TWI704643B - 用於陶瓷台座中的雙效通路 - Google Patents
用於陶瓷台座中的雙效通路 Download PDFInfo
- Publication number
- TWI704643B TWI704643B TW107141513A TW107141513A TWI704643B TW I704643 B TWI704643 B TW I704643B TW 107141513 A TW107141513 A TW 107141513A TW 107141513 A TW107141513 A TW 107141513A TW I704643 B TWI704643 B TW I704643B
- Authority
- TW
- Taiwan
- Prior art keywords
- layer
- ceramic
- substrate
- pedestal assembly
- functional layer
- Prior art date
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
- H01L21/6833—Details of electrostatic chucks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68757—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a coating or a hardness or a material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67103—Apparatus for thermal treatment mainly by conduction
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67109—Apparatus for thermal treatment mainly by convection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/6875—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of individual support members, e.g. support posts or protrusions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0212—Printed circuits or mounted components having integral heating means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
- H05K1/0224—Patterned shielding planes, ground planes or power planes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
- H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09827—Tapered, e.g. tapered hole, via or groove
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Electromagnetism (AREA)
- Resistance Heating (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
本發明提供一陶瓷台座總成及形成陶瓷台座總成之一方法。該陶瓷台座總成包括:一陶瓷基材,其界定一上表面及一下表面;至少一通路,其延伸穿過該陶瓷基材;一上導電箔層,其延伸在該陶瓷基材之上表面上;及一下導電箔層,其延伸在該陶瓷基材之下表面上。各通路包括界定一空腔之一上通路及界定一對應錐形插入物之一下通路。在一態樣中,該上通路、該下通路及該等導電箔層界定一材料,該材料具有大於2,000℃之一熔點及小於或等於該陶瓷基材之一CTE。
Description
本申請案主張2017年11月21日申請之名稱為「用於陶瓷台座中的雙效通路(DUAL-PURPOSE VIAS FOR USE IN CERAMIC PEDESTALS)」之美國暫時申請案第62/589,024號的優先權及利益。
本揭示大致關於半導體加工裝置,且特別地關於用於支持及加熱如一晶圓之一基材的基材支持台座。
在這部份中之說明只提供關於本揭示之背景資訊且可不構成習知技術。
例如用於半導體加工之一台座的一晶圓支持總成設置在一半導體加工腔室中且通常包括一晶圓支持部份及固定在該晶圓支持部份之一中心區域上的一軸。該晶圓支持部份可包括一電阻層,該電阻層具有用於產生熱之一電阻加熱元件及用於連接該等電阻加熱元件與一外電源之多數電終端。該等電終端設置成與該晶圓支持部份之中心區域相鄰且在該軸中延伸。通常,當整合一以上電阻層時,使用一布線層及多數通路或互連來互連及端接在該晶圓支持部份之中心區域中的加熱器電路。
該晶圓支持部份之頂與底層例如藉由擴散接合或輔助熱壓燒結黏合在一起。這高壓、低應變製程在高到足以產生燒結之一溫度下形成一粉末或緻密粉末以便形成一高密度組件/緻密體。通常,將該緻密粉末放入一模中且施加高溫度及壓力以便緻密化及燒結。該模由可耐受該等高溫度及壓力之一材料,例如石墨形成。
