TWI708824B - 黏著片、及光學構件 - Google Patents

黏著片、及光學構件 Download PDF

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Publication number
TWI708824B
TWI708824B TW104111864A TW104111864A TWI708824B TW I708824 B TWI708824 B TW I708824B TW 104111864 A TW104111864 A TW 104111864A TW 104111864 A TW104111864 A TW 104111864A TW I708824 B TWI708824 B TW I708824B
Authority
TW
Taiwan
Prior art keywords
adhesive
meth
acrylate
acid
mentioned
Prior art date
Application number
TW104111864A
Other languages
English (en)
Chinese (zh)
Other versions
TW201546234A (zh
Inventor
片岡賢一
天野立巳
Original Assignee
日商日東電工股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商日東電工股份有限公司 filed Critical 日商日東電工股份有限公司
Publication of TW201546234A publication Critical patent/TW201546234A/zh
Application granted granted Critical
Publication of TWI708824B publication Critical patent/TWI708824B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/20—Carboxylic acid amides
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
    • C09J175/04—Polyurethanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Polarising Elements (AREA)
  • Laminated Bodies (AREA)
TW104111864A 2014-04-16 2015-04-14 黏著片、及光學構件 TWI708824B (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2014085036 2014-04-16
JPJP2014-085036 2014-04-16
JP2015058371A JP6594637B2 (ja) 2014-04-16 2015-03-20 粘着シート、及び、光学部材
JPJP2015-058371 2015-03-20

Publications (2)

Publication Number Publication Date
TW201546234A TW201546234A (zh) 2015-12-16
TWI708824B true TWI708824B (zh) 2020-11-01

Family

ID=54323949

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104111864A TWI708824B (zh) 2014-04-16 2015-04-14 黏著片、及光學構件

Country Status (5)

Country Link
JP (1) JP6594637B2 (fr)
KR (1) KR102290158B1 (fr)
CN (1) CN106255733B (fr)
TW (1) TWI708824B (fr)
WO (1) WO2015159738A1 (fr)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3404069B1 (fr) * 2016-01-12 2022-06-29 Shin-Etsu Polymer Co. Ltd. Dispersion de polymère conducteur et son procédé de préparation, et procédé de fabrication de film conducteur
JP6269769B1 (ja) * 2016-09-30 2018-01-31 東洋インキＳｃホールディングス株式会社 粘着シート
JP2018053212A (ja) * 2016-09-30 2018-04-05 日立化成株式会社 粘着フィルム
JP2018077355A (ja) * 2016-11-09 2018-05-17 日東電工株式会社 積層光学フィルム、及び画像表示装置
JP6829097B2 (ja) * 2017-02-08 2021-02-10 日本カーバイド工業株式会社 保護フィルム用粘着剤組成物及び被着体の表面保護フィルム
JP6763365B2 (ja) * 2017-12-25 2020-09-30 東洋インキＳｃホールディングス株式会社 粘着シート
KR102290864B1 (ko) * 2018-10-30 2021-08-23 산진 옵토일렉트로닉스 (쑤저우) 컴퍼니 리미티드 점착제 조성물
JP7122228B2 (ja) * 2018-11-06 2022-08-19 ライオン・スペシャリティ・ケミカルズ株式会社 粘着剤、粘着シート、粘着シートの製造方法、および画像表示装置
JP7229584B2 (ja) * 2019-01-25 2023-02-28 エルジー・ケム・リミテッド 表面保護フィルムおよび有機発光電子装置の製造方法
JP7069066B2 (ja) * 2019-02-27 2022-05-17 リンテック株式会社 繰り返し屈曲ディスプレイ
KR102475814B1 (ko) * 2019-05-22 2022-12-08 주식회사 엘지화학 점착제 조성물
CN112210325B (zh) * 2019-07-10 2023-11-17 日东电工（上海松江）有限公司 粘合剂组合物

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005097451A (ja) * 2003-09-26 2005-04-14 Nippon Carbide Ind Co Inc 光学部材表面保護フィルム用感圧接着剤組成物及び光学部材表面保護フィルム
JP2010037431A (ja) * 2008-08-05 2010-02-18 Nippon Shokubai Co Ltd 溶剤型再剥離用粘着剤組成物および再剥離用粘着製品
JP2014043108A (ja) * 2013-11-01 2014-03-13 Nitto Denko Corp 透明フィルムおよび該フィルムを用いた表面保護フィルム

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09165460A (ja) 1995-12-14 1997-06-24 Hitachi Chem Co Ltd 帯電防止処理方法
JP4306024B2 (ja) * 1998-06-22 2009-07-29 東洋紡績株式会社 高制電性積層体およびそれを用いた成形品
TWI248872B (en) * 1998-06-22 2006-02-11 Toyo Boseki Highly antistatic laminate
JP2008069202A (ja) * 2006-09-12 2008-03-27 Nippon Carbide Ind Co Inc 光学部材表面保護フィルム用感圧接着剤組成物及び光学部材表面保護フィルム
JP2008150544A (ja) * 2006-12-20 2008-07-03 Toyo Ink Mfg Co Ltd 制電性アクリル系樹脂組成物
JP5452850B2 (ja) * 2007-07-13 2014-03-26 チェイル インダストリーズ インコーポレイテッド 光学部材用の表面保護シート
JP5577620B2 (ja) * 2009-05-11 2014-08-27 Ｄｉｃ株式会社 粘着剤、粘着フィルム、及び光学部材用表面保護フィルム
JP5500362B2 (ja) * 2010-05-19 2014-05-21 Ｄｉｃ株式会社 粘着剤、粘着フィルム、光学部材用表面保護フィルム及びそれが貼付された積層体
JP5723618B2 (ja) * 2011-02-04 2015-05-27 日東電工株式会社 粘着シートおよび表面保護フィルム
JP5687722B2 (ja) * 2012-03-30 2015-03-18 日東電工株式会社 粘着シート、及び、光学部材

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005097451A (ja) * 2003-09-26 2005-04-14 Nippon Carbide Ind Co Inc 光学部材表面保護フィルム用感圧接着剤組成物及び光学部材表面保護フィルム
JP2010037431A (ja) * 2008-08-05 2010-02-18 Nippon Shokubai Co Ltd 溶剤型再剥離用粘着剤組成物および再剥離用粘着製品
JP2014043108A (ja) * 2013-11-01 2014-03-13 Nitto Denko Corp 透明フィルムおよび該フィルムを用いた表面保護フィルム

Also Published As

Publication number Publication date
KR20160148580A (ko) 2016-12-26
CN106255733B (zh) 2020-09-08
JP2015212362A (ja) 2015-11-26
KR102290158B1 (ko) 2021-08-18
JP6594637B2 (ja) 2019-10-23
TW201546234A (zh) 2015-12-16
WO2015159738A1 (fr) 2015-10-22
CN106255733A (zh) 2016-12-21

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