DE112018005969T8 - Multi-Zonen-Stützsockel-Heizgerät mit einer weiterleitenden Schicht - Google Patents

Multi-Zonen-Stützsockel-Heizgerät mit einer weiterleitenden Schicht Download PDF

Info

Publication number
DE112018005969T8
DE112018005969T8 DE112018005969.3T DE112018005969T DE112018005969T8 DE 112018005969 T8 DE112018005969 T8 DE 112018005969T8 DE 112018005969 T DE112018005969 T DE 112018005969T DE 112018005969 T8 DE112018005969 T8 DE 112018005969T8
Authority
DE
Germany
Prior art keywords
conductive layer
support base
base heater
zone support
zone
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE112018005969.3T
Other languages
English (en)
Other versions
DE112018005969T5 (de
Inventor
Kevin Ptasienski
Stanton Hopkins Breitlow
Mohammed Nosrati
Kevin Smith
Brittany Phillips
Ken Ames
Patrick Margavio
Kurt ENGLISH
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Watlow Electric Manufacturing Company St Lou Us
Original Assignee
Watlow Electric Manufacturing Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Watlow Electric Manufacturing Co filed Critical Watlow Electric Manufacturing Co
Publication of DE112018005969T5 publication Critical patent/DE112018005969T5/de
Application granted granted Critical
Publication of DE112018005969T8 publication Critical patent/DE112018005969T8/de
Active legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67103—Apparatus for thermal treatment mainly by conduction
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/458—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for supporting substrates in the reaction chamber
    • C23C16/4582—Rigid and flat substrates, e.g. plates or discs
    • C23C16/4583—Rigid and flat substrates, e.g. plates or discs the substrate being supported substantially horizontally
    • C23C16/4586—Elements in the interior of the support, e.g. electrodes, heating or cooling devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67109—Apparatus for thermal treatment mainly by convection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67248—Temperature monitoring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68735—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge profile or support profile
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68757—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a coating or a hardness or a material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/482—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body
    • H01L23/485—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body consisting of layered constructions comprising conductive layers and insulating layers, e.g. planar contacts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B1/00—Details of electric heating devices
    • H05B1/02—Automatic switching arrangements specially adapted to apparatus ; Control of heating devices
    • H05B1/0202—Switches
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B1/00—Details of electric heating devices
    • H05B1/02—Automatic switching arrangements specially adapted to apparatus ; Control of heating devices
    • H05B1/0227—Applications
    • H05B1/023—Industrial applications
    • H05B1/0233—Industrial applications for semiconductors manufacturing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/02—Details
    • H05B3/06—Heater elements structurally combined with coupling elements or holders
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/20—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater
    • H05B3/22—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible
    • H05B3/28—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor embedded in insulating material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
    • H05B2203/002—Heaters using a particular layout for the resistive material or resistive elements
    • H05B2203/005—Heaters using a particular layout for the resistive material or resistive elements using multiple resistive elements or resistive zones isolated from each other
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
    • H05B2203/002—Heaters using a particular layout for the resistive material or resistive elements
    • H05B2203/007—Heaters using a particular layout for the resistive material or resistive elements using multiple electrically connected resistive elements or resistive zones
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
    • H05B2203/014—Heaters using resistive wires or cables not provided for in H05B3/54
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
    • H05B2203/016—Heaters using particular connecting means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
    • H05B2203/035—Electrical circuits used in resistive heating apparatus

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Resistance Heating (AREA)
  • Control Of Resistance Heating (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
DE112018005969.3T 2017-11-21 2018-11-20 Multi-Zonen-Stützsockel-Heizgerät mit einer weiterleitenden Schicht Active DE112018005969T8 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201762589023P 2017-11-21 2017-11-21
US62/589,023 2017-11-21
PCT/US2018/062036 WO2019104048A1 (en) 2017-11-21 2018-11-20 Multi-zone pedestal heater having a routing layer

Publications (2)

Publication Number Publication Date
DE112018005969T5 DE112018005969T5 (de) 2020-08-06
DE112018005969T8 true DE112018005969T8 (de) 2021-03-11

Family

ID=64755708

Family Applications (2)

Application Number Title Priority Date Filing Date
DE112018005969.3T Active DE112018005969T8 (de) 2017-11-21 2018-11-20 Multi-Zonen-Stützsockel-Heizgerät mit einer weiterleitenden Schicht
DE112018005962.6T Pending DE112018005962T5 (de) 2017-11-21 2018-11-20 Multi-zonen trägerheizung ohne durchkontaktierungen

Family Applications After (1)

Application Number Title Priority Date Filing Date
DE112018005962.6T Pending DE112018005962T5 (de) 2017-11-21 2018-11-20 Multi-zonen trägerheizung ohne durchkontaktierungen

Country Status (7)

