〈第1實施形態〉 參考圖1～圖23，針對第1實施形態作說明。 (基本構成) 如同圖1中所示一般，第1實施形態之基板處理裝置10，係具備有複數之開閉單元11、和第1搬送機器人12、和第1移動機構13、和緩衝單元14、和第2搬送機器人15、和第2移動機構16、和複數之基板處理單元17、以及裝置附帶單元18。另外，開閉單元11係作為收容容器而起作用，第1搬送機器人12和第2搬送機器人15係作為搬送部而起作用，緩衝單元14係作為交接台而起作用。 另外，本實施形態之基板處理裝置10，係作為對於基板表面供給處理液(例如阻劑剝離液或洗清液、洗淨液等)並對基板表面進行處理之裝置來作說明。在複數之基板處理單元17處，係被進行有複數種類之處理工程(例如，阻劑剝離工程或洗清工程、洗淨工程等)。 各開閉單元11，係並排為1列地被作設置。此些之開閉單元11，係將作為搬送容器而起作用的專用箱(例如FOUP)之門作開閉。另外，當專用箱係身為FOUP的情況時，開閉單元11係被稱作FOUP開啟器。在此專用箱中，基板W係以特定間隔而被作層積並被收容。 第1搬送機器人12，係以沿著各開閉單元11所並排之第1搬送方向而移動的方式，而被設置在開閉單元11之列的鄰旁處。此第1搬送機器人12，係從藉由開閉單元11而使門被作了開啟的專用箱來將未處理之基板W取出，並進行迴旋，而放置在緩衝單元14內。又，第1搬送機器人12，係從緩衝單元14來將完成處理之基板W取出，並進行迴旋，而放置在藉由開閉單元11而使門被作了開啟的專用箱內。另外，第1搬送機器人12，當位置在無法進行與緩衝單元14之間之基板W之交接之位置處的情況時，係於第1搬送方向上移動直到到達能夠進行該交接之位置處為止。作為第1搬送機器人12，例如，係能夠使用具備有機器臂或機器手等的機器人。 第1移動機構13，係朝向第1搬送方向而延伸，並為使第1搬送機器人12在與第1搬送方向相平行之直線上而移動的機構。第1搬送機器人12，係被設置在第1移動機構13上，並成為能夠從在第1搬送方向上而並排之各開閉單元11之其中一端起而一直移動至另外一端處。作為第1移動機構13，例如，係可使用利用有線性導軌之移動機構。 緩衝單元14，係被定位於第1搬送機器人12所移動的第1機器人移動路徑之中央附近處，並被設置在該第1機器人移動路徑之單側、亦即是與各開閉單元11相反之單側處。此緩衝單元14，係身為為了在第1搬送機器人12和第2搬送機器人15之間進行基板W之交替拿取而使基板W暫時性地被作放置之緩衝台。在此緩衝單元14處，未處理或完成處理之基板W係以特定間隔而被作層積並被收容。作為緩衝單元14，例如，係能夠使用具備有收容部和支柱等之單元(詳細內容係於後再述)。 第2搬送機器人15，係以在與前述第1搬送方向相正交之第2搬送方向(與第1搬送方向相交叉之方向的其中一例)上移動的方式而被作設置。此第2搬送機器人15，係從緩衝單元14來將未處理之基板W取出，並進行迴旋，而將未處理之基板W放置在所期望之基板處理單元17內。又，第2搬送機器人15，係從基板處理單元17來將完成處理之基板W取出，並進行迴旋，而將完成處理之基板W放置在其他之基板處理單元17或者是緩衝單元14內。另外，第2搬送機器人15，當位置在無法進行與緩衝單元14之間之基板W之交接之位置處的情況時，係於第2搬送方向上移動直到到達能夠進行該交接之位置處為止。作為第2搬送機器人15，例如，係能夠使用具備有機器臂或機器手等的機器人(詳細內容係於後再述)。 第2移動機構16，係朝向第2搬送方向而延伸，並為使緩衝單元14以及第2搬送機器人15在與第2搬送方向相平行之直線上而個別移動的機構。緩衝單元14以及第2搬送機器人15，係被設置在第2移動機構16上，緩衝單元14，係位置在較第2搬送機器人15而更靠第1搬送機器人12側處。緩衝單元14以及第2搬送機器人15，係成為能夠從在第2搬送方向上而並排之各基板處理單元17之其中一端起而一直移動至另外一端處。作為第2移動機構16，例如，係可使用利用有線性導軌之移動機構(詳細內容係於後再述)。 基板處理單元17，係在第2搬送機器人15所移動的第2機器人移動路徑之兩側處而例如各被設置有4個。基板處理單元17，係具備有處理室17a、和基板保持部17b、和第1處理液供給部17c、以及第2處理液供給部17d。基板保持部17b、第1處理液供給部17c以及第2處理液供給部17d，係被設置在處理室17a內。 處理室17a，例如係被形成為直方體形狀，並具備有基板閘門17a1。基板閘門17a1，係在處理室17a處之第2機器人移動路徑側之壁面上，而被可開閉地形成。另外，處理室17a內，係藉由下衝流(垂直層流)而被保持為清淨，又，係相較於外部而被保持為陰壓。 基板保持部17b，係為藉由銷(未圖示)等而將基板W保持為水平狀態，並以與基板W之被處理面之略中央垂直地相交之軸(與基板W之被處理面相交之軸的其中一例)作為旋轉中心來使基板W在水平面內旋轉之機構。例如，基板保持部17b，係將保持為水平狀態之基板W藉由具備有旋轉軸和馬達等之旋轉機構(未圖示)來作旋轉。 第1處理液供給部17c，係對於基板保持部17b上之基板W的被處理面之中央附近供給第1處理液。此第1處理液供給部17c，例如，係具備有吐出處理液之噴嘴，並使噴嘴移動至基板保持部17b上之基板W的被處理面之中央附近處，而從該噴嘴來供給處理液。對於第1處理液供給部17c，係從液供給單元18a起經由配管(未圖示)而被供給有第1處理液。 第2處理液供給部17d，係對於基板保持部17b上之基板W的被處理面之中央附近供給第2處理液。此第2處理液供給部17d，例如，係具備有吐出處理液之噴嘴，並使噴嘴移動至基板保持部17b上之基板W的被處理面之中央附近處，而從該噴嘴來供給處理液。對於第2處理液供給部17d，係從液供給單元18a起經由配管(未圖示)而被供給有第2處理液。 裝置附帶單元18，係被設置於第2機器人移動路徑之其中一端、亦即是與第1搬送機器人12相反側之端處。此裝置附帶單元18，係收容液供給單元18a和控制單元(控制部)18b。液供給單元18a，係對於各基板處理單元17而供給各種的處理液(例如，阻劑剝離液或洗清液、洗淨液等)。控制單元18b，係具備有對於各部作集中性控制之微電腦、和將關連於基板處理之基板處理資訊和各種程式等作記憶之記憶部(均未圖示)。此控制單元18b，係基於基板處理資訊和各種程式，而對於各開閉單元11、第1搬送機器人12、第1移動機構13、第2搬送機器人15、第2移動機構16、各基板處理單元17等之各部進行控制。 (緩衝單元、第2搬送機器人及第2移動機構) 接著，參照圖2，針對緩衝單元14、第2搬送機器人15以及第2移動機構16作說明。 如同圖2中所示一般，緩衝單元14，係具備有收容部14a、和支柱14b。收容部14a，係被形成為能夠將複數枚的基板W以層積狀態來作收容。支柱14b，係以將收容部14a支持於能夠藉由第1搬送機器人12以及第2搬送機器人15來進行基板W之進出之高度處的方式，而被形成。 收容部14a，係至少成為能夠載置一枚以上之未處理之基板W和一枚以上之完成處理之基板W。在收容部14a處，用以將基板W以特定間隔來作層積並收容之置台構件(未圖示)，係在高度方向上以特定間隔而被作設置。此些之置台構件，係以在水平面內而相對向的方式，而被作定位，存在於相同高度位置之一對之置台構件，係相互將基板W之外周的一部分作支持而將1枚之基板W作保持。在此一對之置台構件處，係從其之上方起藉由第2搬送機器人15而使基板W被作載置。 第2搬送機器人15，係具備有第1臂單元15a、和第2臂單元15b、和承液罩15c、以及升降旋轉部15d。此第2搬送機器人15，係為於上下二段而具備有二台的臂單元15a、15b之雙臂機器人。 第1臂單元15a，係具備有手部(基板保持部)21、和臂部22。手部21，係被形成為能夠藉由把持機構(未圖示)來進行基板W之把持及釋放。作為把持機構，例如，係可使用將與基板W之外周面相抵接的複數之爪部區分成用以從基板W之兩側來挾持基板W之組並使該些整組地在接近遠離方向上移動之機構。臂部22，係被連結於升降旋轉部15d上，並被形成為能夠藉由升降旋轉部15d來沿著鉛直方向進行升降並且進而以鉛直方向之軸作為中心而旋轉。此臂部22，係被形成為可伸縮，並保持手部21而使其在水平之直線方向上移動。第1臂單元15a，係藉由手部21而保持基板W，並藉由使臂部22前進，來將基板W搬入至緩衝單元14或處理室17a處，並且藉由使臂部22後退，來將基板W從該些而搬出。 第2臂單元15b，基本上係為與第1臂單元15a相同之構造，並具備有手部21、和臂部22。此些由於係為與前述相同之構造，因此係省略其說明。另外，第1臂單元15a之手部21、和第2臂單元15b之手部21，係被設置為上下二段。 承液罩15c，係以包圍第1臂單元15a和第2臂單元15b的方式而被作設置，並以不會對於各臂部22之伸縮動作造成妨礙的方式而被形成。由於係存在有此承液罩15c，因此，就算是在將結束了處理後的濕潤之狀態之基板W作搬送的情況時液從基板W上而落下並彈開，該液也會碰觸到承液罩15c。藉由此，係能夠對於從基板W上所落下之液飛散至裝置之地面或第2移動機構16處的情形作抑制。 升降旋轉部15d，係保持第1臂單元15a以及第2臂單元15b之各臂部22並沿著鉛直方向之軸移動，並且使第1臂單元15a以及第2臂單元15b與承液罩15c一同作升降。又，升降旋轉部15d，係以鉛直方向之軸作為旋轉軸(機器人旋轉軸)而旋轉，並使所保持的各臂部22與承液罩15c一同旋轉。此升降旋轉部15d，係內藏有升降機構和旋轉機構(均未圖示)。升降旋轉部15d，係被與控制單元18b(參考圖1)作電性連接，其之驅動係被控制單元18b所控制。 第2移動機構16，係具備有直線軌道(第1移動軸)16a、和移動基體(第1移動部)16b、和移動基體(第2移動部)16c。直線軌道16a，係為被設置在地面上並沿著前述之第2搬送方向而延伸的軌道。移動基體16b，係支持緩衝單元14之支柱14b，並可沿著直線軌道16a移動地而被設置在直線軌道16a上。又，移動基體16c，係將第2搬送機器人15之升降旋轉部15d可旋轉地作支持，並可沿著直線軌道16a移動地而被設置在直線軌道16a上。第2移動機構16，係與移動基體16b一同地而使緩衝單元14沿著直線軌道16a移動，並與移動基體16c一同地而使第2搬送機器人15沿著直線軌道16a移動。此第2移動機構16，係被與控制單元18b(參考圖1)作電性連接，其之驅動係被控制單元18b所控制。 於此，緩衝單元14及第2搬送機器人15之移動，係因應於必要而被作限制。例如，在進行緩衝單元14與第2搬送機器人15之間之基板W之交接時，緩衝單元14和第2搬送機器人15之移動係被作限制。但是，在使緩衝單元14和第2搬送機器人15以相同速度來一同移動的情況時，係亦能夠在移動中而進行基板W之交接。又，例如，在圖1中，當使第2搬送機器人15包夾著於上下方向(將裝置附帶單元18和開閉單元11作連結之方向)而延伸之第2機器人搬送路徑地而從左側之處理室17a起來將基板W搬送至與其相對向之右側之處理室17a處的情況(180度之迴旋動作)時，第2搬送機器人15之移動係被作限制。於此迴旋動作時，當緩衝單元14係存在於會對於第2搬送機器人15之迴旋動作造成妨礙之位置處的情況時，於第2搬送機器人15之迴旋動作之前，緩衝單元14係避開至不會對於第2搬送機器人15之迴旋動作造成妨礙的位置處。 (基板處理工程) 接著，針對前述之基板處理裝置10所進行之基板處理(包含基板搬送處理)之流程作說明。另外，在對於基板W而進行2種類之處理的情況時，於圖1中，係設定為使包夾著於上下而延伸之第2機器人搬送路徑的位於左側之4個的處理室17a(以下，係會有稱作第1處理室17a的情形)和位於右側之4個的處理室17a(以下，係會有稱作第2處理室17a的情形)進行相異之處理。在進行相異之處理的情況時，第1處理室17a，係為進行第1處理之處理室，第2處理室17a，係為進行第1處理之後續的處理(第2處理)之處理室。 (包含基本性的基板交換作業之基板處理) 首先，參照圖1，針對包含基本性的基板交換作業之基板處理之流程作說明。第1處理室17a和與該第1處理室17a相對向之第2處理室17a，係被設為一組，對於未處理之基板W所進行之第1處理以及第2處理，係於各組而被反覆進行。另外，第1搬送機器人12、緩衝單元14以及第2搬送機器人15，係如同前述一般地，會有因應於必要而進行移動的情形，但是，於此係省略關於該些之移動之說明。 第1搬送機器人12，係從開閉單元11內之專用箱來將未處理之基板W取出，並進行迴旋，而將未處理之基板W放置在緩衝單元14內。藉由此，在緩衝單元14處，係被收容有未處理之基板W。第2搬送機器人15，係從緩衝單元14來將未處理之基板W取出，並進行迴旋，而將未處理之基板W放置在所期望之第1處理室17a內。藉由此，在第1處理室17a內，係被安置有未處理之基板W。之後，在第1處理室17a處，係對於基板W進行第1處理。 若是在前述之第1處理室17a處之第1處理結束，則第2搬送機器人15，係從第1處理室17a內將第1之完成處理之基板W取出，並進行180度迴旋，而將第1之完成處理之基板W放置在第2處理室17a內。藉由此，第1之完成處理之基板W係被安置在第2處理室17a內。之後，在第2處理室17a處，係對於基板W進行第2處理。 若是在第2處理室17a處之處理結束，則第2搬送機器人15，係從第2處理室17a內將第2之完成處理之基板W取出，並進行迴旋，而將第2之完成處理之基板W放置在緩衝單元14內。藉由此，在緩衝單元14處，係被收容有第2之完成處理之基板W。第1搬送機器人12，係從緩衝單元14內將第2之完成處理之基板W取出，並進行迴旋，而將完成處理之基板W放置在所期望之專用箱內。藉由此，在專用箱處，係被收容有完成處理之基板W。 此種基板處理之流程，係在前述之第1處理室17a和與其相對向之第2處理室17a之各組處被實行，但是，在第1處理室17a和第2處理室17a處，由於處理內容係為相異，因此處理時間亦為相異。又，為了使生產性提升，在各處理室17a處，係成為隨著處理之結束，而藉由第1、第2臂單元15a、15b中之其中一方之臂單元來將完成處理之基板W取出，並藉由另外一方之臂單元來將下一個處理對象之基板W作安置。於此情況，第2搬送機器人15，係成為在緩衝單元14、第1處理室17a、第2處理室17a之各場所處，將完成處理之基板W之取出動作和未處理之基板W之交接動作，作為1組的動作來進行，第1搬送機器人12，係成為在緩衝單元14處，將完成處理之基板W之取出動作和未處理之基板W之交接動作，作為1組的動作來進行。又，為了使生產性提升，係成為在各第1處理室17a處分別安置未處理之基板W並在各第1處理室17a處並行地進行第1處理，並從結束了第1處理的第1處理室17a來將第1之完成處理之基板W取出，並且安置在相對應之第2處理室17a處，而在各第2處理室17a處並行地進行第2處理。故而，實際之基板處理之流程，由於係成為較前述之基板處理之流程而更為複雜，因此，以下係針對包含更具體性的基板交換作業之基板處理作說明。 (包含具體性的基板交換作業之基板處理) 接著，參照圖1以及圖3～圖22，針對包含具體性的基板交換作業之基板處理(包含緩衝單元14以及第2搬送機器人15之移動處理的其中一例)作說明。緩衝單元14以及第2搬送機器人15，係基於關連於基板W之處理的基板處理資訊，來因應於控制單元18b之控制而個別地移動。作為基板處理資訊，例如，係可列舉出代表需要進行基板交換之處理室17a之資訊、代表在處理室17a處之處理結束和處理開始之資訊等。另外，在圖4～圖22中，被描繪有陰影線之基板W，係代表第1之完成處理之基板W，被塗黑的基板W，係代表第2之完成處理之基板W，白色之基板W，係代表未處理之基板W。 在圖1中，係將4台之第1處理室17a，從第1搬送機器人12側起沿著第2機器人搬送路徑而依序標示為(A1)、(A2)、(A3)、(A4)，並將4台之第2處理室17a，從第1搬送機器人12側起沿著第2機器人搬送路徑而依序標示為(B1)、(B2)、(B3)、(B4)。 在圖3中，係與圖1相同的，將4台之第1處理室17a，從第1搬送機器人12側起沿著第2機器人搬送路徑(直線軌道16a)而依序標示為(A1)、(A2)、(A3)、(A4)。又，在圖3中，係將第2搬送機器人15在自身與緩衝單元14之間進行基板W之交接的位置，標示為(1)、(2)、(3)、(4)。 但是，(1)之位置，係亦為第2搬送機器人15對於(A1)或(B1)之處理室17a而將基板W作搬入或搬出之位置。(2)之位置，係亦為第2搬送機器人15對於(A2)或(B2)之處理室17a而將基板W作搬入或搬出之位置。(3)之位置，係亦為第2搬送機器人15對於(A3)或(B3)之處理室17a而將基板W作搬入或搬出之位置。(4)之位置，係亦為第2搬送機器人15對於(A4)或(B4)之處理室17a而將基板W作搬入或搬出之位置。另外，(1)之位置，係亦為第1搬送機器人12在自身與緩衝單元14之間進行基板W之交接的位置。 在關連於基板交換之動作中，若是根據前述之基板處理資訊，而判斷下一個需要進行基板交換之處理室17a係為(A1)，則位於(1)之位置處的緩衝單元14，係從第1搬送機器人12而接收未處理之基板W，並停留在(1)之位置處。另外，在本實施例中，身為第1搬送機器人12在自身與緩衝單元14之間進行基板W之交接的位置之(1)之位置，係亦成為在進行有(A1)之處理室17a處之處理的情況時所進行等待之位置，但是，係亦可設為相異之位置。於此情況，在從第1搬送機器人12而接收了未處理之基板W之後，緩衝單元14，係移動至在進行有(A1)之處理室17a處之處理的情況時所進行等待之位置處。 如同圖4中所示一般，第2搬送機器人15，係從緩衝單元14而接收未處理之基板W，並將基板W安置在(A1)之處理室17a處，而進行第1處理。接著，第2搬送機器人15，係將未處理之基板W安置在(A2)～(A4)之各處理室17a處，而進行第1處理。 於此，至少在第2搬送機器人15並未對於緩衝單元14而進行基板W之交接的期間中，例如在進行有(A1)之處理室17a處之第1處理的期間中，緩衝單元14係朝向第1搬送機器人12與緩衝單元14進行基板W之交接的位置(1)前進，並從第1搬送機器人12而接收下一個進行處理之未處理之基板W。 如同圖5中所示一般，在(A1)之處理室17a處之第1處理結束之前，第2搬送機器人15，係從緩衝單元14而接收未處理之基板W。若是在(A1)之處理室17a處之第1處理結束，則第2搬送機器人15，係將第1之完成處理之基板W取出，並且將未處理之基板W安置在(A1)之處理室17a處。之後，如同圖6中所示一般，第2搬送機器人15，係進行180度迴旋，並將基板W安置在(B1)之處理室17a處，而進行第2處理。 接著，如同圖7中所示一般，第2搬送機器人15，係在(A2)之處理室17a處，將第1之完成處理之基板W與未處理之基板W作交換，並如同圖8中所示一般，進行180度迴旋，而將第1之完成處理之基板W安置在(B2)之處理室17a處。接著，如同圖9中所示一般，第2搬送機器人15，係在(A3)之處理室17a處，將第1之完成處理之基板W與未處理之基板W作交換，並如同圖10中所示一般，進行180度迴旋，而將第1之完成處理之基板W安置在(B3)之處理室17a處。接著，如同圖11中所示一般，第2搬送機器人15，係在(A4)之處理室17a處，將第1之完成處理之基板W與未處理之基板W作交換，並如同圖12中所示一般，進行180度迴旋，而將第1之完成處理之基板W安置在(B4)之處理室17a處。之後，安置在(A1)之處理室17a處的基板W之第1處理係結束。 接著，如同圖13中所示一般，若是在(B1)之處理室17a處之第2處理結束，則第2搬送機器人15，係從緩衝單元14而接收未處理之基板W。之後，第2搬送機器人15，係在(A1)之處理室17a處將未處理之基板W和第1之完成處理之基板W作交換。接著，如同圖14中所示一般，第2搬送機器人15，係進行180度迴旋，而在(B1)之處理室17a處，將第1之完成處理之基板W和第2之完成處理之基板W作交換。接著，如同圖15中所示一般，第2搬送機器人15，係將第2之完成處理之基板W交接至緩衝單元14處，並從緩衝單元14而接收未處理之基板W。此時之動作，具體而言，第2搬送機器人15，係將藉由第1臂單元15a來作了保持的第2之完成處理之基板W放置在緩衝單元14內，並接著藉由第1臂單元15a來將未處理之基板W從緩衝單元14取出。 之後，於在(B2)～(B4)處之第2處理結束之後，亦係藉由相同之流程而進行包含有基板交換之基板處理。 另外，在如同本實施形態一般之從第1處理室17a而接著於第2處理室17a處進行濕處理的情況時，例如，係會有在由純水所致之洗淨處理後維持於基板表面為被水所濕潤的狀態地來進行下一工程之處理的情況時會更有效率的情形。此時，若是基板表面並未均勻地濕潤，則基板表面係會部分性地乾燥，基板品質係會降低。因此，基板W係被設為水平，並在其之表面為被液膜所覆蓋的承液狀態下來搬送至下一個處理室17a處。在此搬送中，以不會使水從基板表面滴下的方式來進行搬送一事，係為重要。於此種情況，由於就算是具備有2個的臂單元15a、15b，亦係會有依存於基板W之處理狀態來作分開使用而使侵入至緩衝單元14中之臂被限定為1根之臂的情況，因此，係會有不得不僅藉由1根的臂來進行基板W之取出、放置的情形。 於此情況，係將當從第1處理室17a起而接著在第2處理室17a處進行濕處理時在使第1之完成處理之基板W維持於濕潤的狀態下來搬送至第2處理室17a處的其中一方之臂單元之手部21，作為濕手來使用。而，當從緩衝單元14而將未處理之基板W取出並安置在第1處理室17a處時、或者是當從第2處理室17a而將完成處理之基板W取出並交接至緩衝單元14處時，係將另外一方之臂單元之手部21作為乾手來使用。亦即是，對於載置未處理以及完成處理之基板W的緩衝單元14之侵入，係藉由乾手來進行。藉由此，係並不會有濕手侵入至緩衝單元14中的情況，而能夠對於液體附著在未處理以及完成處理之基板W上的情形作抑制。 在本實施形態的情況中，第1臂單元15a之手部21係作為乾手而起作用，第2臂單元15b之手部21係作為濕手而起作用。藉由使濕手位置在較乾手而更下方處，就算是在搬送濕潤的基板W之途中，也能夠對於從基板W所落下之液體附著在乾手上的情形作抑制。 在上述之基板處理之流程中，緩衝單元14以及第2搬送機器人15之移動及基板交換動作，係如同下述一般。 從在(A1)～(A4)、(B1)～(B4)之所有的處理室17a處均被安置有基板W之狀態的圖13起，針對緩衝單元14以及第2搬送機器人15之移動及基板交換動作作說明。圖13，係為在(B1)之處理室17a處而第2處理結束的狀態圖。另外，在以下之說明中，位置(1)～(4)，係設為參照圖3者。 若是根據前述之基板處理資訊，而判斷下一個需要進行基板交換之處理室17a係為(A1)，則如同圖13中所示一般，在緩衝單元14為位於(1)之位置處之狀態下，第2搬送機器人15係從緩衝單元14而接收未處理之基板W。接著，第2搬送機器人15，係面向(A1)之處理室17a，並藉由第2臂單元15b之手部21(濕手)，來從(A1)之處理室17a內而將第1之完成處理之基板W取出，並且藉由第1臂單元15a之手部21(乾手)來將未處理之基板W安置在(A1)之處理室17a內。 若是此第1之完成處理之基板W之取出以及未處理之基板W之安置結束，則第2搬送機器人15，係如同圖14中所示一般，進行180度迴旋，並面向(B1)之處理室17a。在此狀態下，第2搬送機器人15，係藉由第1臂單元15a來從第2處理室17a而將第2之完成處理之基板W取出，並且將藉由第2臂單元15b而作了保持的第1之完成處理之基板W安置在(B1)之處理室17a內。如同圖14中所示一般，第1搬送機器人12，係將未處理之基板W放置在緩衝單元14內。 接著，若是根據前述之基板處理資訊，而判斷下一個需要進行基板交換之處理室17a係為(A2)，則位於(1)之位置處的緩衝單元14，係在由第1搬送機器人12所致之基板交換結束之後，將下一個進行處理之未處理之基板W作保持，並如同圖15中所示一般，從(1)之位置而移動至(2)之位置處。此時，當緩衝單元14之移動會與第2搬送機器人15之動作相互干涉的情況時，如同圖14中所示一般，緩衝單元14係在(1)之位置處而等待。 又，如同圖15中所示一般，第2搬送機器人15，若是前一個作業中之在(B1)之處理室17a處的基板交換作業結束，則係在藉由第1臂單元15a之手部21(乾手)來將第2之完成處理之基板W作了保持的狀態下，移動至接下來進行基板交換作業之(2)之位置處。與此第2搬送機器人15之移動一同地，在(1)之位置處而等待之緩衝單元14亦係移動至(2)之位置處((1)→(2)之移動)。 之後，如同圖15中所示一般，第2搬送機器人15，係將藉由第1臂單元15a所取出的第2之完成處理之基板W放置在緩衝單元14內，並接著藉由第1臂單元15a來將未處理之基板W從緩衝單元14取出。使未處理之基板W被取出並且被載置有第2之完成處理之基板W之緩衝單元14，係如同圖16中所示一般，從(2)之位置而移動至(1)之位置處((2)→(1)之移動)。 另外，例如，在緩衝單元14以及第2搬送機器人15之移動速度為相同的情況等之中，亦可構成為在緩衝單元14以及第2搬送機器人15從(1)之位置而移動至(2)之位置的途中，實行未處理之基板W之交接。 如同圖16中所示一般，第2搬送機器人15，係面向(A2)之處理室17a，並藉由第2臂單元15b之手部21(濕手)，來從(A2)之處理室17a內而將第1之完成處理之基板W取出，並且將藉由第1臂單元15a之手部21(乾手)而保持了的將未處理之基板W安置在(A2)之處理室17a內。 若是此第1之完成處理之基板W之取出以及未處理之基板W之安置結束，則第2搬送機器人15，係如同圖17中所示一般，進行180度迴旋，並面向(B2)之處理室17a。在此狀態下，第2搬送機器人15，係藉由第1臂單元15a來從第2處理室17a而將第2之完成處理之基板W取出，並且將藉由第2臂單元15b而作了保持的第1之完成處理之基板W安置在(B2)之處理室17a內。 又，如同圖16中所示一般，第1搬送機器人12，係從回到(1)之位置處的緩衝單元14而將第2之完成處理之基板W取出，並且將未處理之基板W放置在緩衝單元14內。 若是此由第1搬送機器人12所致之基板W之交接結束，則緩衝單元14，係基於前述之基板處理資訊，來移動至下一個進行基板交換作業之場所處。當接下來需要進行基板交換之處理室17a係為(A3)的情況時，緩衝單元14，係如同圖18中所示一般，從(1)之位置而移動至(3)之位置處。當此緩衝單元14之移動會與第2搬送機器人15之動作相互干涉的情況時，如同圖17中所示一般，緩衝單元14係一直移動至(2)之位置處，並在該(2)之位置處而等待((1)→(2)之移動)。 又，如同圖18中所示一般，第2搬送機器人15，若是前一個作業中之在(B2)之處理室17a處的基板交換作業結束，則係在藉由第1臂單元15a之手部21(乾手)來將第2之完成處理之基板W作了保持的狀態下，移動至接下來進行基板交換作業之(3)之位置處。與此第2搬送機器人15之移動一同地，在(2)之位置處而等待之緩衝單元14亦係移動至(3)之位置處((2)→(3)之移動)。 之後，如同圖18中所示一般，第2搬送機器人15，係將藉由第1臂單元15a所取出的第2之完成處理之基板W放置在緩衝單元14內，並接著藉由第1臂單元15a來將未處理之基板W從緩衝單元14取出。使未處理之基板W被取出並且被載置有第2之完成處理之基板W之緩衝單元14，係如同圖19中所示一般，從(3)之位置而移動至(1)之位置處((3)→(1)之移動)。 如同圖19中所示一般，第2搬送機器人15，係面向(A3)之處理室17a，並藉由第2臂單元15b之手部21(濕手)，來從(A3)之處理室17a內而將第1之完成處理之基板W取出，並且將藉由第1臂單元15a之手部21(乾手)來作了保持的未處理之基板W安置在(A3)之處理室17a內。
