KR102022841B1 - 물체 처리 장치, 노광 장치와 노광 방법, 및 디바이스 제조 방법 - Google Patents

물체 처리 장치, 노광 장치와 노광 방법, 및 디바이스 제조 방법 Download PDF

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KR102022841B1
KR102022841B1 KR1020187014528A KR20187014528A KR102022841B1 KR 102022841 B1 KR102022841 B1 KR 102022841B1 KR 1020187014528 A KR1020187014528 A KR 1020187014528A KR 20187014528 A KR20187014528 A KR 20187014528A KR 102022841 B1 KR102022841 B1 KR 102022841B1
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support
substrate
holding member
exposure
holding
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Korean (ko)
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KR20180059948A (ko
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야스오 아오키
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가부시키가이샤 니콘
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    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691Handling of masks or workpieces
    • G03F7/70716Stages
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65GTRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/063Transporting devices for sheet glass
    • B65G49/064Transporting devices for sheet glass in a horizontal position
    • B65G49/065Transporting devices for sheet glass in a horizontal position supported partially or completely on fluid cushions, e.g. a gas cushion
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691Handling of masks or workpieces
    • G03F7/70791Large workpieces, e.g. glass substrates for flat panel displays or solar panels
    • H01L21/67784
    • H01L21/6838
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/36Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations using air tracks
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/78Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using vacuum or suction, e.g. Bernoulli chucks

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
KR1020187014528A 2009-08-20 2010-08-19 물체 처리 장치, 노광 장치와 노광 방법, 및 디바이스 제조 방법 Active KR102022841B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2009190654 2009-08-20
JPJP-P-2009-190654 2009-08-20
PCT/JP2010/064430 WO2011021723A1 (en) 2009-08-20 2010-08-19 Object processing apparatus, exposure apparatus and exposure method, and device manufacturing method

Related Parent Applications (1)

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KR1020127003908A Division KR101862234B1 (ko) 2009-08-20 2010-08-19 물체 처리 장치, 노광 장치와 노광 방법, 및 디바이스 제조 방법

Publications (2)

Publication Number Publication Date
KR20180059948A KR20180059948A (ko) 2018-06-05
KR102022841B1 true KR102022841B1 (ko) 2019-09-19

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KR1020187014528A Active KR102022841B1 (ko) 2009-08-20 2010-08-19 물체 처리 장치, 노광 장치와 노광 방법, 및 디바이스 제조 방법
KR1020127003908A Active KR101862234B1 (ko) 2009-08-20 2010-08-19 물체 처리 장치, 노광 장치와 노광 방법, 및 디바이스 제조 방법

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Country Link
US (1) US20110053092A1 (https=)
JP (1) JP5573849B2 (https=)
KR (2) KR102022841B1 (https=)
CN (1) CN102483580B (https=)
TW (2) TWI587436B (https=)
WO (1) WO2011021723A1 (https=)

