TWI705661B - 壓電振動元件的製造方法 - Google Patents

壓電振動元件的製造方法 Download PDF

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Publication number
TWI705661B
TWI705661B TW106135827A TW106135827A TWI705661B TW I705661 B TWI705661 B TW I705661B TW 106135827 A TW106135827 A TW 106135827A TW 106135827 A TW106135827 A TW 106135827A TW I705661 B TWI705661 B TW I705661B
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TW
Taiwan
Prior art keywords
photoresistance
layer
pattern
alignment mark
substrate
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TW106135827A
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English (en)
Chinese (zh)
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TW201830850A (zh
Inventor
大島尚士
Original Assignee
日商村田製作所股份有限公司
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Application filed by 日商村田製作所股份有限公司 filed Critical 日商村田製作所股份有限公司
Publication of TW201830850A publication Critical patent/TW201830850A/zh
Application granted granted Critical
Publication of TWI705661B publication Critical patent/TWI705661B/zh

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    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
    • H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
    • H03H3/02—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
TW106135827A 2016-11-18 2017-10-19 壓電振動元件的製造方法 TWI705661B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016225257A JP6617928B2 (ja) 2016-11-18 2016-11-18 圧電振動素子の製造方法
JPJP2016-225257 2016-11-18

Publications (2)

Publication Number Publication Date
TW201830850A TW201830850A (zh) 2018-08-16
TWI705661B true TWI705661B (zh) 2020-09-21

Family

ID=62159821

Family Applications (1)

Application Number Title Priority Date Filing Date
TW106135827A TWI705661B (zh) 2016-11-18 2017-10-19 壓電振動元件的製造方法

Country Status (3)

Country Link
JP (1) JP6617928B2 (ja)
CN (1) CN108075741B (ja)
TW (1) TWI705661B (ja)

Citations (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56140322A (en) * 1980-04-04 1981-11-02 Casio Comput Co Ltd Substrate having electrodes on both sides for display cell
US20030049572A1 (en) * 2001-09-07 2003-03-13 Yasuyuki Watanabe Method for forming patterned insulating elements and methods for making electron source and image display device
JP2003347885A (ja) * 2002-05-29 2003-12-05 Seiko Epson Corp 圧電振動片、圧電振動片の製造方法および圧電デバイス
CN1492285A (zh) * 2002-10-24 2004-04-28 友达光电股份有限公司 具有对准量测标记的光罩及其侦测方法
US20050146721A1 (en) * 2003-12-24 2005-07-07 Asml Netherlands B.V. Method of measurement, method for providing alignment marks, and device manufacturing method
JP2005223719A (ja) * 2004-02-06 2005-08-18 Seiko Epson Corp エッチング方法およびこれを利用した圧電デバイスと圧電振動片の製造方法、ならびに電喰抑制パターンの構造
JP2006208429A (ja) * 2005-01-25 2006-08-10 Toppan Printing Co Ltd 両面マスクの作成方法
US7121650B2 (en) * 2001-12-18 2006-10-17 Samsung Electronics Co., Ltd. Piezoelectric ink-jet printhead
US20070059868A1 (en) * 2005-09-14 2007-03-15 Industrial Technology Research Institute Thin film transistor manufacturing method and substrate structure
US20080102567A1 (en) * 2006-10-26 2008-05-01 Industrial Technology Research Institute Method for making thin film transistor
US20080217726A1 (en) * 2007-03-08 2008-09-11 Chartered Semiconductor Manufacturing Ltd. Integrated circuit system employing dipole multiple exposure
TWI339809B (ja) * 2008-03-28 2011-04-01 Tpk Touch Solutions Inc
US20140139813A1 (en) * 2012-11-21 2014-05-22 Boe Technology Group Co., Ltd. Double-surface manufacturing method and exposure apparatus
TWI459436B (zh) * 2008-10-27 2014-11-01 Tpk Touch Solutions Inc The Method of Making Double - sided Graphic Structure of Touch Circuit

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3982502B2 (ja) * 2004-01-15 2007-09-26 セイコーエプソン株式会社 描画装置
US20080003525A1 (en) * 2004-10-26 2008-01-03 Tokyo Institute Of Technology Method for Projecting High Resolution Patterns
JP2007240676A (ja) * 2006-03-07 2007-09-20 Nippon Dempa Kogyo Co Ltd アライメント方法
JP4414987B2 (ja) * 2006-07-27 2010-02-17 日本電波工業株式会社 圧電振動子の製造方法、圧電振動子及び電子部品
JP2012080243A (ja) * 2010-09-30 2012-04-19 Seiko Instruments Inc 圧電振動片の製造方法、並びにウエハ、圧電振動子、発振器、電子機器、および電波時計
WO2013018604A1 (ja) * 2011-07-29 2013-02-07 株式会社村田製作所 圧電デバイス、および、圧電デバイスの製造方法
JP6167520B2 (ja) * 2013-01-08 2017-07-26 セイコーエプソン株式会社 素子の製造方法

Patent Citations (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56140322A (en) * 1980-04-04 1981-11-02 Casio Comput Co Ltd Substrate having electrodes on both sides for display cell
US20030049572A1 (en) * 2001-09-07 2003-03-13 Yasuyuki Watanabe Method for forming patterned insulating elements and methods for making electron source and image display device
US7121650B2 (en) * 2001-12-18 2006-10-17 Samsung Electronics Co., Ltd. Piezoelectric ink-jet printhead
JP2003347885A (ja) * 2002-05-29 2003-12-05 Seiko Epson Corp 圧電振動片、圧電振動片の製造方法および圧電デバイス
CN1492285A (zh) * 2002-10-24 2004-04-28 友达光电股份有限公司 具有对准量测标记的光罩及其侦测方法
US20050146721A1 (en) * 2003-12-24 2005-07-07 Asml Netherlands B.V. Method of measurement, method for providing alignment marks, and device manufacturing method
JP2005223719A (ja) * 2004-02-06 2005-08-18 Seiko Epson Corp エッチング方法およびこれを利用した圧電デバイスと圧電振動片の製造方法、ならびに電喰抑制パターンの構造
JP2006208429A (ja) * 2005-01-25 2006-08-10 Toppan Printing Co Ltd 両面マスクの作成方法
US20070059868A1 (en) * 2005-09-14 2007-03-15 Industrial Technology Research Institute Thin film transistor manufacturing method and substrate structure
US20080102567A1 (en) * 2006-10-26 2008-05-01 Industrial Technology Research Institute Method for making thin film transistor
US20080217726A1 (en) * 2007-03-08 2008-09-11 Chartered Semiconductor Manufacturing Ltd. Integrated circuit system employing dipole multiple exposure
TWI339809B (ja) * 2008-03-28 2011-04-01 Tpk Touch Solutions Inc
TWI459436B (zh) * 2008-10-27 2014-11-01 Tpk Touch Solutions Inc The Method of Making Double - sided Graphic Structure of Touch Circuit
US20140139813A1 (en) * 2012-11-21 2014-05-22 Boe Technology Group Co., Ltd. Double-surface manufacturing method and exposure apparatus

Also Published As

Publication number Publication date
CN108075741A (zh) 2018-05-25
JP6617928B2 (ja) 2019-12-11
CN108075741B (zh) 2021-11-30
TW201830850A (zh) 2018-08-16
JP2018082396A (ja) 2018-05-24

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