<First Embodiment> "With reference to Figs. 1 to 23, the first embodiment will be described. (Basic structure) "As shown in FIG. 1, the substrate processing apparatus 10 of the first embodiment is provided with a plurality of opening and closing units 11, a first transport robot 12, a first moving mechanism 13, and a buffer unit 14, And the second transfer robot 15, and the second moving mechanism 16, and the plurality of substrate processing units 17, and the equipment attachment unit 18. In addition, the opening and closing unit 11 functions as a storage container, the first transport robot 12 and the second transport robot 15 function as transport parts, and the buffer unit 14 functions as a delivery stand. "In addition, the substrate processing apparatus 10 of this embodiment is demonstrated as an apparatus which supplies a processing liquid (for example, a resist stripping liquid, a cleaning liquid, a cleaning liquid, etc.) to a substrate surface, and processes the substrate surface. At the plurality of substrate processing units 17, multiple types of processing processes (for example, resist stripping process or cleaning process, cleaning process, etc.) are performed. The opening and closing units 11 are arranged side by side in a row. These opening and closing units 11 are for opening and closing the door of a dedicated box (for example, FOUP) that functions as a transport container. In addition, when the dedicated box is a FOUP, the opening and closing unit 11 is called a FOUP opener. In this dedicated box, the substrates W are stacked and housed at specific intervals. The first transport robot 12 is installed adjacent to the row of the opening and closing units 11 so as to move along the first transport direction in which the opening and closing units 11 are arranged. The first transfer robot 12 takes out the unprocessed substrate W from a dedicated box whose door is opened by the opening and closing unit 11, and rotates it, and places it in the buffer unit 14. In addition, the first transfer robot 12 takes out the processed substrate W from the buffer unit 14 and rotates it, and places it in a special box whose door is opened by the opening and closing unit 11. In addition, when the first transfer robot 12 is at a position where the substrate W cannot be transferred to the buffer unit 14, it moves in the first transfer direction until it reaches a position where the transfer can be performed. As the first transfer robot 12, for example, a robot provided with a robot arm, a robot hand, or the like can be used. ""The first moving mechanism 13 is a mechanism that extends toward the first conveying direction and moves the first conveying robot 12 on a straight line parallel to the first conveying direction. The first transport robot 12 is installed on the first moving mechanism 13 and can move from one end of the opening and closing units 11 side by side in the first transport direction to the other end. As the first moving mechanism 13, for example, a moving mechanism using linear guides can be used. The buffer unit 14 is positioned near the center of the movement path of the first robot 12 moved by the first transfer robot 12, and is arranged on one side of the movement path of the first robot, that is, opposite to the opening and closing units 11 One side. The buffer unit 14 is a buffer table for temporarily placing the substrate W between the first transfer robot 12 and the second transfer robot 15 to alternately take the substrate W. At the buffer unit 14, unprocessed or processed substrates W are stacked and housed at specific intervals. As the buffer unit 14, for example, a unit provided with a storage portion, a support column, and the like can be used (the details will be described later). "The second conveyance robot 15" is installed so as to move in a second conveyance direction (an example of a direction intersecting the first conveyance direction) orthogonal to the first conveyance direction. The second transfer robot 15 takes out the unprocessed substrate W from the buffer unit 14 and rotates it to place the unprocessed substrate W in the desired substrate processing unit 17. Furthermore, the second transfer robot 15 takes out the processed substrate W from the substrate processing unit 17 and rotates it, and places the processed substrate W in another substrate processing unit 17 or buffer unit 14. In addition, when the second transfer robot 15 is at a position where the substrate W cannot be transferred to the buffer unit 14, it moves in the second transfer direction until it reaches a position where the transfer can be performed. As the second transport robot 15, for example, a robot provided with a robot arm, a robot hand, or the like can be used (the details will be described later). The "second moving mechanism 16" is a mechanism that extends toward the second conveying direction and is a mechanism that individually moves the buffer unit 14 and the second conveying robot 15 on a straight line parallel to the second conveying direction. The buffer unit 14 and the second transfer robot 15 are installed on the second moving mechanism 16, and the buffer unit 14 is located on the side of the first transfer robot 12 relative to the second transfer robot 15. The buffer unit 14 and the second transfer robot 15 are capable of moving from one end of the substrate processing units 17 side by side in the second transfer direction to the other end. As the second moving mechanism 16, for example, a moving mechanism using linear guides can be used (the details will be described later). The “substrate processing units 17” are provided on both sides of the movement path of the second robot 15 where the second transfer robot 15 moves, and for example, four are provided each. The substrate processing unit 17 includes a processing chamber 17a, a substrate holding portion 17b, a first processing liquid supply portion 17c, and a second processing liquid supply portion 17d. The substrate holding portion 17b, the first processing liquid supply portion 17c, and the second processing liquid supply portion 17d are provided in the processing chamber 17a. The "processing chamber 17a" is formed into a rectangular parallelepiped shape, for example, and is provided with a substrate shutter 17a1. The substrate shutter 17a1 is formed on the wall surface of the second robot moving path side in the processing chamber 17a so as to be openable and closable. In addition, the inside of the processing chamber 17a is kept clean by the downflow (vertical laminar flow), and is kept at a negative pressure compared to the outside. The substrate holding portion 17b is used to hold the substrate W in a horizontal state by pins (not shown), etc., and has an axis that intersects approximately the center of the processed surface of the substrate W (to the processed surface of the substrate W). An example of the intersecting axis) is a mechanism for rotating the substrate W in the horizontal plane as the center of rotation. For example, the substrate holding portion 17b rotates the substrate W held in a horizontal state by a rotating mechanism (not shown) provided with a rotating shaft and a motor. ""The first processing liquid supply portion 17c supplies the first processing liquid to the vicinity of the center of the processed surface of the substrate W on the substrate holding portion 17b. The first processing liquid supply portion 17c is provided with a nozzle for discharging processing liquid, for example, and moves the nozzle to the vicinity of the center of the processed surface of the substrate W on the substrate holding portion 17b, and the processing liquid is supplied from the nozzle . The first processing liquid supply portion 17c is supplied with the first processing liquid from the liquid supply unit 18a via a pipe (not shown). The "second processing liquid supply portion 17d" supplies the second processing liquid to the vicinity of the center of the processed surface of the substrate W on the substrate holding portion 17b. The second processing liquid supply portion 17d is provided with a nozzle for discharging the processing liquid, and moves the nozzle to the vicinity of the center of the processed surface of the substrate W on the substrate holding portion 17b, and the processing liquid is supplied from the nozzle. . The second processing liquid supply portion 17d is supplied with the second processing liquid from the liquid supply unit 18a via a pipe (not shown). The "device attachment unit 18" is installed at one end of the movement path of the second robot, that is, at the end on the opposite side to the first transport robot 12. This device has a unit 18 that houses a liquid supply unit 18a and a control unit (control unit) 18b. The liquid supply unit 18a supplies various processing liquids (for example, resist stripping liquid, cleaning liquid, cleaning liquid, etc.) to each substrate processing unit 17. The control unit 18b is provided with a microcomputer for centralized control of each part, and a memory unit (none of which is shown) for storing substrate processing information and various programs related to substrate processing. This control unit 18b is based on the substrate processing information and various programs, and provides for each opening and closing unit 11, the first transfer robot 12, the first moving mechanism 13, the second transfer robot 15, the second moving mechanism 16, and each substrate processing unit 17. Control the various ministries. (Buffer unit, second transfer robot, and second moving mechanism) "Next, referring to FIG. 2, the buffer unit 14, the second transfer robot 15 and the second moving mechanism 16 will be described. "As shown in FIG. 2, the buffer unit 14 is provided with a receiving portion 14a and a support 14b. The accommodating portion 