KR102689596B1 - 정전 척용 볼록 내측 표면을 갖는 환형 에지 시일부 - Google Patents

정전 척용 볼록 내측 표면을 갖는 환형 에지 시일부 Download PDF

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Publication number
KR102689596B1
KR102689596B1 KR1020160099788A KR20160099788A KR102689596B1 KR 102689596 B1 KR102689596 B1 KR 102689596B1 KR 1020160099788 A KR1020160099788 A KR 1020160099788A KR 20160099788 A KR20160099788 A KR 20160099788A KR 102689596 B1 KR102689596 B1 KR 102689596B1
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KR
South Korea
Prior art keywords
radially
edge
adhesive bonding
layer
top surface
Prior art date
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Application number
KR1020160099788A
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English (en)
Korean (ko)
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KR20170018779A (ko
Inventor
매튜 마이클 리
Original Assignee
램 리써치 코포레이션
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Publication of KR20170018779A publication Critical patent/KR20170018779A/ko
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Publication of KR102689596B1 publication Critical patent/KR102689596B1/ko
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Classifications

    • H01L21/6833—
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16J—PISTONS; CYLINDERS; SEALINGS
    • F16J15/00—Sealings
    • F16J15/02—Sealings between relatively-stationary surfaces
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32715—Workpiece holder
    • H01L21/6831—
    • H01L21/6835—
    • H01L21/68721—
    • H01L21/68735—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0441—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/72—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using electrostatic chucks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/72—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using electrostatic chucks
    • H10P72/722—Details of electrostatic chucks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7606—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7611—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge profile or support profile

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Drying Of Semiconductors (AREA)
KR1020160099788A 2015-08-10 2016-08-05 정전 척용 볼록 내측 표면을 갖는 환형 에지 시일부 Active KR102689596B1 (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US201562203118P 2015-08-10 2015-08-10
US62/203,118 2015-08-10
US14/836,202 2015-08-26
US14/836,202 US20170047238A1 (en) 2015-08-10 2015-08-26 Annular edge seal with convex inner surface for electrostatic chuck

Publications (2)

Publication Number Publication Date
KR20170018779A KR20170018779A (ko) 2017-02-20
KR102689596B1 true KR102689596B1 (ko) 2024-07-29

Family

ID=57994425

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020160099788A Active KR102689596B1 (ko) 2015-08-10 2016-08-05 정전 척용 볼록 내측 표면을 갖는 환형 에지 시일부

Country Status (6)

Country Link
US (1) US20170047238A1 (https=)
JP (1) JP7018703B2 (https=)
KR (1) KR102689596B1 (https=)
CN (1) CN106449504B (https=)
SG (2) SG10202001170TA (https=)
TW (1) TWI716430B (https=)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11127619B2 (en) 2016-06-07 2021-09-21 Applied Materials, Inc. Workpiece carrier for high power with enhanced edge sealing
CN107195578B (zh) * 2017-07-17 2019-11-29 北京北方华创微电子装备有限公司 静电卡盘
CN109881184B (zh) * 2019-03-29 2022-03-25 拓荆科技股份有限公司 具有静电力抑制的基板承载装置
WO2024059276A1 (en) * 2022-09-16 2024-03-21 Lam Research Corporation Spring-loaded seal cover band for protecting a substrate support
KR20250064814A (ko) * 2023-11-03 2025-05-12 피에스케이 주식회사 기판 지지 유닛 및 기판 처리 장치

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100027188A1 (en) * 2008-07-30 2010-02-04 Hsi-Shui Liu Replaceable Electrostatic Chuck Sidewall Shield
CN201973238U (zh) * 2010-09-26 2011-09-14 北京北方微电子基地设备工艺研究中心有限责任公司 密封圈及应用该密封圈的等离子体加工设备
JP2012187923A (ja) * 2011-02-25 2012-10-04 Toray Ind Inc 樹脂注入成形装置およびそれを用いたｒｔｍ成形方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW406346B (en) * 1996-08-26 2000-09-21 Applied Materials Inc Method and apparatus for cooling a workpiece using an electrostatic chuck
US6982178B2 (en) 2002-06-10 2006-01-03 E Ink Corporation Components and methods for use in electro-optic displays
JP4458995B2 (ja) 2004-09-10 2010-04-28 京セラ株式会社 ウェハ支持部材
JP2009024712A (ja) 2007-07-17 2009-02-05 Nok Corp 密封装置
US8794638B2 (en) * 2009-02-27 2014-08-05 Halliburton Energy Services, Inc. Sealing array for high temperature applications
US9859142B2 (en) * 2011-10-20 2018-01-02 Lam Research Corporation Edge seal for lower electrode assembly
US9869392B2 (en) * 2011-10-20 2018-01-16 Lam Research Corporation Edge seal for lower electrode assembly
US10090211B2 (en) * 2013-12-26 2018-10-02 Lam Research Corporation Edge seal for lower electrode assembly
TWI613753B (zh) 2015-02-16 2018-02-01 麥豐密封科技股份有限公司 靜電吸附承盤側壁之改良密封件

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100027188A1 (en) * 2008-07-30 2010-02-04 Hsi-Shui Liu Replaceable Electrostatic Chuck Sidewall Shield
CN201973238U (zh) * 2010-09-26 2011-09-14 北京北方微电子基地设备工艺研究中心有限责任公司 密封圈及应用该密封圈的等离子体加工设备
JP2012187923A (ja) * 2011-02-25 2012-10-04 Toray Ind Inc 樹脂注入成形装置およびそれを用いたｒｔｍ成形方法

Also Published As

Publication number Publication date
SG10201606452RA (en) 2017-03-30
TW201724339A (zh) 2017-07-01
TWI716430B (zh) 2021-01-21
CN106449504B (zh) 2021-04-06
CN106449504A (zh) 2017-02-22
JP7018703B2 (ja) 2022-02-14
US20170047238A1 (en) 2017-02-16
JP2017041631A (ja) 2017-02-23
KR20170018779A (ko) 2017-02-20
SG10202001170TA (en) 2020-03-30

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