CN102483580B - 物体处理装置、曝光装置及曝光方法、以及元件制造方法 - Google Patents

物体处理装置、曝光装置及曝光方法、以及元件制造方法 Download PDF

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Publication number
CN102483580B
CN102483580B CN201080036925.1A CN201080036925A CN102483580B CN 102483580 B CN102483580 B CN 102483580B CN 201080036925 A CN201080036925 A CN 201080036925A CN 102483580 B CN102483580 B CN 102483580B
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CN
China
Prior art keywords
substrate
exposure
retaining member
holding surface
processing apparatus
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CN201080036925.1A
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English (en)
Chinese (zh)
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CN102483580A (zh
Inventor
青木保夫
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Nikon Corp
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Nikon Corp
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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70716—Stages
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/063—Transporting devices for sheet glass
    • B65G49/064—Transporting devices for sheet glass in a horizontal position
    • B65G49/065—Transporting devices for sheet glass in a horizontal position supported partially or completely on fluid cushions, e.g. a gas cushion
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70791—Large workpieces, e.g. glass substrates for flat panel displays or solar panels
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/36—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations using air tracks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/78—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using vacuum or suction, e.g. Bernoulli chucks

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
CN201080036925.1A 2009-08-20 2010-08-19 物体处理装置、曝光装置及曝光方法、以及元件制造方法 Active CN102483580B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2009190654 2009-08-20
JP2009-190654 2009-08-20
PCT/JP2010/064430 WO2011021723A1 (en) 2009-08-20 2010-08-19 Object processing apparatus, exposure apparatus and exposure method, and device manufacturing method

Publications (2)

Publication Number Publication Date
CN102483580A CN102483580A (zh) 2012-05-30
CN102483580B true CN102483580B (zh) 2015-04-01

Family

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Family Applications (1)

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CN201080036925.1A Active CN102483580B (zh) 2009-08-20 2010-08-19 物体处理装置、曝光装置及曝光方法、以及元件制造方法

Country Status (6)

Country Link
US (1) US20110053092A1 (https=)
JP (1) JP5573849B2 (https=)
KR (2) KR102022841B1 (https=)
CN (1) CN102483580B (https=)
TW (2) TWI587436B (https=)
WO (1) WO2011021723A1 (https=)