14a is formed to be capable of accommodating a plurality of substrates W in a stacked state. The pillar 14b is formed to support the accommodating portion 14a at a height where the substrate W can be moved in and out by the first transfer robot 12 and the second transfer robot 15. The "accommodating portion 14a" is capable of mounting at least one unprocessed substrate W and one or more processed substrates W. In the accommodating portion 14a, a stage member (not shown) for stacking and accommodating the substrates W at a specific interval is arranged at a specific interval in the height direction. These table members are positioned so as to face each other in the horizontal plane, and one pair of table members existing at the same height position mutually supports a part of the outer periphery of the substrate W to hold one The substrate W is held. At this pair of table members, the substrate W is placed by the second transfer robot 15 from above. ""The second transfer robot 15 is equipped with the 1st arm unit 15a, the 2nd arm unit 15b, the liquid receiving cover 15c, and the raising/lowering rotation part 15d. This second transfer robot 15 is a dual-arm robot provided with two arm units 15a and 15b in two upper and lower stages. ""The first arm unit 15a is provided with a hand (board holding portion) 21 and an arm 22. The hand 21 is formed to be able to hold and release the substrate W by a holding mechanism (not shown). As a gripping mechanism, for example, a plurality of claws contacting the outer peripheral surface of the substrate W can be divided into groups for holding the substrate W from both sides of the substrate W, and the entire group can be moved in the approaching and separating direction. Move on the organization. The arm 22 is connected to the elevating and rotating portion 15d, and is formed to be capable of being raised and lowered in the vertical direction by the elevating and rotating portion 15d, and is further rotated around the axis in the vertical direction. This arm 22 is formed to be stretchable, and holds the hand 21 to move in a horizontal straight direction. The first arm unit 15a holds the substrate W by the hand 21, moves the substrate W into the buffer unit 14 or the processing chamber 17a by moving the arm 22 forward, and retreats the arm 22, Then, the substrate W is carried out from these. ""The second arm unit 15b basically has the same structure as the first arm unit 15a, and includes a hand 21 and an arm 22. Since these are the same structures as described above, their description is omitted. In addition, the hand 21 of the first arm unit 15a and the hand 21 of the second arm unit 15b are arranged in two upper and lower stages. The "liquid receiving cover 15c" is installed so as to surround the first arm unit 15a and the second arm unit 15b, and is formed so as not to hinder the expansion and contraction of each arm 22. Due to the presence of this liquid receiving cover 15c, even if the liquid falls from the substrate W and bounces when the substrate W in a wet state after the processing is completed, the liquid will touch Liquid bearing cover 15c. With this, it is possible to prevent the liquid dropped from the substrate W from being scattered to the ground of the device or the second moving mechanism 16. The up-and-down rotating portion 15d holds the arm portions 22 of the first arm unit 15a and the second arm unit 15b and moves along the axis in the vertical direction, and moves the first arm unit 15a and the second arm unit 15b and the liquid receiving cover 15c Make lifting together. Moreover, 15 d of up-and-down rotation parts rotate the axis|shaft in a vertical direction as a rotation axis (robot rotation axis), and each held|maintained arm part 22 rotates together with the liquid receiving cover 15c. This lifting and rotating part 15d contains a lifting mechanism and a rotating mechanism (neither shown). The lifting and rotating part 15d is electrically connected to the control unit 18b (refer to FIG. 1), and its driving system is controlled by the control unit 18b. ""The second moving mechanism 16 is provided with a linear track (first moving shaft) 16a, a moving base (first moving part) 16b, and a moving base (second moving part) 16c. The linear rail 16a is a rail installed on the ground and extending along the aforementioned second conveying direction. The movable base body 16b is a pillar 14b supporting the buffer unit 14 and is arranged on the linear rail 16a so as to be movable along the linear rail 16a. In addition, the movable base 16c is provided on the linear rail 16a so as to rotatably support the up-and-down rotating part 15d of the second transfer robot 15 and move along the linear rail 16a. The second moving mechanism 16 moves the buffer unit 14 along the linear track 16a together with the moving base 16b, and moves the second transport robot 15 along the linear track 16a together with the moving base 16c. The second moving mechanism 16 is electrically connected to the control unit 18b (refer to FIG. 1), and its driving system is controlled by the control unit 18b. Here, the movement of the buffer unit 14 and the second transfer robot 15 is restricted as necessary. For example, when the substrate W between the buffer unit 14 and the second transfer robot 15 is transferred, the movement system of the buffer unit 14 and the second transfer robot 15 is restricted. However, when the buffer unit 14 and the second transport robot 15 are moved together at the same speed, it is also possible to transfer the substrate W while moving. Also, for example, in FIG. 1, when the second transport robot 15 is sandwiched in the vertical direction (the direction connecting the device attachment unit 18 and the opening and closing unit 11) and extends from the left side of the transport path of the second robot When the processing chamber 17a rises up and transports the substrate W to the processing chamber 17a on the right side opposite to the processing chamber 17a (180 degree orbiting motion), the movement of the second transport robot 15 is restricted. During this orbiting operation, when the buffer unit 14 is located at a position that will hinder the orbiting operation of the second transport robot 15, the buffer unit 14 is avoided before the orbiting operation of the second transport robot 15 A position that does not interfere with the orbiting movement of the second transport robot 15. (Substrate processing process) Next, the flow of substrate processing (including substrate transport processing) performed by the aforementioned substrate processing apparatus 10 will be described. In addition, when two types of processing are performed on the substrate W, in FIG. 1, the four processing chambers 17a on the left side of the second robot conveying path extending from the top and bottom are set to be sandwiched between the upper and lower sides. , There will be a situation called the first processing chamber 17a) and the four processing chambers 17a located on the right side (hereinafter, there will be a situation called the second processing chamber 17a) perform different processing. In the case of different treatments, the first treatment chamber 17a is the treatment chamber for the first treatment, and the second treatment chamber 17a is the treatment chamber for the subsequent treatment (second treatment) of the first treatment . (Substrate processing including basic substrate exchange operations) First, referring to Fig. 1, the flow of substrate processing including basic substrate exchange operations will be described. The first processing chamber 17a and the second processing chamber 17a facing the first processing chamber 17a are set as one group, and the first processing and the second processing performed on the unprocessed substrate W are in each group And it was repeated. In addition, the first transfer robot 12, the buffer unit 14, and the second transfer robot 15 are generally the same as described above, and may be moved as necessary. However, the description of these movements is omitted here. The first transport robot 12 takes out the unprocessed substrate W from the dedicated box in the opening and closing unit 11, and rotates it, and places the unprocessed substrate W in the buffer unit 14. By this, the unprocessed substrate W is accommodated in the buffer unit 14. The second transfer robot 15 takes out the unprocessed substrate W from the buffer unit 14 and rotates, and places the unprocessed substrate W in the desired first processing chamber 17a. By this, the unprocessed substrate W is placed in the first processing chamber 17a. Thereafter, in the first processing chamber 17a, the first processing is performed on the substrate W. If the first processing at the aforementioned first processing chamber 17a is completed, the second transport robot 15 takes out the first processed substrate W from the first processing chamber 17a and performs a 180-degree turn to turn The first processed substrate W is placed in the second processing chamber 17a. With this, the first processed substrate W is placed in the second processing chamber 17a. Then, in the second processing chamber 17a, the second processing is performed on the substrate W. If the processing in the second processing chamber 17a is completed, the second transport robot 15 takes out the second processed substrate W from the second processing chamber 17a, and rotates it to perform the second completed processing The substrate W is placed in the buffer unit 14. As a result, the buffer unit 14 contains the second completed substrate W. The first transfer robot 12 takes the second processed substrate W from the buffer unit 14 and rotates it, and then places the processed substrate W in a desired dedicated box. With this, the processed substrate W is contained in the dedicated box. This substrate processing flow is executed in each group of the aforementioned first processing chamber 17a and the second processing chamber 17a opposite to it. However, in the first processing chamber 17a and the second processing chamber 17a, because The processing content is different, so the processing time is also different. In addition, in order to improve productivity, in each processing chamber 17a, as the processing ends, the substrate W that has been processed is completed by one of the first and second arm units 15a, 15b. Take it out and place the substrate W of the next processing object by the arm unit of the other side. In this case, the second transfer robot 15 is used to take out the processed substrate W and transfer the unprocessed substrate W at each location of the buffer unit 14, the first processing chamber 17a, and the second processing chamber 17a. The action is performed as a set of actions. The first transfer robot 12 is used in the buffer unit 14 to take