TWI701304B - 紅外線遮蔽性組成物、硬化膜及固態攝影裝置 - Google Patents

紅外線遮蔽性組成物、硬化膜及固態攝影裝置 Download PDF

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TWI701304B
TWI701304B TW104143700A TW104143700A TWI701304B TW I701304 B TWI701304 B TW I701304B TW 104143700 A TW104143700 A TW 104143700A TW 104143700 A TW104143700 A TW 104143700A TW I701304 B TWI701304 B TW I701304B
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infrared
compounds
based compounds
infrared shielding
light
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TW104143700A
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Chinese (zh)
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TW201631058A (zh
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畠山耕治
嶋田遵生子
河合孝廣
若林隆太郎
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日商Ｊｓｒ股份有限公司
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/014—Stabilisers against oxidation, heat, light or ozone
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
    • C08K5/005—Stabilisers against oxidation, heat, light, ozone
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00—Optical elements other than lenses
    • G02B5/20—Filters
    • G02B5/22—Absorbing filters
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14625—Optical elements or arrangements associated with the device
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof

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  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electromagnetism (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Optics & Photonics (AREA)
  • Materials Engineering (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Materials For Photolithography (AREA)
  • Optical Filters (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Silicon Polymers (AREA)
TW104143700A 2014-12-26 2015-12-25 紅外線遮蔽性組成物、硬化膜及固態攝影裝置 TWI701304B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014265729 2014-12-26
JP2014-265729 2014-12-26

Publications (2)

Publication Number Publication Date
TW201631058A TW201631058A (zh) 2016-09-01
TWI701304B true TWI701304B (zh) 2020-08-11

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TW104143700A TWI701304B (zh) 2014-12-26 2015-12-25 紅外線遮蔽性組成物、硬化膜及固態攝影裝置

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Country Link
JP (1) JP6702197B2 (ko)
KR (2) KR20170099845A (ko)
CN (1) CN107076894B (ko)
TW (1) TWI701304B (ko)
WO (1) WO2016104491A1 (ko)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI675907B (zh) * 2015-01-21 2019-11-01 日商Ｊｓｒ股份有限公司 固體攝像裝置
JP6788444B2 (ja) * 2016-09-07 2020-11-25 株式会社日本触媒 樹脂組成物および光学フィルター
JP6726317B2 (ja) 2017-02-09 2020-07-22 富士フイルム株式会社 感光性組成物、硬化膜、光学フィルタ、固体撮像素子、画像表示装置および赤外線センサ
KR20190132403A (ko) * 2017-04-07 2019-11-27 제이에스알 가부시끼가이샤 고체 촬상 소자용 조성물 및 고체 촬상 소자용 적외선 차폐막의 형성 방법
JP6922361B2 (ja) * 2017-04-07 2021-08-18 Jsr株式会社 固体撮像素子用組成物、赤外線遮蔽膜及び固体撮像素子
KR101862533B1 (ko) 2018-04-12 2018-05-29 주식회사 엘엠에스 카메라 모듈에 포함되는 근적외선 컷-오프 필터용 광학물품 및 이를 포함하는 카메라 모듈용 근적외선 컷-오프 필터
JP2020042235A (ja) * 2018-09-13 2020-03-19 Jsr株式会社 撮像装置、および赤外吸収膜

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201421993A (zh) * 2012-11-20 2014-06-01 Visera Technologies Co Ltd 影像感測裝置
JP2014214262A (ja) * 2013-04-26 2014-11-17 日本化薬株式会社 熱硬化性樹脂組成物及び近赤外線カットフィルタ

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101047946B1 (ko) * 2006-10-25 2011-07-12 주식회사 엘지화학 투명화 기능 및 근적외선 흡수 기능을 갖는 전자파 차폐필름, 이를 포함하는 광학 필터 및 이를 포함하는 플라즈마디스플레이 패널
JP2011191391A (ja) * 2010-03-12 2011-09-29 Sumitomo Chemical Co Ltd 硬化されたパターンの製造方法
CN105754367A (zh) * 2011-10-14 2016-07-13 Jsr株式会社 固体摄影装置用滤光器及使用该滤光器的固体摄影装置及照相机模块
JP5965639B2 (ja) * 2011-12-27 2016-08-10 富士フイルム株式会社 赤外線カットフィルタの製造方法、該製造方法に用いられる赤外線吸収性液状組成物、及びカメラモジュールの製造方法
JP2013151675A (ja) * 2011-12-27 2013-08-08 Fujifilm Corp 赤外線吸収性組成物、これを用いた赤外線カットフィルタ及びその製造方法、並びに、カメラモジュール及びその製造方法
JP2014203044A (ja) * 2013-04-09 2014-10-27 日本板硝子株式会社 赤外線カットフィルタおよび撮像装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201421993A (zh) * 2012-11-20 2014-06-01 Visera Technologies Co Ltd 影像感測裝置
JP2014214262A (ja) * 2013-04-26 2014-11-17 日本化薬株式会社 熱硬化性樹脂組成物及び近赤外線カットフィルタ

Also Published As

Publication number Publication date
CN107076894B (zh) 2020-01-31
JP6702197B2 (ja) 2020-05-27
KR20170099845A (ko) 2017-09-01
CN107076894A (zh) 2017-08-18
TW201631058A (zh) 2016-09-01
JPWO2016104491A1 (ja) 2017-11-24
WO2016104491A1 (ja) 2016-06-30
KR20220146660A (ko) 2022-11-01

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