Country Link
US (4) US11382180B2 (de)
JP (2) JP7349439B2 (de)
KR (2) KR102664620B1 (de)
CN (2) CN212365925U (de)
DE (2) DE112018005969T8 (de)
TW (2) TWI756494B (de)
WO (2) WO2019104048A1 (de)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10764966B2 (en) * 2016-05-10 2020-09-01 Lam Research Corporation Laminated heater with different heater trace materials
US10667379B2 (en) * 2016-05-10 2020-05-26 Lam Research Corporation Connections between laminated heater and heater voltage inputs
US11551951B2 (en) 2020-05-05 2023-01-10 Applied Materials, Inc. Methods and systems for temperature control for a substrate
CN113823582A (zh) * 2020-06-21 2021-12-21 拓荆科技股份有限公司 用于处理站阻抗调节的装置、系统和方法
US20230110307A1 (en) * 2021-10-08 2023-04-13 Watlow Electric Manufacturing Company Shaped electrical interconnections for multi-layer heater constructions
TW202335174A (zh) * 2022-02-15 2023-09-01 美商瓦特洛威電子製造公司 針對半導體夾盤及加熱器之製造的固態接合方法

Family Cites Families (40)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6066836A (en) 1996-09-23 2000-05-23 Applied Materials, Inc. High temperature resistive heater for a process chamber
JP4503714B2 (ja) 1996-09-23 2010-07-14 アプライド マテリアルズ インコーポレイテッド 高温抵抗式ヒーター
US6617553B2 (en) 1999-05-19 2003-09-09 Applied Materials, Inc. Multi-zone resistive heater
US6423949B1 (en) 1999-05-19 2002-07-23 Applied Materials, Inc. Multi-zone resistive heater
JP2001102157A (ja) * 1999-10-01 2001-04-13 Ngk Insulators Ltd セラミックスヒータ
JP4028149B2 (ja) * 2000-02-03 2007-12-26 日本碍子株式会社 加熱装置
CN100493267C (zh) 2000-11-29 2009-05-27 萨莫希雷梅克斯公司 具有控制电阻率的电阻加热器及其制备方法
KR100434487B1 (ko) 2001-01-17 2004-06-05 삼성전자주식회사 샤워 헤드 및 이를 포함하는 박막 형성 장비
JP3897563B2 (ja) 2001-10-24 2007-03-28 日本碍子株式会社 加熱装置
WO2004019143A2 (en) 2002-08-21 2004-03-04 Watlow Electric Manufacturing Company Variable wattage control system
JP2004296254A (ja) * 2003-03-27 2004-10-21 Sumitomo Electric Ind Ltd セラミックスヒータおよびそれを搭載した半導体あるいは液晶製造装置
US8423193B2 (en) 2003-08-20 2013-04-16 Watlow Electric Manufacturing Company Variable wattage control system
US7196295B2 (en) 2003-11-21 2007-03-27 Watlow Electric Manufacturing Company Two-wire layered heater system
JP4761723B2 (ja) * 2004-04-12 2011-08-31 日本碍子株式会社 基板加熱装置
JP2006222008A (ja) 2005-02-14 2006-08-24 Kyocera Corp セラミックヒータ及びヒータ内蔵電子部品
JP2006229040A (ja) 2005-02-18 2006-08-31 Matsushita Electric Ind Co Ltd 熱処理方法および熱処理装置
US9892941B2 (en) 2005-12-01 2018-02-13 Applied Materials, Inc. Multi-zone resistive heater
JP5202175B2 (ja) 2008-08-07 2013-06-05 日本碍子株式会社 シャフト付きヒータ
JP5705133B2 (ja) 2009-02-04 2015-04-22 マットソン テクノロジー インコーポレイテッドＭａｔｔｓｏｎ Ｔｅｃｈｎｏｌｏｇｙ， Ｉｎｃ． 静電チャックシステムおよび基板表面に亘って温度プロファイルを半径方向に調整するための方法
US8637794B2 (en) * 2009-10-21 2014-01-28 Lam Research Corporation Heating plate with planar heating zones for semiconductor processing
US8791392B2 (en) * 2010-10-22 2014-07-29 Lam Research Corporation Methods of fault detection for multiplexed heater array
US8546732B2 (en) * 2010-11-10 2013-10-01 Lam Research Corporation Heating plate with planar heater zones for semiconductor processing
US8371567B2 (en) 2011-04-13 2013-02-12 Novellus Systems, Inc. Pedestal covers
CA2847437C (en) * 2011-08-30 2017-03-14 Watlow Electric Manufacturing Company Thermal array system
US8624168B2 (en) * 2011-09-20 2014-01-07 Lam Research Corporation Heating plate with diode planar heater zones for semiconductor processing
US9324589B2 (en) * 2012-02-28 2016-04-26 Lam Research Corporation Multiplexed heater array using AC drive for semiconductor processing
US8809747B2 (en) * 2012-04-13 2014-08-19 Lam Research Corporation Current peak spreading schemes for multiplexed heated array
US9089007B2 (en) * 2012-04-27 2015-07-21 Applied Materials, Inc. Method and apparatus for substrate support with multi-zone heating
US9538583B2 (en) * 2013-01-16 2017-01-03 Applied Materials, Inc. Substrate support with switchable multizone heater
JP6441927B2 (ja) * 2013-08-06 2018-12-19 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 局部的に加熱されるマルチゾーン式の基板支持体
JP6431190B2 (ja) * 2014-10-31 2018-11-28 ワットロー・エレクトリック・マニュファクチャリング・カンパニー ヒーター用熱動的応答感知システム
JP2017029876A (ja) 2015-07-29 2017-02-09 寿典 幕田 気泡から作る中空粒子およびその製造方法
KR101776562B1 (ko) 2015-08-20 2017-09-07 엔지케이 인슐레이터 엘티디 정전 척 히터
US9826574B2 (en) * 2015-10-28 2017-11-21 Watlow Electric Manufacturing Company Integrated heater and sensor system
US10707110B2 (en) 2015-11-23 2020-07-07 Lam Research Corporation Matched TCR joule heater designs for electrostatic chucks
US9812342B2 (en) 2015-12-08 2017-11-07 Watlow Electric Manufacturing Company Reduced wire count heater array block
CN108475656B (zh) 2015-12-28 2023-09-05 日本碍子株式会社 圆盘状加热器以及加热器冷却板组件
JP6530333B2 (ja) 2016-02-29 2019-06-12 日本特殊陶業株式会社 加熱部材及び静電チャック
WO2019104040A1 (en) * 2017-11-21 2019-05-31 Watlow Electric Manufacturing Company Dual-purpose vias for use in ceramic pedestals
US11562913B2 (en) * 2019-04-25 2023-01-24 Watlow Electric Manufacturing Company Multi-zone azimuthal heater