out the processed substrate W and transfer the unprocessed substrate W as a set of actions . In addition, in order to improve productivity, unprocessed substrates W are placed in each first processing chamber 17a, and the first processing is performed in parallel in each first processing chamber 17a, and the first processing is completed from the first processing chamber 17a. 1 processing chamber 17a to take out the first processed substrate W, and place it in the corresponding second processing chamber 17a, and perform the second processing in parallel in each second processing chamber 17a. Therefore, the actual substrate processing flow is more complicated than the aforementioned substrate processing flow. Therefore, the following describes the substrate processing including more specific substrate exchange operations. (Substrate processing including specific substrate exchange operations) Next, referring to FIGS. 1 and 3-22, for substrate processing including specific substrate exchange operations (including the movement processing of the buffer unit 14 and the second transfer robot 15) One example) for illustration. The buffer unit 14 and the second transport robot 15 move individually in response to the control of the control unit 18b based on the substrate processing information related to the processing of the substrate W. As the substrate processing information, for example, information representing the processing chamber 17a that needs to be exchanged for substrates, information representing the end of processing and the start of processing at the processing chamber 17a, etc. can be cited. In addition, in FIGS. 4-22, the hatched substrate W represents the first processed substrate W, the blacked-out substrate W represents the second processed substrate W, and the white one represents The substrate W represents the unprocessed substrate W. In FIG. 1, the 4 first processing chambers 17a are marked as (A1), (A2), (A3), (A4) along the second robot conveying path from the first conveying robot 12 side. ), and the four second processing chambers 17a are marked as (B1), (B2), (B3), (B4) in order from the side of the first transport robot 12 along the second robot transport path. In FIG. 3, the same as FIG. 1, the four first processing chambers 17a, from the side of the first transfer robot 12 along the second robot transfer path (linear track 16a), are sequentially indicated as (A1) , (A2), (A3), (A4). In addition, in FIG. 3, the positions where the second transfer robot 15 transfers the substrate W between itself and the buffer unit 14 are indicated as (1), (2), (3), and (4). However, the position of (1) is also a position where the second transfer robot 15 carries the substrate W into or out of the processing chamber 17a of (A1) or (B1). The position (2) is also a position where the second transport robot 15 carries the substrate W into or out of the processing chamber 17a of (A2) or (B2). The position (3) is also a position where the second transfer robot 15 carries the substrate W into or out of the processing chamber 17a of (A3) or (B3). The position of (4) is also a position where the second transport robot 15 carries the substrate W into or out of the processing chamber 17a of (A4) or (B4). In addition, the position of (1) is also a position where the first transfer robot 12 transfers the substrate W between itself and the buffer unit 14. In the action related to substrate exchange, if it is determined based on the aforementioned substrate processing information that the next processing chamber 17a that needs substrate exchange is (A1), then the buffer unit 14 at the position (1) is from The first transfer robot 12 receives the unprocessed substrate W, and stays at the position (1). In addition, in this embodiment, the position (1), which is the position where the first transfer robot 12 transfers the substrate W between itself and the buffer unit 14, also becomes the processing chamber 17a where (A1) is being performed. It is the waiting position in the processing situation, but it can also be set to a different position. In this case, after receiving the unprocessed substrate W from the first transfer robot 12, the buffer unit 14 is moved to the waiting position when the processing in the processing chamber 17a of (A1) is performed . "As shown in FIG. 4, the second transfer robot 15 receives the unprocessed substrate W from the buffer unit 14, and places the substrate W in the processing chamber 17a of (A1) to perform the first processing. Next, the second transfer robot 15 sets the unprocessed substrate W in each processing chamber 17a of (A2) to (A4), and performs the first processing. Here, at least during the period when the second transfer robot 15 does not transfer the substrate W to the buffer unit 14, for example, during the first process in the processing chamber 17a with (A1), the buffer unit 14 is It moves toward the position (1) where the first transfer robot 12 and the buffer unit 14 transfer the substrate W, and receives the next unprocessed substrate W from the first transfer robot 12 to be processed. "As shown in FIG. 5, before the first processing at the processing chamber 17a of (A1) is completed, the second transport robot 15 receives the unprocessed substrate W from the buffer unit 14. If the first processing at the processing chamber 17a of (A1) is completed, the second transport robot 15 takes out the first processed substrate W and places the unprocessed substrate W in the processing chamber (A1) 17a. After that, as shown in FIG. 6, the second transfer robot 15 performs a 180-degree turn and places the substrate W in the processing chamber 17a of (B1) to perform the second processing. Then, as shown in FIG. 7, the second transfer robot 15 is located in the processing chamber 17a of (A2), and exchanges the first processed substrate W with the unprocessed substrate W, as shown in FIG. 8. As shown generally, a 180-degree rotation is performed, and the first processed substrate W is placed in the processing chamber 17a of (B2). Next, as shown in FIG. 9, the second transfer robot 15 is located at the processing chamber 17a of (A3), and exchanges the first processed substrate W with the unprocessed substrate W, as shown in FIG. 10 As shown generally, a 180-degree rotation is performed, and the first processed substrate W is placed in the processing chamber 17a of (B3). Next, as shown in FIG. 11, the second transfer robot 15 is located at the processing chamber 17a of (A4), and exchanges the first processed substrate W with the unprocessed substrate W, as shown in FIG. 12 As shown generally, a 180-degree rotation is performed, and the first processed substrate W is placed in the processing chamber 17a of (B4). After that, the first processing system of the substrate W placed in the processing chamber 17a of (A1) ends. "Next, as shown in FIG. 13, if the second processing at the processing chamber 17a of (B1) is completed, the second transport robot 15 receives the unprocessed substrate W from the buffer unit 14. After that, the second transfer robot 15 exchanges the unprocessed substrate W with the first processed substrate W at the processing chamber 17a of (A1). Next, as shown in FIG. 14, the second transfer robot 15 performs a 180-degree turn, and in the processing chamber 17a of (B1), the first processed substrate W and the second processed substrate W for exchange. Next, as shown in FIG. 15, the second transfer robot 15 transfers the second processed substrate W to the buffer unit 14 and receives the unprocessed substrate W from the buffer unit 14. The operation at this time, specifically, the second transfer robot 15 places the second completed substrate W held by the first arm unit 15a in the buffer unit 14, and then uses the first The arm unit 15 a takes out the unprocessed substrate W from the buffer unit 14. After "", after the second processing at (B2) to (B4) is completed, the substrate processing including substrate exchange is also performed by the same process. In addition, when the wet processing is performed from the first processing chamber 17a and then the second processing chamber 17a as in the present embodiment, for example, it may be maintained on the substrate after the cleaning process by pure water. It will be more efficient when the surface is wetted with water for the next process. At this time, if the surface of the substrate is not uniformly wetted, the surface of the substrate will be partially dried and the quality of the substrate will be reduced. Therefore, the substrate W is set to be horizontal, and is transported to the next processing chamber 17a while its surface is in a liquid-receiving state covered by the liquid film. In this transportation, it is important to carry out transportation so that water does not drip from the surface of the substrate. In this case, even if there are two arm units 15a, 15b, they will be used separately depending on the processing state of the substrate W, so that the arm that penetrates into the buffer unit 14 is limited to one. In the case of arms, therefore, there may be cases in which the substrate W has to be taken out and placed with only one arm. In this case, when the wet processing is performed from the first processing chamber 17a to the second processing chamber 17a, the first processed substrate W is maintained in a wet state and transferred to the second processing chamber 17a The hand 21 of the arm unit on one of the positions is used as a wet hand. However, when the unprocessed substrate W is taken out from the buffer unit 14 and placed in the first processing chamber 17a, or when the processed substrate W is taken out from the second processing chamber 17a and transferred to the buffer unit 14 At this time, the hand 21 of the other arm unit is used as a dry hand. That is, the intrusion into the buffer unit 14 where the unprocessed and processed substrate W is placed is performed by dry hands. By this, there will be no wet hands intruding into the buffer unit 14, and it is possible to suppress the adhesion of liquid on the unprocessed and processed substrate W. "In the case of this embodiment, the hand 21 of the first arm unit 15a functions as a dry hand, and the hand 21 of the second arm unit 15b functions as a wet hand. By making the wet hand position lower than the dry hand, even when the wet substrate W is being transported, it is possible to prevent the liquid falling from the substrate W from adhering to the dry hand. "In the above-mentioned substrate processing flow, the movement of the buffer unit 14 and the second transfer robot 15 and the substrate exchange operation are as follows. From Fig. 13 in which the substrate W is placed in all the processing chambers 17a of (A1) to (A4), (B1) to (B4), the movement and movement of the buffer unit 14 and the second