |
| TW (1) | TWI613753B (en) |
Families Citing this family (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20170047238A1 (en) * | 2015-08-10 | 2017-02-16 | Lam Research Corporation | Annular edge seal with convex inner surface for electrostatic chuck |
| JP6800689B2 (en) * | 2016-10-07 | 2020-12-16 | 株式会社ディスコ | Chuck table mechanism |
| US10943808B2 (en) * | 2016-11-25 | 2021-03-09 | Applied Materials, Inc. | Ceramic electrostatic chuck having a V-shape seal band |
| CN107195578B (en) * | 2017-07-17 | 2019-11-29 | 北京北方华创微电子装备有限公司 | Electrostatic chuck |
| TWM566398U (en) * | 2018-06-21 | 2018-09-01 | 麥豐密封科技股份有限公司 | Semiconductor process equipment |
| JP2019140225A (en) | 2018-02-09 | 2019-08-22 | 株式会社東芝 | Etching method, method for manufacturing semiconductor chips, and method for manufacturing articles |
| CN109194001A (en) * | 2018-09-30 | 2019-01-11 | 珠海凯邦电机制造有限公司 | Sealing ring and motor and compressor |
| JP7445386B2 (en) * | 2019-02-19 | 2024-03-07 | 日本特殊陶業株式会社 | Substrate holding member and substrate holding mechanism |
| JP7332400B2 (en) * | 2019-09-09 | 2023-08-23 | 日本特殊陶業株式会社 | holding device |
| KR102344265B1 (en) * | 2019-12-11 | 2021-12-27 | 세메스 주식회사 | Component for protecting bonding layer and system for treating substrate with the component |
| JP7445420B2 (en) | 2019-12-23 | 2024-03-07 | 日本特殊陶業株式会社 | Parts for semiconductor manufacturing equipment |
| JP7308767B2 (en) * | 2020-01-08 | 2023-07-14 | 東京エレクトロン株式会社 | Mounting table and plasma processing device |
| WO2024097077A1 (en) * | 2022-11-04 | 2024-05-10 | Lam Research Corporation | Electrostatic chuck e-seal with offset sealing surface |
| CN117108742B (en) * | 2023-10-23 | 2024-01-26 | 东芯(苏州)科技有限公司 | Disc ring set for electric sucking disc and installation device and method thereof |
Family Cites Families (26)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2984164B2 (en) * | 1993-03-26 | 1999-11-29 | 日本碍子株式会社 | Susceptor for semiconductor manufacturing |
| US5636098A (en) | 1994-01-06 | 1997-06-03 | Applied Materials, Inc. | Barrier seal for electrostatic chuck |
| US5524905A (en) * | 1994-09-28 | 1996-06-11 | Greene, Tweed Of Delaware, Inc. | Sealing assembly with T-shaped seal ring and anti-extrusion rings |
| US5805408A (en) * | 1995-12-22 | 1998-09-08 | Lam Research Corporation | Electrostatic clamp with lip seal for clamping substrates |
| JP4451098B2 (en) | 2002-08-22 | 2010-04-14 | 住友大阪セメント株式会社 | Susceptor device |
| US20050042881A1 (en) | 2003-05-12 | 2005-02-24 | Tokyo Electron Limited | Processing apparatus |
| JP4458995B2 (en) * | 2004-09-10 | 2010-04-28 | 京セラ株式会社 | Wafer support member |
| US8440049B2 (en) * | 2006-05-03 | 2013-05-14 | Applied Materials, Inc. | Apparatus for etching high aspect ratio features |
| US20070283884A1 (en) * | 2006-05-30 | 2007-12-13 | Applied Materials, Inc. | Ring assembly for substrate processing chamber |
| US7589950B2 (en) * | 2006-10-13 | 2009-09-15 | Applied Materials, Inc. | Detachable electrostatic chuck having sealing assembly |
| JP5201527B2 (en) * | 2008-03-28 | 2013-06-05 | 東京エレクトロン株式会社 | Electrostatic chuck and manufacturing method thereof |