Families Citing this family (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8699001B2 (en) * 2009-08-20 2014-04-15 Nikon Corporation Object moving apparatus, object processing apparatus, exposure apparatus, object inspecting apparatus and device manufacturing method
US8598538B2 (en) 2010-09-07 2013-12-03 Nikon Corporation Movable body apparatus, object processing device, exposure apparatus, flat-panel display manufacturing method, and device manufacturing method
US8941814B2 (en) * 2011-06-20 2015-01-27 Nikon Corporation Multiple-blade holding devices
WO2013031223A1 (ja) * 2011-08-30 2013-03-07 株式会社ニコン 基板処理装置及び基板処理方法、露光方法及び露光装置、並びにデバイス製造方法及びフラットパネルディスプレイの製造方法
JP2013054144A (ja) * 2011-09-02 2013-03-21 Nikon Corp 位置合わせ方法、露光方法、デバイス製造方法、及びフラットパネルディスプレイの製造方法
WO2013133321A1 (ja) * 2012-03-07 2013-09-12 株式会社ニコン マスク、マスクユニット、露光装置、基板処理装置、及びデバイス製造方法
CN103019041B (zh) 2012-11-26 2014-10-22 京东方科技集团股份有限公司 一种曝光机
WO2016027186A1 (en) * 2014-08-19 2016-02-25 Koninklijke Philips N.V. Sapphire collector for reducing mechanical damage during die level laser lift-off
KR101715785B1 (ko) * 2014-12-05 2017-03-13 프로미스 주식회사 Fpd용 노광장치
TWI735438B (zh) * 2015-03-30 2021-08-11 日商尼康股份有限公司 物體搬運裝置、曝光裝置、平板顯示器的製造方法、元件製造方法、物體搬運方法以及曝光方法
KR102584657B1 (ko) * 2015-03-31 2023-10-04 가부시키가이샤 니콘 노광 장치, 플랫 패널 디스플레이의 제조 방법, 디바이스 제조 방법, 및 노광 방법
JP6807334B2 (ja) * 2015-05-13 2021-01-06 ルミレッズ ホールディング ベーフェー ダイレベルのリフトオフの最中におけるメカニカルダメージを低減するためのサファイアコレクタ
JP6802191B2 (ja) * 2015-06-05 2020-12-16 アプライド マテリアルズ インコーポレイテッドApplied Materials,Incorporated サセプタの位置付け及び回転装置、並びに使用の方法
JP6885335B2 (ja) 2015-09-30 2021-06-16 株式会社ニコン 移動体装置、露光装置、フラットパネルディスプレイの製造方法、及びデバイス製造方法、並びに物体の移動方法
KR102676391B1 (ko) * 2015-09-30 2024-06-18 가부시키가이샤 니콘 노광 장치, 노광 방법, 플랫 패널 디스플레이의 제조 방법, 및 디바이스 제조 방법
EP3403954A4 (en) * 2016-01-15 2019-08-14 Nano-Tem Co., Ltd. CONTACTLESS CARRIER AND CONTACTLESS CARRIER SYSTEM
CN109791369B (zh) * 2016-09-30 2022-01-14 株式会社尼康 物体保持装置、曝光装置、平板显示器之制造方法、元件制造方法、以及物体保持方法
CN109791370B (zh) 2016-09-30 2021-05-18 株式会社尼康 曝光装置、平板显示器的制造方法、元件制造方法、及曝光方法
JP6791255B2 (ja) 2016-09-30 2020-11-25 株式会社ニコン 搬送装置、露光装置、露光方法、フラットパネルディスプレイの製造方法、デバイス製造方法、及び搬送方法
CN108983552B (zh) * 2017-05-31 2020-01-24 上海微电子装备(集团)股份有限公司 一种移入移出机构及光刻机工件台移入移出装置
CN118343498A (zh) * 2018-03-01 2024-07-16 杭州孚亚科技有限公司 吸紧装置
JP7114277B2 (ja) 2018-03-07 2022-08-08 キヤノン株式会社 パターン形成装置及び物品の製造方法
JP7017239B2 (ja) * 2018-06-25 2022-02-08 株式会社ブイ・テクノロジー 露光装置および高さ調整方法
KR102653016B1 (ko) 2018-09-18 2024-03-29 삼성전자주식회사 척 구동 장치 및 기판 처리 장치
TWI691715B (zh) * 2019-06-17 2020-04-21 華矽創新股份有限公司 檢測矽晶圓缺陷的自動光學檢測機構及方法
JP7185674B2 (ja) * 2020-09-30 2022-12-07 キヤノントッキ株式会社 成膜装置、調整方法及び電子デバイスの製造方法
JP7756535B2 (ja) * 2021-10-06 2025-10-20 キヤノン株式会社 位置決め装置、リソグラフィ装置、および物品製造方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004177468A (ja) 2002-11-25 2004-06-24 Nikon Corp 露光装置
US20060098176A1 (en) * 2004-11-05 2006-05-11 Asml Netherlands B.V. Lithographic apparatus, device manufacturing method, and substrate table
JP2008218781A (ja) * 2007-03-06 2008-09-18 Tokyo Electron Ltd 基板処理装置