transport robot 15 The substrate exchange operation is explained. FIG. 13 is a diagram showing a state where the second treatment is completed at the treatment chamber 17a of (B1). In addition, in the following description, positions (1) to (4) are referred to FIG. 3. If it is determined based on the aforementioned substrate processing information that the next processing chamber 17a that requires substrate exchange is (A1), then as shown in FIG. 13, in the state where the buffer unit 14 is located at the position (1) , The second transfer robot 15 receives the unprocessed substrate W from the buffer unit 14. Next, the second transfer robot 15 faces the processing chamber 17a of (A1), and uses the hand 21 (wet hands) of the second arm unit 15b to move the first robot from the processing chamber 17a of (A1). The processed substrate W is taken out, and the unprocessed substrate W is placed in the processing chamber 17a of (A1) by the hand 21 (dry hand) of the first arm unit 15a. If the removal of the first processed substrate W and the placement of the unprocessed substrate W are completed, the second transfer robot 15 will perform a 180-degree rotation as shown in FIG. 14 and face (B1) for processing Room 17a. In this state, the second transfer robot 15 takes out the second processed substrate W from the second processing chamber 17a by the first arm unit 15a, and performs the processing by the second arm unit 15b. The first processed substrate W held is placed in the processing chamber 17a of (B1). As shown in FIG. 14, the first transfer robot 12 places the unprocessed substrate W in the buffer unit 14. Next, if it is determined based on the aforementioned substrate processing information that the next processing chamber 17a that requires substrate exchange is (A2), then the buffer unit 14 at the position (1) is located by the first transfer robot 12 After the end of the substrate exchange, the next unprocessed substrate W to be processed is held and moved from the position (1) to the position (2) as shown in FIG. 15. At this time, when the movement of the buffer unit 14 interferes with the movement of the second transport robot 15, as shown in FIG. 14, the buffer unit 14 is waiting at the position (1). Also, as shown in Fig. 15, the second transfer robot 15 is attached to the hand of the first arm unit 15a if the substrate exchange operation at the processing chamber 17a of (B1) in the previous operation is completed. 21 (Dry hands), while holding the second completed substrate W, move to the position of (2) for the next substrate exchange operation. Along with the movement of the second transport robot 15, the buffer unit 14 waiting at the position (1) also moves to the position (2) (movement of (1)→(2)). After that, as shown in FIG. 15, the second transfer robot 15 places the second processed substrate W taken out by the first arm unit 15a in the buffer unit 14, and then uses the first arm unit 15a. The unit 15a takes out the unprocessed substrate W from the buffer unit 14. The buffer unit 14 where the unprocessed substrate W is taken out and the second completed processed substrate W is placed is moved from the position (2) to the position (1) as shown in FIG. 16 ((2)→(1) move). In addition, for example, in a case where the moving speeds of the buffer unit 14 and the second transport robot 15 are the same, the buffer unit 14 and the second transport robot 15 may be configured to move from the position (1) to (2). On the way to the position of ), the unprocessed substrate W is transferred. As shown in FIG. 16, the second transfer robot 15 faces the processing chamber 17a of (A2), and uses the hand 21 (wet hands) of the second arm unit 15b to move from the processing chamber 17a of (A2) Take out the first processed substrate W inside, and place the unprocessed substrate W held by the hand 21 (dry hand) of the first arm unit 15a in the processing chamber 17a of (A2) . If the removal of the first completed substrate W and the placement of the unprocessed substrate W are completed, the second transfer robot 15 will perform a 180-degree rotation as shown in FIG. 17, and face the processing of (B2) Room 17a. In this state, the second transfer robot 15 takes out the second processed substrate W from the second processing chamber 17a by the first arm unit 15a, and performs the processing by the second arm unit 15b. The first processed substrate W held is placed in the processing chamber 17a of (B2). Also, as shown in FIG. 16, the first transport robot 12 takes out the second completed substrate W from the buffer unit 14 at the position (1), and places the unprocessed substrate W In the buffer unit 14. "When the transfer of the substrate W by the first transfer robot 12 is completed, the buffer unit 14 moves to the next place for substrate exchange based on the aforementioned substrate processing information. When the processing chamber 17a that needs to be exchanged next is (A3), the buffer unit 14 is moved from the position (1) to the position (3) as shown in FIG. 18. When the movement of the buffer unit 14 interferes with the movement of the second conveying robot 15, as shown in FIG. 17, the buffer unit 14 has been moved to the position of (2), and is in (2) Waiting at the position ((1)→(2) move). Also, as shown in FIG. 18, the second transfer robot 15, if the substrate exchange operation at the processing chamber 17a of (B2) in the previous operation is completed, it is attached to the hand of the first arm unit 15a. 21 (Dry hands), while holding the second completed substrate W, move to the position of (3) for the next substrate exchange operation. Along with the movement of the second transport robot 15, the buffer unit 14 waiting at the position (2) also moves to the position (3) (movement of (2)→(3)). After that, as shown in FIG. 18, the second transport robot 15 places the second processed substrate W taken out by the first arm unit 15a in the buffer unit 14, and then uses the first arm The unit 15a takes out the unprocessed substrate W from the buffer unit 14. The buffer unit 14 where the unprocessed substrate W is taken out and the second completed processed substrate W is placed is moved from the position (3) to the position (1) as shown in FIG. 19 ((3)→(1) move). As shown in FIG. 19, the second transport robot 15 faces the processing chamber 17a of (A3), and uses the hand 21 (wet hands) of the second arm unit 15b to move from the processing chamber 17a of (A3). Take out the first processed substrate W inside, and place the unprocessed substrate W held by the hand 21 (dry hand) of the first arm unit 15a in the processing chamber 17a of (A3) .
若是此第1之完成處理之基板W之取出以及未處理之基板W之安置結束，則第2搬送機器人15，係如同圖20中所示一般，進行180度迴旋，並面向(B3)之處理室17a。在此狀態下，第2搬送機器人15，係藉由第1臂單元15a來從第2處理室17a而將第2之完成處理之基板W取出，並且將藉由第2臂單元15b而作了保持的第1之完成處理之基板W安置在(B3)之處理室17a內。
If the removal of the first processed substrate W and the placement of the unprocessed substrate W are completed, the second transfer robot 15 will perform a 180-degree rotation as shown in FIG. 20 and face the processing of (B3) Room 17a. In this state, the second transfer robot 15 takes out the second processed substrate W from the second processing chamber 17a by the first arm unit 15a, and performs the processing by the second arm unit 15b. The first processed substrate W held is placed in the processing chamber 17a of (B3).
又，如同圖19中所示一般，第1搬送機器人12，係從回到(1)之位置處的緩衝單元14而將第2之完成處理之基板W取出，並且將未處理之基板W放置在緩衝單元14內。
Also, as shown in FIG. 19, the first transport robot 12 takes out the second completed substrate W from the buffer unit 14 at the position (1), and places the unprocessed substrate W In the buffer unit 14.
若是此由第1搬送機器人12所致之基板W之交接結束，則緩衝單元14，係基於前述之基板處理資訊，來移動至下一個進行基板交換作業之場所處。當接下來需要進行基板交換之處理室17a係為(A4)的情況時，緩衝單元14，係如同圖21中所示一般，從(1)之位置而移動至(4)之位置處。當此緩衝單元14之移動會與第2搬送機器人15之動作相互干涉的情況時，如同圖20中所示一般，緩衝單元14係一直移動至(3)之位置處，並在該(3)之位置處而等待((1)→(3)之移動)。
If the transfer of the substrate W by the first transfer robot 12 is completed, the buffer unit 14 moves to the next place where the substrate exchange operation is performed based on the aforementioned substrate processing information. When the processing chamber 17a that needs to be exchanged next is (A4), the buffer unit 14 is moved from the position (1) to the position (4) as shown in FIG. 21. When the movement of the buffer unit 14 interferes with the movement of the second conveying robot 15, as shown in FIG. 20, the buffer unit 14 has been moved to the position of (3). Waiting for the position ((1)→(3) move).
又，如同圖21中所示一般，第2搬送機器人15，若是前一個作業中之在(B3)之處理室17a處的基板交換動作結束，則係在藉由第1臂單元15a之手部21(乾手)來將第2之完
成處理之基板W作了保持的狀態下，移動至接下來進行基板交換作業之(4)之位置處。與此第2搬送機器人15之移動一同地，在(3)之位置處而等待之緩衝單元14亦係移動至(4)之位置處((3)→(4)之移動)。
Also, as shown in FIG. 21, the second transfer robot 15 is attached to the hand of the first arm unit 15a if the substrate exchange operation at the processing chamber 17a of (B3) in the previous operation is completed. 21 (Dry Hands) Come to the end of Part 2
With the processed substrate W being held, move to the position of (4) for the subsequent substrate exchange operation. Along with the movement of the second transport robot 15, the buffer unit 14 waiting at the position (3) also moves to the position (4) (movement of (3)→(4)).
之後，如同圖21中所示一般，第2搬送機器人15，係將藉由第1臂單元15a所取出的第2之完成處理之基板W放置在緩衝單元14內，並接著藉由第1臂單元15a來將未處理之基板W從緩衝單元14取出。接著，第2搬送機器人15，係與前述之在(A3)和(B3)之處理室17a處之基板交換作業相同的，進行在(A4)和(B4)之處理室17a處的基板交換作業。使未處理之基板W被取出之緩衝單元14，係如同圖22中所示一般，從(4)之位置而移動至(1)之位置處((4)→(1)之移動)。
Then, as shown in FIG. 21, the second transfer robot 15 places the second processed substrate W taken out by the first arm unit 15a in the buffer unit 14, and then uses the first arm unit 15a The unit 15a takes out the unprocessed substrate W from the buffer unit 14. Next, the second transfer robot 15 is the same as the substrate exchange operation in the processing chamber 17a of (A3) and (B3), and performs the substrate exchange operation in the processing chamber 17a of (A4) and (B4). . The buffer unit 14 for taking out the unprocessed substrate W is moved from the position (4) to the position (1) (movement of (4)→(1)) as shown in FIG. 22.
又，如同圖22中所示一般，第1搬送機器人12，係從回到(1)之位置處的緩衝單元14而將第2之完成處理之基板W取出，並且將未處理之基板W放置在緩衝單元14內。
In addition, as shown in FIG. 22, the first transfer robot 12 takes out the second completed substrate W from the buffer unit 14 at the position (1), and places the unprocessed substrate W In the buffer unit 14.
藉由反覆進行前述一般之動作，基板處理係成為被進行。第1搬送機器人12，係反覆進行在緩衝單元14為位置於(1)之位置處的狀態下，將第2之完成處理之基板W從緩衝單元14取出，並將未處理之基板W放置在緩衝單元14內之動作。
By repeatedly performing the aforementioned general operations, the substrate processing becomes performed. The first transfer robot 12 repeatedly performs the state where the buffer unit 14 is at the position (1), takes the second completed substrate W from the buffer unit 14 and places the unprocessed substrate W on Actions in the buffer unit 14.