在熱壓燒結時伴隨積體式通路或互連之問題包括由於陶瓷收縮產生之應力、無法控制且無法預測之位移、高塑性變形及該等導電通路之破壞及破裂。另一問題係在熱壓燒結製程中該等通路及陶瓷材料與由石墨模釋放之碳的交互作用。在半導體加工中使用陶瓷台座時之這些問題及其他問題可由本揭示解決。
在一形態中,本揭示提供一種陶瓷台座總成,其包括具有一第一功能層及一第二功能層之一基材,其中該等第一與第二功能層設置在該基材之相對側。該陶瓷台座總成更包括延伸穿過該基材之至少一通路,各通路包括界定一空腔之一上通路及界定一對應插入物之一下通路。該第一功能層、該第二功能層及該等通路界定一材料,該材料具有大於2,000℃之一熔點及低於該陶瓷基材之一CTE。
在一變化例中,該基材由一氮化鋁材料形成,且該至少一通路、該第一功能層及該第二功能層由一鉬材料形成。
在其他變化例中,該下通路被該上通路之該空腔收納使得當該陶瓷基材被加熱時在該等上與下通路之間形成一干涉配合,該上通路之一頂部及該下通路之一底部呈錐形,及/或該上通路之空腔及該下空腔之對應插入物具有選自於由多邊形、平面、圓形、卵形、三角形及橢圓形構成之群組的一橫截面形狀。該第一功能層可為具有至少一電阻加熱元件之一電阻加熱器層且該第二功能層係一布線層,其中各電阻加熱元件界定至少一電阻加熱區域。
在另一變化例中,該陶瓷台座總成更包括至少一犧牲層,該至少一犧牲層在該第一功能層及該第二功能層中之至少一功能層上。該(等)犧牲層可選自於由鎢、碳化鎢及氮化硼構成之群組。
在又一變化例中,該陶瓷台座總成更包括一射頻(RF)格柵層。
在另一變化例中,本揭示提供一種陶瓷台座總成,其包括界定一上表面及一下表面之一陶瓷基材及延伸穿過該陶瓷基材之至少一通路。該至少一通路包含界定一錐形空腔之一上通路及界定一對應錐形插入物之一下通路。該陶瓷台座總成更包含在該陶瓷基材之該上表面上延伸的一上導電箔層及在該陶瓷基材之該下表面上延伸的一下導電箔層。該上通路、該下通路及該等導電箔層界定一材料,該材料具有大於2,000℃之一熔點及小於或等於該陶瓷基材之一CTE。該通路之一頂部及該下通路之一底
部呈錐形。該下通路被該上通路之該空腔收納使得當該陶瓷基材被加熱時在該等上與下通路間形成一干涉配合。
在其他變化例中,該陶瓷台座總成更包含至少一犧牲層,該至少一犧牲層在該等上與下導電箔層中之至少一導電箔層上。該犧牲層可選自於由鎢、碳化鎢及氮化硼構成之群組。該上通路之一頂部及該下通路之一底部可呈錐形。
本揭示更提供一種形成陶瓷台座總成之方法。該方法包含以下步驟:使在一生胚狀態之一陶瓷基材形成至少一孔;使界定一錐形空腔之一上通路穿過該陶瓷基材之一上表面;使界定一對應錐形插入物之一下通路穿過該陶瓷基材之一下表面;將一上導電箔層配置在該陶瓷基材之該上表面上;配置在該陶瓷基材之該下表面上延伸的一下導電箔層;及朝一單軸方向熱壓該總成。在這態樣中,該上通路、該下通路及該等導電箔層界定一材料,該材料具有大於2,000℃之一熔點及小於或等於該陶瓷基材之一CTE。該總成可放入一石墨模中。
在一變化例中,該陶瓷基材由一氮化鋁材料形成,且該上通路、該下通路及該等上與下導電箔層由一鉬材料形成。
在另一變化例中,該方法更包括以下步驟:在大約1700C至大約2,000℃之範圍內的一溫度燒結該壓縮總成。
在另一變化例中,該方法更包括以下步驟:
將至少一犧牲層配置在該上導電箔層及該下導電箔層中之至少一導電箔層上;及接著移除該犧牲層。該犧牲層選自於由鎢、碳化鎢及氮化硼構成之群組。
在其他變化例中,該方法包括以下步驟:在該上導電箔層中形成至少一加熱器層;在該下導電箔層中形成一布線層;及形成一RF格柵層。
其他應用之領域可由在此提供之說明了解。應了解的是該說明及特定例子只是為了要說明而不是意圖限制本揭示之範圍。
20:支持台座
22:陶瓷台座總成
23:中心區域
24:管狀軸
25,46,162:頂表面
26:電纜
27,56,148:底表面
30,130:陶瓷基材
32,146:上表面
34,156:下表面
36,136:通路
42,142:上導電箔層
44,144:下導電箔層
132:上表面(側)
134:下表面(側)
138:上通路
140:下通路
150:錐形頂部
152:頸部
154:空腔
158:錐形底部
160:插入物
164:犧牲層
166:孔
184:熱壓模
200:電阻加熱器層
202:布線層
206:電阻加熱元件
300:方法
302,304,306,308,310:步驟
本揭示可由詳細說明及附圖更完整地了解,其中:圖1係依據本揭示之教示構成之一陶瓷台座總成的側視圖;圖2係依據本揭示之教示構成之一陶瓷台座總成的部份側橫截面圖;圖3顯示依據本揭示之教示之陶瓷台座總成的一生胚狀態;圖4係依據本揭示一態樣之一陶瓷基材的俯視立體圖;圖5A係依據本揭示之一通路的橫截面圖,該通路延伸穿過在一生胚狀態之一陶瓷基材;圖5B係依據本揭示之另一態樣之具有一倒角插入物及倒角空腔的通路的橫截面圖;
圖5C係具有大致矩形橫截面圖之通路的橫截面圖;圖6顯示依據本揭示之教示之陶瓷台座總成的一燒結狀態;圖7係依據本揭示之教示之圖6的一通路的放大圖,該通路延伸穿過一陶瓷基材且在一燒結狀態;圖8係依據本揭示之教示之一上導電箔層的立體圖,該上導電箔層作為形成在一陶瓷基材上之一電阻加熱層;圖9係依據本揭示之教示之一下導電箔層的立體圖,該下導電箔層作為形成在一陶瓷基材上之一布線層;及圖10係顯示依據本揭示之教示之形成陶瓷台座總成的一方法的流程圖。
在圖式之數個圖中對應符號表示對應部件。
以下說明在本質上只是示範而不是意圖限制本揭示、應用或用途。
