TWI704640B - 物體處理裝置、物體處理方法、以及元件製造方法 - Google Patents

物體處理裝置、物體處理方法、以及元件製造方法 Download PDF

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Publication number
TWI704640B
TWI704640B TW106114288A TW106114288A TWI704640B TW I704640 B TWI704640 B TW I704640B TW 106114288 A TW106114288 A TW 106114288A TW 106114288 A TW106114288 A TW 106114288A TW I704640 B TWI704640 B TW I704640B
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TW
Taiwan
Prior art keywords
substrate
patent application
exposure
area
processing device
Prior art date
Application number
TW106114288A
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English (en)
Chinese (zh)
Other versions
TW201729331A (zh
Inventor
青木保夫
Original Assignee
日商尼康股份有限公司
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Publication of TW201729331A publication Critical patent/TW201729331A/zh
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Publication of TWI704640B publication Critical patent/TWI704640B/zh

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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70716—Stages
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/063—Transporting devices for sheet glass
    • B65G49/064—Transporting devices for sheet glass in a horizontal position
    • B65G49/065—Transporting devices for sheet glass in a horizontal position supported partially or completely on fluid cushions, e.g. a gas cushion
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70791—Large workpieces, e.g. glass substrates for flat panel displays or solar panels
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/36—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations using air tracks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/78—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using vacuum or suction, e.g. Bernoulli chucks

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
TW106114288A 2009-08-20 2010-08-20 物體處理裝置、物體處理方法、以及元件製造方法 TWI704640B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2009190654 2009-08-20
JPJP2009-190654 2009-08-20

Publications (2)

Publication Number Publication Date
TW201729331A TW201729331A (zh) 2017-08-16
TWI704640B true TWI704640B (zh) 2020-09-11

Family

ID=43063876

Family Applications (2)

Application Number Title Priority Date Filing Date
TW106114288A TWI704640B (zh) 2009-08-20 2010-08-20 物體處理裝置、物體處理方法、以及元件製造方法
TW099127837A TWI587436B (zh) 2009-08-20 2010-08-20 物體處理裝置、曝光裝置及曝光方法、以及元件製造方法

Family Applications After (1)

Application Number Title Priority Date Filing Date
TW099127837A TWI587436B (zh) 2009-08-20 2010-08-20 物體處理裝置、曝光裝置及曝光方法、以及元件製造方法

Country Status (6)

Country Link
US (1) US20110053092A1 (https=)
JP (1) JP5573849B2 (https=)
KR (2) KR102022841B1 (https=)
CN (1) CN102483580B (https=)
TW (2) TWI704640B (https=)
WO (1) WO2011021723A1 (https=)

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TWI784972B (zh) 2016-09-30 2022-12-01 日商尼康股份有限公司 曝光裝置、平板顯示器的製造方法、元件製造方法以及曝光方法
US20200019071A1 (en) 2016-09-30 2020-01-16 Nikon Corporation Carrier device, exposure apparatus, exposure method, manufacturing method of flat-panel display, device manufacturing method, and carrying method
JPWO2018062508A1 (ja) * 2016-09-30 2019-07-04 株式会社ニコン 物体保持装置、露光装置、フラットパネルディスプレイの製造方法、デバイス製造方法、及び物体保持方法
CN108983552B (zh) * 2017-05-31 2020-01-24 上海微电子装备（集团）股份有限公司 一种移入移出机构及光刻机工件台移入移出装置
CN118343498A (zh) * 2018-03-01 2024-07-16 杭州孚亚科技有限公司 吸紧装置
JP7114277B2 (ja) 2018-03-07 2022-08-08 キヤノン株式会社 パターン形成装置及び物品の製造方法
JP7017239B2 (ja) * 2018-06-25 2022-02-08 株式会社ブイ・テクノロジー 露光装置および高さ調整方法
KR102653016B1 (ko) 2018-09-18 2024-03-29 삼성전자주식회사 척 구동 장치 및 기판 처리 장치
TWI691715B (zh) * 2019-06-17 2020-04-21 華矽創新股份有限公司 檢測矽晶圓缺陷的自動光學檢測機構及方法
JP7185674B2 (ja) * 2020-09-30 2022-12-07 キヤノントッキ株式会社 成膜装置、調整方法及び電子デバイスの製造方法
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Also Published As

Publication number Publication date
JP5573849B2 (ja) 2014-08-20
US20110053092A1 (en) 2011-03-03
CN102483580B (zh) 2015-04-01
KR102022841B1 (ko) 2019-09-19
TWI587436B (zh) 2017-06-11
TW201729331A (zh) 2017-08-16
KR101862234B1 (ko) 2018-05-29
WO2011021723A1 (en) 2011-02-24
KR20180059948A (ko) 2018-06-05
CN102483580A (zh) 2012-05-30
JP2013502600A (ja) 2013-01-24
HK1166140A1 (en) 2012-10-19
TW201138008A (en) 2011-11-01
KR20120062711A (ko) 2012-06-14

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