Families Citing this family (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8699001B2 (en) * 2009-08-20 2014-04-15 Nikon Corporation Object moving apparatus, object processing apparatus, exposure apparatus, object inspecting apparatus and device manufacturing method
US8598538B2 (en) 2010-09-07 2013-12-03 Nikon Corporation Movable body apparatus, object processing device, exposure apparatus, flat-panel display manufacturing method, and device manufacturing method
US8941814B2 (en) * 2011-06-20 2015-01-27 Nikon Corporation Multiple-blade holding devices
WO2013031223A1 (ja) * 2011-08-30 2013-03-07 株式会社ニコン 基板処理装置及び基板処理方法、露光方法及び露光装置、並びにデバイス製造方法及びフラットパネルディスプレイの製造方法
JP2013054144A (ja) * 2011-09-02 2013-03-21 Nikon Corp 位置合わせ方法、露光方法、デバイス製造方法、及びフラットパネルディスプレイの製造方法
WO2013133321A1 (ja) * 2012-03-07 2013-09-12 株式会社ニコン マスク、マスクユニット、露光装置、基板処理装置、及びデバイス製造方法
CN103019041B (zh) 2012-11-26 2014-10-22 京东方科技集团股份有限公司 一种曝光机
WO2016027186A1 (en) * 2014-08-19 2016-02-25 Koninklijke Philips N.V. Sapphire collector for reducing mechanical damage during die level laser lift-off
KR101715785B1 (ko) * 2014-12-05 2017-03-13 프로미스 주식회사 Ｆｐｄ용 노광장치
TWI735438B (zh) * 2015-03-30 2021-08-11 日商尼康股份有限公司 物體搬運裝置、曝光裝置、平板顯示器的製造方法、元件製造方法、物體搬運方法以及曝光方法
KR102584657B1 (ko) * 2015-03-31 2023-10-04 가부시키가이샤 니콘 노광 장치, 플랫 패널 디스플레이의 제조 방법, 디바이스 제조 방법, 및 노광 방법
JP6807334B2 (ja) * 2015-05-13 2021-01-06 ルミレッズ ホールディング ベーフェー ダイレベルのリフトオフの最中におけるメカニカルダメージを低減するためのサファイアコレクタ
JP6802191B2 (ja) * 2015-06-05 2020-12-16 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ サセプタの位置付け及び回転装置、並びに使用の方法
JP6885335B2 (ja) 2015-09-30 2021-06-16 株式会社ニコン 移動体装置、露光装置、フラットパネルディスプレイの製造方法、及びデバイス製造方法、並びに物体の移動方法
KR102676391B1 (ko) * 2015-09-30 2024-06-18 가부시키가이샤 니콘 노광 장치, 노광 방법, 플랫 패널 디스플레이의 제조 방법, 및 디바이스 제조 방법
EP3403954A4 (en) * 2016-01-15 2019-08-14 Nano-Tem Co., Ltd. CONTACTLESS CARRIER AND CONTACTLESS CARRIER SYSTEM
CN109791369B (zh) * 2016-09-30 2022-01-14 株式会社尼康 物体保持装置、曝光装置、平板显示器之制造方法、元件制造方法、以及物体保持方法
CN109791370B (zh) 2016-09-30 2021-05-18 株式会社尼康 曝光装置、平板显示器的制造方法、元件制造方法、及曝光方法
JP6791255B2 (ja) 2016-09-30 2020-11-25 株式会社ニコン 搬送装置、露光装置、露光方法、フラットパネルディスプレイの製造方法、デバイス製造方法、及び搬送方法
CN108983552B (zh) * 2017-05-31 2020-01-24 上海微电子装备（集团）股份有限公司 一种移入移出机构及光刻机工件台移入移出装置
CN118343498A (zh) * 2018-03-01 2024-07-16 杭州孚亚科技有限公司 吸紧装置
JP7114277B2 (ja) 2018-03-07 2022-08-08 キヤノン株式会社 パターン形成装置及び物品の製造方法
JP7017239B2 (ja) * 2018-06-25 2022-02-08 株式会社ブイ・テクノロジー 露光装置および高さ調整方法
KR102653016B1 (ko) 2018-09-18 2024-03-29 삼성전자주식회사 척 구동 장치 및 기판 처리 장치
TWI691715B (zh) * 2019-06-17 2020-04-21 華矽創新股份有限公司 檢測矽晶圓缺陷的自動光學檢測機構及方法
JP7185674B2 (ja) * 2020-09-30 2022-12-07 キヤノントッキ株式会社 成膜装置、調整方法及び電子デバイスの製造方法
JP7756535B2 (ja) * 2021-10-06 2025-10-20 キヤノン株式会社 位置決め装置、リソグラフィ装置、および物品製造方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060098176A1 (en) * 2004-11-05 2006-05-11 Asml Netherlands B.V. Lithographic apparatus, device manufacturing method, and substrate table
US20080014075A1 (en) * 2005-09-30 2008-01-17 Photon Dynamics, Inc. Vacuum gripping system for positioning large thin substrates on a support table
CN101124133A (zh) * 2004-04-14 2008-02-13 科福罗科学解决方案有限公司 用于调整距离的非接触支撑平台