Also Published As

Publication number Publication date
US11343879B2 (en) 2022-05-24
TWI710053B (zh) 2020-11-11
CN212542359U (zh) 2021-02-12
US20190159291A1 (en) 2019-05-23
US20190153598A1 (en) 2019-05-23
KR102613392B1 (ko) 2023-12-14
TWI756494B (zh) 2022-03-01
US20220210873A1 (en) 2022-06-30
WO2019104060A1 (en) 2019-05-31
JP7303820B2 (ja) 2023-07-05
DE112018005969T5 (de) 2020-08-06
TW201926540A (zh) 2019-07-01
US11382180B2 (en) 2022-07-05
US20220338305A1 (en) 2022-10-20
TW201926539A (zh) 2019-07-01
CN212365925U (zh) 2021-01-15
KR102664620B1 (ko) 2024-05-14
US11895741B2 (en) 2024-02-06
JP7349439B2 (ja) 2023-09-22
DE112018005962T5 (de) 2020-08-06
WO2019104048A1 (en) 2019-05-31
KR20200086357A (ko) 2020-07-16
KR20200087852A (ko) 2020-07-21
JP2021504925A (ja) 2021-02-15
JP2021504971A (ja) 2021-02-15

Similar Documents

Publication Publication Date Title
DE112018005969T8 (de) Multi-Zonen-Stützsockel-Heizgerät mit einer weiterleitenden Schicht
DK3359712T3 (da) Færdigudglatning af ru metalartiklers overflade
MA49936A (fr) Radome a decoration retro-illuminee
IL274338A (en) Resistor with heat dissipation on top surface
DE112019002688A5 (de) Stator mit Isolationsschicht
DE112017003950A5 (de) Oxygenator mit einem heizelement
IT201700109605A1 (it) Piano cottura con rivestimento riscaldante
EP3558886C0 (de) Heizvorrichtung mit einem beidseitig beschichteten verglasungssubstrat
JP2015138767A5 (de)
DE112018005026A5 (de) Oberflächen-Temperiereinrichtung
HUE054950T2 (hu) Tartóprofil állítóelemmel
DE112017005436A5 (de) Knickbares Substrat mit Bauelement
DK3468422T3 (da) Varmebestandigt faconlagen
DE112016002458A5 (de) Bauelement mit einer transparenten leitfähigen Nitridschicht
DK3239399T3 (da) Overfladebelægning
DK3401938T3 (da) Fotovoltaisk element
FR3001480B1 (fr) Tuile photovoltaique sur substrat poreux
IT201700046757U1 (it) Impianto di riscaldamento a nastri radianti
DE112016004453A5 (de) Auflageelement für flexible bandförmige Heizelemente einer Flächenheizung
DE112015000429A5 (de) Keramiksubstrat mit Funktionsbeschichtung
FR3047350B1 (fr) Substrat avance a miroir integre
DK3228448T3 (da) Linoleumbaseret overfladebelægning
DE112015006663A5 (de) Schiffsmast mit einer strömungsfreundlichen Oberfläche
DE112015000641A5 (de) Flächenhaftes, elektrisches Widerstandsheiznetz
CA196909S (en) Sock with heating element

Legal Events

Date Code Title Description
R081 Change of applicant/patentee

Owner name: WATLOW ELECTRIC MANUFACTURING COMPANY, ST. LOU, US

Free format text: FORMER OWNER: WATLOW ELECTRIC MANUFACTURING COMPANY, ST. LOUIS, MISS., US

R082 Change of representative

Representative=s name: GESKES PATENT- UND RECHTSANWAELTE, DE