在此種基板處理工程中，因應於基板處理之進行，緩衝單元14和第2搬送機器人15係成為能夠相互獨立地來移動至各處理室17a之基板交換作業位置(緩衝單元14與第2搬送機器人15將基板W作交換之位置)處。在緩衝單元14為固定在圖3(1)之位置處的情況時，若是下一個需要進行基板交換之處理室17a係為(A3)，則位置於(2)之位置處的第2搬送機器人15，係成為回到(1)之位置處並與固定之緩衝單元14進行基板交換作業，之後再移動至(3)之位置處。但是，如同前述一般，緩衝單元14之位置係並非為固定，緩衝單元14係能夠進行移動。因此，當下一個需要進行基板交換之處理室17a係為(A3)的情況時，係只要使第2搬送機器人15從(2)之位置而至(3)之位置地來與緩衝單元14一同作移動即可，相較於緩衝單元14係為固定的情況，第2搬送機器人15之移動時間係變短。藉由此，來將直到開始進行基板交換作業為止所需的等待時間縮短，而能夠有效率地實施基板交換作業、亦即是有效率地實施基板搬送。 又，在使緩衝單元14和第2搬送機器人15一同移動的情況時，係亦能夠在該些之移動中而進行基板W之交接。藉由此，相較於並不在移動中實行基板W之交接的情況，係能夠將基板交換作業之開始提早。故而，係能夠將直到開始進行基板交換作業為止所需的等待時間更進一步縮短，而能夠有效率地實施基板搬送。 又，在如同本實施形態一般之使複數之處理室17a並排為列狀的情況時，被設置在「被設置於各處理室17a所並排的方向上之第2機器人移動路徑之其中一端、亦即是被設置在與第1搬送機器人12相反側之端」處的處理室17a(圖1中之(A4))，係身為與「被定位在於自身與第1搬送機器人12之間而將基板W作交換的位置處之緩衝單元14」之間之距離為最遠的處理室。 於此，當緩衝單元14為被固定在與第1搬送機器人12之間進行基板W之交換之位置處的情況時，相較於距離緩衝單元14為近之處理室17a，係以距離緩衝單元14而為遠的處理室17a的情況時，第2搬送機器人15之移動時間會變長。圖23，係為對於第1處理室17a以及第2處理室17a的處理時間和第2搬送機器人15之動作時間之間之相關作了展示之圖。在圖23中，A係為在緩衝單元14處之交換中所耗費的時間，B係為在基於基板處理資訊所對於下一個的將基板W作交換之處理室17a之移動中所耗費之時間，C係為在處理室17a處之基板交換中所耗費之時間，D係為在從第1處理室17a起而至第2處理室17a之迴旋搬送中所耗費之時間，E係為在處理室17a處之基板交換中所耗費之時間，F係為在從將基板W作了交換的處理室17a起而朝向緩衝單元14的移動中所耗費之時間。如同在圖23之「比較例」中所示一般，B和F之移動時間，係若是越為遠離緩衝單元14之處理室17a則會變得越長。因此，如同在「比較例」中所示一般，係會有就算是處理結束第2搬送機器人15亦仍正在其他之處理室17a處而進行基板交換的情形，而會有發生對於在結束了處理之處理室17a處的完成處理之基板W之取出和未處理之基板W之安置作等待之等待時間的情況。特別是當在處理室17a處而進行處理時間為少之處理的情況和第1處理與第2處理之處理時間之差為大的情況時，等待時間係會增大，生產性係降低。 如同上述之實施例一般，緩衝單元14，係成為能夠從在第2搬送方向上而並排之各基板處理單元17之其中一端起而一直移動至另外一端處。因此，如同在圖23之「第1實施形態」中所示一般，在進行於處理室(A1)～(A4)處之各基板交換作業時，係能夠以與第2搬送機器人15之朝向移動時間為最短之處理室(A1)之移動時間相同的移動時間，來將基板W搬送至其他之各處理室17a處。又，緩衝單元14，由於係在第2搬送機器人15正在進行B～E之作業的期間中，一直移動至第1搬送機器人12之交接位置處，並進行未處理之基板W與完成處理之基板W之交換，並且一直移動至下一個的處理室17a之位置處，因此，係亦能夠削減第2搬送機器人15之等待時間。其結果，在特定之處理室17a處之處理時間中，亦能夠預先完成在其他之處理室17a處之基板交換作業，而能夠將在處理室17a處之處理等待時間作削減，並能夠實現有效率之搬送。 又，緩衝單元14以及第2搬送機器人15，係被設置在第2移動機構16上。亦即是，緩衝單元14以及第2搬送機器人15，係被設置在同軸之移動機構上(同軸上)。因此，相較於使緩衝單元14以及第2搬送機器人15以相異之軸來移動的情況，係能夠將第2機器人搬送路徑縮窄。若是將第2機器人搬送路徑縮窄，則係能夠將包夾著第2機器人搬送路徑地而被設置之第1處理室17a和第2處理室17a之間之距離縮短。如同上述一般，第1之完成處理之濕潤的狀態之基板W，係朝向第2處理室17a而被作迴旋搬送。在進行此迴旋搬送時，係會被施加有離心力，而會有液體從基板W彈出並附著在裝置內的可能性。因此，係有必要以使離心力變少的方式來使第2搬送機器人15之迴旋動作變慢。然而，若是能夠將第1處理室17a和第2處理室17a之間之距離縮短，則係能夠將第2搬送機器人15之迴旋半徑縮小，而能夠將離心力之影響減少地來進行迴旋搬送。因此，係能夠更快速地進行迴旋動作，而能夠將搬送時間縮短。 又，在第2搬送機器人15從第1處理室17a來朝向第2處理室17a而搬送濕潤之狀態之基板W時，若是使緩衝單元14被定位在對於第2搬送機器人15而作了接近的位置處，則在第2搬送機器人15迴旋時，係會有起因於離心力而導致液體彈出並附著於緩衝單元14內之虞。若是附著在緩衝單元14內，則會附著在被收容於其之內部的未處理之基板W或完成處理之基板W處，並會有對於製品品質造成不良影響的可能性。因此，第2搬送機器人15，係使正保持有基板W之手部21朝向從緩衝單元14而遠離之方向進行迴旋動作。例如，在圖1中，緩衝單元14由於係對於第2搬送機器人15而言為位置在左方，因此，第2搬送機器人15係以朝向順時針方向進行迴旋的方式，來進行迴旋動作。藉由此，係能夠防止液體之朝向緩衝單元14內的彈出地來進行迴旋搬送，而能夠成為不會對於基板W之製品品質造成不良影響。 如同以上所作了說明一般，若依據第1實施形態，則緩衝單元14以及第2搬送機器人15，係基於關連於基板W之處理的基板處理資訊而個別地移動。藉由此，緩衝單元14和第2搬送機器人15，係能夠相互獨立地來因應於基板處理資訊而移動至處理室17a附近之基板交換作業位置(所期望之位置)處。故而，係能夠將直到開始進行基板交換作業為止所需的等待時間縮短，而成為能夠有效率地實施基板搬送，因此係能夠使基板處理裝置10之生產性提升。 〈第2實施形態〉 參考圖24，針對第2實施形態作說明。另外，在第2實施形態中，係針對與第1實施形態間的相異點(第2移動機構)作說明，並省略其他之說明。 如同圖24中所示一般，第2實施形態之第2移動機構16，係在第2搬送機器人15所移動之移動路徑的上方處，定位緩衝單元14所移動之移動路徑，而以不會使緩衝單元14以及第2搬送機器人15相互干涉的方式，來使緩衝單元14以及第2搬送機器人15個別地移動。此第2移動機構16，係除了第1實施形態之直線軌道(第1移動軸)16a、移動基體16b以及移動基體16c以外，更進而具備有直線軌道(第2移動軸)16d。 直線軌道16d，係被設置在頂板面上，並為沿著第2搬送方向而延伸的軌道。在此直線軌道16d處，緩衝單元14係可沿著直線軌道16d之延伸方向移動地而被作設置。緩衝單元14之移動基體16b，係被安裝在直線軌道16d上，在移動基體16b處，係經由作為懸吊構件而起作用之支柱14b而被安裝有收容部14a。 直線軌道16a，係如同在第1實施形態中所說明一般，被設置在地面上。在此直線軌道16a處，第2搬送機器人15係可在直線軌道16a之延伸方向上移動地而被作設置。第2搬送機器人15之移動基體16c，係被安裝在直線軌道16a上。 如此這般，緩衝單元14，係被構成為能夠在對於各處理室17a而進行基板W之交換時的第2搬送機器人15之上方自由移動的布局。此緩衝單元14，係以使收容部14a之高度成為能夠使第1搬送機器人12進行基板交換作業之高度並且就算是收容部14a沿著直線軌道16a移動也不會與第2搬送機器人15相碰撞之高度的方式，而被形成。 又，第2搬送機器人15，係藉由使用升降旋轉部15d之升降機構(上下移動機構)來使第1臂單元15a以及第2臂單元15b之高度(手高度)與緩衝單元14之收容部14a之高度相配合，而具備有成為能夠進行對於緩衝單元14之完成處理之基板W之安置以及從緩衝單元14之未處理之基板W之取出的動作範圍。 在關連於基板交換之動作中，首先，若是根據前述之基板處理資訊，而判斷下一個需要進行基板交換之處理室17a係為(A1)，則位於(1)之位置處的緩衝單元14，係從第1搬送機器人12而接收未處理之基板W，並停留在(1)之位置處。另外，在本實施例中，身為第1搬送機器人12與緩衝單元14進行基板W之交接的位置之(1)之位置，係亦成為在進行有(A1)之處理室17a處之處理的情況時所進行等待之位置，但是，係亦可設為相異之位置。於此情況，緩衝單元14，係移動至當正在進行(A1)之處理室17a處之處理的情況時所進行等待之位置處。 第2搬送機器人15，係從緩衝單元14而接收未處理之基板W，並將基板W安置在(A1)之處理室17a處，而進行第1處理。 於此，至少在第2搬送機器人15並未對於緩衝單元14而進行基板W之交接的期間中，例如在進行有(A1)之處理室17a處之第1處理的期間中，緩衝單元14係朝向第1搬送機器人12與緩衝單元14進行基板W之交接的位置(1)前進，並從第1搬送機器人12而接收下一個進行處理之未處理之基板W。 若是在(A1)之處理室17a處的第1處理結束，則第2搬送機器人15，係進行180度迴旋，並將基板W安置在(B1)之處理室17a處，而進行第2處理。 若是在(B1)之處理室17a處的第2處理結束，則第2搬送機器人15，係將第2之完成處理之基板W從(B1)之處理室17a取出，並交接至緩衝單元14處，並且從緩衝單元14而接收未處理之基板W。此時之動作，具體而言，第2搬送機器人15，係將藉由第1臂單元15a來作了保持的第2之完成處理之基板W放置在緩衝單元14內，並接著藉由第1臂單元15a來將未處理之基板W從緩衝單元14取出。 接著，若是根據前述之基板處理資訊，而判斷下一個需要進行基板交換之處理室17a係為(A2)，則位於(1)之位置處的緩衝單元14，係在由第1搬送機器人12所致之基板交換結束之後，將下一個進行處理之未處理之基板W作保持，並從(1)之位置而移動至(2)之位置處。此時，為了使緩衝單元14之移動不會與第2搬送機器人15之動作相互干涉，緩衝單元14，係超越正在(1)之位置處而進行基板交換作業之第2搬送機器人15之上方地而移動，並在(2)之位置處而等待((1)→(2)之移動)。 第2搬送機器人15，若是前一個作業中之在(B1)之處理室17a處的基板交換作業結束，則係在藉由第1臂單元15a(乾手)來將第2之完成處理之基板W作了保持的狀態下，移動至接下來進行基板交換作業之(2)之位置處。在此位置處，第2搬送機器人15，係使第1臂單元15a一直上升至緩衝單元14之高度處，並將藉由第1臂單元15a來作了保持的完成處理之基板W放置在緩衝單元14內，之後，藉由第1臂單元15a來將未處理之基板W從緩衝單元14取出。使未處理之基板W被取出之緩衝單元14，係從(2)之位置而移動至(1)之位置處((2)→(1)之移動)。 第2搬送機器人15，係使將未處理之基板W作了保持的第1臂單元15a一直下降至(A2)和(B2)之處理室17a之間之基板搬送高度處，並面向(A2)之處理室17a，並且藉由第2臂單元15b(濕手)，來從(A2)之處理室17a內而將第1之完成處理之基板W取出，並且將藉由第1臂單元15a而作了保持的未處理之基板W安置在(A2)之處理室17a內。若是此第1之完成處理之基板W之取出以及未處理之基板W之安置結束，則第2搬送機器人15，係進行180度迴旋，並面向(B2)之處理室17a。在此狀態下，第2搬送機器人15，係藉由第1臂單元15a來從第2處理室17a而將第2之完成處理之基板W取出，並且將藉由第2臂單元15b而作了保持的第1之完成處理之基板W安置在(B2)之處理室17a內。 第1搬送機器人12，係從回到(1)之位置處的緩衝單元14而將完成處理之基板W取出，並且將未處理之基板W放置在緩衝單元14內。若是此由第1搬送機器人12所致之基板W之交接結束，則緩衝單元14，係基於前述之基板處理資訊，來移動至下一個進行基板交換作業之場所處。當接下來需要進行基板交換之處理室17a係為(A3)的情況時，緩衝單元14，係從(1)之位置而移動至(3)之位置處。為了使此緩衝單元14之移動不會與第2搬送機器人15之動作相互干涉，緩衝單元14，係超越正在(2)之位置處而進行基板交換作業之第2搬送機器人15之上方地而移動，並在(3)之位置處而等待((1)→(3)之移動)。 第2搬送機器人15，若是前一個作業中之在(B2)之處理室17a處的基板交換作業結束，則係在藉由第1臂單元15a(乾手)來將第2之完成處理之基板W作了保持的狀態下，移動至接下來進行基板交換作業之(3)之位置處。在此位置處，第2搬送機器人15，係使第1臂單元15a一直上升至緩衝單元14之高度處，並將藉由第1臂單元15a來作了保持的第2之完成處理之基板W放置在緩衝單元14內，之後，藉由第1臂單元15a來將未處理之基板W從緩衝單元14取出。接著，第2搬送機器人15，係與前述之在(A2)和(B2)之處理室17a處之基板交換作業相同的，進行在(A3)和(B3)之處理室17a處的基板交換作業。使未處理之基板W被取出之緩衝單元14，係從(3)之位置而移動至(1)之位置處((3)→(1)之移動)。 第1搬送機器人12，係從回到(1)之位置處的緩衝單元14而將完成處理之基板W取出，並且將未處理之基板W放置在緩衝單元14內。若是此由第1搬送機器人12所致之基板W之交接結束，則緩衝單元14，係基於前述之基板處理資訊，來移動至下一個進行基板交換作業之場所處。當接下來需要進行基板交換之處理室17a係為(A4)的情況時，緩衝單元14，係從(1)之位置而移動至(4)之位置處。為了使此緩衝單元14之移動不會與第2搬送機器人15之動作相互干涉，緩衝單元14，係超越正在(3)之位置處而進行基板交換作業之第2搬送機器人15之上方地而移動，並在(4)之位置處而等待((1)→(4)之移動)。 第2搬送機器人15，若是前一個作業中之在(B3)之處理室17a處的基板交換動作結束，則係在藉由第1臂單元15a(乾手)來將第2之完成處理之基板W作了保持的狀態下，移動至接下來進行基板交換作業之(4)之位置處。在此位置處，第2搬送機器人15，係使第1臂單元15a一直上升至緩衝單元14之高度處，並將藉由第1臂單元15a來作了保持的第2之完成處理之基板W放置在緩衝單元14內，之後，藉由第1臂單元15a來將未處理之基板W從緩衝單元14取出。之後，第2搬送機器人15，係與前述之在(A3)和(B3)之處理室17a處之基板交換作業相同的，進行在(A4)和(B4)之處理室17a處的基板交換作業。使未處理之基板W被取出之緩衝單元14，係從(4)之位置而移動至(1)之位置處((4)→(1)之移動)。 在此種基板處理工程中，由於緩衝單元14和第2處理室15係能夠相互獨立並且並不相互干涉地而移動至各處理室17a之每一者的基板交換作業位置處，因此，係與第1實施形態相同的，能夠將直到進行基板交換作業為止所需的等待時間縮短，而能夠有效率地實施基板交換作業、亦即是有效率地實施基板搬送。另外，由於緩衝單元14和第2搬送機器人15係能夠並不相互干涉地來移動，因此，係能夠使緩衝單元14較第2搬送機器人15更早地而預先移動至處理室17a附近之基板交換作業位置處。 如同以上所作了說明一般，若依據第2實施形態，則係能夠得到與第1實施形態相同之效果。又，藉由個別地設置緩衝單元14之移動路徑和第2搬送機器人15之移動路徑，由於緩衝單元14之移動和第2搬送機器人15之移動係成為不會相互干涉，因此係能夠使緩衝單元14和第2搬送機器人15之移動自由度提升。故而，就算是在進行第1處理以及第2處理之基板處理工程以外的各種之基板處理工程中，亦能夠將直到開始進行基板交換作業為止所需的等待時間縮短，而成為能夠有效率地實施基板搬送，因此係能夠使基板處理裝置10之生產性提升。 〈其他實施形態〉 在前述之說明中，作為緩衝單元14之緩衝器本體以及第2搬送機器人15之機器人本體之移動機構，雖係對於使用利用有直線軌道16a之線性導軌的直線移動轉換機構之構成作了例示，但是，係並不被限定於此，例如，係亦可並非使用線性導軌，而是藉由偏芯凸輪機構來使緩衝器本體以及機器人本體移動。又，雖係將地面之直線軌道16a作為緩衝器本體以及機器人本體之滑動軸，但是，係亦可在地面上設置2根的直線軌道，而個別設置緩衝器本體之滑動軸和機器人本體之滑動軸，並且構成為使緩衝器本體以及機器人本體個別地移動。但是，於此情況，由於係在地面上設置2根的直線軌道，因此，相應於此，在直線軌道所並排之方向上，裝置係會大型化。故而，為了對於在直線軌道所並排的方向上之裝置的大型化作抑制，較理想，係以使2根的直線軌道成為位置於上下之位置關係的方式，來設置2根的直線軌道。 又，在前述之說明中，雖係對於使用2種類的處理室17a之構成作了例示，但是，係並不被限定於此，例如，係亦可構成為使用3種類之處理室17a。於此情況，係成為先以處理1→處理2→處理3之順序來進行處理之後再將完成處理之基板W送回至緩衝單元14處的作業。例如，雖係將進行處理1之處理室17a的數量設為2個，並將進行處理2之處理室17a的數量設為4個，並且將進行處理3之處理室17a的數量設為2個，但是，此係因為想定為進行處理2之處理室17a的處理相較於處理1或處理3而需要2倍的時間的情況，而將台數設為2倍之故。 又，在前述之說明中，緩衝單元14，係構成為在每次結束與第2搬送機器人15之間之基板之交接時，均會移動至進行與第1搬送機器人12之間之基板交換的位置(1)處，但是，係並不被限定於此。例如，若是緩衝單元14係身為能夠保持複數之基板W之多段的構成，則係能夠保持複數之未處理之基板W或者是複數之完成處理之基板W，而亦可構成為在未處理之基板W耗盡時或者是在緩衝單元14處能夠保持完成處理之基板W之置台構件耗盡時，再移動至進行與第1搬送機器人12之間之基板交換的位置(1)處。於此情況，係能夠減少緩衝單元14之在第2搬送方向上的往返次數。 又，在前述之第2實施形態之說明中，第2搬送機器人15雖係構成為使用升降旋轉部15d之升降機構(上下移動機構)來與緩衝單元14之收容部14a之高度相配合，但是，係並不被限定於此。例如，係亦能夠使緩衝單元14具備有升降機構，並構成為使緩衝單元14於上下方向而一直移動至能夠使第1搬送機器人12和第2搬送機器人15對於收容部14a而進行基板W之交接的高度處。於此情況，當基板W在第1搬送機器人12與緩衝單元14之間、第2搬送機器人15與緩衝單元14之間而被作交接時，緩衝單元14係下降，除此之外，緩衝單元14係上升並被定位在不會與第2搬送機器人15相互干涉之高度處。 以上，雖係針對本發明之數個實施形態作了說明，但是，此些之實施形態係僅為作為例子所提示者，而並非為對於發明之範圍作限定。此些之新穎的實施形態，係可藉由其他之各種形態來實施，在不脫離發明之要旨的範圍內，係可進行各種之省略、置換、變更。此些之實施形態及其變形，係被包含於發明之範圍及要旨中，並且被包含於在申請專利範圍中所記載之發明及其均等範圍內。In this substrate processing process, in response to the substrate processing, the buffer unit 14 and the second transfer robot 15 are able to move independently of each other to the substrate exchange position of each processing chamber 17a (the buffer unit 14 and the second transfer The position where the robot 15 exchanges the substrate W). When the buffer unit 14 is fixed at the position of Fig. 3(1), if the next processing chamber 17a that needs to be exchanged for the substrate is (A3), the second transport robot located at the position of (2) 15. It is to return to the position of (1) and perform substrate exchange operation with the fixed buffer unit 14, and then move to the position of (3). However, as mentioned above, the position of the buffer unit 14 is not fixed, and the buffer unit 14 can be moved. Therefore, when the next processing chamber 17a that requires substrate exchange is (A3), it is only necessary to make the second transfer robot 15 move from the position (2) to the position (3) to work with the buffer unit 14 It only needs to be moved, and the movement time of the second transport robot 15 is shorter than when the buffer unit 14 is fixed. By this, the waiting time required until the substrate exchange operation is started can be shortened, and the substrate exchange operation, that is, the substrate transport can be efficiently performed. "In addition, when the buffer unit 14 and the second transfer robot 15 are moved together, it is also possible to transfer the substrate W during these movements. By this, compared with the case where the substrate W is not transferred during the movement, the substrate exchange operation can be started earlier. Therefore, the waiting time required until the start of the substrate exchange work can be further shortened, and the substrate can be transported efficiently. In addition, when a plurality of processing chambers 17a are arranged in a row as in the present embodiment, they are arranged at one end of the movement path of the second robot in the direction in which each processing chamber 17a is arranged. That is, the processing chamber 17a ((A4) in FIG. 1) is set at the end opposite to the first transfer robot 12, and it is positioned between itself and the first transfer robot 12. The processing chamber where the distance between the buffer units 14" at the position where the substrate W is exchanged is the furthest. Here, when the buffer unit 14 is fixed at the position where the substrate W is exchanged with the first transfer robot 12, the buffer unit 14 is closer to the processing chamber 17a than the buffer unit 14 In the case of the processing chamber 17a which is far away from 14, the movement time of the second transport robot 15 becomes longer. FIG. 23 is a diagram showing the correlation between the processing time of the first processing chamber 17a and the second processing chamber 17a and the operation time of the second transport robot 15. In FIG. 23, A is the time spent in the exchange at the buffer unit 14, and B is the time spent in the movement of the next processing chamber 17a that exchanges the substrate W based on the substrate processing information , C is the time spent in the substrate exchange at the processing chamber 17a, D is the time spent in the orbiting transfer from the first processing chamber 17a to the second processing chamber 