請參閱圖1,依據本揭示之教示構成的一支持台座20可使用在一半導體處理腔室中用於支持及加熱一加熱目標,例如一晶圓。該支持台座20包括一陶瓷台座總成22及附接在該陶瓷台座總成22之一中心區域23上的一管狀軸24。該陶瓷台座總成22包括用於支持如一晶圓(未圖示)之一基材的一頂表面25及一底表面27,且該管
狀軸24附接該底表面27上。該支持台座20更包括被收納在該管狀軸24中用於連接至少一電氣元件/層(未圖示)之多數電纜26,該至少一電氣元件/層埋設在該陶瓷台座總成22中且與一外電源連接。依據應用,該電氣層可為一電阻加熱層、一溫度感測器、用於一靜電吸盤(ESC)之一電極或一射頻(RF)天線等。雖然未顯示在圖中,但陶瓷台座總成22可選擇地界定用於收納一沖洗氣體之一氣體導管及為該晶圓提供真空夾持之一真空導管。關於該支持台座之其他資訊揭露在名稱為「多區域陶瓷台座(Multi-zone Ceramic Pedestal)」之申請人同時申請的共同申請案,該共同申請案與本申請案共同地被擁有且其內容在此全部加入作為參考。
請參閱圖2,依據本揭示之教示顯示該陶瓷台座總成22之一部份側視橫截面圖。在這態樣中,該陶瓷台座總成22包含界定一上表面32及一下表面34之一陶瓷基材30。該陶瓷台座總成22更包含延伸穿過該陶瓷基材30之至少一通路36、一上導電箔層42及一下導電箔層44。在這態樣中,該至少一通路36、該上導電箔層42及該下導電箔層44如以下詳細說明地由一材料形成,該材料具有大於2,000℃之一熔點及小於或等於該陶瓷基材30之一熱膨脹係數(CTE)。
該至少一通路36延伸穿過該陶瓷基材30使得該通路36之一頂表面46與該上導電箔層42接觸且該通路36之一底表面56與該下導電箔層44接觸。該等通路36
亦為一導電材料,且該等通路36在該上導電箔層42與一下導電箔層44之間提供電連續性。
在一態樣中,該上導電箔層42係用於產生熱之一電阻層,且該下導電箔層44係一布線層。更詳而言之,該電阻層包括多數電阻加熱元件,該等電阻加熱元件可獨立地控制且界定一或多數加熱區域。該布線層與一或多數電纜26電連接且組配成可控制供應至該電阻層之加熱區域的電力。該等通路36延伸穿過該基材30且電連接設置在該基材30之相對側/表面的電阻層及布線層。因此,該布線層藉由該等通路36供應電力至該電阻層之一或多數區域。
應了解的是該等箔層42、44可用箔以外之另一產品形式,例如用一「層疊」形式來提供,其中「層疊」應被視為由如薄薄膜、厚薄膜、熱噴塗及溶膠-凝膠之製程產生的一產品態樣,且其中該層係透過施加或累積一材料在一基材上來形成。因此,該等箔層42、44及其相對該陶瓷基材30之配置不應被視為限制本揭示之範圍。因此,這些層亦可用一廣義方式稱為「功能層」使得本揭示不限於如在此所示及所述之一加熱器及一布線層的導電箔或特定功能。
此外,該陶瓷台座總成22可包括多數其他層(例如,如黏合層、介電層、感測層及保護層等其他功能層)而仍在本揭示之範圍內。在一示範態樣中,該陶瓷台座總成22更包含一積體式射頻(RF)格柵層,該RF格柵層
與接地端子電連接以抵消由加工腔室施加之RF電漿或磁場。或者,該上導電箔層42及該下導電箔層44之至少一導電箔層係一RF格柵層。通常,該RF格柵層係作為一天線使用以透過接地端子導引由加工腔室施加之RF電漿或磁場且屏蔽及保護加熱器電路及感測器裝置。
形成該陶瓷台座總成22包括:取得已形成一所需形狀之粉末;及藉由加熱該總成,即燒結將該粉末材料轉變成一緻密固體。一生胚狀態表示在加熱該總成前之該成形粉末或成形生胚體。
圖3、4與5A顯示依據本揭示之教示形成該陶瓷台座總成22。為形成該陶瓷台座總成22,提供在該生胚狀態之一陶瓷基材130。該陶瓷基材130具有一上表面132及一下表面134且界定延伸穿過該陶瓷基材130用於收納一通路136(圖3)之至少一孔166(圖4)。孔166之數目對應於通路136之數目。在該生胚狀態之陶瓷基材130可藉由例如冷均壓(CIP)技術形成,藉此提供所需強度給握把、機器,且燒結該陶瓷台座總成。
請繼續參閱圖3與5A,各通路136包含界定一錐形空腔154之一上通路138及具有一對應錐形插入物160之一下通路140。該上通路138包括具有一上表面146之一錐形頂部150及由該錐形頂部150延伸之一頸部152。該頸部152界定該錐形空腔154且更具有一底表面148。該下通路140之對應錐形插入物160由一錐形底部158延伸。該錐形底部158具有一下表面156及一頂表面
162且由該插入物160之一遠端徑向地延伸。該下通路140被該上通路138之空腔154收納,且當以下更詳細說明地燒結該陶瓷基材31時在該上通路138與該下通路140間形成一干涉/緊密配合。
在一態樣中,該通路138之空腔154及該下通路140之對應插入物160具有一圓形橫截面形狀。但是,應了解的是該橫截面可為另一適當形狀且不應限於一圓形橫截面。其他態樣之空腔154及對應插入物160顯示在圖5B與5C中且具有分別形成倒角及矩形之一橫截面形狀。此外,該空腔154及該對應插入物160可具有選自於由以下群組:多邊形、平面、卵形、三角形、橢圓形及容許當燒結該陶瓷基材130時在該等上與下通路之間形成一干涉/緊密配合之任何其他形狀的一橫截面形狀。上與下通路之設計可設計成在該熱壓燒結時抵消陶瓷收縮。例如,該石墨模可設計成限制該陶瓷及通路朝X與Y方向之位移及收縮且控制該熱壓軸向負載朝Z方向發生之位移。
