JP7246147B2 - 基板処理装置及び基板処理方法 - Google Patents

基板処理装置及び基板処理方法 Download PDF

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JP7246147B2
JP7246147B2 JP2018166334A JP2018166334A JP7246147B2 JP 7246147 B2 JP7246147 B2 JP 7246147B2 JP 2018166334 A JP2018166334 A JP 2018166334A JP 2018166334 A JP2018166334 A JP 2018166334A JP 7246147 B2 JP7246147 B2 JP 7246147B2
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substrate
processing
processing chamber
transfer
transfer table
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Japanese (ja)
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JP2019068058A5 (enrdf_load_stackoverflow
JP2019068058A (ja
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正明 古矢
秀樹 森
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Shibaura Mechatronics Corp
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Shibaura Mechatronics Corp
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Priority to TW107132889A priority Critical patent/TWI708728B/zh
Priority to KR1020180113545A priority patent/KR102164067B1/ko
Priority to CN201811145723.5A priority patent/CN109585339B/zh
Publication of JP2019068058A publication Critical patent/JP2019068058A/ja
Publication of JP2019068058A5 publication Critical patent/JP2019068058A5/ja
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  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
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JP2018166334A 2017-09-29 2018-09-05 基板処理装置及び基板処理方法 Active JP7246147B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
TW107132889A TWI708728B (zh) 2017-09-29 2018-09-19 基板處理裝置及基板處理方法
KR1020180113545A KR102164067B1 (ko) 2017-09-29 2018-09-21 기판 처리 장치 및 기판 처리 방법
CN201811145723.5A CN109585339B (zh) 2017-09-29 2018-09-29 基板处理装置及基板处理方法

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JP2017189576 2017-09-29
JP2017189576 2017-09-29

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JP2019068058A JP2019068058A (ja) 2019-04-25
JP2019068058A5 JP2019068058A5 (enrdf_load_stackoverflow) 2021-10-07
JP7246147B2 true JP7246147B2 (ja) 2023-03-27

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TW (1) TWI708728B (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20220165599A1 (en) * 2019-03-25 2022-05-26 SCREEN Holdings Co., Ltd. Substrate processing apparatus

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP4102550A4 (en) * 2020-02-05 2023-02-01 Kabushiki Kaisha Yaskawa Denki TRANSPORT SYSTEM, TRANSPORT METHOD AND TRANSPORT DEVICE
CN113471119A (zh) * 2020-03-31 2021-10-01 芝浦机械电子装置株式会社 基板处理装置以及基板处理方法
KR102672414B1 (ko) * 2020-05-21 2024-06-04 가부시키가이샤 야스카와덴키 반송 장치, 반송 방법 및 반송 시스템
KR102584514B1 (ko) 2020-07-09 2023-10-06 세메스 주식회사 기판 반송 장치, 기판 처리 장치 및 방법
TWI796713B (zh) * 2020-07-23 2023-03-21 旺矽科技股份有限公司 可緩衝受測物溫度之電子元件檢測設備
KR102348259B1 (ko) * 2021-05-31 2022-01-10 (주) 티로보틱스 기판 이송 로봇을 진공 챔버 내에서 주행하기 위한 주행 로봇
KR102307687B1 (ko) * 2021-06-25 2021-10-05 (주) 티로보틱스 기판 이송 로봇을 진공 챔버 내에서 주행하기 위한 주행 로봇
JP7645141B2 (ja) * 2021-07-09 2025-03-13 Ｔｏｗａ株式会社 加工装置、及び加工品の製造方法
CN118136562A (zh) * 2022-12-01 2024-06-04 盛美半导体设备(上海)股份有限公司 基板处理装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101624982B1 (ko) 2010-09-03 2016-05-27 주식회사 원익아이피에스 기판처리시스템 및 기판처리방법
JP2017069548A (ja) 2015-09-30 2017-04-06 芝浦メカトロニクス株式会社 基板処理装置及び基板処理方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20100054415A (ko) * 2008-11-14 2010-05-25 세메스 주식회사 기판 처리 장치
JP5883232B2 (ja) * 2011-03-26 2016-03-09 東京エレクトロン株式会社 基板処理装置
CN103377971A (zh) * 2012-04-30 2013-10-30 细美事有限公司 用于清洗基板的装置和方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101624982B1 (ko) 2010-09-03 2016-05-27 주식회사 원익아이피에스 기판처리시스템 및 기판처리방법
JP2017069548A (ja) 2015-09-30 2017-04-06 芝浦メカトロニクス株式会社 基板処理装置及び基板処理方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20220165599A1 (en) * 2019-03-25 2022-05-26 SCREEN Holdings Co., Ltd. Substrate processing apparatus

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TW201919973A (zh) 2019-06-01
TWI708728B (zh) 2020-11-01
JP2019068058A (ja) 2019-04-25

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