17a, and E is the time spent in the processing For the time spent in the substrate exchange at the chamber 17a, F is the time spent in the movement toward the buffer unit 14 from the processing chamber 17a where the substrate W was exchanged. As shown in the "comparative example" of FIG. 23, the moving time of B and F becomes longer if the distance from the processing chamber 17a of the buffer unit 14 is farther. Therefore, as shown in the "comparative example", even if the processing is completed, the second transfer robot 15 is still performing substrate exchange at the other processing chamber 17a. The removal of the processed substrate W and the placement of the unprocessed substrate W in the processing chamber 17a are the waiting time. In particular, when the processing time is small in the processing chamber 17a and the processing time difference between the first processing and the second processing is large, the waiting time increases and the productivity decreases. "As in the above-mentioned embodiment, the buffer unit 14 can be moved from one end of the substrate processing units 17 side by side in the second conveying direction to the other end. Therefore, as shown in the "first embodiment" of FIG. 23, when performing each substrate exchange operation at the processing chambers (A1) to (A4), it can move in the direction of the second transport robot 15 The time is the same as the movement time of the shortest processing chamber (A1), and the substrate W is transferred to each of the other processing chambers 17a. In addition, the buffer unit 14 is moved to the transfer position of the first transfer robot 12 while the second transfer robot 15 is performing operations B to E, and performs unprocessed substrates W and completed substrates. W is exchanged, and it has been moved to the position of the next processing chamber 17a. Therefore, the waiting time of the second transport robot 15 can also be reduced. As a result, during the processing time at the specific processing chamber 17a, the substrate exchange operation at other processing chambers 17a can also be completed in advance, and the processing waiting time at the processing chamber 17a can be reduced, and it is possible to achieve Efficient transportation. "In addition, the buffer unit 14 and the second transfer robot 15 are installed on the second moving mechanism 16. That is, the buffer unit 14 and the second transfer robot 15 are installed on a coaxial moving mechanism (on the same axis). Therefore, compared to the case where the buffer unit 14 and the second transport robot 15 are moved on different axes, the transport path of the second robot can be narrowed. If the second robot conveying path is narrowed, the distance between the first processing chamber 17a and the second processing chamber 17a that are installed so as to sandwich the second robot conveying path can be shortened. As described above, the substrate W in a wet state after the first process has been completed is transported in a circular motion toward the second processing chamber 17a. During this orbiting conveyance, centrifugal force is applied to the system, and there is a possibility that the liquid will eject from the substrate W and adhere to the device. Therefore, it is necessary to slow down the orbiting motion of the second transport robot 15 so as to reduce the centrifugal force. However, if the distance between the first processing chamber 17a and the second processing chamber 17a can be shortened, the turning radius of the second transport robot 15 can be reduced and the effect of centrifugal force can be reduced to perform the orbiting transport. Therefore, the system can perform the orbiting operation more quickly, and the conveying time can be shortened. In addition, when the second transfer robot 15 transfers the substrate W in a wet state from the first processing chamber 17a toward the second processing chamber 17a, if the buffer unit 14 is positioned close to the second transfer robot 15 At the position, when the second transport robot 15 is rotating, the liquid may be ejected due to centrifugal force and adhere to the buffer unit 14. If it is attached to the buffer unit 14, it will attach to the unprocessed substrate W or the processed substrate W accommodated in the buffer unit 14, and there is a possibility of adversely affecting the quality of the product. Therefore, the second transfer robot 15 rotates the hand 21 holding the substrate W in a direction away from the buffer unit 14. For example, in FIG. 1, since the buffer unit 14 is positioned on the left with respect to the second transfer robot 15, the second transfer robot 15 performs a turning motion so as to turn in the clockwise direction. With this, it is possible to prevent the liquid from popping out into the buffer unit 14 to perform the orbiting conveyance, and it is possible to prevent adverse effects on the product quality of the substrate W. As described above, according to the first embodiment, the buffer unit 14 and the second transport robot 15 are moved individually based on the substrate processing information related to the processing of the substrate W. With this, the buffer unit 14 and the second transport robot 15 can be moved to the substrate exchange operation position (desired position) near the processing chamber 17a in response to the substrate processing information independently of each other. Therefore, the waiting time required until the substrate exchange operation is started can be shortened, and the substrate transfer can be performed efficiently. Therefore, the productivity of the substrate processing apparatus 10 can be improved. <Second Embodiment> "With reference to Fig. 24, the second embodiment will be described. In addition, in the second embodiment, the difference between the first embodiment and the first embodiment (the second moving mechanism) will be described, and the other description will be omitted. As shown in FIG. 24, the second moving mechanism 16 of the second embodiment is located above the moving path of the second transport robot 15, and the moving path of the buffer unit 14 is positioned so as not to The buffer unit 14 and the second conveying robot 15 interfere with each other to move the buffer unit 14 and the second conveying robot 15 individually. This second moving mechanism 16 is provided with a linear track (second moving shaft) 16d in addition to the linear track (first moving shaft) 16a, the moving base 16b, and the moving base 16c of the first embodiment. The linear rail 16d is a rail that is provided on the top plate surface and extends along the second conveying direction. At this linear track 16d, the buffer unit 14 is arranged to be movable along the extending direction of the linear track 16d. The moving base 16b of the buffer unit 14 is mounted on a linear rail 16d, and the moving base 16b is mounted with a receiving portion 14a via a support 14b that functions as a suspension member. The linear track 16a is generally installed on the ground as described in the first embodiment. At this linear track 16a, the second transport robot 15 is installed so as to be movable in the extending direction of the linear track 16a. The moving base 16c of the second transfer robot 15 is mounted on the linear rail 16a. "In this way, the buffer unit 14 is configured in a layout that can move freely above the second transfer robot 15 when the substrate W is exchanged for each processing chamber 17a. The buffer unit 14 is such that the height of the accommodating portion 14a is a height that enables the first transfer robot 12 to perform substrate exchange operations, and even if the accommodating portion 14a moves along the linear rail 16a, it will not collide with the second transfer robot 15 The height of the way is formed. In addition, the second transfer robot 15 uses the lifting mechanism (up and down movement mechanism) of the lifting and rotating part 15d to adjust the height (hand height) of the first arm unit 15a and the second arm unit 15b and the receiving part of the buffer unit 14 In accordance with the height of 14a, it is provided with a motion range that enables the placement of the substrate W that has been processed for the buffer unit 14 and the removal of the unprocessed substrate W from the buffer unit 14. In the action related to substrate exchange, firstly, if it is determined based on the aforementioned substrate processing information that the next processing chamber 17a requiring substrate exchange is (A1), then the buffer unit 14 located at the position (1), The unprocessed substrate W is received from the first transfer robot 12 and stays at the position of (1). In addition, in this embodiment, the position (1), which is the position where the first transfer robot 12 and the buffer unit 14 transfer the substrate W, is also the position where the processing at the processing chamber 17a where (A1) is performed The waiting position in case of situation, however, it can also be set to a different position. In this case, the buffer unit 14 is moved to a position where it waits when the processing in the processing chamber 17a of (A1) is being performed. "The second transfer robot 15 receives the unprocessed substrate W from the buffer unit 14, and places the substrate W in the processing chamber 17a of (A1), and performs the first processing. Here, at least during the period when the second transfer robot 15 does not transfer the substrate W to the buffer unit 14, for example, during the first process in the processing chamber 17a with (A1), the buffer unit 14 is It moves toward the position (1) where the first transfer robot 12 and the buffer unit 14 transfer the substrate W, and receives the next unprocessed substrate W from the first transfer robot 12 to be processed. "When the first processing in the processing chamber 17a of (A1) is completed, the second transfer robot 15 performs a 180-degree turn and places the substrate W in the processing chamber 17a of (B1) to perform the second processing. If the second processing at the processing chamber 17a of (B1) is completed, the second transport robot 15 takes out the second processed substrate W from the processing chamber 17a of (B1) and transfers it to the buffer unit 14 , And receive the unprocessed substrate W from the buffer unit 14. The operation at this time, specifically, the second transfer robot 15 places the second completed substrate W held by the first arm unit 15a in the buffer unit 14, and then uses the first The arm unit 15 a takes out the unprocessed substrate W from the buffer unit 14. Next, if it is determined based on the aforementioned substrate processing information that the next processing chamber 17a that requires substrate exchange is (A2), then the buffer unit 14 at the position (1) is located by the first transfer robot 12 After the end of the substrate exchange, the next unprocessed substrate W to be processed is held and moved from the position (1) to the position (2). At this time, in order to prevent the movement of the buffer unit 14 from interfering with the movement of the second transport robot 15, the buffer unit 14 is overtaken above the second transport robot 15 that is currently performing the substrate exchange operation at the position (1) And move, and wait at the position of (2) ((1)→(2) move). If the second transfer robot 15 has completed the substrate exchange operation at the processing chamber 17a of (B1) in the previous operation, it will use the first arm unit 15a (dry hands) to