TWI710044B - 工件處理系統及其設備 - Google Patents

工件處理系統及其設備 Download PDF

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Publication number
TWI710044B
TWI710044B TW108131771A TW108131771A TWI710044B TW I710044 B TWI710044 B TW I710044B TW 108131771 A TW108131771 A TW 108131771A TW 108131771 A TW108131771 A TW 108131771A TW I710044 B TWI710044 B TW I710044B
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TW
Taiwan
Prior art keywords
fluid
temperature
valve
channel
pressure
Prior art date
Application number
TW108131771A
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English (en)
Chinese (zh)
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TW202015152A (zh
Inventor
菲利浦 克里米奈爾
賈斯汀 費
丹恩Ａ 馬洛爾
瑟吉歐富庫達 修吉
貝德Ｌ 梅斯
Original Assignee
美商應用材料股份有限公司
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Publication of TW202015152A publication Critical patent/TW202015152A/zh
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67109—Apparatus for thermal treatment mainly by convection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32715—Workpiece holder
    • H01J37/32724—Temperature
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H01L21/3065—Plasma etching; Reactive-ion etching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67248—Temperature monitoring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Drying Of Semiconductors (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Control Of Temperature (AREA)
TW108131771A 2014-11-26 2015-11-25 工件處理系統及其設備 TWI710044B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US14/555,467 2014-11-26
US14/555,467 US10490429B2 (en) 2014-11-26 2014-11-26 Substrate carrier using a proportional thermal fluid delivery system

Publications (2)

Publication Number Publication Date
TW202015152A TW202015152A (zh) 2020-04-16
TWI710044B true TWI710044B (zh) 2020-11-11

Family

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Family Applications (2)

Application Number Title Priority Date Filing Date
TW108131771A TWI710044B (zh) 2014-11-26 2015-11-25 工件處理系統及其設備
TW104139247A TWI674638B (zh) 2014-11-26 2015-11-25 工件處理系統及其設備

Family Applications After (1)

Application Number Title Priority Date Filing Date
TW104139247A TWI674638B (zh) 2014-11-26 2015-11-25 工件處理系統及其設備

Country Status (6)

Country Link
US (2) US10490429B2 (enExample)
JP (3) JP7072383B2 (enExample)
KR (2) KR102577570B1 (enExample)
CN (1) CN106663648B (enExample)
TW (2) TWI710044B (enExample)
WO (1) WO2016085826A1 (enExample)

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KR20230091794A (ko) * 2021-12-16 2023-06-23 에이에스엠 아이피 홀딩 비.브이. 반도체 처리 시스템 로드 록의 이슬점 감지
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Also Published As

Publication number Publication date
KR20220156108A (ko) 2022-11-24
US10490429B2 (en) 2019-11-26
TW202015152A (zh) 2020-04-16
US20200051839A1 (en) 2020-02-13
US20160148822A1 (en) 2016-05-26
JP2021132219A (ja) 2021-09-09
JP7301903B2 (ja) 2023-07-03
JP2018503965A (ja) 2018-02-08
JP2023134477A (ja) 2023-09-27
KR102467428B1 (ko) 2022-11-14
JP7072383B2 (ja) 2022-05-20
US11615973B2 (en) 2023-03-28
WO2016085826A1 (en) 2016-06-02
KR20170091574A (ko) 2017-08-09
JP7649818B2 (ja) 2025-03-21
CN106663648B (zh) 2020-10-02
CN106663648A (zh) 2017-05-10
TWI674638B (zh) 2019-10-11
KR102577570B1 (ko) 2023-09-11
TW201626491A (zh) 2016-07-16

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