Family Cites Families (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2007A (en) * 1841-03-16 Improvement in the mode of harvesting grain
KR100300618B1 (ko) * 1992-12-25 2001-11-22 오노 시게오 노광방법,노광장치,및그장치를사용하는디바이스제조방법
JP3689949B2 (ja) * 1995-12-19 2005-08-31 株式会社ニコン 投影露光装置、及び該投影露光装置を用いたパターン形成方法
EP0866375A3 (en) * 1997-03-17 2000-05-24 Nikon Corporation Article positioning apparatus and exposing apparatus having the same
JP2001215718A (ja) * 1999-11-26 2001-08-10 Nikon Corp 露光装置及び露光方法
TW529172B (en) * 2001-07-24 2003-04-21 Asml Netherlands Bv Imaging apparatus
US6888620B2 (en) * 2001-11-29 2005-05-03 Nikon Corporation System and method for holding a device with minimal deformation
US20030098965A1 (en) * 2001-11-29 2003-05-29 Mike Binnard System and method for supporting a device holder with separate components
TWI222423B (en) * 2001-12-27 2004-10-21 Orbotech Ltd System and methods for conveying and transporting levitated articles
US7077019B2 (en) * 2003-08-08 2006-07-18 Photon Dynamics, Inc. High precision gas bearing split-axis stage for transport and constraint of large flat flexible media during processing
JP4767251B2 (ja) * 2004-04-14 2011-09-07 コアフロー サイエンティフィック ソリューションズ リミテッド 光学検査装置を平坦な対象物の接面に対して焦点合わせする方法
JPWO2006009254A1 (ja) * 2004-07-23 2008-05-01 株式会社ニコン 支持装置、ステージ装置、露光装置、及びデバイスの製造方法
TWI408506B (zh) * 2005-03-29 2013-09-11 尼康股份有限公司 曝光裝置、曝光裝置的製造方法以及微元件的製造方法
KR100949502B1 (ko) * 2005-06-20 2010-03-24 엘지디스플레이 주식회사 액정표시장치 제조 공정용 기판 반송장치
JP4553376B2 (ja) * 2005-07-19 2010-09-29 東京エレクトロン株式会社 浮上式基板搬送処理装置及び浮上式基板搬送処理方法
US7543867B2 (en) * 2005-09-30 2009-06-09 Photon Dynamics, Inc. Vacuum gripping system for positioning large thin substrates on a support table
JP4702083B2 (ja) * 2006-02-10 2011-06-15 ウシオ電機株式会社 XYθ移動ステージ
CN101980084B (zh) * 2006-02-21 2013-01-23 株式会社尼康 曝光装置、曝光方法及组件制造方法
JP4318709B2 (ja) * 2006-10-10 2009-08-26 東京エレクトロン株式会社 現像処理方法及び現像処理装置
KR101547784B1 (ko) * 2007-03-05 2015-08-26 가부시키가이샤 니콘 이동체 장치, 패턴 형성 장치 및 패턴 형성 방법, 디바이스 제조 방법, 이동체 장치의 제조 방법, 및 이동체 구동 방법
US7607647B2 (en) * 2007-03-20 2009-10-27 Kla-Tencor Technologies Corporation Stabilizing a substrate using a vacuum preload air bearing chuck
JP2009147240A (ja) * 2007-12-18 2009-07-02 Dainippon Printing Co Ltd 基板支持装置、基板支持方法、基板加工装置、基板加工方法、表示装置構成部材の製造方法
JP5125739B2 (ja) * 2008-05-08 2013-01-23 凸版印刷株式会社 Xyステップ露光装置
US8699001B2 (en) * 2009-08-20 2014-04-15 Nikon Corporation Object moving apparatus, object processing apparatus, exposure apparatus, object inspecting apparatus and device manufacturing method
US20110042874A1 (en) * 2009-08-20 2011-02-24 Nikon Corporation Object processing apparatus, exposure apparatus and exposure method, and device manufacturing method
US20120064460A1 (en) * 2010-09-07 2012-03-15 Nikon Corporation Movable body apparatus, object processing device, exposure apparatus, flat-panel display manufacturing method, and device manufacturing method
US8598538B2 (en) * 2010-09-07 2013-12-03 Nikon Corporation Movable body apparatus, object processing device, exposure apparatus, flat-panel display manufacturing method, and device manufacturing method
US20120064461A1 (en) * 2010-09-13 2012-03-15 Nikon Corporation Movable body apparatus, exposure apparatus, device manufacturing method, flat-panel display manufacturing method, and object exchange method

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004177468A (ja) 2002-11-25 2004-06-24 Nikon Corp 露光装置
US20060098176A1 (en) * 2004-11-05 2006-05-11 Asml Netherlands B.V. Lithographic apparatus, device manufacturing method, and substrate table
JP2008218781A (ja) * 2007-03-06 2008-09-18 Tokyo Electron Ltd 基板処理装置

Also Published As

Publication number Publication date
TWI704640B (zh) 2020-09-11
JP5573849B2 (ja) 2014-08-20
KR101862234B1 (ko) 2018-05-29
WO2011021723A1 (en) 2011-02-24
HK1166140A1 (en) 2012-10-19
TWI587436B (zh) 2017-06-11
TW201729331A (zh) 2017-08-16
US20110053092A1 (en) 2011-03-03
CN102483580A (zh) 2012-05-30
JP2013502600A (ja) 2013-01-24
KR20180059948A (ko) 2018-06-05
CN102483580B (zh) 2015-04-01
KR20120062711A (ko) 2012-06-14
TW201138008A (en) 2011-11-01

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