transfer the second completed substrate With W held, move to the position of (2) for the next substrate exchange operation. At this position, the second transfer robot 15 raises the first arm unit 15a to the height of the buffer unit 14, and places the processed substrate W held by the first arm unit 15a in the buffer In the unit 14, after that, the unprocessed substrate W is taken out from the buffer unit 14 by the first arm unit 15a. The buffer unit 14 for taking out the unprocessed substrate W is moved from the position of (2) to the position of (1) ((2)→(1) movement). The second transfer robot 15 lowers the first arm unit 15a holding the unprocessed substrate W to the substrate transfer height between the processing chambers 17a of (A2) and (B2), and faces (A2) The processing chamber 17a, and by the second arm unit 15b (wet hands), from the processing chamber 17a (A2) to take out the first completed substrate W, and will be removed by the first arm unit 15a The unprocessed substrate W that has been held is placed in the processing chamber 17a of (A2). If the removal of the first processed substrate W and the placement of the unprocessed substrate W are completed, the second transport robot 15 rotates 180 degrees and faces the processing chamber 17a of (B2). In this state, the second transfer robot 15 takes out the second processed substrate W from the second processing chamber 17a by the first arm unit 15a, and performs the processing by the second arm unit 15b. The first processed substrate W held is placed in the processing chamber 17a of (B2). "The first transfer robot 12 takes out the processed substrate W from the buffer unit 14 returning to the position of (1), and places the unprocessed substrate W in the buffer unit 14. If the transfer of the substrate W by the first transfer robot 12 is completed, the buffer unit 14 moves to the next place where the substrate exchange operation is performed based on the aforementioned substrate processing information. When the processing chamber 17a that needs to be exchanged next is (A3), the buffer unit 14 is moved from the position (1) to the position (3). In order to prevent the movement of the buffer unit 14 from interfering with the movement of the second transport robot 15, the buffer unit 14 is moved beyond the position of (2) above the second transport robot 15 which is performing substrate exchange operations. , And wait at the position of (3) ((1)→(3) move). If the second transfer robot 15 has completed the substrate exchange operation at the processing chamber 17a of (B2) in the previous operation, it will use the first arm unit 15a (dry hands) to transfer the second completed substrate With W held, move to the position (3) for the next substrate exchange operation. At this position, the second transfer robot 15 raises the first arm unit 15a up to the height of the buffer unit 14, and transfers the second processed substrate W held by the first arm unit 15a After placing it in the buffer unit 14, the unprocessed substrate W is taken out from the buffer unit 14 by the first arm unit 15a. Next, the second transfer robot 15 performs the same substrate exchange operation at the processing chamber 17a of (A2) and (B2), and performs the substrate exchange operation at the processing chamber 17a of (A3) and (B3). . The buffer unit 14 for taking out the unprocessed substrate W is moved from the position (3) to the position (1) (movement of (3)→(1)). "The first transfer robot 12 takes out the processed substrate W from the buffer unit 14 returning to the position of (1), and places the unprocessed substrate W in the buffer unit 14. If the transfer of the substrate W by the first transfer robot 12 is completed, the buffer unit 14 moves to the next place where the substrate exchange operation is performed based on the aforementioned substrate processing information. When the processing chamber 17a that needs to be exchanged next is (A4), the buffer unit 14 is moved from the position (1) to the position (4). In order to prevent the movement of the buffer unit 14 from interfering with the movement of the second transport robot 15, the buffer unit 14 is moved beyond the position of (3) above the second transport robot 15 performing the substrate exchange operation. , And wait for ((1)→(4) movement) at the position of (4). If the second transfer robot 15 has completed the substrate exchange operation in the processing chamber 17a of (B3) in the previous operation, it will use the first arm unit 15a (dry hands) to transfer the second completed substrate With W held, move to the position (4) for the next substrate exchange operation. At this position, the second transfer robot 15 raises the first arm unit 15a up to the height of the buffer unit 14, and transfers the second processed substrate W held by the first arm unit 15a After placing it in the buffer unit 14, the unprocessed substrate W is taken out from the buffer unit 14 by the first arm unit 15a. After that, the second transfer robot 15 is the same as the aforementioned substrate exchange operation at the processing chamber 17a of (A3) and (B3), and performs the substrate exchange operation at the processing chamber 17a of (A4) and (B4). . The buffer unit 14 for taking out the unprocessed substrate W is moved from the position (4) to the position (1) (movement of (4)→(1)). In this kind of substrate processing process, since the buffer unit 14 and the second processing chamber 15 can be moved to the substrate exchange operation position of each of the processing chambers 17a independently and without mutual interference, they are related to In the same manner as in the first embodiment, the waiting time required until the substrate exchange operation is performed can be shortened, and the substrate exchange operation, that is, the substrate transfer can be performed efficiently. In addition, since the buffer unit 14 and the second transfer robot 15 can move without mutual interference, the buffer unit 14 can be moved to the vicinity of the processing chamber 17a earlier than the second transfer robot 15 for substrate exchange. At the job location. As described above, according to the second embodiment, the same effect as the first embodiment can be obtained. In addition, by separately setting the movement path of the buffer unit 14 and the movement path of the second transport robot 15, the movement of the buffer unit 14 and the movement of the second transport robot 15 do not interfere with each other, so the buffer unit can be made The freedom of movement of 14 and the second transfer robot 15 is improved. Therefore, even in various substrate processing processes other than the substrate processing process in which the first process and the second process are performed, the waiting time required until the start of the substrate exchange work can be shortened, and it can be implemented efficiently Since the substrate is transported, the productivity of the substrate processing apparatus 10 can be improved. <Other Embodiments> In the foregoing description, the movement mechanism of the buffer body as the buffer unit 14 and the robot body of the second transfer robot 15 is a linear movement conversion mechanism that uses a linear guide rail with a linear rail 16a. The configuration is exemplified, but the system is not limited to this. For example, instead of using a linear guide, the system may use an eccentric cam mechanism to move the shock absorber body and the robot body. In addition, although the linear track 16a on the ground is used as the sliding axis of the buffer body and the robot body, it is also possible to install two linear tracks on the ground, and the sliding axis of the buffer body and the sliding axis of the robot body The shaft is configured to move the shock absorber body and the robot body individually. However, in this case, since two linear rails are installed on the ground, the device system will be enlarged in the direction in which the linear rails are aligned accordingly. Therefore, in order to suppress the enlargement of the device in the direction in which the linear rails are arranged, it is preferable to install the two linear rails so that the two linear rails are in a positional relationship between the upper and lower positions. "In addition, in the foregoing description, although the configuration using two types of processing chambers 17a was exemplified, the system is not limited to this. For example, it may be configured to use three types of processing chambers 17a. In this case, the processing is performed in the order of processing 1 → processing 2 → processing 3 and then returning the processed substrate W to the buffer unit 14. For example, although the number of processing chambers 17a for processing 1 is set to 2, the number of processing chambers 17a for processing 2 is set to 4, and the number of processing chambers 17a for processing 3 is set to two However, this is because it is assumed that the processing in the processing chamber 17a for processing 2 will take twice as long as the processing 1 or 3, so the number of units is doubled. In addition, in the foregoing description, the buffer unit 14 is configured to move to the one where the substrate exchange with the first transfer robot 12 is completed every time the transfer of the substrate with the second transfer robot 15 is completed. Position (1), but the system is not limited to this. For example, if the buffer unit 14 has a multi-stage structure that can hold a plurality of substrates W, it can hold a plurality of unprocessed substrates W or a plurality of processed substrates W, or it may be configured to When the substrate W is exhausted or when the table member capable of holding the processed substrate W at the buffer unit 14 is exhausted, it moves to the position (1) where the substrate is exchanged with the first transfer robot 12. In this case, the number of round trips of the buffer unit 14 in the second conveying direction can be reduced. In addition, in the foregoing description of the second embodiment, the second transport robot 15 is configured to use the elevating mechanism (up-and-down movement mechanism) of the elevating and rotating portion 15d to match the height of the receiving portion 14a of the buffer unit 14, but , Department is not limited to this. For example, it is also possible to provide the buffer unit 14 with an elevating mechanism, and to be configured to move the buffer unit 14 in the vertical direction until the first transfer robot 12 and the second transfer robot 15 can perform the substrate W on the receiving portion 14a. At the height of the handover. In this case, when the substrate W is transferred between the first transfer robot 12 and the buffer unit 14, and between the second transfer robot 15 and the buffer unit 14, the buffer unit 14 is lowered. In addition, the buffer unit The 14 series is raised and positioned at a height that does not interfere with the second transport robot 15. Although several embodiments of the present invention have been described above, these embodiments are merely presented as examples, and are not intended to limit the scope of the invention. These novel embodiments can be implemented in various other forms, and various omissions, substitutions, and changes can be made without departing from the gist of the invention. These embodiments and their modifications are included in the scope and gist of the invention, and are included in the invention described in the patent application and its equivalent scope.