該上通路138係由該陶瓷基材130之上表面側132放入該孔166中使得該上通路138之上表面146與該陶瓷基材130之上表面132實質齊平。該對應下通路140係由該陶瓷基材130之下表面側134放入該孔166中使得該下通路140之下表面156與該陶瓷基材130之下表面134實質齊平。該下通路140之插入物160被該上通路138之空腔154收納(圖3與5)。在一態樣中,該插入物160具有一錐形端,該錐形端對齊且被該空腔154收納以改善對
齊/配合及抵消在該上通路138及該下通路140與該陶瓷基材130間之製造公差及熱變化。
在將該上通路138及該下通路140配置成穿過該陶瓷基材130後,在/沿著該陶瓷基材130之上表面132上配置一上導電箔層142且在/沿著該陶瓷基材130之下表面134上配置一下導電箔層144(圖3)。該上箔層142與該陶瓷基材130之上表面132及該上通路138之上表面146接觸。該下箔層144與該陶瓷基材130之下表面134及該下通路140之下表面156接觸。在燒結前,具有該等通路136之陶瓷基材130及該等層142與下導電箔層144可大致稱為一生胚狀態陶瓷台座總成。
在另一態樣中,該生胚狀態陶瓷台座總成更包含在該上導電箔層142及該下導電箔層144中之至少一導電箔層上的一犧牲層164。該犧牲層164減少燒結時之交叉污染且在燒結後移除。例如,該犧牲層吸收由石墨模釋放之碳且減少陶瓷與多餘釋放碳之反應及交互作用。它亦防止該陶瓷整體及表面之變色。該犧牲層164選自於由鎢、碳化鎢及氮化硼構成之群組。但是,應了解的是亦可使用其他材料而仍在本揭示之範圍內。
該陶瓷台座總成22之組件可為各種材料中之任一材料,且在一態樣中,該上通路138、該下通路140、該上導電箔層142及該下導電箔層144界定一材料,該材料具有大於2,000℃之一熔點及相當於或低於,或換言之,小於或大致等於該陶瓷基材之一熱膨脹係數
(CTE)。例如,該陶瓷基材130可為一氮化鋁(AlN)材料且該上通路138、該下通路140、該上導電箔層142及該下導電箔層144由一鉬(Mo)材料形成。鉬可耐受大於2,000℃之溫度且其CTE相當於或低於AlN。應了解的是該等通路及陶瓷基材亦可使用其他材料組合,只要該材料可耐受大於2,000℃之溫度且該等通路之熱膨脹係數(CTE)低於該陶瓷基材即可。因此,使用Mo及AlN不應被視為限制本揭示之範圍。
將該生胚狀態陶瓷台座總成放在一熱壓模184中,該熱壓模係由例如石墨之可耐受熱壓燒結的一材料形成。請參閱圖6與7,朝一單軸方向熱壓該生胚狀態陶瓷台座總成,且在例如大約1700C至大約2,000℃之範圍內的一溫度燒結。在高溫下施加壓力熱壓燒結時,由具有一高熔點之材料(例如,大約2620℃之Mo材料)形成的該上通路138、該下通路140、該上導電箔層142及該下導電箔層144保持其形態且未因該燒結製程翹曲。
此外,單軸壓力將該上通路138及該下通路140壓在一起使得該上通路138之頸部152與該下通路140之插入物160接合,且該插入物160進一步貫穿該空腔154。在一態樣中,該錐形底部158之頂表面162作為該頸部152之一擋止使得該頸部152之底表面148抵靠該下通路140之錐形底部158的頂表面162。或者,該頸部152之底表面148可定位在該錐形底部158之頂表面162上方使得其間形成一小間隙。該單軸加壓更將該上導電箔層142
及該下導電箔層144分別地黏合在該陶瓷基材130之上表面132及下表面134上。
因為AlN具有比Mo高之一熱膨脹係數(CTE),該AlN基材130在該燒結製程中膨脹,而由Mo材料形成之通路136可保持其初始形狀。該膨脹基材130朝全部方向施加另外之壓力在該通路136上使得在收縮時,該基材130實質地包覆該通路136且將該上通路138及該下通路140牢固地固定在該基材130內。
在燒結時,該通路136在該基材130內之垂直位置及對齊係藉由該上通路138之錐形頂部150及空腔154以及該下通路140之錐形底部58及插入物160來控制。例如,該錐形頂部150與該孔166之側邊接合,同時該上通路138之上表面146仍與該陶瓷基材130之上表面132實質齊平。該錐形底部158以一與該錐形頂部150類似之方式作用。此外,該插入物160及具有該空腔154之頸部152係組配成互相接合以防止該通路136突出該陶瓷基材之上與下表面132與134。在燒結後,該上通路138及該下通路140形成一單一導電通路。見圖6及圖7。
藉由至少該通路136使用鉬,因為該鉬材料係一耐高溫金屬、有韌性、可延展且具有一體心立方晶體結構,所以該上通路138及該下通路140可在加壓及收縮時自動調整。在該燒結製程中,鉬產生極少塑性變形、殘留應力及破裂。
此外,鉬捕捉由該石墨模84釋出之碳。換言
之,鉬吸引由該石墨模184釋放之碳,藉此減少在該燒結製程中會發生之該AlN基材130的不必要交互作用及變色。
在燒結後,可依據最後陶瓷台座總成之所需組態以各種適當方式組配該上導電箔層142及該下導電箔層144。例如,在一態樣中,該上導電箔層142可形成為用於產生熱之一電阻層且該下導電箔層144可為用於連接該電阻層及一電源(未圖示)或該支持台座20之其他元件的一布線層。
請參閱圖8與9,提供一電阻加熱器層200及一布線層202之一例。蝕刻該上導電箔層142以形成包括一或多數電阻加熱元件之電阻加熱器層200,且該一或多數電阻加熱元件界定少一加熱區域。在圖8中,顯示界定六個加熱區域之六個電阻加熱元件206,但是在不偏離本揭示之範圍的情形下可使用任何數目之電阻加熱元件206。蝕刻該下導電箔層144以形成用於電耦合電力及該等通路136之布線層202。因此,該等通路136如上所述地電耦合該布線層及該電阻加熱層。關於電阻加熱層及布線層之其他資訊揭露在與本申請案同時申請且與本申請案共同地被擁有之名稱為「多區域陶瓷台座(Multi-zone Ceramic Pedestal)」的共同申請案,該共同申請案之內容在此全部加入作為參考。
