TWI708728B - 基板處理裝置及基板處理方法 - Google Patents

基板處理裝置及基板處理方法 Download PDF

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Publication number
TWI708728B
TWI708728B TW107132889A TW107132889A TWI708728B TW I708728 B TWI708728 B TW I708728B TW 107132889 A TW107132889 A TW 107132889A TW 107132889 A TW107132889 A TW 107132889A TW I708728 B TWI708728 B TW I708728B
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TW
Taiwan
Prior art keywords
substrate
processing
processing chamber
transfer
buffer unit
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TW107132889A
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English (en)
Chinese (zh)
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TW201919973A (zh
Inventor
古矢正明
森秀樹
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日商芝浦機械電子裝置股份有限公司
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  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
TW107132889A 2017-09-29 2018-09-19 基板處理裝置及基板處理方法 TWI708728B (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2017-189576 2017-09-29
JP2017189576 2017-09-29
JP2018166334A JP7246147B2 (ja) 2017-09-29 2018-09-05 基板処理装置及び基板処理方法
JP2018-166334 2018-09-05

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TW201919973A TW201919973A (zh) 2019-06-01
TWI708728B true TWI708728B (zh) 2020-11-01

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JP (1) JP7246147B2 (enrdf_load_stackoverflow)
TW (1) TWI708728B (enrdf_load_stackoverflow)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7152338B2 (ja) * 2019-03-25 2022-10-12 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
EP4102550A4 (en) * 2020-02-05 2023-02-01 Kabushiki Kaisha Yaskawa Denki TRANSPORT SYSTEM, TRANSPORT METHOD AND TRANSPORT DEVICE
CN113471119A (zh) * 2020-03-31 2021-10-01 芝浦机械电子装置株式会社 基板处理装置以及基板处理方法
KR102672414B1 (ko) * 2020-05-21 2024-06-04 가부시키가이샤 야스카와덴키 반송 장치, 반송 방법 및 반송 시스템
KR102584514B1 (ko) 2020-07-09 2023-10-06 세메스 주식회사 기판 반송 장치, 기판 처리 장치 및 방법
TWI796713B (zh) * 2020-07-23 2023-03-21 旺矽科技股份有限公司 可緩衝受測物溫度之電子元件檢測設備
KR102348259B1 (ko) * 2021-05-31 2022-01-10 (주) 티로보틱스 기판 이송 로봇을 진공 챔버 내에서 주행하기 위한 주행 로봇
KR102307687B1 (ko) * 2021-06-25 2021-10-05 (주) 티로보틱스 기판 이송 로봇을 진공 챔버 내에서 주행하기 위한 주행 로봇
JP7645141B2 (ja) * 2021-07-09 2025-03-13 Ｔｏｗａ株式会社 加工装置、及び加工品の製造方法
CN118136562A (zh) * 2022-12-01 2024-06-04 盛美半导体设备(上海)股份有限公司 基板处理装置

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201304033A (zh) * 2011-03-26 2013-01-16 Tokyo Electron Ltd 基板處理裝置
CN103377971A (zh) * 2012-04-30 2013-10-30 细美事有限公司 用于清洗基板的装置和方法
KR101624982B1 (ko) * 2010-09-03 2016-05-27 주식회사 원익아이피에스 기판처리시스템 및 기판처리방법

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20100054415A (ko) * 2008-11-14 2010-05-25 세메스 주식회사 기판 처리 장치
JP6748524B2 (ja) * 2015-09-30 2020-09-02 芝浦メカトロニクス株式会社 基板処理装置及び基板処理方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101624982B1 (ko) * 2010-09-03 2016-05-27 주식회사 원익아이피에스 기판처리시스템 및 기판처리방법
TW201304033A (zh) * 2011-03-26 2013-01-16 Tokyo Electron Ltd 基板處理裝置
CN103377971A (zh) * 2012-04-30 2013-10-30 细美事有限公司 用于清洗基板的装置和方法

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TW201919973A (zh) 2019-06-01
JP7246147B2 (ja) 2023-03-27
JP2019068058A (ja) 2019-04-25

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