TWI707989B - 電鍍銅浴 - Google Patents

電鍍銅浴 Download PDF

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Publication number
TWI707989B
TWI707989B TW108129592A TW108129592A TWI707989B TW I707989 B TWI707989 B TW I707989B TW 108129592 A TW108129592 A TW 108129592A TW 108129592 A TW108129592 A TW 108129592A TW I707989 B TWI707989 B TW I707989B
Authority
TW
Taiwan
Prior art keywords
molecular weight
reaction product
group
compound
electroplating bath
Prior art date
Application number
TW108129592A
Other languages
English (en)
Chinese (zh)
Other versions
TW202016360A (zh
Inventor
池田健
岸本一喜
高谷康子
安田弘樹
下村彩
原崎裕介
佐波正浩
清原靖
藤原伊織
田中正夫
阿部峰大
Original Assignee
日商傑希優股份有限公司
日商互應化學工業股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商傑希優股份有限公司, 日商互應化學工業股份有限公司 filed Critical 日商傑希優股份有限公司
Publication of TW202016360A publication Critical patent/TW202016360A/zh
Application granted granted Critical
Publication of TWI707989B publication Critical patent/TWI707989B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Manufacturing Of Printed Wiring (AREA)
TW108129592A 2018-08-28 2019-08-20 電鍍銅浴 TWI707989B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
PCT/JP2018/031730 WO2020044432A1 (ja) 2018-08-28 2018-08-28 電気銅めっき浴
WOPCT/JP2018/031730 2018-08-28

Publications (2)

Publication Number Publication Date
TW202016360A TW202016360A (zh) 2020-05-01
TWI707989B true TWI707989B (zh) 2020-10-21

Family

ID=69643478

Family Applications (1)

Application Number Title Priority Date Filing Date
TW108129592A TWI707989B (zh) 2018-08-28 2019-08-20 電鍍銅浴

Country Status (5)

Country Link
JP (1) JP6782477B2 (ko)
KR (1) KR102319041B1 (ko)
CN (1) CN111108235B (ko)
TW (1) TWI707989B (ko)
WO (1) WO2020044432A1 (ko)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023074223A1 (ja) 2021-10-26 2023-05-04 株式会社Jcu 被めっき物中の銅結晶粒を粗大化する方法および銅めっき膜中の銅結晶粒を粗大化した銅めっき膜

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200613586A (en) * 2004-07-22 2006-05-01 Rohm & Haas Elect Mat Leveler compounds
TW201623360A (zh) * 2014-12-30 2016-07-01 羅門哈斯電子材料有限公司 用於銅電鍍覆之胺基磺酸系聚合物
TW201718947A (zh) * 2015-09-10 2017-06-01 德國艾托特克公司 銅電鍍浴組合物及沉積銅之方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6800188B2 (en) * 2001-05-09 2004-10-05 Ebara-Udylite Co., Ltd. Copper plating bath and plating method for substrate using the copper plating bath
CN101617014A (zh) * 2007-02-26 2009-12-30 昭和高分子株式会社 阻燃性粘结剂组合物、挠性镀铜叠层板和覆盖膜
JP5595301B2 (ja) * 2011-02-22 2014-09-24 Ｊｘ日鉱日石金属株式会社 銅電解液
JP6356119B2 (ja) * 2013-04-02 2018-07-11 株式会社Adeka 電解銅めっき浴用添加剤、該添加剤を含む電解銅めっき浴および該電解銅めっき浴を用いた電解銅めっき方法
US9783905B2 (en) * 2014-12-30 2017-10-10 Rohm and Haas Electronic Mateirals LLC Reaction products of amino acids and epoxies
US9611560B2 (en) * 2014-12-30 2017-04-04 Rohm And Haas Electronic Materials Llc Sulfonamide based polymers for copper electroplating
US9932684B2 (en) * 2015-08-06 2018-04-03 Rohm And Haas Electronic Materials Llc Method of electroplating photoresist defined features from copper electroplating baths containing reaction products of alpha amino acids and bisepoxides

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200613586A (en) * 2004-07-22 2006-05-01 Rohm & Haas Elect Mat Leveler compounds
TW201623360A (zh) * 2014-12-30 2016-07-01 羅門哈斯電子材料有限公司 用於銅電鍍覆之胺基磺酸系聚合物
TW201718947A (zh) * 2015-09-10 2017-06-01 德國艾托特克公司 銅電鍍浴組合物及沉積銅之方法

Also Published As

Publication number Publication date
WO2020044432A1 (ja) 2020-03-05
CN111108235A (zh) 2020-05-05
TW202016360A (zh) 2020-05-01
CN111108235B (zh) 2022-05-03
JPWO2020044432A1 (ja) 2020-09-10
KR102319041B1 (ko) 2021-10-29
KR20200026800A (ko) 2020-03-11
JP6782477B2 (ja) 2020-11-11

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