該等導電層可以其他適當方式組配且不應限於該電阻層及該布線層。例如,在本揭示之另一態樣
中,該上導電箔層及該下導電箔層中之至少一導電箔層可組配為一RF格柵層。在又一態樣中,該下導電箔層可組配成包括一布線層及一第二電阻加熱器層。
請參閱圖10,以示意方式顯示形成如上所述之一陶瓷台座總成的一方法300。在步驟302,提供在一生胚狀態之一陶瓷基材且可藉由例如CIP技術形成該陶瓷基材。該陶瓷基材包括一或多數孔。在步驟304,將一通路放在一孔中。例如,將一上通路由該陶瓷基材之一上表面側放入該孔中且將一下通路由該陶瓷基材之一下表面側放入該孔中。
在步驟306,沿著該陶瓷基材之上表面配置一第一(上)導電箔層且沿著該陶瓷基材之下表面配置一第二(下)導電箔層。在步驟308,將包括在該生胚狀態之陶瓷台座、該等通路及該等導電箔層的總成放入一熱壓模中,且在步驟310,在該總成上施行一燒結製程以形成該陶瓷台座總成。該模由可耐受該燒結製程之一材料,例如石墨形成。在燒結時,朝一單軸方向熱壓且在大約1700℃至大約2,000℃之範圍內的一溫度燒結該總成。該單軸加壓使該等上與下通路相向移動以形成一單一導電通路,且該等導電箔層黏合在該陶瓷基材之表面上。因此,該等上與下導電箔層藉由該通路電耦合。
該方法300只是形成本揭示之陶瓷基材總成之一例且可包括多數其他或替代步驟。例如,在另一態樣中,該方法300更包括沿著該等導電箔層中之至少一導
電箔層配置至少一犧牲層(未圖示)以便在燒結時減少交叉污染。在該燒結製程後,由該總成移除該犧牲層。
在又一態樣中,該方法300包括,在該燒結製程後,蝕刻該等導電箔層以形成例如一或多數電阻層及一布線層。
在再一態樣中,該方法300可包括蝕刻至少一導電箔層以形成一RF格柵層。
本揭示之陶瓷台座總成22在該生胚狀態組合該陶瓷基材30與該至少一通路36、該上導電箔層42及該下導電箔層44且如在此所述地使用熱壓燒結黏合該等組件。在該燒結製程前組合由一耐高溫金屬形成之通路36與該陶瓷基材30容許壓力在熱壓時在該等上與下通路38與40間及在該通路36與該基材30間產生一牢固地固定的黏合。因此,包括藉由該通路36互相電耦合且在燒結前在生胚狀態之導電箔層42與44產生具有最小塑性變形之一致歐姆接觸。但是,應了解的是該等導電箔層42/44或其他功能層可在該燒結製程後加入該陶瓷基材30而仍在本揭示之範圍內。
此外,本揭示之兩件式通路係積體式通路且在該生胚狀態互連。這可減少熱壓加工步驟且可比習知單件式通路更符合經濟效益。該等兩件式通路亦朝該熱壓軸向負載之方向自由地移動且抵消陶瓷收縮之效應。雖然顯示及說明一兩件式通路,但可使用包括二或二以上之任何數目的部件/組件以形成一積體式通路而仍在本揭示之範
圍內。
應注意的是此揭示不限於所述及所示作為例子之實施例。在此已說明了多種修改例且更多修改例係所屬技術領域中具有通常知識者之知識的一部分。在不脫離此揭示及本專利之保護範圍的情形下,這些及其他修改例以及技術等效物之任何取代例可加入該說明及圖中。
22:陶瓷台座總成
30:陶瓷基材
32:上表面
34:下表面
36:通路
42:上導電箔層
44:下導電箔層
46:頂表面
56:底表面
Claims (16)
- 一種陶瓷台座總成,其包含:一基材;一第一功能層及一第二功能層,其設置在該基材之相對側;及至少一通路,其延伸穿過該基材且包含:一上通路,其界定一空腔;及一下通路,其界定一對應插入物,其中該第一功能層、該第二功能層及該至少一通路界定一材料,該材料具有大於2,000℃之一熔點及低於該基材之一CTE。
- 如請求項1之陶瓷台座總成,其中該基材由一氮化鋁材料形成,且該至少一通路、該第一功能層及該第二功能層由一鉬材料形成。
- 如請求項1之陶瓷台座總成,其中該下通路被該上通路之該空腔收納,使得當該基材被加熱時在該等上與下通路之間形成一干涉配合。
- 如請求項1之陶瓷台座總成,其中該上通路之一頂部及該下通路之一底部呈錐形。
- 如請求項1之陶瓷台座總成,其中該第一功能層係具有至少一電阻加熱元件之一電阻加熱器層且該第二功能層係一布線層,其中各電阻加熱元件界定至少一電阻加熱區域。
- 如請求項1之陶瓷台座總成,其中該上通 路之該空腔及該下空腔之該對應插入物具有選自於由多邊形、平面、圓形、卵形、三角形及橢圓形構成之群組的一橫截面形狀。
- 如請求項1之陶瓷台座總成,更包含至少一犧牲層,該至少一犧牲層橫跨在該第一功能層及該第二功能層中之至少一功能層上。
- 如請求項7之陶瓷台座總成,其中該犧牲層選自於由鎢、碳化鎢及氮化硼構成之群組。
- 如請求項1之陶瓷台座總成,更包含一RF格柵層。
- 如請求項1之陶瓷台座總成,其中該第一功能層係為一上導電箔層,其在該基材之一上表面上延伸,且該第二功能層係為一下導電箔層,其在該基材之一下表面上延伸。
- 如請求項1之陶瓷台座總成,其中該上通路之該空腔呈錐形,且該下通路界定一對應錐形。
- 一種形成陶瓷台座總成之方法,其包含以下步驟:使在一生胚狀態之一陶瓷基材形成至少一孔;使界定一空腔之一上通路配置成穿過該陶瓷基材之一上表面;使界定一對應插入物之一下通路配置成穿過該陶瓷基材之一下表面; 將一上功能層配置成橫跨在該陶瓷基材之該上表面上;將一下功能層配置成延伸橫跨在該陶瓷基材之該下表面上;及朝一單軸方向熱壓該總成,其中該上通路、該下通路及該等功能層界定一材料,該材料具有大於2,000℃之一熔點及小於或等於該陶瓷基材之一CTE。