| US9543181B2 (en) * | 2008-07-30 | 2017-01-10 | Taiwan Semiconductor Manufacturing Company, Ltd. | Replaceable electrostatic chuck sidewall shield |
| JP5743895B2 (en) * | 2008-10-31 | 2015-07-01 | ラム リサーチ コーポレーションＬａｍ Ｒｅｓｅａｒｃｈ Ｃｏｒｐｏｒａｔｉｏｎ | Lower electrode assembly in plasma processing chamber |
| TWI503920B (en) * | 2009-03-19 | 2015-10-11 | Taiwan Semiconductor Mfg Co Ltd | Process equipment and o-ring thereof |
| CN201802870U (en) * | 2010-06-03 | 2011-04-20 | 厦门麦丰密封件有限公司 | Novel flashless Y-shaped/U-shaped seal ring |
| WO2011155479A1 (en) * | 2010-06-11 | 2011-12-15 | 株式会社 アルバック | Etching apparatus |
| US9869392B2 (en) | 2011-10-20 | 2018-01-16 | Lam Research Corporation | Edge seal for lower electrode assembly |
| US9859142B2 (en) * | 2011-10-20 | 2018-01-02 | Lam Research Corporation | Edge seal for lower electrode assembly |
| CN202402695U (en) * | 2011-12-31 | 2012-08-29 | 厦门麦丰密封件有限公司 | Sealing ring |
| US8677586B2 (en) * | 2012-04-04 | 2014-03-25 | Lam Research Corporation | Installation fixture for elastomer bands and methods of using the same |
| JP2013258270A (en) * | 2012-06-12 | 2013-12-26 | Tokyo Electron Ltd | Substrate mounting table and substrate processing apparatus |
| CN202851965U (en) * | 2012-09-14 | 2013-04-03 | 上海麦特密封件有限公司 | Novel sealing ring |
| JP6017328B2 (en) * | 2013-01-22 | 2016-10-26 | 東京エレクトロン株式会社 | Mounting table and plasma processing apparatus |
| JP5798140B2 (en) * | 2013-02-15 | 2015-10-21 | 株式会社東芝 | Plasma processing equipment |
| US10804081B2 (en) * | 2013-12-20 | 2020-10-13 | Lam Research Corporation | Edge ring dimensioned to extend lifetime of elastomer seal in a plasma processing chamber |
| US10515786B2 (en) * | 2015-09-25 | 2019-12-24 | Tokyo Electron Limited | Mounting table and plasma processing apparatus |
-
2015
- 2015-02-16 TW TW104105259A patent/TWI613753B/en active
- 2015-10-30 CN CN201510724773.9A patent/CN105895570B/en active Active
-
2016
- 2016-01-20 US US15/001,291 patent/US10529611B2/en active Active
- 2016-01-27 SG SG10201600659UA patent/SG10201600659UA/en unknown
- 2016-02-01 DE DE102016101751.5A patent/DE102016101751A1/en not_active Withdrawn
- 2016-02-01 DE DE202016008428.4U patent/DE202016008428U1/en active Active
- 2016-02-03 FR FR1650865A patent/FR3032768B1/en active Active
- 2016-02-05 JP JP2016020365A patent/JP6195636B2/en active Active
- 2016-02-12 KR KR1020160016506A patent/KR101854973B1/en active IP Right Grant
Also Published As
| Publication number | Publication date |
|---|---|
| JP2016152414A (en) | 2016-08-22 |
| FR3032768B1 (en) | 2018-09-07 |
| CN105895570B (en) | 2018-11-02 |
| KR101854973B1 (en) | 2018-05-04 |
| DE202016008428U1 (en) | 2017-12-04 |
| JP6195636B2 (en) | 2017-09-13 |
| US20160240421A1 (en) | 2016-08-18 |
| CN105895570A (en) | 2016-08-24 |
| US10529611B2 (en) | 2020-01-07 |
| TWI613753B (en) | 2018-02-01 |
| TW201631695A (en) | 2016-09-01 |
| KR20160100841A (en) | 2016-08-24 |
| FR3032768A1 (en) | 2016-08-19 |
| DE102016101751A1 (en) | 2016-08-18 |
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