Family Cites Families (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2007A (en) * 1841-03-16 Improvement in the mode of harvesting grain
KR100300618B1 (ko) * 1992-12-25 2001-11-22 오노 시게오 노광방법,노광장치,및그장치를사용하는디바이스제조방법
JP3689949B2 (ja) * 1995-12-19 2005-08-31 株式会社ニコン 投影露光装置、及び該投影露光装置を用いたパターン形成方法
EP0866375A3 (en) * 1997-03-17 2000-05-24 Nikon Corporation Article positioning apparatus and exposing apparatus having the same
JP2001215718A (ja) * 1999-11-26 2001-08-10 Nikon Corp 露光装置及び露光方法
TW529172B (en) * 2001-07-24 2003-04-21 Asml Netherlands Bv Imaging apparatus
US6888620B2 (en) * 2001-11-29 2005-05-03 Nikon Corporation System and method for holding a device with minimal deformation
US20030098965A1 (en) * 2001-11-29 2003-05-29 Mike Binnard System and method for supporting a device holder with separate components
TWI222423B (en) * 2001-12-27 2004-10-21 Orbotech Ltd System and methods for conveying and transporting levitated articles
JP4378938B2 (ja) * 2002-11-25 2009-12-09 株式会社ニコン 露光装置、及びデバイス製造方法
US7077019B2 (en) * 2003-08-08 2006-07-18 Photon Dynamics, Inc. High precision gas bearing split-axis stage for transport and constraint of large flat flexible media during processing
JPWO2006009254A1 (ja) * 2004-07-23 2008-05-01 株式会社ニコン 支持装置、ステージ装置、露光装置、及びデバイスの製造方法
TWI408506B (zh) * 2005-03-29 2013-09-11 尼康股份有限公司 曝光裝置、曝光裝置的製造方法以及微元件的製造方法
KR100949502B1 (ko) * 2005-06-20 2010-03-24 엘지디스플레이 주식회사 액정표시장치 제조 공정용 기판 반송장치
JP4553376B2 (ja) * 2005-07-19 2010-09-29 東京エレクトロン株式会社 浮上式基板搬送処理装置及び浮上式基板搬送処理方法
JP4702083B2 (ja) * 2006-02-10 2011-06-15 ウシオ電機株式会社 ＸＹθ移動ステージ
CN101980084B (zh) * 2006-02-21 2013-01-23 株式会社尼康 曝光装置、曝光方法及组件制造方法
JP4318709B2 (ja) * 2006-10-10 2009-08-26 東京エレクトロン株式会社 現像処理方法及び現像処理装置
KR101547784B1 (ko) * 2007-03-05 2015-08-26 가부시키가이샤 니콘 이동체 장치, 패턴 형성 장치 및 패턴 형성 방법, 디바이스 제조 방법, 이동체 장치의 제조 방법, 및 이동체 구동 방법
JP4743716B2 (ja) * 2007-03-06 2011-08-10 東京エレクトロン株式会社 基板処理装置
US7607647B2 (en) * 2007-03-20 2009-10-27 Kla-Tencor Technologies Corporation Stabilizing a substrate using a vacuum preload air bearing chuck
JP2009147240A (ja) * 2007-12-18 2009-07-02 Dainippon Printing Co Ltd 基板支持装置、基板支持方法、基板加工装置、基板加工方法、表示装置構成部材の製造方法
JP5125739B2 (ja) * 2008-05-08 2013-01-23 凸版印刷株式会社 Ｘｙステップ露光装置
US8699001B2 (en) * 2009-08-20 2014-04-15 Nikon Corporation Object moving apparatus, object processing apparatus, exposure apparatus, object inspecting apparatus and device manufacturing method
US20110042874A1 (en) * 2009-08-20 2011-02-24 Nikon Corporation Object processing apparatus, exposure apparatus and exposure method, and device manufacturing method
US20120064460A1 (en) * 2010-09-07 2012-03-15 Nikon Corporation Movable body apparatus, object processing device, exposure apparatus, flat-panel display manufacturing method, and device manufacturing method
US8598538B2 (en) * 2010-09-07 2013-12-03 Nikon Corporation Movable body apparatus, object processing device, exposure apparatus, flat-panel display manufacturing method, and device manufacturing method
US20120064461A1 (en) * 2010-09-13 2012-03-15 Nikon Corporation Movable body apparatus, exposure apparatus, device manufacturing method, flat-panel display manufacturing method, and object exchange method

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101124133A (zh) * 2004-04-14 2008-02-13 科福罗科学解决方案有限公司 用于调整距离的非接触支撑平台
US20060098176A1 (en) * 2004-11-05 2006-05-11 Asml Netherlands B.V. Lithographic apparatus, device manufacturing method, and substrate table
US20080014075A1 (en) * 2005-09-30 2008-01-17 Photon Dynamics, Inc. Vacuum gripping system for positioning large thin substrates on a support table

Also Published As

Publication number Publication date
TWI704640B (zh) 2020-09-11
KR102022841B1 (ko) 2019-09-19
JP5573849B2 (ja) 2014-08-20
KR101862234B1 (ko) 2018-05-29
WO2011021723A1 (en) 2011-02-24
HK1166140A1 (en) 2012-10-19
TWI587436B (zh) 2017-06-11
TW201729331A (zh) 2017-08-16
US20110053092A1 (en) 2011-03-03
CN102483580A (zh) 2012-05-30
JP2013502600A (ja) 2013-01-24
KR20180059948A (ko) 2018-06-05
KR20120062711A (ko) 2012-06-14
TW201138008A (en) 2011-11-01

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