- 如請求項12之方法,更包含以下步驟:在大約1700℃至大約2,000℃之範圍內的一溫度燒結該陶瓷台座總成。
- 如請求項12之方法,更包含以下步驟:將該總成放入一石墨模中。
- 如請求項12之方法,更包含以下步驟:將至少一犧牲層配置成橫跨在該上功能層及該下功能層中之至少一功能層上。
- 如請求項12之方法,更包含以下步驟:在該基材上形成一射頻(RF)格柵層。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201762589024P | 2017-11-21 | 2017-11-21 | |
US62/589,024 | 2017-11-21 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201933525A TW201933525A (zh) | 2019-08-16 |
TWI704643B true TWI704643B (zh) | 2020-09-11 |
Family
ID=64870561
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW107141513A TWI704643B (zh) | 2017-11-21 | 2018-11-21 | 用於陶瓷台座中的雙效通路 |
Country Status (7)
Country | Link |
---|---|
US (1) | US10483147B2 (zh) |
JP (1) | JP6820451B1 (zh) |
KR (1) | KR102188366B1 (zh) |
CN (1) | CN212874436U (zh) |
DE (1) | DE112018005933B4 (zh) |
TW (1) | TWI704643B (zh) |
WO (1) | WO2019104040A1 (zh) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE112018005969T8 (de) * | 2017-11-21 | 2021-03-11 | Watlow Electric Manufacturing Company | Multi-Zonen-Stützsockel-Heizgerät mit einer weiterleitenden Schicht |
US10498021B1 (en) * | 2019-04-30 | 2019-12-03 | CCS Technologies LLC | Rf equipment concealment foundation |
KR102107985B1 (ko) * | 2019-06-05 | 2020-05-07 | 주식회사 케이에스엠컴포넌트 | 플라즈마 처리 장치용 세라믹 구조체 및 그의 제조방법 |
US10793772B1 (en) | 2020-03-13 | 2020-10-06 | Accelovant Technologies Corporation | Monolithic phosphor composite for sensing systems |
US11359976B2 (en) | 2020-10-23 | 2022-06-14 | Accelovant Technologies Corporation | Multipoint surface temperature measurement system and method thereof |
CA3137183C (en) | 2020-11-05 | 2024-02-20 | Accelovant Technologies Corporation | Optoelectronic transducer module for thermographic temperature measurements |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6310755B1 (en) * | 1999-05-07 | 2001-10-30 | Applied Materials, Inc. | Electrostatic chuck having gas cavity and method |
TW201230201A (en) * | 2010-10-25 | 2012-07-16 | Ngk Insulators Ltd | Heating device |
TW201330168A (zh) * | 2011-09-28 | 2013-07-16 | Sumitomo Osaka Cement Co Ltd | 靜電吸持裝置 |
TW201344840A (zh) * | 2012-02-29 | 2013-11-01 | Jonathan H Harris | 多層的陶磁成分結合的方法和設備 |
TW201626497A (zh) * | 2014-10-17 | 2016-07-16 | 應用材料股份有限公司 | 用於高溫處理之靜電吸座組件 |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5539609A (en) | 1992-12-02 | 1996-07-23 | Applied Materials, Inc. | Electrostatic chuck usable in high density plasma |
JPH08507196A (ja) | 1994-01-31 | 1996-07-30 | アプライド マテリアルズ インコーポレイテッド | 共形な絶縁体フィルムを有する静電チャック |
JPH0870036A (ja) | 1994-08-29 | 1996-03-12 | Souzou Kagaku:Kk | 静電チャック |
JPH08107140A (ja) | 1994-10-03 | 1996-04-23 | Souzou Kagaku:Kk | 静電チャック |
US5644467A (en) | 1995-09-28 | 1997-07-01 | Applied Materials, Inc. | Method and structure for improving gas breakdown resistance and reducing the potential of arcing in a electrostatic chuck |
JP4256483B2 (ja) | 1996-07-19 | 2009-04-22 | アプライド マテリアルズ インコーポレイテッド | 静電チャック、集積回路デバイスを製造するための装置、及び静電チャックの製造方法 |
EP0948042A1 (de) | 1998-03-06 | 1999-10-06 | VenTec Gesellschaft für Venturekapital und Unternehmensberatung | Elektrostatische Vorrichtung zum Halten von Wafern und anderen Bauteilen |
US6104596A (en) | 1998-04-21 | 2000-08-15 | Applied Materials, Inc. | Apparatus for retaining a subtrate in a semiconductor wafer processing system and a method of fabricating same |
US6780787B2 (en) | 2002-03-21 | 2004-08-24 | Lam Research Corporation | Low contamination components for semiconductor processing apparatus and methods for making components |
JP4409373B2 (ja) | 2004-06-29 | 2010-02-03 | 日本碍子株式会社 | 基板載置装置及び基板温度調整方法 |
US7544251B2 (en) | 2004-10-07 | 2009-06-09 | Applied Materials, Inc. | Method and apparatus for controlling temperature of a substrate |
JP2007042909A (ja) | 2005-08-04 | 2007-02-15 | Sumitomo Electric Ind Ltd | ウェハ保持体およびそれを搭載したウェハプローバ |
US7696455B2 (en) * | 2006-05-03 | 2010-04-13 | Watlow Electric Manufacturing Company | Power terminals for ceramic heater and method of making the same |
US20080016684A1 (en) * | 2006-07-06 | 2008-01-24 | General Electric Company | Corrosion resistant wafer processing apparatus and method for making thereof |
JP5348439B2 (ja) * | 2011-09-30 | 2013-11-20 | Toto株式会社 | 静電チャック |
JP5984504B2 (ja) | 2012-05-21 | 2016-09-06 | 新光電気工業株式会社 | 静電チャック、静電チャックの製造方法 |
KR101986547B1 (ko) | 2012-12-17 | 2019-06-07 | 삼성전자주식회사 | 정전척 및 이를 포함하는 기판 처리 장치 |
-
2018
- 2018-11-20 US US16/196,571 patent/US10483147B2/en active Active
- 2018-11-20 KR KR1020207017878A patent/KR102188366B1/ko active IP Right Grant
- 2018-11-20 DE DE112018005933.2T patent/DE112018005933B4/de active Active
- 2018-11-20 WO PCT/US2018/062018 patent/WO2019104040A1/en active Application Filing
- 2018-11-20 JP JP2020540446A patent/JP6820451B1/ja active Active
- 2018-11-20 CN CN201890001473.5U patent/CN212874436U/zh active Active
- 2018-11-21 TW TW107141513A patent/TWI704643B/zh active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6310755B1 (en) * | 1999-05-07 | 2001-10-30 | Applied Materials, Inc. | Electrostatic chuck having gas cavity and method |
TW201230201A (en) * | 2010-10-25 | 2012-07-16 | Ngk Insulators Ltd | Heating device |
TW201330168A (zh) * | 2011-09-28 | 2013-07-16 | Sumitomo Osaka Cement Co Ltd | 靜電吸持裝置 |
TW201344840A (zh) * | 2012-02-29 | 2013-11-01 | Jonathan H Harris | 多層的陶磁成分結合的方法和設備 |
TW201626497A (zh) * | 2014-10-17 | 2016-07-16 | 應用材料股份有限公司 | 用於高溫處理之靜電吸座組件 |
Also Published As
Publication number | Publication date |
---|---|
US20190157127A1 (en) | 2019-05-23 |
DE112018005933T8 (de) | 2021-04-08 |
DE112018005933B4 (de) | 2021-11-18 |
TW201933525A (zh) | 2019-08-16 |
DE112018005933T5 (de) | 2020-07-30 |
JP6820451B1 (ja) | 2021-01-27 |
KR102188366B1 (ko) | 2020-12-08 |
US10483147B2 (en) | 2019-11-19 |
KR20200079555A (ko) | 2020-07-03 |
JP2021504970A (ja) | 2021-02-15 |
CN212874436U (zh) | 2021-04-02 |
WO2019104040A1 (en) | 2019-05-31 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TWI704643B (zh) | 用於陶瓷台座中的雙效通路 | |
JP3154629U (ja) | 静電チャック | |
KR100885060B1 (ko) | 플라즈마 발생용 전극내장형 서셉터 및 그 제조 방법 | |
JP3155802U (ja) | ウエハー載置装置 | |
KR102368339B1 (ko) | 웨이퍼 지지대 | |
KR101582785B1 (ko) | 정전 척 조립체 | |
US6538872B1 (en) | Electrostatic chuck having heater and method | |
US6490146B2 (en) | Electrostatic chuck bonded to base with a bond layer and method | |
TWI809204B (zh) | 半導體製造裝置用構件 | |
US10079167B2 (en) | Electrostatic chucking device | |
US6267839B1 (en) | Electrostatic chuck with improved RF power distribution | |
US6572814B2 (en) | Method of fabricating a semiconductor wafer support chuck apparatus having small diameter gas distribution ports for distributing a heat transfer gas | |
CN111095521B (zh) | 晶片载置台及其制法 | |
WO2019131611A1 (ja) | セラミック装置 | |
CN112135806A (zh) | 带有结合沟槽的陶瓷铝组件 | |
JP7110828B2 (ja) | 静電チャック装置 | |
KR20170007739A (ko) | 대형 동시소성 물품의 개선된 제조방법 | |
JP2023023670A (ja) | セラミックスヒータ | |
US20230111137A1 (en) | Wafer placement table | |
US20230343564A1 (en) | Wafer placement table | |
US20230187252A1 (en) | Substrate holder | |
TWI840855B (zh) | 晶圓載置台 | |
US11869796B2 (en) | Electrode-embedded member and method for manufacturing same, electrostatic chuck, and ceramic heater | |
US20230420282A1 (en) | Wafer placement table | |
JP6903512B2 (ja) | 接合体 |